CN109567312A - It is a kind of to be integrally formed transparent dual-density sole and its production technology - Google Patents
It is a kind of to be integrally formed transparent dual-density sole and its production technology Download PDFInfo
- Publication number
- CN109567312A CN109567312A CN201910004024.7A CN201910004024A CN109567312A CN 109567312 A CN109567312 A CN 109567312A CN 201910004024 A CN201910004024 A CN 201910004024A CN 109567312 A CN109567312 A CN 109567312A
- Authority
- CN
- China
- Prior art keywords
- outer cladding
- etpu
- cpu
- integrally formed
- die head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/02—Soles; Sole-and-heel integral units characterised by the material
- A43B13/04—Plastics, rubber or vulcanised fibre
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/14—Soles; Sole-and-heel integral units characterised by the constructive form
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/14—Soles; Sole-and-heel integral units characterised by the constructive form
- A43B13/16—Pieced soles
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/14—Soles; Sole-and-heel integral units characterised by the constructive form
- A43B13/18—Resilient soles
- A43B13/187—Resiliency achieved by the features of the material, e.g. foam, non liquid materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D35/00—Producing footwear
- B29D35/12—Producing parts thereof, e.g. soles, heels, uppers, by a moulding technique
- B29D35/122—Soles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D35/00—Producing footwear
- B29D35/12—Producing parts thereof, e.g. soles, heels, uppers, by a moulding technique
- B29D35/128—Moulds or apparatus therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
Abstract
The present invention, which discloses, a kind of is integrally formed transparent dual-density sole and its production technology, it is described to be integrally formed transparent dual-density sole, including CPU outer cladding body and it is located at the intracorporal ETPU buffer layer of CPU outer cladding, the CPU outer cladding body has bottom surface and the prominent side for being molded over bottom surface surrounding of one, the bottom surface and side form cavity, and the ETPU buffer layer is made of using ETPU particle and PU glue form.Compared with prior art, the present invention has easy to clean, without processing and the high feature of product specification of additionally painting.
Description
Technical field
The present invention relates to sole fields, and in particular to be a kind of to be integrally formed transparent dual-density sole and its production work
Skill.
Background technique
The high-quality performance as specific to TPU material, TPU material are applied to have within 2 years at this and are advanced by leaps and bounds as sole
Development, for footwear material other than its distinctive performance is fastidious, aesthetic appearance is also the very distinctive one side in footwear material field.
Existing etpu puffed rice sole in the market, is generally divided into two kinds, and one is passed through in a mold using etpu particle
It crosses vapor foaming and obtains damping sheet material later, then brush one layer of glue in damping sheet material bottom again, and pass through the glue
Layer and connect one layer of rubber layer, be thusly-formed wear-resisting, on-slip and in terms of equal performance preferable soles.Another kind is
Be heating and curing the damping indsole to be formed after being adequately mixed together using etpu particle and various glue (such as PU glue), this
Damping indsole utilizes the damping performance of etpu particle itself, and the glue is then wherein to play the role of each particle of connection.
First method is due to being to use vapor foaming, and connection is not especially tight between adjacent etpu particle
It is close, i.e., there is also gap between adjacent etpu particle so that damping sheet material outer surface do not allow it is easy to clean, it is often necessary to volume again
One layer of paint of outer brush, stops extraneous dust to enter in gap, it is ensured that convenience of the people in routine use by painting.
Second method then aesthetically shows in appearance relatively inferior, leverages the sales performance of product, in view of this, this
Applicant furthers investigate regarding to the issue above, there is this case generation then.
Summary of the invention
It is integrally formed transparent dual-density sole and its production technology the main purpose of the present invention is to provide a kind of, to solve
Cleaning inconvenience exists in the prior art, also needs to carry out the problem that additionally spray painting is handled and product specification is lower.
