CN109560070B

CN109560070B - Integrated inductor device

Info

Publication number: CN109560070B
Application number: CN201710890695.9A
Authority: CN
Inventors: 颜孝璁
Original assignee: Realtek Semiconductor Corp
Current assignee: Realtek Semiconductor Corp
Priority date: 2017-09-27
Filing date: 2017-09-27
Publication date: 2020-08-14
Anticipated expiration: 2037-09-27
Also published as: CN109560070A

Abstract

An integrated inductive device includes a first coil, a second coil, a third coil, and a fourth coil. The first coil is disposed on a first layer of the integrated circuit structure. The second coil is also arranged on the first layer and is adjacent to the first coil, and the second coil and the first coil have the same winding number. The third coil is disposed on the second layer of the integrated circuit structure and above the first coil. The fourth coil is arranged on the second layer and is positioned above the second coil, and the fourth coil and the third coil have the same winding number of turns. The first coil of the first layer is coupled to the fourth coil of the second layer in an interlaced mode, and the second coil of the first layer is coupled to the third coil of the second layer in an interlaced mode.

Description

Integrated inductor device

Technical Field

The present application relates to an integrated circuit, and more particularly, to an integrated inductor device in an integrated circuit.

Background

The inductor structure is an indispensable device in the integrated circuit. The splay inductor has symmetrical electrical property, and two ends of the splay inductor can generate magnetic fields with opposite directions, so that the magnetic fields generated by the splay inductor can be mutually offset, and thus, the splay inductor can cause smaller influence on other elements in an integrated circuit, and is widely used in the integrated circuit, especially in the design of a Transformer. However, it is difficult to achieve complete electrical symmetry in the conventional inductors shaped like Chinese character ba.

Disclosure of Invention

An object of the present invention is to provide an integrated inductor device, and more particularly, a dual (Twin) inductor structure, which can be used in the design of a transformer to improve the electrical symmetry problem of the transformer with the splay inductor or the transformer with the similar structure in the prior art.

Embodiments of the present invention relate to an integrated inductive device, comprising a first coil, a second coil, a third coil, and a fourth coil. The first coil is disposed on a first layer of an integrated circuit structure. The second coil is arranged on the first layer and is adjacent to the first coil, wherein the second coil and the first coil have the same winding number. The third coil is disposed on the second layer of the integrated circuit structure and above the first coil. The fourth coil is arranged on the second layer and positioned above the second coil, wherein the fourth coil and the third coil have the same winding number. The first coil of the first layer is coupled to the fourth coil of the second layer in an interlaced manner, and the second coil of the first layer is coupled to the third coil of the second layer in an interlaced manner.

Thus, in accordance with the present disclosure, embodiments provide an integrated inductive device having a structural configuration that provides better electrical symmetry than prior art devices.

Drawings

FIG. 1 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure; and

FIG. 7 is a diagram illustrating experimental results of an integrated inductive device according to an embodiment of the present disclosure.

Description of the symbols

100: first coil

101: starting end

200: second coil

201: starting end

300: third coil

301: tail end of the tube

400: fourth coil

401: tail end of the tube

500: first coil

501: starting end

600: second coil

601: starting end

700: third coil

701: tail end of the tube

800: fourth coil

801: tail end of the tube

A: first region

B: second region

C: third zone

D: fourth zone

L1: first imaginary straight line

L2: second imaginary straight line

C1: first connecting element

C2: second connecting element

C3: first connecting element

C4: second connecting element

CA: first center point

CB: second center point

CC: third center point

CD: fourth center point

P1: the first port

P2: the second port

P31: the third port

P32: connection point

P41: the fourth port

P42: connection point

P5: the first port

P6: the second port

P71: the third port

P72: connection point

P81: the fourth port

P82: connection point

T1: reference point

T2: reference point

T3: reference point

T4: reference point

T5: reference point

T6: reference point

Q, L: curve line

Detailed Description

FIG. 1 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure. In the embodiment, a first coil 100 and a second coil 200 are shown, both of which are planar coil structures, and the first coil 100 and the second coil 200 are disposed on a first layer of an integrated circuit board (not shown). As shown in the figure, a first imaginary straight line L1 is drawn on the first layer of the integrated circuit board from the first side of the first layer to the second side of the first layer, and the first layer of the integrated circuit board is roughly divided into a first area A and a second area B by taking the first imaginary straight line L1 as a boundary, the first area A has a first center point CA, and the second area B has a second center point CB. The first coil 100 is disposed in the first area a with the first center point CA as the center, and the second coil 200 is disposed in the second area B with the second center point CB as the center.

