CN109560454B - Shell grip device for butterfly semiconductor laser automatic coupling package - Google Patents
Shell grip device for butterfly semiconductor laser automatic coupling package Download PDFInfo
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- CN109560454B CN109560454B CN201811640102.4A CN201811640102A CN109560454B CN 109560454 B CN109560454 B CN 109560454B CN 201811640102 A CN201811640102 A CN 201811640102A CN 109560454 B CN109560454 B CN 109560454B
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- board clamp
- shell
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- clamp
- power
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/02365—Fixing laser chips on mounts by clamping
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a kind of shell grip devices for butterfly semiconductor laser automatic coupling package, are related to electronic device automatic coupling package field.The shell grip device includes bracket and the butterfly semiconductor laser being arranged in above bracket, laser placing groove, first powers on board clamp, second power on board clamp, upper battery plate, shell clamp cylinder, shell clamping fixture head, power on board clamp sliding rail, first power on board clamp minitype cylinder, the fixed components such as limited block and spring.Shell grip device of the invention easily clamps butterfly semiconductor laser and can be accurately located, while can easily be powered on and be adjusted with position, and the butterfly semiconductor laser that installs or removes is easier.In addition, also having the advantages that high degree of automation, simple to operate, production cost is low etc..
Description
Technical field
The present invention relates to automation coupling package technical fields, and in particular to one kind is automatic for butterfly semiconductor laser
The shell grip device of coupling package.
Background technique
With the development of fiber optic communication and optical fiber sensing technology, opto-electronic device is prepared into for optical information technology progress
Key.In optic communication product, the demand of opto-electronic device such as butterfly semiconductor laser is increasing with developing.Butterfly
Shape semiconductor laser is the most common long distance transmission optical signal amplification device of fiber optic communication industry, but butterfly semiconductor swashs
The packaging cost of light device can not have always been high any more, expensive packaging cost, too low packaging efficiency and growing demand it
Between huge contradiction, significantly limit the development speed of opto-electronic device industry.
The maximum bottleneck of optoelectronic device packaging industry is packaging cost, and the key reason for restricting cost is exactly to encapsulate
The degree of automation.In automation process, emphasis is needed to consider fiber coupling (optical fiber align) technology and tail optical fiber technique for fixing.
During fiber coupling, most of alignment is by manually whether judging optical fiber according to the size of laser output power
Alignment, and be finely adjusted using platform is adjusted.Tail optical fiber is fixed generally to use laser welding mode, it is also desirable to extremely accurately weld
It connects, otherwise will affect product qualified rate.
Domestic many company's device productions are substantially or hand-manipulated at present, and portioned product may be implemented semi-automatic
Change, but fiber coupling still needs skilled artisan to manually complete under microscopical auxiliary, it is not only time-consuming but cannot be guaranteed at
Product rate.The large enterprises of external some optical communications industries possess some advanced automation sealed in unit, can be realized laser
Automatic coupling and semi-automatic encapsulation with optical fiber.By means of these sealed in unit, production efficiency is than manual or semi-automatic metaplasia
Production mode is significantly increased.However, these complete set of equipments are expensive, higher capital investment is needed, and these encapsulation are set
The standby packaging technology used also has the place much needed to be improved, such as the precision deficiency of fiber coupling etc..Therefore, how to solve
The problems such as fiber coupling precision existing in the prior art is not high, packaging cost is high, product qualification rate is low, is current butterfly
The developing most important thing of shape semiconductor laser.
During butterfly semiconductor laser automatic coupling package, the reasonable shell grip device of design structure, energy
Coupling package efficiency and product qualification rate are enough improved, packaging cost is reduced.
Summary of the invention
It is an object of the invention to overcome defect existing in the prior art, provide a kind of for butterfly semiconductor laser
The shell grip device of automatic coupling package, the shell grip device can easily clamp butterfly semiconductor laser and can be accurate
Ground positioning, while can easily be powered on and be adjusted with position, and the butterfly semiconductor laser that installs or removes compares
It is easy.
