CN109579789B - Vertical shaft deflection monitoring method based on inclination angle sensor - Google Patents
Vertical shaft deflection monitoring method based on inclination angle sensor Download PDFInfo
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- CN109579789B CN109579789B CN201811600525.3A CN201811600525A CN109579789B CN 109579789 B CN109579789 B CN 109579789B CN 201811600525 A CN201811600525 A CN 201811600525A CN 109579789 B CN109579789 B CN 109579789B
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 100
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- 230000001052 transient effect Effects 0.000 claims description 21
- 230000000087 stabilizing effect Effects 0.000 claims description 18
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- 238000012360 testing method Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C9/00—Measuring inclination, e.g. by clinometers, by levels
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/18—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge using photoelastic elements
Abstract
The invention discloses a vertical shaft deflection monitoring method based on an inclination sensor, which comprises the steps of arranging 2-3 datum points along a bedrock position, and installing the inclination sensor on each datum point for inspection; a plurality of measuring points are arranged on the axial wall of the main shaft, and an inclination sensor is arranged at each measuring point; the matched power supply and data transmission cable are arranged for the inclination angle sensor and the strain sensor, are grounded to the ground, and are connected with automatic acquisition equipment and a system, so that automatic and real-time acquisition is realized. The method for measuring the deflection of the vertical shaft by using the inclination sensor has the advantages of high measurement precision, 0.001 degree of resolution, 0.005 degree of full-range precision, 0.001 degree of temperature drift per DEG C, good environmental adaptability, protection level IP67, capability of normally operating in an environment of-30-85 ℃, capability of meeting the requirement of monitoring the deflection of the vertical shaft of a coal mine, and capability of transmitting sensor signals to a ground control terminal on the shaft through a main optical cable, thereby realizing automatic and real-time acquisition.
Description
Technical Field
The invention relates to the technical field of coal mine vertical shaft deflection monitoring. In particular to a vertical shaft deflection monitoring method based on an inclination angle sensor.
Background
At present, the deflection monitoring of the vertical shaft of the coal mine is carried out in China, the geometrical measurement method of deformation measurement is carried out by using the traditional suspension steel wire rope, the shaft occupation time is long, automatic monitoring cannot be realized, and the normal production of the mine is affected. The inclination sensor has many applications in vertical building deflection measurement, such as measurement of inclination angle of high-rise buildings and overhead line towers, but has not been applied and popularized in the mining field. Therefore, how to design a method for monitoring the deflection of the vertical shaft of the coal mine, and the method has the characteristics of high precision, good environmental adaptability and the like, and meeting the requirements of monitoring the deflection of the vertical shaft of the coal mine is a subject which is always researched in the field.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to provide a vertical shaft deflection monitoring method based on an inclination sensor for realizing remote, automatic and real-time acquisition.
In order to solve the technical problems, the invention provides the following technical scheme:
a vertical shaft deflection monitoring method based on an inclination angle sensor comprises the following steps:
(1) 2-3 datum points are arranged on a well wall along the bedrock position, and each datum point is provided with an inclination sensor for inspection;
(2) A plurality of measuring points are arranged on the axial wall of the main shaft, and an inclination sensor is arranged at each measuring point; comparing the data measured by the measuring point inclination sensor with the data measured by the reference point inclination sensor to determine the deflection of each measuring point; slotting on the well wall with the same level as the inclination angle sensor of the measuring point, installing a strain sensor in the slot, measuring the stress of the well wall structure according to the data acquired by the strain sensor, and further calculating the local deformation of the well shaft;
(3) Installing matched power supply and data transmission cables for the inclination angle sensor and the strain sensor, grounding the power supply and the data transmission cables to the ground, connecting automatic acquisition equipment and a system, and realizing automatic and real-time acquisition; and finally, fitting a deflection curve of the whole shaft measuring section by a least square method according to the data acquired by the inclination angle sensor.
In the vertical shaft deflection monitoring method based on the inclination sensor, in the step (2):
(2-1) arranging a plurality of monitoring fracture surfaces along the axial direction of a main well shaft, wherein the distance from the well head to the first monitoring fracture surface layer L1 is 1m-20m, and the distance between the rest monitoring fracture surfaces is 40m-100m;
(2-2) arranging measuring points along the well walls of the monitoring fracture layers, and fixedly installing inclination sensors on the well walls at the measuring points: 4 inclination angle sensors are arranged on the well wall of the first monitoring broken surface layer L1 at equal intervals; the well walls of the other monitoring broken surface layers are also provided with 4 inclination angle sensors at equal intervals, grooves are formed in the well walls at the same level, and 5 groups of strain sensors are arranged in the grooves; each group of strain sensors comprises a transverse fiber bragg grating strain sensor and a longitudinal fiber bragg grating strain sensor, and the transverse fiber bragg grating strain sensor and the longitudinal fiber bragg grating strain sensor are connected in series.
In the method for monitoring the deflection of the vertical shaft based on the inclination sensor, in the step (2-1), 8 monitoring fracture layers are arranged along the axial direction of the main shaft from-10 m to-460 m: -10m is a first monitoring breaker layer L1, -100m is a second monitoring breaker layer L2, -160m is a third monitoring breaker layer L3, -240m is a fourth monitoring breaker layer L4, -290m is a fifth monitoring breaker layer L5, -330m is a sixth monitoring breaker layer L6, -420m is a seventh monitoring breaker layer L7, -460m is an eighth monitoring breaker layer L8;
in the step (2-2), 4 inclination sensors are arranged and installed on the well wall of the first monitoring fracture layer L1 at equal intervals; 4 inclination angle sensors are also arranged and installed on the well walls of the second monitoring broken surface layer L2 to the eighth monitoring broken surface layer L8 at equal intervals, grooves are formed in the well walls at the same level at equal intervals, and 5 groups of strain sensors are installed in the grooves.
