CN109560026A - A kind of vacuum electronic component mechanical environment adaptability device - Google Patents
A kind of vacuum electronic component mechanical environment adaptability device Download PDFInfo
- Publication number
- CN109560026A CN109560026A CN201811462785.9A CN201811462785A CN109560026A CN 109560026 A CN109560026 A CN 109560026A CN 201811462785 A CN201811462785 A CN 201811462785A CN 109560026 A CN109560026 A CN 109560026A
- Authority
- CN
- China
- Prior art keywords
- bonding wire
- connect
- wire end
- electronic component
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 230000002787 reinforcement Effects 0.000 abstract description 2
- 230000003044 adaptive effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000007812 deficiency Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011499 joint compound Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
The present invention proposes a kind of vacuum electronic component mechanical environment adaptability device, described device includes: chip (1), substrate (2), support rod (3), the first bonding wire end (4a), the second bonding wire end (4b), package shell (5), package shell pad (7), substrate pads (8), wherein, the first bonding wire end (4a) and the second bonding wire end (4b) are respectively the both ends of a bonding wire；The support rod (3) connect with substrate (2), and the support rod (3) connect with package shell (5)；The chip (1) connect with substrate (2), and the first bonding wire end (4a) is connect with substrate pads (8)；Second bonding wire end (4b) is connect with package shell pad (7).The present invention has carried out brand new design by the support rod to component internal, and carries out dispensing Reinforcement Measures to support rod and package shell, can realize that vacuum electronic component mechanical environment adaptability is greatly improved in a short time.
Description
Technical field
The present invention relates to a kind of vacuum electronic component mechanical environment adaptability device, especially for containing chip and bonding
The mechanical environment adaptability device of the vacuum electronic component of silk.
Background technique
With the rapid development of electronic information technology, various electronic equipments vacuum component or vacuum electronic component towards
Integrated, miniaturization rapidly develops.Vacuum electronic component is since structure is complicated, and the miniaturization of Yao Shixian product need to be to component internal
The various aspects such as chip volume, the volume of pad and bonding wire, weight, size, technique and reliability carry out mechanical environment adaptability
Design, especially for the bonding wire of component internal, on the one hand, the diameter of small bonding pad requirements bonding wire is smaller, brings bonding wire
Vibration resistance is deteriorated, and is easy to appear solder joint compound bending fatigue fracture phenomenon；On the other hand, bonding wire one end is welded on chip base
On plate, substrate itself can increase the vibratory response magnitude of bonding wire with the vibration of assembly housing, further result in bonding wire antivibration
It is deteriorated.Meet system requirement to improve the mechanical environment adaptability of vacuum electronic component bonding wire, there is an urgent need to mention
It is a kind of out to be directed to vacuum electronic component mechanical environment adaptive improvement technical method, to solve vacuum electronic component internal by chip
Substrate vibrates the problem for leading to bonding wire mechanical adaptive capacity to environment deficiency.
Summary of the invention
The object of the invention provides a kind of for vacuum electronic component mechanical environment adaptability device, solution vacuum electronic component
Inside is led to the problem of bonding wire mechanical adaptive capacity to environment deficiency by chip substrate vibration.
Very to above-mentioned technical problem, the present invention proposes a kind of vacuum electronic component mechanical environment adaptability device, the dress
Set includes: chip, substrate, support rod, the first bonding wire end, the second bonding wire end, package shell, package shell pad, substrate
Pad, wherein the first bonding wire end and the second bonding wire end are respectively the both ends of a bonding wire；The support rod and substrate connect
It connects, the support rod is connect with package shell；The chip is connect with substrate, and the first bonding wire end is connect with substrate pads；Institute
The second bonding wire end is stated to connect with package shell pad.
The present invention carries out technological improvement to vacuum electronic component mechanical environment adaptability device, passes through the branch to component internal
Strut has carried out brand new design, and carries out dispensing Reinforcement Measures to support rod and package shell, can be in a short time
It realizes that vacuum electronic component mechanical environment adaptability is greatly improved, is a kind of mechanical environment adaptability dress for having very much promotion prospect
It sets.
Detailed description of the invention
Fig. 1 is the top view of vacuum electronic component mechanical environment adaptability device.
Fig. 2 is the main view of vacuum electronic component mechanical environment adaptability device.
Fig. 3 is the perspective view of vacuum electronic component mechanical environment adaptability device.
Specific example mode
A specific embodiment of the invention is described in detail below in conjunction with attached drawing.
A kind of specific steps of the improved technology method of vacuum electronic component mechanical environment adaptability device are as follows:
The first step constructs vacuum electronic component mechanical environment adaptive system
The composition of vacuum electronic component mechanical environment adaptive system includes: chip 1, substrate 2, the bonding of support rod 3, first
Silk end 4a, the second bonding wire end 4b, package shell 5, fixed glue 6, package shell pad 7, substrate pads 8, solder 9.Wherein,
One bonding wire end 4a and the second bonding wire end 4b is respectively the both ends of a bonding wire.
Second step support rod 3
Support rod 3 is connect with substrate 2.Support rod 3 is passed through fixed glue 6 with package shell 5 to connect.
Third step substrate 2
Chip 1 is passed through fixed glue 6 with substrate 2 to connect.First bonding wire end 4a is connected with substrate pads 8 by solder 9
It connects.
