CN109590522B - Control method of thin-wall milling device with non-uniform thickness change - Google Patents

Control method of thin-wall milling device with non-uniform thickness change Download PDF

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Publication number
CN109590522B
CN109590522B CN201910086555.5A CN201910086555A CN109590522B CN 109590522 B CN109590522 B CN 109590522B CN 201910086555 A CN201910086555 A CN 201910086555A CN 109590522 B CN109590522 B CN 109590522B
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milling cutters
milling
thin
cutters
wall
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CN109590522A (en
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衣杰
周稼铭
衣丰艳
项俊锋
张帅
康强
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Hefei Longzhi Electromechanical Technology Co ltd
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Shandong Jianzhu University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23CMILLING
    • B23C3/00Milling particular work; Special milling operations; Machines therefor

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  • Mechanical Engineering (AREA)
  • Milling Processes (AREA)

Abstract

The invention discloses a control method of a thin-wall milling device with non-uniform thickness change, wherein the thin-wall milling device comprises two milling cutters which are arranged in parallel, the two milling cutters are arranged in a sliding manner, and the sliding directions of the two milling cutters move in the opposite or back-to-back direction of the two milling cutters; the control method comprises the following steps: adjusting the positions of the two milling cutters to enable the distance between the two milling cutters to be equal to the thickness of the thin wall to be milled; starting the two milling cutters, and moving the two milling cutters to a part to be milled along a direction perpendicular to a plane where center lines of the two milling cutters are located; simultaneously moving the two milling cutters along a set track; adjusting the distance between the two milling cutters according to the requirement while moving along a set track; until the movement is completed along the set track. The thin wall with non-uniform thickness change can be rapidly processed.

Description

Control method of thin-wall milling device with non-uniform thickness change
Technical Field
The invention relates to the technical field of automobile parts, in particular to a control method of a thin-wall milling device with non-uniform thickness change.
Background
The tiny thin-wall features are widely used in complex components such as microchannel cold plates, micro-impellers, micro-molds, and terahertz slow waves. Micro-milling can effectively machine three-dimensional complex features with good precision performance on these tiny components. Due to tight tolerance requirements, tiny thin walls are the most typical and challenging machining features. The micro thin wall, especially the micro thin wall with a large height-width ratio, is easy to deform under the action of milling force during the dynamic milling process, and influences the dimensional accuracy and surface quality of the part.
Particularly, for thin walls with non-uniform thickness changes, how to prevent the thin walls from deforming in the milling process and realize the rapid milling of the thin walls with non-uniform thickness changes is one of the important problems to be solved urgently in the field.
Disclosure of Invention
The invention aims to provide a control method of a thin-wall milling device with non-uniform thickness change, which solves the defects in the prior art and can facilitate the milling of the thin wall with non-uniform thickness change.
The invention provides a control method of a thin-wall milling device with non-uniform thickness change, wherein the thin-wall milling device comprises two milling cutters which are arranged in parallel, the two milling cutters are arranged in a sliding manner, and the sliding directions of the two milling cutters move in the opposite or back-to-back direction of the two milling cutters;
s1, adjusting the positions of the two milling cutters to enable the distance between the two milling cutters to be equal to the thickness of the thin wall to be milled;
s2, starting the two milling cutters, and moving the two milling cutters to a part to be milled along a direction perpendicular to a plane where the center lines of the two milling cutters are located;
s3, moving the two milling cutters simultaneously along the set track;
s4, adjusting the distance between the two milling cutters according to the requirement while moving along the set track; until the movement is completed along the set track.
Optionally, the thin-wall milling device further comprises a mounting plate, the two milling cutters are slidably mounted on the mounting plate, and the mounting plate is slidably arranged;
in step S3, the movement of the two milling cutters in the track direction is realized by controlling the movement of the mounting plate.
Optionally, in step S3, during the movement of the mounting plate, the two milling cutters are controlled to move in opposite or opposite directions, so that the distance between the two milling cutters is equal to the thin-wall thickness of the corresponding point.
Optionally, in step S3, during the process of moving the two milling cutters along the set track, the plane where the center lines of the two milling cutters are located is ensured to be perpendicular to the set track.
Optionally, the set trajectory is a curve, and the preset minimum curvature radius of the trajectory is larger than the diameter of the milling cutter.
Optionally, in step S3, during the process of moving the two milling cutters, the mounting plate is rotated to ensure that the plane of the center lines of the two milling cutters is perpendicular to the preset track.
Optionally, step S1 further includes:
and adjusting the positions of the two milling cutters in the direction of the axes of the two milling cutters so as to adjust the milling depth of the two milling cutters.
Compared with the prior art, the milling cutter device has the advantages that the two milling cutters are arranged and move in the opposite or back-to-back direction. When the milling cutter is used, the positions of the two milling cutters are adjusted, so that the distance between the two milling cutters is equal to the thickness of a thin wall to be milled; starting the two milling cutters, and moving the two milling cutters to a part to be milled along a direction perpendicular to a plane where center lines of the two milling cutters are located; simultaneously moving the two milling cutters along a set track; adjusting the distance between the two milling cutters according to the requirement while moving along a set track; until the movement is completed along the set track. Therefore, the distance between the two milling cutters is adjusted in the process of moving the two milling cutters, so that the control of the non-uniform change of the thickness of the thin wall can be conveniently realized, and the milling speed and the milling precision can be improved.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a flow chart of steps of a control method of a thin-wall milling device with non-uniform thickness variation, which is provided by the invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The embodiment of the invention comprises the following steps: as shown in fig. 1, the present embodiment provides a method for controlling a thin-wall milling device with non-uniform thickness, wherein the thin-wall milling device includes two milling cutters arranged in parallel, the two milling cutters are arranged in a sliding manner, and the sliding direction of the two milling cutters is the direction in which the two milling cutters move toward or away from each other.
And S1, adjusting the positions of the two milling cutters to enable the distance between the two milling cutters to be equal to the thickness of the thin wall to be milled. Specifically, adjusting the positions of the two milling cutters means adjusting the distance between the two milling cutters. The distance between two said milling cutters as referred to herein is the smallest distance between two said milling cutters.
And S2, starting the two milling cutters, specifically, rotating the two milling cutters to move to the part to be milled along the direction perpendicular to the plane where the center lines of the two milling cutters are located.
And S3, moving the two milling cutters simultaneously along the set track. In particular, during the movement, the two milling cutters move synchronously. In this way, deformation of the formed thin wall during milling can be prevented.
S4, adjusting the distance between the two milling cutters according to the requirement while moving along the set track; until the movement is completed along the set track. Therefore, the thin wall with non-uniform thickness variation is convenient to form.
Optionally, the thin-wall milling device further comprises a mounting plate on which the two milling cutters are slidably mounted, the mounting plate being slidably disposed. Specifically, one end of the milling cutter is slidably mounted on the mounting plate, and the other end of the milling cutter is a free end. In step S3, the movement of the two milling cutters in the track direction is realized by controlling the movement of the mounting plate. Specifically, the installation of the two milling cutters is realized by controlling the movement of the installation plate.
Optionally, in step S3, during the movement of the mounting plate, the two milling cutters are controlled to move in opposite or opposite directions, so that the distance between the two milling cutters is equal to the thin-wall thickness of the corresponding point. By controlling the two milling cutters to move in the opposite or back-to-back directions, the distance between the two milling cutters can be conveniently adjusted. So as to form thin walls with non-uniform thickness variations.
Optionally, in step S3, during the process of moving the two milling cutters along the set track, the plane where the center lines of the two milling cutters are located is ensured to be perpendicular to the set track. Therefore, the transverse forces applied to the two milling cutters in the milling process can be counteracted as much as possible.
The set track is a curve, and the preset minimum curvature radius of the track is larger than the diameter of the milling cutter.
Optionally, in step S3, during the process of moving the two milling cutters, the mounting plate is rotated to ensure that the plane of the center lines of the two milling cutters is perpendicular to the preset track. Specifically, the two milling cutters are controlled to rotate and move by simultaneously controlling the mounting plate during the moving process, so that the speed and the angle of the moving of the two milling cutters are controlled. When the mounting plate rotates, the rotation center of the mounting plate is the symmetrical center line of the two milling cutters.
Optionally, step S1 further includes: and adjusting the positions of the two milling cutters in the direction of the axes of the two milling cutters so as to adjust the milling depth of the two milling cutters. Thus, the milling depth of the two milling cutters is convenient to control.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (2)