In order to solve the above technical problems, the invention adopts the following technical scheme:
A kind of shell grip device for butterfly semiconductor automatic coupling package, including bracket and setting are in bracket
The butterfly semiconductor laser of top, laser placing groove, first power on board clamp, second power on board clamp, upper battery plate, shell
Clamp cylinder, shell clamping fixture head, power on board clamp sliding rail, first power on board clamp minitype cylinder, fixed limited block with
And spring, there are four being in two groups of arrangements, two in every group power on board clamp sliding rail and are parallel to each other the board clamp sliding rail that powers on,
It each powers on and is provided with one on board clamp sliding rail and powers on board clamp sliding block, described first powers on battery plate on board clamp and second
Fixture, which is separately connected two groups and powers on, powers on board clamp sliding block on board clamp sliding rail, powers on board clamp and second described first
Battery plate is installed at the respective intermediate position of battery plate fixture respectively, and the laser placing groove, which is arranged, powers on board clamp described first
And second power between board clamp；First, which powers on the setting of board clamp minitype cylinder, powers on board clamp far from laser placing groove first
Side, the fixed limited block is arranged in first and powers on board clamp battery plate on the side of laser placing groove, described first
First is then passed through after the piston rod sheathed spring of fixture minitype cylinder to power on the through-hole on board clamp and withstand on fixed limited block；
The shell clamp cylinder is connect with shell clamping fixture head, and the shell clamp cylinder can drive shell clamping fixture head
It moves horizontally to clamp butterfly semiconductor laser.
The above-mentioned shell grip device for butterfly semiconductor automatic coupling package, it is preferred that the shell clamp
The lower section of laser placing groove is arranged in cylinder, and the shell clamping fixture head, which is arranged, powers on board clamp side first.
The above-mentioned shell grip device for butterfly semiconductor automatic coupling package, it is preferred that the laser placing groove
Bottom surface be in rectangle, and a positioning surface for protruding from bottom surface is respectively provided on three sides of rectangle, respectively close to second
Two sides for powering on a line of board clamp side and powering on board clamp perpendicular to second；The laser placing groove is close to
One, which powers on board clamp side, is not provided with positioning surface.
The above-mentioned shell grip device for butterfly semiconductor automatic coupling package, it is preferred that pacify the lower section of the bracket
Equipped with around X-axis angle position platform, the side around X-axis angle position platform is provided with angle position platform driving motor, angle position platform driving motor
It can move described in driving around X-axis angle position platform to realize that angle adjusts.It is furthermore preferred that the adjustment angle model around X-axis angle position platform
Enclose is ± 10 °.
The working principle of the shell grip device is as follows: the butterfly semiconductor laser is placed on the laser
In placing groove, by the driving of the shell clamp cylinder, controls shell clamping fixture head and move horizontally, clamp butterfly and partly lead
Body laser is fixed on butterfly semiconductor laser in laser placing groove.Butterfly semiconductor laser is put by laser
Three positioning surfaces for setting slot are positioned.The two sides of butterfly semiconductor laser are provided with more pins, described to power on board clamp
It is provided with above sliding rail and powers on board clamp sliding block, described first, which powers on board clamp and second, powers on the respective both ends of board clamp point
Be not fixed on power on board clamp sliding block (power on board clamp sliding block also there are four, be divided into two groups) on, first power on board clamp and
Second, which powers on the respective centre of board clamp, is fixedly installed with battery plate, and described first, which powers on board clamp minitype cylinder, is fixedly mounted on
First powers on the bottom of board clamp, and the described first piston rod for powering on board clamp minitype cylinder powers on board clamp across first and withstands on
On fixed limited block, described first powers on board clamp minitype cylinder at work, piston rod stretches out cylinder, due to fixed limited block
Effect, drive first to power on board clamp counter motion (i.e. far from laser placing groove direction move), by butterfly semiconductor
After laser places, battery plate minitype cylinder stops working on described first, and described first powers on board clamp in the effect of spring
Under return to original position, drive the first upper battery plate powered on board clamp to be in contact with the side pin of butterfly semiconductor laser, so
It pushes manually again afterwards and second powers on board clamp, be second to power on the another of upper battery plate on board clamp and butterfly semiconductor laser
Side pin contact, to realize the function of powering on to butterfly semiconductor laser.