In order to achieve the above objectives, solution of the invention is:
It is a kind of to be integrally formed transparent dual-density sole, wherein including CPU outer cladding body and to be located in CPU outer cladding body
ETPU buffer layer, the CPU outer cladding body has bottom surface and the prominent side for being molded over bottom surface surrounding of one, the bottom surface
And side forms cavity, the ETPU buffer layer is made of using ETPU particle and PU glue form.
Further, several loss of weight blind holes are also formed on the ETPU buffer layer.
Further, the height of the ETPU buffer layer is lower than the height of CPU outer cladding body side surface.
Another object of the present invention is to provide a kind of production technologies for being integrally formed transparent dual-density sole, wherein packet
Include following steps:
1. carrying out vacuumize process to the liquid CPU material stirred evenly, then pour into molding die, through using the first mould
After head molding, transparent type shell is molded, obtains CPU outer cladding body, the CPU outer cladding body has bottom surface and one prominent
It is molded over the side of bottom surface surrounding out, the bottom surface and side form cavity；
2. being fed into the mixture of ETPU particle and PU glue in the cavity of CPU outer cladding body, it is molded using the second die head
Later, transparent dual-density sole is molded.
Further, second die head is molded over the back side of the first die head, and the thickness of second die head is less than the first mould
The thickness of head, first die head and the second die head are connected on the pedestal of molding die by turning joint.
Further, the step 1. in the temperature of liquid CPU material be 30-60 DEG C, the temperature of the molding die is 60-
70℃。
After adopting the above structure, it is integrally formed transparent dual-density sole and its production technology the present invention relates to a kind of, until
It has the following beneficial effects: less
One, since CPU has transparent material property, as the outer cladding body of entire dual-density sole, there is crystal
Effect so greatly strengthens the technology sense and class of entire sole, improves the market competitiveness of enterprise.
Two, due to the high-elastic and light feature that CPU itself has, it is also reduction of the weight of entire sole on the whole
Amount, additionally, due to CPU as outer cladding body, appearance no longer needs to carry out spray painting processing, can have and be highly convenient for people day
Often the characteristics of cleaning, practicability is increased.
Detailed description of the invention
Fig. 1 is the schematic perspective view of CPU outer cladding body in the present invention.
Fig. 2 is that the present invention relates to the structural schematic diagrams for being integrally formed transparent dual-density sole.
Fig. 3 is the structural schematic diagram of molding die in the present invention.
Fig. 4 is structural schematic diagram of first die head in working condition.
Fig. 5 is structural schematic diagram of second die head in working condition.
Fig. 6 is the structural schematic diagram of lower mold.
In figure:
CPU outer cladding body -1；Bottom surface -11；Side -12；
Cavity -13；ETPU buffer layer -2；Loss of weight blind hole -21；
Molding die -30；Lower mold -31；Type chamber -311；
First die head -32；Second die head -33；Turning joint -34；
Pedestal -35.
Specific embodiment
In order to further explain the technical solution of the present invention, being explained in detail below by specific embodiment the present invention
It states.
It as shown in Figures 1 to 6, is a kind of transparent dual-density sole of integrated molding of the present invention, including CPU outsourcing
Cover body 1 and the ETPU buffer layer 2 in CPU outer cladding body 1.
As shown in Figure 1, the CPU outer cladding body 1 has bottom surface 11 and the prominent side for being molded over 11 surrounding of bottom surface of one
Face 12, the bottom surface 11 and side 12 form cavity 13.
As depicted in figs. 1 and 2, the ETPU buffer layer 2 is made of using ETPU particle and PU glue form.
As shown in Fig. 2, a kind of specific embodiment as the ETPU buffer layer 2, also formed on the ETPU buffer layer 2
There are several loss of weight blind holes 21.
As shown in Fig. 2, the height of the ETPU buffer layer 2 is lower than 1 side of CPU outer cladding body as a kind of preferred embodiment
The height in face 12.