In the vertical shaft deflection monitoring method based on the inclination sensor, in the step (3):
(3-1) arranging a main optical cable and a main electric cable: after the inclination angle sensor and the strain sensor are installed, the main optical cable and the main cable are lowered from the wellhead and fixed from top to bottom along the shaft ladder room;
(3-2) the first to eighth monitoring section layers L1 to L8 are connected in series with 4 inclination sensors of each monitoring section layer by optical cables, introduced into a protection box to form a link, and then connected to a main optical cable; the 4 inclination sensors are connected in series by cables, introduced into the protection box and then connected to the main cable; the protection box is arranged near the main optical cable of the vertical shaft ladder room;
(3-3) connecting 5 groups of strain sensors of each of the second to eighth monitoring sections L2 to L8 in series with an optical cable, introducing into a protection box to form another link, and then connecting to a main optical cable; the 5 groups of strain sensors are connected in series by cables, introduced into the protection box and then connected to the main cable;
(3-4) an automatic acquisition device and system for connecting the main optical cable and the main electric cable to the ground control terminal, thereby realizing automatic and real-time acquisition.
According to the vertical shaft deflection monitoring method based on the inclination sensor, the main optical cable is a 16-core optical cable; the automatic acquisition equipment and the system of the ground control terminal are provided with a set of 15 optical channel signal processors for on-line monitoring.
The vertical shaft deflection monitoring method based on the inclination sensor comprises the following steps: the first single-axis sensing chip and the second single-axis sensing chip are arranged vertically; the first single-axis sensing chip is connected with the first buffer amplifying circuit; the second single-axis sensing chip is connected with the second buffer amplifying circuit; the first buffer amplifying circuit and the second buffer amplifying circuit are connected with the singlechip; the singlechip is connected with the signal conversion module.
According to the vertical shaft deflection monitoring method based on the inclination sensor, the inclination sensor further comprises a power supply voltage stabilizing circuit which is connected with the first single-axis sensing chip, the first buffer amplifying circuit, the second single-axis sensing chip, the second buffer amplifying circuit, the single chip microcomputer and the signal conversion module; the power supply voltage stabilizing circuit is used for providing high-quality temperature compensated 5V voltage for the first single-axis sensing chip, the first buffer amplifying circuit, the second single-axis sensing chip and the second buffer amplifying circuit, providing 3.3V voltage for the singlechip and providing 5V voltage for the signal conversion module; the input voltage of the power supply voltage stabilizing circuit outputs 3.3 volts and 5 volts through MIC5202-33YM and MIC5202-50YM, and the input voltage respectively supplies power for the singlechip and the signal conversion module; the chip 5430 outputs 5 volts, and the REF02AU outputs high-quality 5 volts to supply power to the first single-axis sensing chip, the first buffer amplifying circuit, the second single-axis sensing chip and the second buffer amplifying circuit.
According to the vertical shaft deflection monitoring method based on the inclination sensor, the first single-axis sensing chip and/or the second single-axis sensing chip are SCA103T_D04 chips;
the terminal pins 6, 9 and 10 of the first single-axis inclination angle sensing chip are grounded together, the terminal pin 12 is connected with 5 volts, the terminal pin 11 is connected with the first buffer amplifying circuit through a resistor R1, and the terminal pin 5 is connected with the first buffer amplifying circuit through a resistor R5;
the pins 6, 9 and 10 of the second single-axis inclination angle sensing chip are grounded together, the pin 12 is grounded through a capacitor C1, the pin 11 is grounded through a resistor R10 and connected with the second buffer amplifying circuit, and the pin 5 is grounded through a resistor R15 and connected with the second buffer amplifying circuit.
In the vertical shaft deflection monitoring method based on the inclination sensor, the first buffer amplifying circuit and/or the second buffer amplifying circuit is/are OP284;
the terminal pin 3 and the terminal pin 5 of the first buffer amplifying circuit are respectively grounded through a capacitor C4 and a capacitor C2, the terminal pin 4 is grounded, and the terminal pin 8 is connected with 5 volts and is grounded through the capacitor C5; the terminal pin 1 and the terminal pin 2 are grounded through a resistor R2 and a resistor R3 after being short-circuited, the middle joint of the resistor R2 and the resistor R3 is connected to the singlechip, the terminal pin 6 and the terminal pin 7 are grounded through a resistor R6 and a resistor R8 after being short-circuited, and the middle joint of the resistor R6 and the resistor R8 is connected to the singlechip;
the terminal pin 3 and the terminal pin 5 of the second buffer amplifying circuit are respectively grounded through a capacitor C10 and a capacitor C11, the terminal pin 4 is grounded, the terminal pin 8 is grounded through a capacitor C30, the terminal pins 1 and 2 are grounded through a resistor R11 and a resistor R12 after being short-circuited, the middle contact points of the resistor R11 and the resistor R12 are connected to the singlechip, the terminal pin 6 and the terminal pin 7 are grounded through a resistor R16 and a resistor R17 after being short-circuited, and the middle contact points of the resistor R16 and the resistor R17 are connected to the singlechip.