Compared with prior art, the advantages and beneficial effects of the present invention are:
1, the present invention provides a kind of shell grip device for butterfly semiconductor laser automatic coupling package, energy sides
Just it clamps butterfly semiconductor laser and can be accurately located, while can easily be powered on and be adjusted with position, and
The butterfly that installs or removes semiconductor laser is easier.
2, shell grip device of the invention, there are three positioning surfaces for setting, can be easily to butterfly semiconductor laser
It is accurately positioned；And the side of not set positioning surface, butterfly semiconductor laser can be facilitated to be put into laser placing groove
In.In addition, powering on the components such as board clamp minitype cylinder using spring, first, it can conveniently realize and give butterfly semiconductor laser
The function that device powers on.
3, it is provided in shell grip device of the invention around X-axis angle position platform, angle adjustment can be carried out, easily with auxiliary
Help coupling package accurate.
4, all parts in shell grip device of the invention are rationally distributed, smart structural design, so that the knot of equipment
Structure is compact, occupied area is small, operating space is big, and is easily installed and dismantles.
Detailed description of the invention
Fig. 1 is that the stereochemical structure of shell grip device in butterfly semiconductor laser automatic coupling package equipment of the present invention is shown
It is intended to.
Fig. 2 is that shell grip device removes shell fixture in butterfly semiconductor laser automatic coupling package equipment of the present invention
Schematic perspective view after collet and butterfly semiconductor laser.
Fig. 3 is that shell grip device removes shell fixture in butterfly semiconductor laser automatic coupling package equipment of the present invention
Schematic perspective view after collet.
Fig. 4 is that shell grip device removes shell fixture in butterfly semiconductor laser automatic coupling package equipment of the present invention
Collet and the schematic perspective view after the platform of X-axis angle position.
Fig. 5 is positioning butterfly half in the shell grip device of butterfly semiconductor laser automatic coupling package equipment of the present invention
The schematic perspective view of the component of conductor laser.
Fig. 6 is the three-dimensional knot of butterfly semiconductor laser in butterfly semiconductor laser automatic coupling package equipment of the present invention
Structure schematic diagram.
Appended drawing reference:
401, butterfly semiconductor laser；402, first board clamp is powered on；403, second board clamp is powered on；404, upper battery plate
Fixture sliding rail；405, upper battery plate；406, shell clamp cylinder；407, first board clamp minitype cylinder is powered on；408, around X-axis
Angle position platform；409, angle position platform driving motor；410, shell clamping fixture head；411, laser placing groove；412, positioning surface；413, solid
Fixing limit block；414, spring；415, board clamp sliding block is powered on.
Specific embodiment
With reference to the accompanying drawings and examples, further description of the specific embodiments of the present invention.Following embodiment is only
For clearly illustrating technical solution of the present invention, and not intended to limit the protection scope of the present invention.
As shown in figures 1 to 6, a kind of shell for butterfly semiconductor laser automatic coupling package is present embodiments provided
Grip device, including bracket and the butterfly semiconductor laser 401 being arranged in above bracket, (Fig. 6 shows butterfly semiconductor
The schematic perspective view of laser), laser placing groove 411, first power on board clamp 402, second power on board clamp 403,
Upper battery plate 405, shell clamping fixture head 410, powers on battery plate folder on board clamp sliding rail 404, first at shell clamp cylinder 406
Have minitype cylinder 407, fixed limited block 413 and a spring 414, the board clamp sliding rail 404 that powers on there are four in two groups of arrangements,
Two in every group power on board clamp sliding rail 404 and are parallel to each other, and each power on and are provided with one on board clamp sliding rail 404 and power on
Board clamp sliding block 415, described first, which powers on board clamp 402 and second, powers on board clamp 403 and is separately connected two groups and power on board clamp
Board clamp sliding block 415 is powered on sliding rail 404, board clamp 402 is powered on described first and second to power on board clamp 403 respective
Battery plate 405 is installed at intermediate position respectively, and the setting of laser placing groove 411 powers on board clamp 402 and the described first
Two power between board clamp 403；First, which powers on the setting of board clamp minitype cylinder 407, powers on board clamp 402 far from laser first
The side of placing groove, the fixed limited block 413 are arranged in first and power on board clamp 402 close to the side of laser placing groove, institute
State be then passed through after the piston rod sheathed spring 414 that first powers on board clamp minitype cylinder 407 first power on it is logical on board clamp 402
Hole is simultaneously withstood on fixed limited block 413；The shell clamp cylinder 406 is connect with shell clamping fixture head 410, the shell
Clamp cylinder 406 can drive shell clamping fixture head 410 to move horizontally to clamp butterfly semiconductor laser 401.More preferably
, the lower section of laser placing groove 411 is arranged in the shell clamp cylinder 406, and the shell clamping fixture head 410 is arranged
402 side of board clamp is powered on first.