In this embodiment, the first area a has a first side, a second side, a third side and a fourth side, and referring to fig. 1, the first side of the first area a refers to the upper side of the first area a, the second side of the first area a refers to the lower side of the first area a, the third side of the first area a refers to the left side of the first area a, and the fourth side of the first area a refers to the right side of the first area a. The second region B has a first side, a second side, a third side, and a fourth side, which are arranged in the same manner as the first side, the second side, the third side, and the fourth side of the first region a. Wherein the fourth side of the first region a is adjacent to the third side of the second region B.

In the present embodiment, the number of winding turns of the first coil 100 is approximately two, and the first coil is roughly divided into an inner first turn and an outer second turn, and the second turn of the first coil 100 surrounds the first turn of the first coil 100 in the first area a. The first winding of the first coil 100 has a start end 101, and from the start end 101, the first winding of the first coil 100 is wound counterclockwise according to the first center point CA, passes through the first side, the third side, the second side, and the fourth side of the first area a to the reference point T1, and is then wound to the second winding of the first coil 100 by the reference point T1. The wire segment of the second loop of the first coil 100 is wound counterclockwise from the reference point T1 of the first area a according to the first center point CA, and is coupled to the first connecting element C1 through the first side, the third side, the second side, and the fourth side of the first area a. The first port P1 is disposed at the upper right corner of the first area a and outside the second turn of the first coil 100. The start terminal 101 of the first coil 100 is coupled to the first port P1 through a first connection segment (not shown) disposed on a layer different from the first layer of the integrated circuit board, the start terminal 101 of the first coil 100 is coupled to the first connection segment through a via, and the first port P1 is also coupled to the first connection segment through a via. The tail end of the first coil 100 is coupled to the first connection element C1, the first connection element C1 is disposed at the upper right of the first region a and outside the second turn of the first coil 100, the first connection element C1 is disposed on the first layer approximately perpendicular to the first layer, and the first connection element C1 is disposed between the first region a and the second region B.

In the present embodiment, the number of winding turns of the second coil 200 is approximately two, and the winding turns can be roughly divided into a first turn located inside and a second turn located outside, and the second turn of the second coil 200 surrounds the first turn of the second coil 200 in the second region B. The first turn of the second coil 200 has a start end 201, and from the start end 201, the first turn of the second coil 200 is wound counterclockwise according to the second center point CB, passes through the second side, the fourth side, the first side, and the third side of the second region B to the reference point T2, and is then wound to the second turn of the second coil 200 by the reference point T2. The metal line segment of the second loop of the second coil 200 is wound counterclockwise from the reference point T2 of the second area B according to the second center point CB, and is coupled to the second connecting element C2 through the second side, the fourth side, the first side and the third side of the second area B. The second port P2 is disposed at the lower left corner of the second area B and outside the second loop of the second loop 200. The start end 201 of the second coil 200 is coupled to the second port P2 through a second connection segment (not shown) disposed on a layer different from the first layer of the integrated circuit board, the start end 201 of the second coil 200 is coupled to the second connection segment through a via, and the second port P2 is also coupled to the second connection segment through a via. The tail end of the second coil 200 is coupled to the second connecting element C2, the second connecting element C2 is disposed at the lower left of the second region B and outside the second turn of the second coil 200, the second connecting element C2 is disposed on the first layer approximately perpendicular to the first layer, and the second connecting element C2 is disposed between the first region a and the second region B.

FIG. 2 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure. In the present embodiment, a third coil 300 and a fourth coil 400 are shown, both of which are planar coil structures, and the third coil 300 and the fourth coil 400 are disposed on a second layer of the integrated circuit board, which is located above the first layer as shown in FIG. 1. As shown in fig. 2, a second imaginary straight line L2 is shown on the second layer of the integrated circuit board extending from the first side of the second layer to the second side of the second layer, the second imaginary straight line L2 is parallel to the first imaginary straight line L1 of fig. 1 in space, and the second layer of the integrated circuit board is roughly divided into a third region C and a fourth region D by using the second imaginary straight line L2 as a boundary, the third region C has a third center point CC, the fourth region D has a fourth center point CD, the third region C is located directly above the first region a of fig. 1 in space, and the fourth region D is located directly above the second region B of fig. 1 in space. The third coil 300 is substantially centered on the third center point CC in the third area C, and the fourth coil 400 is substantially centered on the fourth center point CD in the fourth area D.