According to the vertical shaft deflection monitoring method based on the inclination sensor, the singlechip is a C8051F350 chip; the terminal pin 21 of the singlechip is connected to 3.3 volts, the terminal pin 21 is grounded through a capacitor C6, the terminal pin 9 and the terminal pin 32 are grounded, the terminal pin 11 and the terminal pin 12 are respectively connected to the terminal pin 3 and the terminal pin 2 of the simulation downloading device in sequence, the terminal pin 1 of the simulation downloading device is grounded, and the terminal pin 2 of the simulation downloading device is connected to 3.3 volts through a resistor R14; the terminal pin 1, the terminal pin 2, the terminal pin 7 and the terminal pin 8 are respectively the output voltages of the first buffer amplifying circuit and the second buffer amplifying circuit, the terminal pin 10 is connected with 3.3 volts, the terminal pin 19 is connected with the base electrode of the triode Q1, and the terminal pin 17 and the terminal pin 18 are connected with the signal conversion module; the terminal pin 15, the terminal pin 16, the resistor R13 and the crystal oscillator Y1 are indirectly connected, the connection end of the crystal oscillator Y1 and the terminal pin 15 is grounded through a capacitor C12, and the connection end of the crystal oscillator Y1 and the terminal pin 16 is grounded through the capacitor C13; terminal 23 is connected to 3.3 volts via resistor R9, terminal 28 is connected to ground via resistor R22, terminal 31 is connected to ground via resistor R7, and is connected to 5 volts via resistor R4;
the signal conversion module is an HVD 888 chip; the terminal pin 1 and the terminal pin 4 of the HVD 888 chip are connected with the singlechip, the terminal pin 2 and the terminal pin 3 are short-circuited and connected with 5V voltage through a resistor R21, the short-circuited points of the terminal pin 2 and the terminal pin 3 are simultaneously connected with the emitter of a triode Q1, and the collector of the triode Q1 is grounded; the terminal pin 5 is grounded, the terminal pin 8 is grounded through a capacitor C16, the terminal pin 6 is connected with the signal output end A, and the terminal pin 7 is connected with the signal output end B; the point between the terminal pin 6 and the terminal pin 7 is connected with a bidirectional transient suppression tube D3, the point between the bidirectional transient suppression tube D3 and the terminal pin 7 is connected with a bidirectional transient suppression tube D4 and then grounded, the point between the bidirectional transient suppression tube D3 and the terminal pin 7 is connected with a resistor R24 and then grounded, the point between the bidirectional transient suppression tube D3 and the terminal pin 6 is connected with a bidirectional transient suppression tube D2 and then grounded, and the point between the bidirectional transient suppression tube D3 and the terminal pin 6 is connected with a resistor R19 and then connected with a resistor R18 and then connected with 5V voltage.
The technical scheme of the invention has the following beneficial technical effects:
the inclination sensor for monitoring the deflection of the vertical shaft of the coal mine can be arranged on a shaft wall structure, can measure the inclination angle of the shaft structure in space, can measure the inclination angle variation of the shaft along the central line direction, obtains deflection data of the shaft structure through conversion, has high measurement precision, has the resolution of 0.001 DEG, the precision of the whole range of 0.005 DEG and the temperature drift of 0.001 DEG/DEG C, has good environmental adaptability and protection level IP67, can normally operate in the environment of-30-85 ℃ and can meet the requirement of monitoring the deflection of the vertical shaft of the coal mine.
In addition, in order to ensure that the inclination angle sensing chip works in an optimal state, the chip power supply is independently designed, and accurate power supply voltage with high temperature stability is selected. In order to be suitable for severe working environments, the sensor is guaranteed to work stably for a long time by adopting a high sealing structure design. Has good rainproof, dustproof, moisture-proof, smog-proof and mildew-proof capabilities.
After the inclination sensor and the strain sensor are connected, sensor signals are transmitted to a ground control terminal on the well through a main optical cable, and a tester can realize ground test at the well mouth through automatic acquisition equipment and a system, so that automatic and real-time acquisition is realized.
Drawings
FIG. 1 is a schematic diagram of a well section monitoring point arrangement of a vertical well bore deflection monitoring method based on an inclination sensor;
FIG. 2 is a schematic diagram of a wellbore monitoring section layer measuring point sensor arrangement of a vertical wellbore deviation monitoring method based on an inclination sensor of the present invention;
FIG. 3 is a schematic diagram of a tilt sensor of the tilt sensor-based method for monitoring vertical wellbore deviation of the present invention;
FIG. 4 is a schematic diagram of a tilt sensor-based method for vertical wellbore deviation monitoring according to the present invention (another embodiment);
FIG. 5 is a circuit diagram of a tilt sensor power supply voltage stabilizing circuit of the tilt sensor-based vertical shaft deflection monitoring method of the present invention;
FIG. 6 is a circuit diagram of a first single-axis sensing chip and a first buffer amplifying circuit of an inclination sensor based on an inclination sensor of a vertical shaft deflection monitoring method of the invention;
FIG. 7 is a circuit diagram of a second single-axis sensing chip and a second buffer amplifying circuit of the tilt sensor based on the tilt sensor vertical shaft deflection monitoring method;
FIG. 8 is a circuit diagram of a single-chip microcomputer of an inclination sensor of the vertical shaft deflection monitoring method based on the inclination sensor;
FIG. 9 is a circuit diagram of a tilt sensor signal conversion module of a tilt sensor-based vertical wellbore deviation monitoring method of the present invention.
