CN109581717A - Display device manufacturing method and display device manufactured by using same - Google Patents
Display device manufacturing method and display device manufactured by using same Download PDFInfo
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- CN109581717A CN109581717A CN201910084634.2A CN201910084634A CN109581717A CN 109581717 A CN109581717 A CN 109581717A CN 201910084634 A CN201910084634 A CN 201910084634A CN 109581717 A CN109581717 A CN 109581717A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 306
- 238000002844 melting Methods 0.000 claims abstract description 68
- 230000008018 melting Effects 0.000 claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims description 48
- 239000003292 glue Substances 0.000 claims description 47
- 239000000155 melt Substances 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 16
- 238000005452 bending Methods 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 240000001439 Opuntia Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
Abstract
The invention discloses a display device manufacturing method and a display device manufactured by the method, wherein the display device manufacturing method comprises the following steps: irradiating the peripheries of a plurality of first display areas of the first mother substrate with laser to form first laser melting marks, wherein the first laser melting marks are provided with a plurality of first surrounding parts which respectively surround the peripheries of the first display areas; the first mother substrate is cut to obtain a plurality of first substrates, each first substrate is provided with a corresponding first display area, and the first surrounding part is arranged between the first display area and the edge of the first substrate in each first substrate.
Description
Technical field
The present invention is about a kind of display device production method and uses the display device of this method；Specifically, of the invention
Display device production method about cutting substrate technique and the display device using this method production.
Background technique
Display device is widely used in a variety of different products, such as TV, laptop, mobile phone etc..Substrate cut
It is a ring important in display device technique.Existing substrate cut is usually mechanical cutting mode, such mode for
The intensity of substrate cannot gradually meet product demand.Therefore, existing display device is still to be improved.
Summary of the invention
A purpose of the present invention is that providing a kind of display device and display device production method, the strong of substrate can be improved
Degree.
Display device production method is comprised the steps of: with the outer of multiple first viewing areas of the first mother substrate of laser irradiation
It encloses and forms first laser melting trace, first laser, which melts trace, has multiple first surrounding portions Huan Rao not multiple first viewing areas
Periphery；The first mother substrate is cut to obtain multiple first substrates, makes each first substrate that there is corresponding first viewing area, each
In first substrate, first surrounds portion between the first viewing area and the edge of first substrate.
In an embodiment, this method further includes one second mother substrate with multiple second viewing areas, cut this second
Mother substrate to obtain multiple the second substrates, make respectively the second substrate have corresponding second viewing area.
In an embodiment, further included before cutting second mother substrate:
Second laser melting is formed with the respectively periphery of second viewing area of another laser irradiation second mother substrate
Trace, the second laser melt trace have multiple second surrounding portions not Huan Rao multiple second viewing areas periphery, make cutting
After second mother substrate, in the respectively the second substrate, this second around portion between second viewing area and the second substrate
Between edge.
In an embodiment, before with the laser irradiation first mother substrate, to organizing first mother substrate and one the
Two mother substrates, make multiple first viewing areas of first mother substrate respectively with multiple second viewing areas phase of second mother substrate
It is corresponding.
In an embodiment, one of one of multiple first substrates and multiple the second substrates are assembled with a frame glue
And form a display panel, on a projection plane of the parallel first substrate, the frame glue between first viewing area and this
This of one laser melting trace first between the portion, the first laser melt trace this first around portion between the frame glue and this
Between the edge of one substrate.
In an embodiment, on the projection plane of the parallel first substrate, the frame glue and the first laser are melted
First shortest distance around portion of trace arrives 100um between 10, and the edge of the first substrate and the first laser melt trace
First shortest distance around portion arrives 150um between 10.
In an embodiment, respectively the first substrate has a line areas to be electrically connected corresponding first viewing area,
On a projection plane of the parallel first substrate, which is located at first viewing area and the first laser melts being somebody's turn to do for trace
First between portion.
In an embodiment, on the projection plane of the parallel first substrate, the line areas and the first laser are molten
First shortest distance around portion for melting trace arrives 250um between 20.
In an embodiment, this method is further included:
With a frame glue assembles one of one of multiple first substrates and multiple the second substrates and forms a display surface
Plate:
It is bent the display panel；And
It overlaps on the display panel to an arcuation substrate and fixes the display panel in the arcuation substrate.
In an embodiment, which has wave-length coverage between 157nm to 360nm.
Display device includes first substrate and the second substrate.First substrate have one first viewing area and this first
Substrate have first laser melt trace, first laser melt trace have around the first non-display area first surround portion, first
Around portion between the first viewing area and the edge of first substrate.The second substrate is arranged on the first substrate.It is molten by laser
Melt trace and forms protection to improve the intensity of substrate.
In an embodiment, which has one second viewing area, first viewing area and second viewing area
Corresponding, which there is a second laser to melt trace, which, which melts trace, has outside second viewing area
One second enclosed surround portion, this second around portion between second viewing area and the edge of the second substrate.