1. The control method of the thin-wall milling device with non-uniform thickness variation is characterized in that the thin-wall milling device comprises two milling cutters which are arranged in parallel, the two milling cutters are arranged in a sliding manner, and the sliding directions of the two milling cutters are opposite or back to each other;
s1, adjusting the positions of the two milling cutters to enable the distance between the two milling cutters to be equal to the thickness of the thin wall to be milled;
s2, starting the two milling cutters, and moving the two milling cutters to a part to be milled along a direction perpendicular to a plane where the center lines of the two milling cutters are located;
s3, moving the two milling cutters simultaneously along the set track;
s4, adjusting the distance between the two milling cutters according to the requirement while moving along the set track; until the movement is finished along the set track;
the thin-wall milling device further comprises a mounting plate, the two milling cutters are slidably mounted on the mounting plate, and the mounting plate is slidably arranged;
in step S3, the movement of the two milling cutters along the track direction is realized by controlling the movement of the mounting plate;
in step S3, in the process of moving the mounting plate, controlling the two milling cutters to move in opposite or reverse directions, so that the distance between the two milling cutters is equal to the thin-wall thickness of the corresponding point;
in step S3, in the process of moving the two milling cutters along the set track, the plane where the center lines of the two milling cutters are located is ensured to be perpendicular to the set track;
step S1 further includes:
adjusting the positions of the two milling cutters in the direction of the axes of the two milling cutters so as to adjust the milling depths of the two milling cutters;
in step S3, during the process of moving the two milling cutters, the mounting plate is rotated to ensure that the plane of the center lines of the two milling cutters is perpendicular to the preset track.
2. The method as claimed in claim 1, wherein the predetermined trajectory is a curve, and the predetermined minimum curvature radius of the trajectory is larger than the diameter of the milling cutter.
CN201910086555.5A 2019-01-29 2019-01-29 Control method of thin-wall milling device with non-uniform thickness change Active CN109590522B (en)

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Publication number Priority date Publication date Assignee Title
CN104551140B (en) * 2013-10-28 2017-08-01 珠海格力电器股份有限公司 Milling tool for air deflector
CN204053042U (en) * 2014-04-21 2014-12-31 江苏远航精密合金科技股份有限公司 High-precision wide cut nickel-base material milling face machine
CN107745146B (en) * 2017-09-28 2020-03-13 贵州航天电子科技有限公司 Milling method of cast aluminum thin-wall part
CN109128316B (en) * 2018-10-30 2019-07-30 哈尔滨工业大学 A kind of tool track planing method applied to folded waveguide slow-wave structure

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Address after: 230000 B-2704, wo Yuan Garden, 81 Ganquan Road, Shushan District, Hefei, Anhui.

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Address before: 250000 Shandong province Ji'nan port development area Feng Ming Road

Patentee before: SHANDONG JIANZHU University

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