The reference numerals in the drawings are as follows: 1-an inclination sensor; 2-a transverse fiber bragg grating strain sensor; 3-a longitudinal fiber bragg grating strain sensor; 4, a well wall; 5-a primary optical cable; 6-main cable; 7-a ground control terminal; 10-a first single axis sense die; 20-a second single axis sense die; 30-a first buffer amplifying circuit; 40-a second buffer amplifying circuit; 50-a singlechip; a 60-signal conversion module; 70-power supply voltage stabilizing circuit.
Detailed Description
The invention relates to a principle of a vertical shaft deflection monitoring method, which comprises the following steps: and a section of one side of the shaft structure is assumed to be a section of fixed cantilever beam, when the well wall deflects under the action of additional stress, the inclination angle of the measuring point is measured by an inclination angle sensor, and the deflection quantity of the shaft of the measuring section can be obtained by calculation. The more the number of the sensors is, the higher the measurement accuracy is, and finally, the deflection curve of the whole shaft measurement section is fitted through a least square method. Compared with the traditional measuring method, the inclination angle sensor can be used for directly measuring the relative displacement change condition of each position of the shaft.
Based on the principle of a monitoring method, the vertical shaft deflection monitoring method based on the inclination sensor comprises the following steps:
(1) 2-3 datum points are arranged on a well wall along the bedrock position, and each datum point is provided with an inclination sensor for inspection;
(2) A plurality of measuring points are arranged on the axial wall of the main shaft, and an inclination sensor is arranged at each measuring point; comparing the data measured by the measuring point inclination sensor with the data measured by the reference point inclination sensor to determine the deflection of each measuring point; slotting on the well wall with the same level as the inclination angle sensor of the measuring point, installing a strain sensor in the slot, measuring the stress of the well wall structure according to the data acquired by the strain sensor, and further calculating the local deformation of the well shaft; the height of the shaft of the embodiment is-10 m to-460 m;
in the step (2-1), 8 monitoring fracture layers are arranged along the axial direction of a main well shaft of-10 m to-460 m: -10m is a first monitoring breaker layer L1, -100m is a second monitoring breaker layer L2, -160m is a third monitoring breaker layer L3, -240m is a fourth monitoring breaker layer L4, -290m is a fifth monitoring breaker layer L5, -330m is a sixth monitoring breaker layer L6, -420m is a seventh monitoring breaker layer L7, -460m is an eighth monitoring breaker layer L8; as shown in fig. 1 and 2.
In the step (2-2), 4 inclination sensors 2 are arranged and installed on the well wall 4 of the first layer L1 at equal intervals; 4 inclination angle sensors 1 are also arranged and installed on the well wall 4 of the second layer L2 to the eighth layer L8 at equal intervals, grooves are formed in the well wall at the same level at equal intervals, and 5 groups of strain sensors are installed in the grooves; each group of strain sensors comprises a transverse fiber bragg grating strain sensor 2 and a longitudinal fiber bragg grating strain sensor 3, and the transverse fiber bragg grating strain sensor 2 and the longitudinal fiber bragg grating strain sensor 3 are connected in series; the arrangement of the monitoring section measuring points of the second layer L2 to the eighth layer L8 is shown in figure 2. The whole shaft needs to be provided with 32 inclination sensors.
(3) The matched power supply and data transmission cable are arranged for the inclination angle sensor and the strain sensor, the ground is connected to the ground, and the automatic acquisition equipment and the system are connected, so that automatic and real-time acquisition is realized; and finally, fitting a deflection curve of the whole shaft measuring section by a least square method according to the data acquired by the inclination angle sensor.
(3-1) arranging the main optical cable 5 and the main cable 6: after the slotting installation of the inclination angle sensor 1 and the strain sensor is completed, the main optical cable 5 and the main cable 6 are lowered from a wellhead and fixed from top to bottom along a shaft ladder room;
(3-2) the 4 inclination sensors 1 of each of the first to eighth monitoring section layers L1 to L8 are connected in series with cables, introduced into a protection box to form a link, and then connected to the main optical cable 5;4 inclination sensors 1 are connected in series by cables, introduced into a protection box and then connected to a main cable 6; the protection box is arranged near the main optical cable 5 of the vertical shaft ladder room;
(3-3) the 5 sets of strain sensors of each of the second to eighth monitoring section layers L2 to L8 are connected in series with an optical cable, introduced into a protection box to form another link, and then connected to the main optical cable 5; the strain sensors of group 5 are connected in series by cables, introduced into a protection box and then connected to a main cable 6;
(3-4) automatic acquisition devices and systems connecting the main optical cable 5 and the main electric cable 6 to the ground control terminal 7, realizing automatic, real-time acquisition. After the inclination sensor 1 and the strain sensor are connected, sensor signals are transmitted to the ground control terminal 7 on the well through the main optical cable, and finally, testers fit the deflection curve of the whole shaft measuring section through a least square method according to the collected inclination sensor data of the automatic collecting equipment and the system, so that the ground test at the well mouth can be realized.