In an embodiment, which further includes a frame glue, which assembles the first substrate and second base
Plate and form a display panel, on a projection plane of the parallel first substrate, the frame glue between first viewing area with should
First laser melt trace this first between the portion, the first laser melt trace this first around portion between the frame glue with should
Between the edge of first substrate.
In an embodiment, on the projection plane of the parallel first substrate, the frame glue and the first laser are melted
First shortest distance around portion of trace arrives 100um between 10, and the edge of the first substrate and the first laser melt trace
First shortest distance around portion arrives 150um between 10.
In an embodiment, which there is a line areas to be electrically connected first viewing area, it is parallel this
On one projection plane of one substrate, the line areas be located at first viewing area and first laser melting trace this first around portion
Between.
In an embodiment, on the projection plane of the parallel first substrate, the line areas and the first laser are molten
First shortest distance around portion for melting trace arrives 250um between 20.
In an embodiment, further include a frame glue and an arcuation substrate, the frame glue assemble the first substrate and this second
Substrate and form a display panel, which is superimposed on the arcuation substrate and is fixed on the arcuation substrate.
The present invention is by can be improved resistance to compression and tensile energy, working as display device in the design of substrate formation laser melting trace
In bending deformation, the situation for generating rupture can avoid.
Detailed description of the invention
Fig. 1 is an embodiment flow chart of the display device of that present invention production method.
Fig. 2A -1, Fig. 2A -2, Fig. 2 B-1, Fig. 2 B-2 and Fig. 2 C are to obtain the schematic diagram of first substrate.
Fig. 2 D is the partial enlarged view of first substrate.
Fig. 3 is another embodiment flow chart of display device production method.
Fig. 4 A to Fig. 4 B is to obtain the schematic diagram of the second substrate.
Fig. 5 is an embodiment schematic diagram of display panel.
Fig. 6 is another embodiment flow chart of display device production method.
Fig. 7 is the schematic diagram of first substrate and the second substrate.
Fig. 8 is another embodiment schematic diagram of display device.
Fig. 9 is another embodiment schematic diagram of display device.
Figure 10 is another embodiment flow chart of display device production method.
Figure 11 is another embodiment flow chart of display device production method.
Figure 12 A and Figure 12 B are the implementation diagram for being bent display panel.
Figure 13 A and Figure 13 B are another implementation diagram for being bent display panel.
Wherein, appended drawing reference:
1 display device
10 first mother substrates
11 irradiation positions
11A closed path
11B connection path
12 first lasers melt trace
12A first surrounds portion
The first extension of 12B
13 cutting positions
14 microgrooves
15 separated places
20 second mother substrates
22 second lasers melt trace
22A second surrounds portion
The second extension of 22B
23 cutting positions
50 laser aids
52 laser
100 first substrates
102 edges
200 the second substrates
202 edges
300 liquid crystal layers
400 frame glues
501 conductive films
502 conductive films
600 integrated circuits
700 arcuation substrates
D1 first distance
D2 second distance
D3 third distance
The 4th distance of d4
The 5th distance of d5
The first viewing area A1
The second viewing area A2
The first non-display area of B1
The second non-display area of B2
The line areas C
D1 first direction
D2 second direction
S10, S10-1, S10-2, S10-3 step
S20, S30, S32 step
S40, S50, S60 step
Specific embodiment
The present invention provides a kind of display device production method and please refers to Fig. 1.Fig. 1 is the display device of that present invention production method
One embodiment flow chart.As shown in Figure 1, display device production method includes to form the first mother substrate of laser melting trace and cutting
Stage.In step S10, first laser melting trace is formed with the periphery of multiple first viewing areas of the first mother substrate of laser irradiation,
First laser melt trace have multiple first surrounding portions not Huan Rao each first viewing area periphery.
Please refer to Fig. 2A -1.Fig. 2A -1 is painted the top view of the first mother substrate 10.As shown in Fig. 2A -1, the first mother substrate 10
With multiple first viewing area A1.First mother substrate 10 is, for example, glass material.There is irradiation position 11 in the first mother substrate 10
And cutting position 13.The irradiation position 11 is the predefined paths of confession under directions laser irradiation, and cutting position 13 is confession under directions cutting dress
Set the predefined paths of (such as break bar) cutting.As shown in Fig. 2A -1, irradiation position 11 is located at each first display of the first mother substrate 10
The periphery of area A1.
Specifically, cutting position 13 is between each first viewing area A1, to by the difference on the first mother substrate 10
The first viewing area A1 separate.By taking Fig. 2A -1 as an example, for the first viewing area A1 of 2x2 arrangement, cutting position 13 is along not Tongfang
Pass through the separated place 15 between two first viewing area A1 to (such as first direction D1 and second direction D2).With regard to 13 He of cutting position
For irradiation position 11, irradiation position 11 is respectively formed closed path 11A around the part of every one first viewing area A1, except this it
Outside, irradiation position 11 also may include the connection path 11B for extending to different closed path 11A.