The present invention, which also resides in, provides a kind of production technology for being integrally formed transparent dual-density sole, includes the following steps:
1. carrying out vacuumize process to the liquid CPU material stirred evenly, then pour into molding die 30, specifically pours into
In the lower mold 31 of molding die 30, type chamber 311 is formed on the lower mold 31；
As shown in figure 4, molding transparent type shell after using the molding of the first die head 32, obtaining CPU outer cladding body 1
(please referring to shown in Fig. 1), the CPU outer cladding body 1 have bottom surface 11 and the prominent side for being molded over 11 surrounding of bottom surface of one
12, the bottom surface 11 and side 12 form cavity 13；
2. the mixture of ETPU particle and PU glue is fed into the cavity 13 of CPU outer cladding body 1, using the second die head 33
After molding, as shown in figure 5, molding transparent dual-density sole, finished product is as shown in Figure 2.
As shown in Figures 3 to 5, second die head 33 is molded over the back side of the first die head 32, second die head 33
Less than the thickness of the first die head 32, first die head 32 and the second die head 33 pass through turning joint 34 and are connected to shaping mould thickness
On the pedestal 35 of tool 30, the lower mold 31 is also arranged on pedestal 35.
In order to ensure CPU material may be at flow regime, the step 1. in the temperature of liquid CPU material be 30-60
DEG C, the temperature of the molding die 30 is 60-70 DEG C.
To sum up, it is integrally formed transparent dual-density sole and its production technology the present invention relates to a kind of, at least had as follows
The utility model has the advantages that
One, since CPU has transparent material property, as the outer cladding body of entire dual-density sole, there is crystal
Effect so greatly strengthens the technology sense and class of entire sole, improves the market competitiveness of enterprise.
Two, due to the high-elastic and light feature that CPU itself has, it is also reduction of the weight of entire sole on the whole
Amount, additionally, due to CPU as outer cladding body, appearance no longer needs to carry out spray painting processing, can have and be highly convenient for people day
Often the characteristics of cleaning, practicability is increased.
Above-described embodiment and schema and non-limiting product form and style of the invention, any technical field it is common
The appropriate changes or modifications that technical staff does it all should be regarded as not departing from patent category of the invention.
Claims (6)
1. a kind of be integrally formed transparent dual-density sole, which is characterized in that including CPU outer cladding body and be located at CPU outer cladding
Intracorporal ETPU buffer layer, the CPU outer cladding body has bottom surface and the prominent side for being molded over bottom surface surrounding of one, described
Bottom surface and side form cavity, and the ETPU buffer layer is made of using ETPU particle and PU glue form.
2. being integrally formed transparent dual-density sole as described in claim 1, which is characterized in that go back shape on the ETPU buffer layer
At there is several loss of weight blind holes.
3. being integrally formed transparent dual-density sole as described in claim 1, which is characterized in that the height of the ETPU buffer layer
Lower than the height of CPU outer cladding body side surface.
4. a kind of production technology for being integrally formed transparent dual-density sole, which comprises the steps of:
1. carrying out vacuumize process to the liquid CPU material stirred evenly, then pour into molding die, through using the first die head mould
After pressure, transparent type shell is molded, obtains CPU outer cladding body, the CPU outer cladding body has bottom surface and integrally protrudes
Type forms cavity in the side of bottom surface surrounding, the bottom surface and side；
2. the mixture of ETPU particle and PU glue is fed into the cavity of CPU outer cladding body, after the molding of the second die head,
Mold transparent dual-density sole.
5. a kind of production technology for being integrally formed transparent dual-density sole as claimed in claim 4, which is characterized in that described the
Two die heads are molded over the back side of the first die head, thickness of the thickness less than the first die head of second die head, first die head
It is connected on the pedestal of molding die with the second die head by turning joint.