The main optical cable 5 is a 16-core optical cable, and can meet the normal collection work of 100 strain sensors; the automatic acquisition equipment and the system of the ground control terminal 7 are provided with a set of 15 optical channel signal processors for on-line monitoring, 12 channels are used in total, and 3 channels are reserved.
The tilt sensor 1 critical to the present invention, as shown in fig. 3, comprises a first single-axis sensor chip 10 and a second single-axis sensor chip 20 which are disposed vertically to each other, for example, the first single-axis sensor chip 10 is disposed vertically and the second single-axis sensor chip 20 is disposed horizontally; the first uniaxial sensing chip 10 is connected with the first buffer amplifying circuit 30; the second uniaxial sensing chip 20 is connected with a second buffer amplifying circuit 40; the first buffer circuit 30 and the second buffer circuit 40 are connected with the singlechip 50; the singlechip 50 is connected with the signal conversion module 60.
The inclination sensor 1 is placed in the sensing elements in the first single-axis sensing chip 10 and the second single-axis sensing chip 20 to convert the acceleration value into two paths of voltage signals, and the voltage signals are subjected to impedance matching through the first buffer amplifying circuit 30 and the second buffer amplifying circuit 40, so that the signal quality is improved. The single-chip microcomputer 50 is provided with an A/D sampling channel, signals output by the first buffer amplifying circuit 30 and the second buffer amplifying circuit 40 are sampled by the A/D sampling channel of the single-chip microcomputer 50 and then calculated to obtain an inclination angle value, and finally the signals are output to the automatic acquisition equipment and the system of the ground control terminal 7 through a main optical cable by the signal conversion module 60.
As shown in fig. 4, on the basis of the embodiment corresponding to fig. 3, the tilt sensor 1 further includes a power voltage stabilizing circuit 70 connected to the first single-axis sensor chip 10, the first buffer amplifying circuit 30, the second single-axis sensor chip/20, the second buffer amplifying circuit 40, the single-chip microcomputer 50, and the signal converting module 60. The single-chip microcomputer is used for providing high-quality temperature compensated 5V voltage for the first single-axis sensing chip 10, the first buffer amplifying circuit 30, the second single-axis sensing chip 20 and the second buffer amplifying circuit 40, 3.3V voltage for the single-chip microcomputer and 5V voltage for the signal conversion module.
More specifically, as shown in fig. 5, the input voltage Vin of the power supply voltage stabilizing circuit 70 outputs 3.3 v through MIC5202-33YM to supply power to the single chip microcomputer, and the input voltage Vin of the power supply voltage stabilizing circuit outputs 5 v through MIC5202-50YM to supply power to the signal conversion module 60. The input voltage Vin of the power supply voltage stabilizing circuit 70 is output by 5430 for 5 volts, and is subjected to temperature compensation by REF02AU for outputting high-quality 5 volts to supply power to the first single-axis sensing chip 10, the first buffer amplifying circuit 30, the second single-axis sensing chip 20 and the second buffer amplifying circuit 40.
As shown in fig. 6 and 7, the first uniaxial sensing chip 10 and/or the second uniaxial sensing chip 20 is a SCA103t_d04 chip. The first buffer amplifying circuit 30 and/or the second buffer amplifying circuit 40 is OP284.
As shown in fig. 6; when the first uniaxial sensing chip 10 is a SCA103t_d04 chip and the first buffer amplifying circuit 30 is an OP284, as shown in fig. 6, the SCA103t_d04 chip has 12 pins. The terminal pin 6, the terminal pin 9 and the terminal pin 10 are grounded together, the terminal pin 12 is connected with 5 volts, the terminal pin 11 is connected with the terminal pin 5 of the first buffer amplifying circuit OP284 through a resistor R1, and the terminal pin 5 is connected with the terminal pin 3 of the first buffer amplifying circuit OP284 through the resistor R5. The terminal pin 3 and the terminal pin 5 of the first buffer amplifying circuit are respectively grounded through a capacitor C4 and a capacitor C2, the terminal pin 4 is grounded, and the terminal pin 8 is connected with 5 volts and grounded through the capacitor C5; the terminal pins 1 and 2 are grounded through the resistor R2 and the resistor R3 after being short-circuited, the middle joint of the resistor R2 and the resistor R3 is connected to the singlechip, the terminal pin 6 and the terminal pin 7 are grounded through the resistor R6 and the resistor R8 after being short-circuited, and the middle joint of the resistor R6 and the resistor R8 is connected to the singlechip.
When the second single-axis sensor chip is the SCA103t_d04 chip and the second buffer amplifying circuit is the OP284, as shown in fig. 7, the second single-axis tilt sensor chip has 12 pins, pin 6, pin 9, pin 10 are grounded together, pin 12 is grounded at 5 v, and is grounded through capacitor C1, pin 11 is connected to pin 3 of the second buffer amplifying circuit OP284 through resistor R10, and pin 5 is connected to pin 5 of the second buffer amplifying circuit OP284 through resistor R15. The terminal pin 3 and the terminal pin 5 of the second buffer amplifying circuit OP284 are respectively grounded through a capacitor C10 and a capacitor C11, the terminal pin 4 is grounded, the terminal pin 8 is grounded through a capacitor C30, the terminal pins 1 and 2 are grounded through a resistor R11 and a resistor R12 after being short-circuited, the middle contact point of the resistor R11 and the resistor R12 is connected to the singlechip, the terminal pin 6 and the terminal pin 7 are grounded through a resistor R16 and a resistor R17 after being short-circuited, and the middle contact point of the resistor R16 and the resistor R17 is connected to the singlechip.