Please refer to Fig. 2A -1 and Fig. 2A -2.Fig. 2A -2 is the enlarged diagram of the first viewing area A1 and irradiation position 11.For
Illustrate conveniently, the first viewing area A1 and irradiation position 11 to be only shown in Fig. 2A -2, and omits other structures feature.Such as Fig. 2A -2
Shown, irradiation position 11 includes closed path 11A and connection path 11B.Line segment (11ah, 11ai, 11aj, 11ak) constitutes closing
Path 11A, the part that self-enclosed path 11A extends outwardly away are connection path 11B.With first display in the upper left corner Fig. 2A -1
For area A1, irradiation position 11 surround the first viewing area A1 in the upper left corner, and is extended along first direction D1 by separated place 15
To the first viewing area A1 in the upper right corner, and D2 extends to first viewing area in the lower left corner across separated place 15 in a second direction
A1。
Generally speaking, the closed path 11A and connection path 11B of irradiation position 11 collectively form rectangular mesh distribution.Such as
Shown in Fig. 2A -1, cutting position 13 is between different closed path 11A, and respectively along first direction D1 and second direction D2
Across the connection path 11B by separated place 15, and forms cutting position 13 and connection path 11B and interlock.Cutting position 13 is horizontal
Across the first mother substrate 10, the first mother substrate 10 is divided for multiple regions, the corresponding first viewing area A1 in each region.
Fig. 2 B-1 is painted the first mother substrate 10 with the top view after laser irradiation.As shown in Fig. 2 B-1, it is surround with laser 52
Irradiate the periphery of first more than 10 the first viewing area A1 of mother substrate.For example, laser aid 50 generates laser 52, and towards first
Direction D1 and mobile with the second direction D2 different from first direction D1, along the irradiation position 11 in Fig. 2A -1 to the first mother
Substrate 10 heats and forms first laser melting trace 12.In an embodiment, laser 52 have wave-length coverage between 157nm extremely
360nm。
Specifically, first laser melting trace 12 may include multiple first around portion 12A and multiple first extension 12B.
As shown in Fig. 2 B-1, multiple first surround the periphery of the first viewing area A1 around portion 12A respectively, in addition, first laser melts trace
12 also surround the first extension 12B of portion 12A comprising extending to difference first.With reference to Fig. 2A -2 and Fig. 2 B-1, first surrounds portion
12A corresponds to the position of aforementioned closed path 11A, and the first extension 12B corresponds to the position of aforementioned connection path 11B.It please refers to
Fig. 2 B-2.For convenience of understanding, portion 12A and the first extension 12B are surrounded for first with the line width of different thicknesses in Fig. 2 B-2 model
It encloses and is distinguish.As shown in Fig. 2 B-2, the thick line around the first periphery viewing area A1 is first around portion 12A, and is enclosed from first
The filament that 12A extends outwardly away around portion is the first extension 12B.It can provide the female base of protection first around portion 12A by first
The effect of plate 10 avoids obtaining undesirable product in subsequent cutting step.It need to supplement, be extended by forming aforementioned first
Portion 12B can provide the fluency of laser radiation operation, help to be continuously formed first laser melting trace on substrate, but unlimited
In this.In other embodiments, it also may be selected not reserve connection path 11B, therefore only around the first viewing area after laser irradiation
The first of the periphery A1 surrounds portion 12A.
Fig. 1 is returned to, in step S20, cuts the first mother substrate to obtain multiple first substrates, there is each first substrate pair
The first viewing area answered, in each first substrate, first surrounds portion between the first viewing area and the edge of first substrate.Figure
2C is painted multiple first substrates 100.The first mother substrate 10 is cut along the cutting position 13 in Fig. 2 B-1.With reference to Fig. 2 B-1 and figure
2C is formed as the edge 102 of first substrate 100 along former cutting position 13 after cutting.The edge 102 of first substrate 100 is located at original
The periphery of irradiation position 11 (see Fig. 2A -1).As shown in Figure 2 C, multiple first substrates 100 are obtained after cutting.Each first substrate 100
With corresponding first viewing area A1.In each first substrate 100, first surrounds portion 12A between the first viewing area A1 and first
Between the edge 102 of substrate 100.
Generally speaking, in display device manufacturing process, the is formed by the irradiation of the first non-display area using laser
One laser melting trace can form the first viewing area and protect.For example, Fig. 2 D is please referred to.Fig. 2 D is the first base of corresponding diagram 2C
Partial enlarged view of the plate 100 at frame R.As shown in Figure 2 D, first laser melting trace 12 is located at the first non-display area B1, and between
Between first viewing area A1 and the edge 102 of first substrate 100.The edge 102 of first substrate 100 may generate edge with cutting
The microgroove 14 of cutting position distribution.Microgroove 14 can be limited by first laser melting trace 12 to stretch towards the first viewing area A1, avoided
The microgroove 14 that cutting generates influences the integral strength of first substrate.In other words, laser irradiation forms first laser and melts trace 12
It is provided with the effect of 100 improved strength of first substrate.
Fig. 3 is another embodiment flow chart of display device production method.As shown in figure 3, removing abovementioned steps S10 and step
S20, display device production method include the second mother substrate of cutting and the stage for forming display panel.Second mother substrate has multiple
Second viewing area.In step S30, the second mother substrate is cut to obtain multiple the second substrates, there is each the second substrate corresponding
Second viewing area.