Further, the bottom surface of the laser placing groove 411 is in rectangle, and is respectively provided on three sides of rectangle prominent
For a positioning surface 412 of bottom surface, a line for respectively powering on 403 side of board clamp close to second and perpendicular to second
Power on two sides of board clamp 403；The laser placing groove 411 powers on 402 side of board clamp close to first and is not provided with positioning
Face 412 (as shown in Figure 2).
Further, it is equipped with below the bracket around X-axis angle position platform 408, the side around X-axis angle position platform is arranged
There is an angle position platform driving motor 409, angle position platform driving motor 409, which can drive, described to be moved around X-axis angle platform 408 to realize angle
Degree adjustment.It is furthermore preferred that the adjustment angle range around X-axis angle position platform 408 is ± 10 °.
The working principle of the shell grip device is as follows: the butterfly semiconductor laser 401 being placed on described sharp
In light device placing groove 411, by the driving of the shell clamp cylinder 406, the horizontal shifting of shell clamping fixture head 410 is controlled
It is dynamic, butterfly semiconductor laser 401 is clamped, is fixed on butterfly semiconductor laser 401 in laser placing groove 411.Butterfly
Semiconductor laser 401 is positioned by three positioning surfaces 412 of laser placing groove 411.Butterfly semiconductor laser 401
Two sides be provided with more pins, the top for powering on board clamp sliding rail 404, which is provided with, powers on board clamp sliding block 415, described
First power on board clamp 402 and second power on the respective both ends of board clamp 403 be separately fixed at power on board clamp sliding block 415 (on
Battery plate fixture slide block 415 also there are four, be divided into two groups) on, power on board clamp 402 first and second to power on board clamp 403 each
From centre be fixedly installed with upper battery plate 405, described first, which powers on board clamp minitype cylinder 407, is fixedly mounted on battery plate on first
The bottom of fixture 402, the described first piston rod for powering on board clamp minitype cylinder 407 power on board clamp 402 across first and withstand on
On fixed limited block 413, described first powers on board clamp minitype cylinder 407 at work, piston rod stretches out cylinder, due to fixation
The effect of limited block 413 drives first to power on 402 counter motion of board clamp (moving far from 411 direction of laser placing groove),
After placing butterfly semiconductor laser 401, battery plate minitype cylinder stops working on described first, battery plate on described first
Fixture 402 returns to original position under the action of spring 414, and drive first powers on upper battery plate and butterfly semiconductor on board clamp 402
The side pin of laser 401 is in contact, and is then pushed manually again and second powers on board clamp 403, is second to power on board clamp 403
On upper battery plate contacted with the other side pin of butterfly semiconductor laser 401, thus realize to butterfly semiconductor laser 401
The function of powering on.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (5)
1. a kind of shell grip device for butterfly semiconductor laser automatic coupling package, including bracket and setting exist
Butterfly semiconductor laser, laser placing groove above bracket, first power on board clamp, second power on board clamp, upper battery plate,
Shell clamp cylinder, shell clamping fixture head power on board clamp sliding rail, first power on board clamp minitype cylinder, fixed limit
Block and spring, the board clamp sliding rail that powers on is there are four in two groups of arrangements, and two in every group to power on board clamp sliding rail mutual
In parallel, it each powers on and is provided with one on board clamp sliding rail and powers on board clamp sliding block, described first powers on board clamp and second
Power on board clamp and be separately connected two groups and power on and power on board clamp sliding block on board clamp sliding rail, described first power on board clamp and
Second powers on the respective intermediate position of board clamp installs battery plate respectively, and the laser placing groove setting is powered on described first
Board clamp and second powers between board clamp；First, which powers on the setting of board clamp minitype cylinder, powers on board clamp far from laser first
The side of placing groove, the fixed limited block are arranged in first and power on board clamp close to the side of laser placing groove, and described first
It powers on and is then passed through first after the piston rod sheathed spring of board clamp minitype cylinder and powers on the through-hole on board clamp and withstand on fixed limit
On the block of position；The shell clamp cylinder is connect with shell clamping fixture head, and the shell clamp cylinder can drive shell
Clamping fixture head is moved horizontally to clamp butterfly semiconductor laser.