The singlechip is a C8051F350 chip. As shown in fig. 8, the single chip microcomputer has 32 terminal pins. The terminal pin 21 of the singlechip is connected to the 3.3 volt output end of the power supply voltage stabilizing circuit, the terminal pin 21 is grounded through a capacitor C6, the terminal pin 9 and the terminal pin 32 are grounded, the terminal pin 11 and the terminal pin 12 are respectively connected to the terminal pin 3 and the terminal pin 2 of the emulation downloading device in sequence, the terminal pin 1 of the emulation downloading device is grounded, and the terminal pin 2 of the emulation downloading device is connected to the 3.3 volt output end of the power supply voltage stabilizing circuit through a resistor R14. The terminal pin 1, the terminal pin 2, the terminal pin 7 and the terminal pin 8 of the singlechip are respectively connected with the output voltages Yout1 and Yout2 of the first buffer amplifying circuit and the output voltages XOut1 and XOut2 of the second buffer amplifying circuit, the terminal pin 10 is connected with 3.3 volts for supplying power to the analog signal module, the terminal pin 19 is connected with the base electrode of the triode Q1, and the terminal pin 17 and the terminal pin 18 are connected with the signal conversion module. The terminal pin 15 and the terminal pin 16 are connected with a resistor R13 and a crystal oscillator Y1, the connection end of the crystal oscillator Y1 and the terminal pin 15 is grounded through a capacitor C12, and the connection end of the crystal oscillator Y1 and the terminal pin 16 is grounded through the capacitor C13. The terminal pin 23 is connected with the 3.3 volt output end of the power supply voltage stabilizing circuit through the resistor R9, the terminal pin 28 is grounded through the resistor R22, the terminal pin 31 is grounded through the resistor R7, and the terminal pin is connected with the 5 volt output end of the power supply voltage stabilizing circuit through the resistor R4.
In specific implementation, the signal conversion module is an HVD 888 chip; as shown in fig. 9, the pins 1 and 4 of the HVD 888 chip are connected with the singlechip, the pins 2 and 3 are short-circuited and connected with the 5 volt output end of the power supply voltage stabilizing circuit through the resistor R21, the short-circuited points of the pins 2 and 3 are simultaneously connected with the emitter of the triode Q1, and the collector of the triode Q1 is grounded; the terminal pin 5 is grounded, the terminal pin 8 is grounded through a capacitor C16, the terminal pin 6 is connected with the signal output end A, and the terminal pin 7 is connected with the signal output end B; the point between the terminal pin 6 and the terminal pin 7 is connected with a bidirectional transient state restraining tube D3, the point between the bidirectional transient state restraining tube D3 and the terminal pin 7 is connected with a bidirectional transient state restraining tube D4 and then grounded, the point between the bidirectional transient state restraining tube D3 and the terminal pin 7 is connected with a resistor R24 and then grounded, the point between the bidirectional transient state restraining tube D3 and the terminal pin 6 is connected with a bidirectional transient state restraining tube D2 and then grounded, and the point between the bidirectional transient state restraining tube D3 and the terminal pin 6 is connected with a resistor R19 and then connected with a resistor R18 and then connected with a 5V voltage output end of the power supply stabilizing circuit.
The inclination sensor for monitoring the deflection of the vertical shaft of the coal mine can be arranged on a shaft wall structure, can measure the inclination angle of the shaft structure in space, can measure the inclination angle variation of the shaft along the central line direction, obtains deflection data of the shaft structure through conversion, has high measurement precision, has the resolution of 0.001 DEG, the precision of the whole range of 0.005 DEG and the temperature drift of 0.001 DEG/DEG C, has good environmental adaptability and protection level IP67, can normally operate in the environment of-30-85 ℃ and can meet the requirement of monitoring the deflection of the vertical shaft of the coal mine. In addition, in order to ensure that the single-axis inclination angle sensing chip works in an optimal state, the chip power supply is independently designed, and accurate power supply voltage with high temperature stability is selected. In order to be suitable for severe working environments, the sensor is guaranteed to work stably for a long time by adopting a high sealing structure design. Has good rainproof, dustproof, moisture-proof, smog-proof and mildew-proof capabilities.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While the obvious variations or modifications which are extended therefrom remain within the scope of the claims of this patent application.