Please refer to Fig. 4 A and Fig. 4 B.Fig. 4 A is painted the top view of the second mother substrate 20.Fig. 4 B is painted multiple the second substrates
200.As shown in Figure 4 A, the second mother substrate 20 has multiple second viewing area A2.Second mother substrate 20 is, for example, glass material.?
Second mother substrate 20 has cutting position 23.As shown in Figure 4 A, cutting position 23 is located at each second viewing area of the second mother substrate 20
The periphery of A2.Cutting position 23 divides the second mother substrate 20 for multiple regions, each region corresponding one across the second mother substrate 20
A second viewing area A2.The second mother substrate 20 is cut along the cutting position 23 in Fig. 4 A.As shown in Figure 4 B, it is obtained after cutting more
A the second substrate 200, and each the second substrate 200 has a corresponding second viewing area A2.
Fig. 3 is returned to, in step S40, display panel is formed with frame glue assembling first substrate and the second substrate.For example, choosing
A first substrate and a second substrate after taking cutting assemble to form display panel.Fig. 5 is an embodiment of display panel
Schematic diagram.As shown in figure 5, display device 1 includes first substrate 100 and the second substrate 200 being set on first substrate 100.
Display device 1 can have the first viewing area A1 and the first non-display area B1.With reference to Fig. 2 C and Fig. 5, first substrate 100 has first
Laser melting trace 12, and first laser melting trace 12 is located at the first non-display area B1.Furthermore, first laser melts trace 12
With portion 12A is surrounded around the first of the periphery the first viewing area A1, first surrounds portion 12A between the first viewing area A1 and the first base
Between the edge 102 of plate 100.In an embodiment, it is contemplated that first substrate 100 is compared with Structure of need reinforcement, and only in the first base
Plate 100 has laser melting trace, so without being limited thereto, can also all have laser melting in first substrate 100 and the second substrate 200
Trace.In an embodiment, first substrate 100 is one of thin film transistor base plate and colored filter substrate, the second substrate 200
It is therein another with colored filter substrate for thin film transistor base plate, but not limited to this.In addition, in Fig. 5, first laser melting
Trace 12 is formed in the top surface of first substrate 100, so without being limited thereto, can also be formed in bottom surface or the first substrate of first substrate 100
100 inside, visual demand adjustment.
In addition, for the display device for forming display panel using frame glue assembling first substrate and the second substrate, first
Laser melting trace is located at the periphery of frame glue.By taking Fig. 5 as an example, display device 1 includes first substrate 100 and the second substrate 200.First
Liquid crystal layer 300 is accompanied between substrate 100 and the second substrate 200.Frame glue 400 is equipped on the outside of liquid crystal layer 300.100 He of first substrate
The one side of the second substrate 200 towards liquid crystal layer 300 is equipped with conductive film 501 and 502.As shown in figure 5, in the projection of parallel first substrate
In plane, frame glue 400 surrounds between portion 12A between the first of the first viewing area A1 and first laser melting trace 12, and first swashs
The first of light melting trace 12 is around portion 12A between frame glue 400 and the edge 102 of first substrate 100.
In addition, as shown in figure 5, frame glue 400 and first laser melt trace on the projection plane of parallel first substrate 100
The first of 12 has first distance d1 between portion 12A, is defined as edge of the frame glue 400 in contrast to the first viewing area side A1
To first around portion 12A close to the first viewing area side A1 edge length.The first of first laser melting trace 12 surrounds portion
There is second distance d2 between 12A and the edge 102 of first substrate 100, be defined as the edge 102 to the first of first substrate 100
Length around portion 12A in contrast to the edge of the first viewing area side A1.In an embodiment, frame glue 400 and first laser are melted
The first of trace 12 surrounds the shortest distance of portion 12A between 10um to 100um, that is, the range of first distance d1 is arrived between 10um
100um.The first of edge 102 and first laser the melting trace 12 of first substrate 100 surrounds the shortest distance of portion 12A between 10um
To 150um, that is, the range of second distance d2 is between 10um to 150um.
It should be understood that laser melting trace is formed as the filament of narrower in width on substrate, respectively scheme described in the embodiments herein
In, for convenience of description the distance relation of laser melting trace and frame glue and substrate edges and highlight laser melting trace, size is not
It is painted by actual proportions.
Fig. 6 is another embodiment flow chart of display device production method.As shown in fig. 6, display device production method packet
Containing mother substrate assembling, the first mother substrate of laser irradiation and the second mother substrate, the stage for cutting the first mother substrate and the second mother substrate.
As shown in fig. 6, the difference is that, in step S10-1, in laser irradiation and the first mother substrate of cutting and the second mother substrate it
Before, by two mother substrates to group, keep the first viewing area of the first mother substrate opposite with the second viewing area of the second mother substrate respectively
It answers, i.e., every corresponding second viewing area in one first viewing area.It, can be by frame glue by two mother substrates pair in an embodiment
Group makes to reach after cutting the first mother substrate and the second mother substrate and assemble a first substrate and a second substrate by frame glue
And form a display panel.