In the present embodiment, the third region C and the fourth region D respectively have a first side, a second side, a third side and a fourth side, and the arrangement order of the four sides is the same as that of the first region a and the second region B in fig. 1. Wherein the fourth side of the third zone C is adjacent to the third side of the fourth zone D.

In the present embodiment, the number of winding turns of the third coil 300 is approximately two, and the third coil 300 is roughly divided into a first turn located on the outer side and a second turn located on the inner side, and the first turn of the third coil 300 surrounds the second turn of the third coil 300 in the third region C. The first winding of the third coil 300 has a start end, and the start end of the third coil 300 is coupled to the second connection element C2 shown in fig. 1. The first turn of the third coil 300 is wound clockwise according to the third center point CC from the second connection element C2, passes through the second, third, first, and fourth sides of the third region C to the reference point T3, and is then wound to the second turn of the third coil 300 by the reference point T3. A second coil of the third coil 300 is wound clockwise from the reference point T3 of the third region C according to the third center point CC, and is coupled to the tail end 301 through the second, third, first, and fourth sides of the third region C. The tail end 301 of the third coil 300 is coupled to the third port P31, the third port P31 is disposed in the first layer as shown in fig. 1, and the third port P31 is disposed at the lower right corner of the first area a and outside the second turn of the first coil 100. The tail end 301 of the third coil 300 is coupled to a connection point P32 disposed on the first layer, and then coupled to the third port P31 through a third connection line segment (not shown) disposed on a layer different from the second layer of the integrated circuit board from the connection point P32, the tail end 301 of the third coil 300 is coupled to the connection point P32 through a via, and the third port P31 is also coupled to the third connection line segment through a via.

In the present embodiment, the number of winding turns of the fourth coil 400 is approximately two, and the winding turns are roughly divided into a first turn located on the outer side and a second turn located on the inner side, and the first turn of the fourth coil 400 surrounds the second turn of the fourth coil 400 in the fourth region D. The first winding of the fourth coil 400 has a start end, and the start end of the fourth coil 400 is coupled to the first connection element C1 shown in fig. 1. The first turn of the fourth coil 400 is wound clockwise according to the fourth center point CD from the first connecting element C1, passes through the first, fourth, second, and third sides of the fourth region D to the reference point T4, and is then wound to the second turn of the fourth coil 400 by the reference point T4. The second loop of the fourth coil 400 is wound clockwise from the reference point T4 of the fourth area D according to the fourth center point CD, and is coupled to the tail end 401 through the first side, the fourth side, the second side, and the third side of the fourth area D. The tail end 401 of the fourth coil 400 is coupled to a fourth port P41, the fourth port is disposed in the first layer as shown in fig. 1, and the fourth port P41 is disposed at the upper left corner of the second region B and outside the second turn of the second coil 200 as shown in fig. 1. The tail end 401 of the fourth coil 400 is coupled to the connection point P42 disposed on the first layer, and then coupled to the fourth port P41 through a fourth connection line segment (not shown) disposed on a layer different from the second layer of the integrated circuit board from the connection point P42, the tail end 401 of the fourth coil 400 is coupled to the connection point P42 through a via, and the fourth port connection point P41 is also coupled to the fourth connection line segment through a via.

FIG. 3 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure. Fig. 1 shows an embodiment of the embodiment of fig. 1 and an embodiment of fig. 2 configured in space, and reference is made to fig. 1 and fig. 2 together for the element labels in the figures. In this embodiment, the second layer of the integrated circuit board is disposed in parallel on the first layer, the third region C of the second layer is spatially above the first region A of the first layer, and the fourth region D of the second layer is spatially above the second region B of the first layer. In the present embodiment, as shown in fig. 1 and 2, the first coil 100 disposed on the first layer is alternatively coupled to the fourth coil 400 disposed on the second layer through the first connecting element C1, and the second coil 200 disposed on the first layer is alternatively coupled to the third coil 300 disposed on the second layer through the second connecting element C2. The first coil 100 and the third coil 300 can generate opposite magnetic fields which can be approximately cancelled when current flows, and the second coil 200 and the fourth coil 400 can generate opposite magnetic fields which can be approximately cancelled when current flows.