Claims (5)
1. The vertical shaft deflection monitoring method based on the inclination angle sensor is characterized by comprising the following steps of:
(1) 2-3 datum points are arranged on a well wall along the bedrock position, and each datum point is provided with an inclination sensor for inspection;
(2) A plurality of measuring points are arranged on the axial wall of the main shaft, and an inclination sensor is arranged at each measuring point; comparing the data measured by the measuring point inclination sensor with the data measured by the reference point inclination sensor to determine the deflection of each measuring point; slotting on the well wall with the same level as the inclination angle sensor of the measuring point, installing a strain sensor in the slot, measuring the stress of the well wall structure according to the data acquired by the strain sensor, and further calculating the local deformation of the well shaft;
(2-1) arranging a plurality of monitoring fracture surfaces along the axial direction of a main well shaft, wherein the distance from the well head to the first monitoring fracture surface layer L1 is 1m-20m, and the distance between the rest monitoring fracture surfaces is 40m-100m;
(2-2) arranging measuring points along the well walls of the monitoring fracture surface layers, and fixedly installing inclination angle sensors (1) on the well walls at the measuring points: 4 inclination angle sensors (1) are arranged on a well wall (4) of the first monitoring fracture surface layer L1 at equal intervals along the circumferential direction of a well shaft; the well walls (4) of the other monitoring fracture surface layers are also provided with 4 inclination angle sensors (1) at equal intervals along the circumferential direction of the well shaft, 5 grooves are formed in the well wall at the same level along the circumferential direction of the well shaft, and 1 group of strain sensors are arranged in each of the 5 grooves; each group of strain sensors comprises a transverse fiber bragg grating strain sensor (2) and a longitudinal fiber bragg grating strain sensor (3), and the transverse fiber bragg grating strain sensors (2) and the longitudinal fiber bragg grating strain sensors (3) are connected in series;
(3) Installing matched power supply and data transmission cables for the inclination angle sensor and the strain sensor, grounding the power supply and the data transmission cables to the ground, connecting automatic acquisition equipment and a system, and realizing automatic and real-time acquisition; finally, fitting a deflection curve of the whole shaft measuring section through a least square method according to the data acquired by the inclination angle sensor;
the tilt sensor (1) comprises: a first uniaxial sensing chip (10) and a second uniaxial sensing chip (20) which are mutually and perpendicularly placed; the first single-axis sensing chip (10) is connected with the first buffer amplifying circuit (30); the second single-axis sensing chip (20) is connected with a second buffer amplifying circuit (40); the first buffer amplifying circuit (30) and the second buffer amplifying circuit (40) are connected with the singlechip (50); the singlechip (50) is connected with the signal conversion module (60);
the inclination sensor (1) further comprises a power supply voltage stabilizing circuit (70) which is connected with the first single-axis sensing chip (10), the first buffer amplifying circuit (30), the second single-axis sensing chip (20), the second buffer amplifying circuit (40), the singlechip (50) and the signal conversion module (60); the power supply voltage stabilizing circuit (70) is used for providing temperature-compensated 5-volt voltage for the first single-axis sensing chip (10), the first buffer amplifying circuit (30), the second single-axis sensing chip (20) and the second buffer amplifying circuit (40), providing 3.3-volt voltage for the singlechip (50) and providing 5-volt voltage for the signal conversion module (60); the input voltage of the power supply voltage stabilizing circuit (70) outputs 3.3 volts and 5 volts through MIC5202-33YM and MIC5202-50YM, and the power supply voltage is respectively supplied to the singlechip (50) and the signal conversion module (60); after 5 volts is output by the chip 5430 and subjected to temperature compensation by the REF02AU, 5 volts is output to supply power (40) for the first single-axis sensing chip (10), the first buffer amplifying circuit (30), the second single-axis sensing chip (20) and the second buffer amplifying circuit;
the first single-axis sensing chip (10) and/or the second single-axis sensing chip (20) are SCA103T_D04 chips;
the terminal pin 6, the terminal pin 9 and the terminal pin 10 of the first single-axis sensing chip (10) are grounded together, the terminal pin 12 is connected with 5V voltage, the terminal pin 11 is connected with the first buffer amplifying circuit (30) through a resistor R1, and the terminal pin 5 is connected with the first buffer amplifying circuit (30) through a resistor R5;
the terminal pin 6, the terminal pin 9 and the terminal pin 10 of the second single-axis sensing chip (20) are grounded together, the terminal pin 12 is grounded through a capacitor C1, the terminal pin 11 is grounded through a resistor R10 and connected with the second buffer amplifying circuit (40), and the terminal pin 5 is connected with the second buffer amplifying circuit (40) through a resistor R15;
the first buffer amplifying circuit (30) and/or the second buffer amplifying circuit (40) is/are OP284;
the terminal pin 3 and the terminal pin 5 of the first buffer amplifying circuit (30) are respectively grounded through a capacitor C4 and a capacitor C2, the terminal pin 4 is grounded, and the terminal pin 8 is grounded through a capacitor C5 at a voltage of 5 volts; the terminal pin 1 and the terminal pin 2 are grounded through a resistor R2 and a resistor R3 after being short-circuited, the middle joint of the resistor R2 and the resistor R3 is connected to the singlechip, the terminal pin 6 and the terminal pin 7 are grounded through a resistor R6 and a resistor R8 after being short-circuited, and the middle joint of the resistor R6 and the resistor R8 is connected to the singlechip;
the terminal pin 3 and the terminal pin 5 of the second buffer amplifying circuit (40) are respectively grounded through a capacitor C10 and a capacitor C11, the terminal pin 4 is grounded, the terminal pin 8 is grounded through a capacitor C30, the terminal pins 1 and 2 are grounded through a resistor R11 and a resistor R12 after being short-circuited, the middle joint of the resistor R11 and the resistor R12 is connected to the singlechip, the terminal pin 6 and the terminal pin 7 are grounded through a resistor R16 and a resistor R17 after being short-circuited, and the middle joint of the resistor R16 and the resistor R17 is connected to the singlechip.