It is the laser irradiation stage in step S10-2 and step S10-3, wherein step S10-2 is the female base of laser irradiation first
Plate forms the process of first laser melting trace, and content is as aforementioned.In step S10-3, second laser is formed in the second mother substrate
Melt trace.The forming process of second laser melting trace can refer to Fig. 2A -1 and Fig. 2 B-1.Specifically, with another laser irradiation
The periphery of each second viewing area in two mother substrates and form second laser melting trace, second laser melting trace, which has, multiple second to be enclosed
Around portion respectively around the periphery of each second viewing area.In an embodiment, difference can be used in the first mother substrate and the second mother substrate
Laser aid with respectively on two mother substrates formed first laser melting trace and second laser melt trace.In another implementation
Example, single laser aid can be used, by adjusting focal length with respectively on two mother substrates formed first laser melting trace and
Second laser melts trace.
It is the cutting stage in step S20 and step S32, wherein step S20 is the first mother substrate of cutting to obtain the first base
The process of plate, content is as aforementioned.Then in step S32, the second mother substrate is cut to obtain the second substrate, in each the second substrate
In, second surrounds portion between the second viewing area and the edge of the second substrate.The process for cutting the second mother substrate can refer to figure
2B-1 and Fig. 2 C.Multiple the second substrates are obtained after cutting.
Fig. 7 is the schematic diagram of first substrate 100 and the second substrate 200.In to the first mother substrate and second female base after group
First laser melting trace and second laser melting trace are respectively formed on plate.As shown in fig. 7, first substrate 100 has corresponding surround
The first laser of first periphery viewing area A1 melts trace 12, and first laser, which melts trace 12, to be had around the periphery the first viewing area A1
First surrounds portion 12A.On the other hand, there is the second substrate 200 the corresponding second laser around the second periphery viewing area A2 to melt
Trace 22, second laser melt trace 22 and surround portion 22A with surround the periphery the second viewing area A2 second.Optionally, second laser
Melting trace 22 includes the second extension 22B extended outward from second around portion 22A.Second extension 22B can provide laser
The fluency for irradiating operation helps to be continuously formed second laser melting trace on substrate.Trace 22 is melted by second laser
Can avoid the microgroove that cutting generates influences the integral strength of the second substrate.In other words, laser irradiation forms second laser and melts trace
22 are also provided with the effect of 200 improved strength of the second substrate.
Fig. 8 is another embodiment schematic diagram of display device.As shown in figure 8, display device 1 include first substrate 100 and
The second substrate 200 being set on first substrate 100.Display device 1 has the first viewing area A1, the first non-display area B1, the
Two viewing area A2 and the second non-display area B2.First viewing area A1 is corresponding with the second viewing area A2, also, in parallel first
On the projection plane of substrate, the first viewing area A1 is Chong Die with the range of the second viewing area A2.In addition, the first non-display area B1 and
Two non-display area B2 are corresponding, and on the projection plane of parallel first substrate, the first non-display area B1 and the second non-display area
The range of B2 is least partially overlapped.In the embodiment of Fig. 8, the projection plane of Yu Pinghang first substrate, the first non-display area B1
It is Chong Die with the range of the second non-display area B2.As shown in figure 8, first laser melting trace 12 is located at the first non-display area B1, second
Laser melting trace 22 is located at the second non-display area B2.Furthermore, the first of first laser melting trace 12 surround around portion 12A
The periphery of first viewing area A1, the second of second laser melting trace 22 is around portion 22A around the periphery of the second viewing area A2.
In addition, for the display for forming display panel using the assembling first substrate 100 of frame glue 400 and the second substrate 200
Device 1, first laser melting trace 12 and second laser melting trace 22 are located at the periphery of frame glue 400.By taking Fig. 8 as an example, display device 1
Include first substrate 100 and the second substrate 200.Liquid crystal layer 300 is accompanied between first substrate 100 and the second substrate 200.Liquid crystal layer
300 outsides are equipped with frame glue 400.The one side of first substrate 100 and the second substrate 200 towards liquid crystal layer 300 can be equipped with conductive film 501 with
502.As shown in figure 8, for first laser melt trace 12, on the projection plane of parallel first substrate 100, frame glue 400 between
The first of first viewing area A1 and first laser melting trace 12 is between the portion 12A, and the first of first laser melting trace 12 encloses
Around portion 12A between frame glue 400 and the edge 102 of first substrate 100.Trace 22 is melted for second laser, parallel second
On the projection plane of substrate 200, frame glue 400 surrounds portion 22A between the second of the second viewing area A2 and second laser melting trace 22
Between, and the second of second laser melting trace 22 surrounds portion 22A between frame glue 400 and the edge 202 of the second substrate 200.