FIG. 4 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure. In the present embodiment, a first coil 500 and a second coil 600 are disposed on a first layer of an integrated circuit board, wherein the disposition of the first coil 500 and the second coil 600 in the first layer is the same as the disposition of the first coil 100 and the second coil 200 in fig. 1, and the related description refers to fig. 1. The difference between the integrated inductive device shown in FIG. 4 and that shown in FIG. 1 is that the first coil 500 of the integrated inductive device shown in FIG. 4 has a start terminal 501, and the start terminal 501 is coupled to the first port P5, the second coil 600 has a start terminal 601, and the start terminal 601 is coupled to the second port P6. In addition, the first coil 500 of the integrated inductor device of FIG. 4 is coupled to the first connection element C3, and the second coil 600 is coupled to the second connection element C4. In addition, the position of the reference point T5 of the first region a of fig. 4 is a position corresponding to the reference point T1 of the first region a of fig. 1, and the position of the reference point T6 of the second region B of fig. 4 is a position corresponding to the reference point T2 of the second region B of fig. 1.

FIG. 5 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure. In the present embodiment, a third coil 700 and a fourth coil 800 are disposed on a second layer of the integrated circuit board. The second layer is divided into a third region C and a fourth region D by a second imaginary straight line L2, and the third region C and the fourth region D respectively have a first side, a second side, a third side and a fourth side, and the directions referred to by the four sides are the same as those in fig. 2 of the present application, please refer to the detailed description of fig. 2.

In the present embodiment, the number of winding turns of the third coil 700 is approximately one. The first winding of the third winding 700 has a start end coupled to the second connection element C4 as shown in fig. 4. From the second connection element C4, the first turn of the third coil 700 is wound clockwise according to the third center point CC, passes through the second, third, first, fourth sides of the third region C and is then coupled to the tail end 701. The tail 701 of the third coil 700 is coupled to a third port P71, and the third port P71 is disposed in the first layer as shown in FIG. 4. The end of the third coil 700 is first coupled to the connection point P72 disposed on the first layer, and then coupled to the third port P71 through a third connection line segment (not shown) disposed on another layer of the integrated circuit board different from the second layer from the connection point P72.

In the present embodiment, the fourth coil 800 has approximately one winding turn. The first turn of the fourth coil 800 has a start end coupled to the first connection element C3 shown in fig. 4. From the first connecting element C3, the first loop of the fourth coil 800 winds clockwise according to the fourth center point CD, passes through the first, fourth, second and third sides of the fourth region D, and is then coupled to the tail end 801. The tail 801 of the fourth coil 800 is coupled to the fourth port P81, and the fourth port P81 is disposed in the first layer as shown in FIG. 4. The tail 801 of the fourth coil 800 is first coupled to the connection point P82 disposed on the first layer, and then coupled to the fourth port P81 from the connection point P82 via a fourth connection line segment (not shown) disposed on a layer different from the second layer of the integrated circuit board.

FIG. 6 is a schematic diagram of an integrated inductive device according to an embodiment of the present disclosure. Depicted are implementations of the embodiment of fig. 4 and the embodiment of fig. 5 arranged in space. According to the embodiments of FIGS. 4 and 5, in the integrated circuit board, the second layer is disposed in parallel on the first layer, the third region C of the second layer is spatially above the first region A of the first layer, and the fourth region D of the second layer is spatially above the second region B of the first layer. In space, the first coil 500 disposed in the first layer is alternatively coupled to the fourth coil 800 disposed in the second layer through the first connecting element C3, and the second coil 600 disposed in the first layer is alternatively coupled to the third coil 700 disposed in the second layer through the second connecting element C4.

FIG. 7 is a diagram illustrating experimental results of an integrated inductive device according to an embodiment of the present disclosure. Referring to fig. 7, the horizontal axis represents frequency, and the vertical axis represents values representing quality factor (Q factor) and Inductance (Inductance). The coil arrangement of the integrated inductive device measured in the experiment of this figure is as shown in the above-described embodiment of the present invention, and the actual line width of each coil is 2 micrometers (μm), and the radius length of each coil is 25 μm. The curve Q is a quality factor curve of the integrated inductor device according to the above embodiment of the present invention, which is actually a quality factor value measured from the inductor structure formed by coupling the first coil and the fourth coil of the present invention, and the quality factor value measured from the inductor structure formed by coupling the second coil and the third coil of the present invention is also overlapped with the curve Q.