6. a kind of production technology for being integrally formed transparent dual-density sole as claimed in claim 4, which is characterized in that the step
Suddenly 1. the temperature of middle liquid CPU material is 30-60 DEG C, and the temperature of the molding die is 60-70 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910004024.7A CN109567312A (en) | 2019-01-03 | 2019-01-03 | It is a kind of to be integrally formed transparent dual-density sole and its production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910004024.7A CN109567312A (en) | 2019-01-03 | 2019-01-03 | It is a kind of to be integrally formed transparent dual-density sole and its production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109567312A true CN109567312A (en) | 2019-04-05 |
Family
ID=65915957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910004024.7A Pending CN109567312A (en) | 2019-01-03 | 2019-01-03 | It is a kind of to be integrally formed transparent dual-density sole and its production technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109567312A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113753A (en) * | 2019-12-25 | 2020-05-08 | 福建飞扬鞋材有限公司 | Manufacturing mold and production device for inflatable shoe sole |
| WO2023035327A1 (en) * | 2021-09-13 | 2023-03-16 | 福建鸿星尔克体育用品有限公司 | Method for making shock-absorbing sole formed by cpu injection method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2262356Y (en) * | 1996-06-28 | 1997-09-17 | 双邦实业股份有限公司 | Insoles |
| CN101537721A (en) * | 2009-04-20 | 2009-09-23 | 东莞兴泰鞋材有限公司 | Processing method of sole with dual density |
| CN103522564A (en) * | 2013-09-05 | 2014-01-22 | 隆典实业股份有限公司 | Preparation method for compound type sole |
| CN105476172A (en) * | 2015-12-22 | 2016-04-13 | 丁荣誉 | PU puffed sole and production process thereof |
| CN105639837A (en) * | 2016-03-29 | 2016-06-08 | 丁荣誉 | Laminating popcorn polyurethane shoe material and production technology |
| CN206507423U (en) * | 2017-01-03 | 2017-09-22 | 际华三五一三实业有限公司 | A kind of sole with external skeleton |
| CN207444377U (en) * | 2017-10-12 | 2018-06-05 | 东莞兴腾鞋材有限公司 | Half finished rubber wraps up the molding sole of EVA foaming body common modes |
| CN108556389A (en) * | 2018-04-09 | 2018-09-21 | 晋江兴迅新材料科技有限公司 | A kind of light weight and the ETPU sole molding process with air cushion appearance |
| CN209563549U (en) * | 2019-01-03 | 2019-11-01 | 晋江国盛新材料科技有限公司 | It is a kind of to be integrally formed transparent dual-density sole |
-
2019
- 2019-01-03 CN CN201910004024.7A patent/CN109567312A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2262356Y (en) * | 1996-06-28 | 1997-09-17 | 双邦实业股份有限公司 | Insoles |
| CN101537721A (en) * | 2009-04-20 | 2009-09-23 | 东莞兴泰鞋材有限公司 | Processing method of sole with dual density |
| CN103522564A (en) * | 2013-09-05 | 2014-01-22 | 隆典实业股份有限公司 | Preparation method for compound type sole |
| CN105476172A (en) * | 2015-12-22 | 2016-04-13 | 丁荣誉 | PU puffed sole and production process thereof |
| CN105639837A (en) * | 2016-03-29 | 2016-06-08 | 丁荣誉 | Laminating popcorn polyurethane shoe material and production technology |
| CN206507423U (en) * | 2017-01-03 | 2017-09-22 | 际华三五一三实业有限公司 | A kind of sole with external skeleton |
| CN207444377U (en) * | 2017-10-12 | 2018-06-05 | 东莞兴腾鞋材有限公司 | Half finished rubber wraps up the molding sole of EVA foaming body common modes |
| CN108556389A (en) * | 2018-04-09 | 2018-09-21 | 晋江兴迅新材料科技有限公司 | A kind of light weight and the ETPU sole molding process with air cushion appearance |
| CN209563549U (en) * | 2019-01-03 | 2019-11-01 | 晋江国盛新材料科技有限公司 | It is a kind of to be integrally formed transparent dual-density sole |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113753A (en) * | 2019-12-25 | 2020-05-08 | 福建飞扬鞋材有限公司 | Manufacturing mold and production device for inflatable shoe sole |
| WO2023035327A1 (en) * | 2021-09-13 | 2023-03-16 | 福建鸿星尔克体育用品有限公司 | Method for making shock-absorbing sole formed by cpu injection method |
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