In addition, as shown in figure 8, frame glue 400 and second laser melt trace on the projection plane of parallel the second substrate 200
The second of 22 has third distance d3 between portion 22A, is defined as edge of the frame glue 400 in contrast to the second viewing area side A2
To second around portion 22A close to the second viewing area side A2 edge length.The second of second laser melting trace 22 surrounds portion
There is the 4th distance d4, the edge for being defined as the second substrate 200 is surrounded to second between 22A and the edge 202 of the second substrate 200
Length of the portion 22A in contrast to the edge of the second viewing area side A2.In an embodiment, frame glue 400 and second laser melt trace 22
Second around portion 22A the shortest distance between 10um to 100um, that is, the range of third distance d3 is arrived between 10um
100um.The second of edge 202 and second laser the melting trace 22 of the second substrate 200 surrounds the shortest distance of portion 22A between 10um
To 150um, that is, the range of the 4th distance d4 is between 10um to 150um.
In addition, each first substrate can have line areas to be for electrically connecting to corresponding first viewing area.Fig. 9 is display dress
Set 1 another embodiment schematic diagram.As shown in figure 9, the side of first substrate 100 has line areas C.First substrate 100 has
Line areas C is to be electrically connected corresponding first viewing area A1, for example, is set to route and the first viewing area of line areas C
The route of A1 is electrically connected to each other, the route that line areas C can also have integrated circuit 600 to be electrically connected the first viewing area A1.Line
Road area C and first laser melting trace 12 are located at the first non-display area B1.On the projection plane of parallel first substrate 100, route
Area C is located at the first viewing area A1 and the first of first laser melting trace 12 and surrounds between portion 12A.In addition, as shown in figure 9, flat
On the projection plane of row first substrate 100, the first of line areas C and first laser melting trace 12 has the between the portion 12A
Five distance d5, the edge for being defined as line areas C in contrast to the first viewing area side A1 are shown around portion 12A close to first to first
The length at the edge of the area side A1.In an embodiment, melt trace 12 near first laser in the C of line areas first surrounds portion
The outermost of the route of 12A can be considered as edge of the line areas C in contrast to the first viewing area side A1.In an embodiment, route
Area C and first laser melting trace 12 first around portion 12A the shortest distance between 20um to 250um, that is, the 5th distance d5
Range between 20um to 250um.
Figure 10 is another embodiment flow chart of display device production method.As shown in Figure 10, display device production method
Comprising the first mother substrate of laser irradiation and cutting, the second mother substrate of cutting, the stage for forming display panel, correspond to step S10
~S40 is as aforementioned.In addition, display device production method also includes the stage for being bent display panel and being superimposed on arcuation substrate.
In step S50, it is bent display panel.Then in step S60, overlap on display panel to arcuation substrate and fixed display panel in
Arcuation substrate.
Display panel is bent in addition to foregoing manner, also can operate in the process for first cutting substrate again to group.It please refers to
Figure 11.Figure 11 is another embodiment flow chart of display device production method.As shown in figure 11, display device production method includes
Mother substrate assembling, laser irradiation and cutting the first mother substrate, cutting the second mother substrate, correspond to step S10-1, S10-2, S20,
S30, content is as aforementioned.Display panel is obtained after cutting the first mother substrate and the second mother substrate, then bending display
Panel (step S50) then overlaps on display panel to arcuation substrate and fixed display panel is in arcuation substrate (step S60).
Figure 12 A and Figure 12 B are the implementation diagram for being bent display panel.As illustrated in fig. 12, the assembling of frame glue 400 first
Substrate 100 and the second substrate 200 and after forming display panel, display panel is bent and is superimposed on display panel after bending
On arcuation substrate 700.In the example of Figure 12 A and Figure 12 B, first substrate 100 is, for example, colored filter substrate, the second substrate
200 be, for example, thin film transistor base plate.First substrate 100 and the bending of the second substrate 200 are in the form of concaving towards down.Such as Figure 12 B institute
Show, display panel is set on arcuation substrate 700, and is fixed on arcuation substrate 700, to maintain the curvature of display panel.Pass through
The design of first laser melting trace is formed in first substrate, resistance to compression and tensile energy can be improved, when display device is in bending deformation
When, it can avoid the situation for generating rupture.
Figure 13 A and Figure 13 B are another implementation diagram for being bent display panel.As shown in FIG. 13A, the assembling of frame glue 400 the
One substrate 100 and the second substrate 200 and after forming display panel, display panel is bent and overlaps display panel after bending
In on arcuation substrate 700.In the example of Figure 13 A and Figure 13 B, first substrate 100 is, for example, thin film transistor base plate, the second base
Plate 200 is, for example, colored filter substrate.First substrate 100 and the bending of the second substrate 200 are in the form of concaving towards.Such as Figure 13 B
Shown, display panel is set on arcuation substrate 700, and is fixed on arcuation substrate 700, to maintain the curvature of display panel.It is logical
Excessively first substrate forms the design that first laser melts trace, and resistance to compression and tensile energy can be improved, when display device becomes in bending
When shape, the situation for generating rupture can avoid.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
Various corresponding changes and modifications, but these corresponding changes and modifications can be made according to the present invention by knowing those skilled in the art
It all should belong to the protection scope of the claims in the present invention.
Claims (17)
1. a kind of display device production method, characterized by comprising:
First laser melting trace is formed with the periphery of multiple first viewing areas of one first mother substrate of a laser irradiation, this
One laser melting trace have multiple first surrounding portions not Huan Rao multiple first viewing areas periphery；
First mother substrate is cut to obtain multiple first substrates, make respectively the first substrate have corresponding first viewing area,
In the respectively first substrate, this first around portion between first viewing area and the edge of the first substrate.