Referring to fig. 7, a curve L is a inductance curve of the integrated inductor device according to the above embodiments of the present invention. Similarly, at all frequencies, the inductance (L) measured from the inductance structure formed by coupling the first coil and the fourth coil and the inductance measured from the inductance structure formed by coupling the second coil and the third coil are also completely overlapped on the curve Q. Therefore, the quality factor and the inductance value measured on the two sets of inductor structures of the integrated inductor device provided by the present application are relatively symmetrical, and the degree of symmetry is better than that of the prior art.

Claims

1. An integrated inductive device, comprising:

a first coil disposed on a first layer of an integrated circuit structure;

the second coil is arranged on the first layer and is adjacent to the first coil, wherein the second coil and the first coil have the same winding number;

a third coil disposed on a second layer of the integrated circuit structure and above the first coil; and

the fourth coil is arranged on the second layer and is positioned above the second coil, wherein the fourth coil and the third coil have the same winding number of turns;

wherein the first coil of the first layer is coupled to the fourth coil of the second layer in an interleaved manner, and the second coil of the first layer is coupled to the third coil of the second layer in an interleaved manner;

the first coil is coupled to a first port, the second coil is coupled to a second port, the third coil is coupled to a third port, the fourth coil is coupled to a fourth port, the first port is electrically connected to the fourth port, the second port is electrically connected to the third port, and the first port, the second port, the third port and the fourth port are all configured on the first layer.

2. The integrated inductive device of claim 1, wherein the first coil is coupled to the fourth coil at a first side of the first layer via a first connection element, the second coil is coupled to the fourth coil at a second side of the first layer via a second connection element, the first side being opposite to the second side.

3. The integrated inductive device of claim 2, wherein the first port and the fourth port are disposed on the first side of the first layer, and the second port and the third port are disposed on the second side of the first layer.

4. The integrated inductive device of claim 2, wherein a first imaginary line is drawn from the first side to the second side of the first layer, the first imaginary line divides the first layer into a first region and a second region, the first coil is disposed in the first region, the second coil is disposed in the second region, the second layer has a third region and a fourth region, the third region is disposed above the first region, the fourth region is disposed above the second region, the third coil is disposed in the third region, the fourth coil is disposed in the fourth region, the first region, the second region, the third region and the fourth region each have a first side, a second side, a third side and a fourth side arranged in the same order.

5. The integrated inductive device of claim 4, wherein the first region has a first center point, the first coil is coupled to a first port between the first side and the fourth side of the first region, the first coil is wound from the first side of the first region from inside to outside counterclockwise by two turns according to the first center point, and the first coil is coupled to the first connection element between the first side and the fourth side of the first region.

6. The integrated inductive device of claim 5, wherein the fourth region has a fourth center point, the fourth coil is coupled to the first connecting element between the first side and the third side of the fourth region, the fourth coil is wound from the outside to the inside clockwise from the fourth center point between the first side and the third side of the fourth region for two turns, and the fourth coil is coupled to a fourth port between the first side and the third side of the fourth region.

7. The integrated inductive device of claim 5, wherein the fourth region has a fourth center point, the fourth coil is coupled to the first connecting element between the first side and the third side of the fourth region, the fourth coil is wound from the outside to the inside clockwise from the fourth center point between the first side and the third side of the fourth region, and the fourth coil is coupled to a fourth port between the first side and the third side of the fourth region.

8. The integrated inductive device of claim 4, wherein the second region has a second center point, the second coil is coupled to a second port at the second side of the second region, the second coil is wound from inside to outside counterclockwise according to the second center point from between the second side and the third side of the second region, and the second coil is coupled to the second connection element between the second side and the third side of the second region.

9. The integrated inductive device of claim 8, wherein the third region has a third center point, the third coil is coupled to the second connection element between the second side and the fourth side of the third region, the third coil is wound two turns clockwise from the outside to the inside according to the third center point from between the second side and the fourth side of the third region, the third coil is coupled to a third port between the second side and the fourth side of the third region.

10. The integrated inductive device of claim 8, wherein the third region has a third center point, the third coil is coupled to the second connection element between the second side and the fourth side of the third region, the third coil is wound from the outside to the inside clockwise from the third center point between the second side and the fourth side of the third region, the third coil is coupled to a third port between the second side and the fourth side of the third region.