2. The method for tilt sensor-based vertical wellbore deviation monitoring of claim 1,
in the step (2-1), 8 monitoring fracture layers are arranged along the axial direction of a main well shaft of-10 m to-460 m: -10m is a first monitoring breaker layer L1, -100m is a second monitoring breaker layer L2, -160m is a third monitoring breaker layer L3, -240m is a fourth monitoring breaker layer L4, -290m is a fifth monitoring breaker layer L5, -330m is a sixth monitoring breaker layer L6, -420m is a seventh monitoring breaker layer L7, -460m is an eighth monitoring breaker layer L8;
in the step (2-2), 4 inclination sensors (1) are arranged on a well wall (4) of a first monitoring fracture layer L1 at equal intervals along the circumferential direction of a well shaft; 4 inclination angle sensors (1) are also arranged and installed on the well wall (4) of the second monitoring fracture surface layer L2-eighth monitoring fracture surface layer L8 at equal intervals along the circumferential direction of the well shaft, 5 grooves are formed in the well wall at the same level at equal intervals along the circumferential direction of the well shaft, and 1 group of strain sensors are installed in each groove of the 5 grooves.
3. The tilt sensor based vertical wellbore deviation monitoring method of claim 1, wherein in step (3):
(3-1) arranging a main optical cable (5) and a main cable (6): after the inclination angle sensor (1) and the strain sensor are installed, a main optical cable (5) and a main cable (6) are lowered from a wellhead and fixed from top to bottom along a shaft ladder compartment;
(3-2) the first to eighth monitoring section layers L1 to L8 each of which has 4 inclination sensors (1) connected in series with optical cables, are introduced into a protection box to form a link, and then are connected to a main optical cable (5); the 4 inclination sensors (1) are connected in series by cables, are led into a protection box, and then are connected to a main cable (6); the protection box is arranged near a main optical cable (5) of the vertical shaft ladder room;
(3-3) the 5 groups of strain sensors of each of the second to eighth monitoring section layers L2 to L8 are connected in series with an optical cable, introduced into a protection box, formed into another link, and then connected to the main optical cable (5); and 5 groups of strain sensors are connected in series by cables, introduced into a protection box and then connected to a main cable (6);
and (3-4) connecting the main optical cable (5) and the main cable (6) to an automatic acquisition device and system of a ground control terminal (7) to realize automatic and real-time acquisition.
4. A vertical shaft deviation monitoring method based on inclination sensor according to claim 3, characterized in that the main optical cable (5) is a 16-core optical cable; the automatic acquisition equipment and the system of the ground control terminal (7) are provided with a set of 15 optical channel signal processors for on-line monitoring.
5. The tilt sensor-based vertical shaft deflection monitoring method of claim 1, wherein the single chip microcomputer (50) is a C8051F350 chip; the terminal pin 21 of the singlechip (50) is connected to 3.3V voltage, the terminal pin 21 is grounded through the capacitor C6, the terminal pin 9 and the terminal pin 32 of the singlechip (50) are grounded, the terminal pin 11 and the terminal pin 12 of the singlechip (50) are respectively connected to the terminal pin 3 and the terminal pin 2 of the simulation downloading device in sequence, the terminal pin 1 of the simulation downloading device is grounded, and the terminal pin 2 of the simulation downloading device is connected to 3.3V voltage through the resistor R14; the terminal pin 1, the terminal pin 2, the terminal pin 7 and the terminal pin 8 of the single chip microcomputer (50) are respectively connected with the first buffer amplifying circuit (30) and the second buffer amplifying circuit (40), the terminal pin 10 of the single chip microcomputer (50) is connected with 3.3 volts, the terminal pin 19 of the single chip microcomputer (50) is connected with the base electrode of the triode Q1, and the terminal pin 17 and the terminal pin 18 of the single chip microcomputer (50) are connected with the signal conversion module (60); the terminal pin 15, the terminal pin 16 of the singlechip (50) are connected with the resistor R13 and the crystal oscillator Y1 indirectly, the connection end of the crystal oscillator Y1 and the terminal pin 15 is grounded through a capacitor C12, and the connection end of the crystal oscillator Y1 and the terminal pin 16 is grounded through the capacitor C13; the terminal pin 23 of the singlechip (50) is connected with 3.3 volts through a resistor R9, the terminal pin 28 of the singlechip (50) is grounded through a resistor R22, the terminal pin 31 of the singlechip (50) is grounded through a resistor R7, and the voltage is connected with 5 volts through a resistor R4;
the signal conversion module (60) is an HVD 888 chip; the terminal pin 1 and the terminal pin 4 of the HVD 888 chip are connected with the singlechip (50), the terminal pin 2 and the terminal pin 3 are short-circuited and connected with 5V voltage through a resistor R21, the short-circuited points of the terminal pin 2 and the terminal pin 3 are simultaneously connected with the emitter of the triode Q1, and the collector of the triode Q1 is grounded; the terminal pin 5 is grounded, the terminal pin 8 is grounded through a capacitor C16, the terminal pin 6 is connected with the signal output end A, and the terminal pin 7 is connected with the signal output end B; the point between the terminal pin 6 and the terminal pin 7 is connected with a bidirectional transient suppression tube D3, the point between the bidirectional transient suppression tube D3 and the terminal pin 7 is connected with a bidirectional transient suppression tube D4 and then grounded, the point between the bidirectional transient suppression tube D3 and the terminal pin 7 is connected with a resistor R24 and then grounded, the point between the bidirectional transient suppression tube D3 and the terminal pin 6 is connected with a bidirectional transient suppression tube D2 and then grounded, and the point between the bidirectional transient suppression tube D3 and the terminal pin 6 is connected with a resistor R19 and then connected with a resistor R18 and then connected with 5V voltage.
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