2. the method as described in claim 1, which is characterized in that further including one second mother substrate has multiple second viewing areas,
Second mother substrate is cut to obtain multiple the second substrates, make respectively the second substrate have corresponding second viewing area.
3. method according to claim 2, which is characterized in that further included before cutting second mother substrate:
Second laser melting trace is formed with the respectively periphery of second viewing area of another laser irradiation second mother substrate, it should
Second laser melt trace have multiple second surrounding portions not around multiple second viewing areas periphery, make cutting this second
After mother substrate, in the respectively the second substrate, this second around portion between the edge of second viewing area and the second substrate it
Between.
4. the method as described in claim 1, which is characterized in that, should to group before with the laser irradiation first mother substrate
First mother substrate and one second mother substrate, make multiple first viewing areas of first mother substrate respectively with second mother substrate
Multiple second viewing areas are corresponding.
5. method according to claim 2, which is characterized in that with a frame glue assemble one of the multiple first substrates with it is multiple
One of the second substrate and form a display panel, on a projection plane of the parallel first substrate, the frame glue is between this
This of first viewing area and first laser melting trace first between the portion, the first laser melt trace this first surround portion
Between the frame glue and the edge of the first substrate.
6. method as claimed in claim 5, which is characterized in that on the projection plane of the parallel first substrate, the frame glue
With the first laser melting trace this first around portion the shortest distance between 10 arrive 100um, the edge of the first substrate with should
First shortest distance around portion that first laser melts trace arrives 150um between 10.
7. the method as described in claim 1, which is characterized in that respectively the first substrate has a line areas to be electrically connected correspondence
First viewing area, on a projection plane of the parallel first substrate, the line areas be located at first viewing area with this
This of one laser melting trace is first between the portion.
8. the method for claim 7, which is characterized in that on the projection plane of the parallel first substrate, the route
First shortest distance around portion of area and first laser melting trace arrives 250um between 20.
9. method according to claim 2, which is characterized in that further include:
With a frame glue assembles one of one of multiple first substrates and multiple the second substrates and forms a display panel:
It is bent the display panel；And
It overlaps on the display panel to an arcuation substrate and fixes the display panel in the arcuation substrate.
10. the method as described in claim 1, which is characterized in that the laser has wave-length coverage between 157nm to 360nm.
11. a kind of display device, characterized by comprising:
There is one first substrate one first viewing area and the first substrate there is a first laser to melt trace, the first laser
Melt trace have around first non-display area one first surround portion, this first around portion between first viewing area with should
Between the edge of first substrate；And
One the second substrate is set on the first substrate.
12. display device as claimed in claim 11, which is characterized in that the second substrate has one second viewing area, this
One viewing area is corresponding with second viewing area, which there is a second laser to melt trace, which melts trace
With around second non-display area one second surround portion, this second around portion between second viewing area and second base
Between the edge of plate.
13. display device as claimed in claim 11, which is characterized in that further include a frame glue, which assembles first base
Plate and the second substrate and form a display panel, on a projection plane of the parallel first substrate, the frame glue between this
This of one viewing area and first laser melting trace first between the portion, the first laser melt trace this first be situated between around portion
Between the frame glue and the edge of the first substrate.
14. display device as claimed in claim 13, which is characterized in that on the projection plane of the parallel first substrate,
The frame glue and first shortest distance around portion of first laser melting trace arrive 100um, the side of the first substrate between 10
First shortest distance around portion of edge and first laser melting trace arrives 150um between 10.
15. display device as claimed in claim 11, which is characterized in that there is the first substrate line areas to be electrically connected should
First viewing area, on a projection plane of the parallel first substrate, which is located at first viewing area and this is first sharp
Light melt trace this first between the portion.
16. display device as claimed in claim 15, which is characterized in that on the projection plane of the parallel first substrate,
First shortest distance around portion of the line areas and first laser melting trace arrives 250um between 20.