2. being used for the shell grip device of butterfly semiconductor laser automatic coupling package, feature as described in claim 1
Be: the lower section of laser placing groove is arranged in the shell clamp cylinder, and the shell clamping fixture head is arranged first
Power on board clamp side.
3. it is used for the shell grip device of butterfly semiconductor laser automatic coupling package as claimed in claim 1 or 2, it is special
Sign is: the bottom surface of the laser placing groove is in rectangle, and is respectively provided on three sides of rectangle and protrudes from the one of bottom surface
A positioning surface, a line for respectively powering on board clamp side close to second and perpendicular to the second two for powering on board clamp
Side；The laser placing groove powers on board clamp side close to first and is not provided with positioning surface.
4. being used for the shell grip device of butterfly semiconductor laser automatic coupling package, feature as described in claim 1
It is: is equipped with below the bracket around X-axis angle position platform, the side around X-axis angle position platform is provided with angle position platform driving electricity
Machine, angle position platform driving motor can drive described moved around X-axis angle platform to realize that angle adjusts.
5. being used for the shell grip device of butterfly semiconductor laser automatic coupling package, feature as claimed in claim 4
Be: it is described around X-axis angle position platform adjustment angle range be ± 10 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811640102.4A CN109560454B (en) | 2018-12-29 | 2018-12-29 | Shell grip device for butterfly semiconductor laser automatic coupling package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811640102.4A CN109560454B (en) | 2018-12-29 | 2018-12-29 | Shell grip device for butterfly semiconductor laser automatic coupling package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109560454A CN109560454A (en) | 2019-04-02 |
| CN109560454B true CN109560454B (en) | 2019-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811640102.4A Active CN109560454B (en) | 2018-12-29 | 2018-12-29 | Shell grip device for butterfly semiconductor laser automatic coupling package |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571173B (en) * | 2019-09-10 | 2024-06-11 | 广东瑞谷光网通信股份有限公司 | Clamp for mounting chip on tube shell |
| CN111230337A (en) * | 2020-02-21 | 2020-06-05 | 中南大学 | Four-piece type optical device coupling welding clamp based on power and light spot detection |
| CN111404022B (en) * | 2020-04-24 | 2024-05-03 | 大连优欣光科技股份有限公司 | Multi-path power supply and clamping positioning coupling device for miniature BOX type laser |
| CN114976851B (en) * | 2022-07-29 | 2022-09-30 | 苏州新镭激光科技有限公司 | Automatic packaging equipment for laser production |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6243404B1 (en) * | 1999-01-25 | 2001-06-05 | Lucent Technologies, Inc. | Laser module with adjustable operating temperature range |
| US7070340B2 (en) * | 2001-08-29 | 2006-07-04 | Silicon Bandwidth Inc. | High performance optoelectronic packaging assembly |
| WO2003096500A1 (en) * | 2002-05-14 | 2003-11-20 | Sumitomo Electric Industries, Ltd. | Optical module |
| CN200989911Y (en) * | 2006-12-06 | 2007-12-12 | 武汉光迅科技股份有限公司 | Multipurpose device testing holder |
| CN105880831B (en) * | 2016-01-07 | 2017-12-08 | 武汉电信器件有限公司 | The Coupling device and coupling process of a kind of flip device |
| CN207098265U (en) * | 2017-03-29 | 2018-03-13 | 上海昕虹光电科技有限公司 | A kind of butterfly laser mounting seat of integrated driving |
| CN207250932U (en) * | 2017-06-15 | 2018-04-17 | 山西大学 | A kind of distributed feedback semiconductor laser encapsulating structure |
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2018
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