17. display device as claimed in claim 11, which is characterized in that further include a frame glue and an arcuation substrate, the frame glue
It assembles the first substrate and the second substrate and forms a display panel, which is superimposed on the arcuation substrate and fixes
In on the arcuation substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| TW107143511A TWI681241B (en) | 2018-12-04 | 2018-12-04 | Manufacturing method for display device and display device utilized thereof |
| TW107143511 | 2018-12-04 |
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| CN109581717A true CN109581717A (en) | 2019-04-05 |
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| CN201910084634.2A Pending CN109581717A (en) | 2018-12-04 | 2019-01-29 | Display device manufacturing method and display device manufactured by using same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112987364A (en) * | 2019-12-13 | 2021-06-18 | 群创光电股份有限公司 | Electronic device and manufacturing method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001056455A (en) * | 1998-12-04 | 2001-02-27 | Samsung Electronics Co Ltd | Liquid crystal display device panel |
| CN1643656A (en) * | 2002-03-12 | 2005-07-20 | 浜松光子学株式会社 | Method for deviding substrate |
| CN1657220A (en) * | 2004-02-19 | 2005-08-24 | 佳能株式会社 | Laser based splitting method, object to be split, and semiconductor element chip |
| CN1953857A (en) * | 2004-05-20 | 2007-04-25 | 三星钻石工业股份有限公司 | Motherboard cutting method, motherboard scribing apparatus, program and recording medium |
| CN1982950A (en) * | 2005-12-12 | 2007-06-20 | Lg.菲利浦Lcd株式会社 | Method for repairing LCD device and LCD device using the method |
| CN1991491A (en) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | Method for cutting liquid crystal display panel and method for fabricating liquid crystal display panel using the same |
| CN101046571A (en) * | 2006-03-28 | 2007-10-03 | 三星电子株式会社 | Method for cutting substrate and substrate cutting apparatus using the same |
| CN101139165A (en) * | 2006-08-18 | 2008-03-12 | 康宁股份有限公司 | Boro-silicate glass frits for hermetic sealing of light emitting device displays |
| CN101821071A (en) * | 2007-10-11 | 2010-09-01 | 三星钻石工业股份有限公司 | Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus |
| CN105312775A (en) * | 2014-06-10 | 2016-02-10 | 三星钻石工业股份有限公司 | Processing method for brittle material substrate |
| CN107910296A (en) * | 2017-12-08 | 2018-04-13 | 京东方科技集团股份有限公司 | A kind of flexible display panels motherboard and its cutting method, flexible display panels, display device |
| CN108448011A (en) * | 2018-05-14 | 2018-08-24 | 昆山国显光电有限公司 | A kind of display master blank and its display screen, display terminal |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4563097B2 (en) * | 2003-09-10 | 2010-10-13 | 浜松ホトニクス株式会社 | Semiconductor substrate cutting method |
| MX2007001159A (en) * | 2004-07-30 | 2007-09-25 | Mitsuboshi Diamond Ind Co Ltd | Vertical crack forming method and vertical crack forming device in substrate. |
| US9701581B2 (en) * | 2009-06-04 | 2017-07-11 | Corelase Oy | Method and apparatus for processing substrates using a laser |
| CN103282317B (en) * | 2011-12-22 | 2015-12-16 | 三星钻石工业股份有限公司 | The cut-off method of brittle substrate |
| TWI481574B (en) * | 2013-01-17 | 2015-04-21 | Taiwan Mitsuboshi Diamond Ind Co Ltd | Processing method and cutting apparatus for a strengthened glass substrate |
| EP3107868B1 (en) * | 2014-02-20 | 2021-05-26 | Corning Incorporated | Methods for cutting radii in flexible thin glass |
| DE102017200631B4 (en) * | 2017-01-17 | 2022-12-29 | Disco Corporation | Method of processing a substrate |
-
2018
- 2018-12-04 TW TW107143511A patent/TWI681241B/en active
-
2019
- 2019-01-29 CN CN201910084634.2A patent/CN109581717A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001056455A (en) * | 1998-12-04 | 2001-02-27 | Samsung Electronics Co Ltd | Liquid crystal display device panel |
| CN1643656A (en) * | 2002-03-12 | 2005-07-20 | 浜松光子学株式会社 | Method for deviding substrate |
| CN1657220A (en) * | 2004-02-19 | 2005-08-24 | 佳能株式会社 | Laser based splitting method, object to be split, and semiconductor element chip |
| CN1953857A (en) * | 2004-05-20 | 2007-04-25 | 三星钻石工业股份有限公司 | Motherboard cutting method, motherboard scribing apparatus, program and recording medium |
| CN1982950A (en) * | 2005-12-12 | 2007-06-20 | Lg.菲利浦Lcd株式会社 | Method for repairing LCD device and LCD device using the method |
| CN1991491A (en) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | Method for cutting liquid crystal display panel and method for fabricating liquid crystal display panel using the same |
| CN101046571A (en) * | 2006-03-28 | 2007-10-03 | 三星电子株式会社 | Method for cutting substrate and substrate cutting apparatus using the same |
| CN101139165A (en) * | 2006-08-18 | 2008-03-12 | 康宁股份有限公司 | Boro-silicate glass frits for hermetic sealing of light emitting device displays |
| CN101821071A (en) * | 2007-10-11 | 2010-09-01 | 三星钻石工业股份有限公司 | Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus |
| CN105312775A (en) * | 2014-06-10 | 2016-02-10 | 三星钻石工业股份有限公司 | Processing method for brittle material substrate |
| CN107910296A (en) * | 2017-12-08 | 2018-04-13 | 京东方科技集团股份有限公司 | A kind of flexible display panels motherboard and its cutting method, flexible display panels, display device |
| CN108448011A (en) * | 2018-05-14 | 2018-08-24 | 昆山国显光电有限公司 | A kind of display master blank and its display screen, display terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112987364A (en) * | 2019-12-13 | 2021-06-18 | 群创光电股份有限公司 | Electronic device and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| TW202022466A (en) | 2020-06-16 |
| TWI681241B (en) | 2020-01-01 |
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