4th step package shell pad 7
Second bonding wire end 4b is connect with package shell pad 7 by solder 9.
So far, the formulation of vacuum electronic component mechanical environment adaptive improvement technical method is completed.
The vacuum electronic component mechanical environment adaptability device of the invention includes: chip 1, substrate 2, support rod 3,
One bonding wire end 4a, the second bonding wire end 4b, package shell 5, package shell pad 7, substrate pads 8, wherein the first bonding wire
End 4a and the second bonding wire end 4b is respectively the both ends of a bonding wire.The support rod 3 is connect with substrate 2, the support rod 3
Pass through fixed glue 6 with package shell 5 to connect.The chip 1 passes through fixed glue 6 with substrate 2 and connect.First bonding wire end 4a and base
Plate pad 8 is connected by solder 9.Second bonding wire end 4b is connect with package shell pad 7 by solder 9.
Claims (5)
1. a kind of vacuum electronic component mechanical environment adaptability device, which is characterized in that described device includes: chip (1), substrate
(2), support rod (3), the first bonding wire end (4a), the second bonding wire end (4b), package shell (5), package shell pad (7),
Substrate pads (8), wherein the first bonding wire end (4a) and the second bonding wire end (4b) are respectively the both ends of a bonding wire；
The support rod (3) connect with substrate (2), and the support rod (3) connect with package shell (5)；
The chip (1) connect with substrate (2), and the first bonding wire end (4a) is connect with substrate pads (8)；
Second bonding wire end (4b) is connect with package shell pad (7).
2. vacuum electronic component mechanical environment adaptability device according to claim 1, which is characterized in that the support rod
(3) pass through fixed glue (6) with package shell (5) to connect.
3. vacuum electronic component mechanical environment adaptability device according to claim 1, which is characterized in that the chip
(1) pass through fixed glue (6) with substrate (2) to connect.
4. vacuum electronic component mechanical environment adaptability device according to claim 1, which is characterized in that the first bonding wire
End (4a) is connect with substrate pads (8) by solder (9).
5. vacuum electronic component mechanical environment adaptability device according to claim 1, which is characterized in that second key
Plying end (4b) is connect with package shell pad (7) by solder (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811462785.9A CN109560026A (en) | 2018-12-03 | 2018-12-03 | A kind of vacuum electronic component mechanical environment adaptability device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811462785.9A CN109560026A (en) | 2018-12-03 | 2018-12-03 | A kind of vacuum electronic component mechanical environment adaptability device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109560026A true CN109560026A (en) | 2019-04-02 |
Family
ID=65868498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811462785.9A Pending CN109560026A (en) | 2018-12-03 | 2018-12-03 | A kind of vacuum electronic component mechanical environment adaptability device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109560026A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH088284A (en) * | 1994-06-20 | 1996-01-12 | Hitachi Ltd | Wire bonding structure and its reinforcement method |
| CN1880742A (en) * | 2005-06-13 | 2006-12-20 | 韩英 | Protective cover for turbofan engine of aeroplane |
| CN101944512A (en) * | 2010-09-30 | 2011-01-12 | 无锡中微高科电子有限公司 | Switching base plate packaged by integrated circuit |
| CN105428267A (en) * | 2015-12-16 | 2016-03-23 | 济南市半导体元件实验所 | High-reliability ultra-small metal ceramic surface-mounted device packaging process |
| CN106847719A (en) * | 2016-11-28 | 2017-06-13 | 西安科锐盛创新科技有限公司 | It is applied to the naked core chip architecture and its manufacture method of test |
| CN107180809A (en) * | 2016-03-11 | 2017-09-19 | 无锡华润安盛科技有限公司 | Semiconductor package and its method for packing |
| CN107731772A (en) * | 2017-09-13 | 2018-02-23 | 北京无线电测量研究所 | A kind of wedge bonding lead ruggedized construction and reinforcement means |
| CN108155158A (en) * | 2017-12-22 | 2018-06-12 | 中国电子科技集团公司第四十七研究所 | The 3D encapsulating structures of mass storage circuit |
-
2018
- 2018-12-03 CN CN201811462785.9A patent/CN109560026A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH088284A (en) * | 1994-06-20 | 1996-01-12 | Hitachi Ltd | Wire bonding structure and its reinforcement method |
| CN1880742A (en) * | 2005-06-13 | 2006-12-20 | 韩英 | Protective cover for turbofan engine of aeroplane |
| CN101944512A (en) * | 2010-09-30 | 2011-01-12 | 无锡中微高科电子有限公司 | Switching base plate packaged by integrated circuit |
| CN105428267A (en) * | 2015-12-16 | 2016-03-23 | 济南市半导体元件实验所 | High-reliability ultra-small metal ceramic surface-mounted device packaging process |
| CN107180809A (en) * | 2016-03-11 | 2017-09-19 | 无锡华润安盛科技有限公司 | Semiconductor package and its method for packing |
| CN106847719A (en) * | 2016-11-28 | 2017-06-13 | 西安科锐盛创新科技有限公司 | It is applied to the naked core chip architecture and its manufacture method of test |
| CN107731772A (en) * | 2017-09-13 | 2018-02-23 | 北京无线电测量研究所 | A kind of wedge bonding lead ruggedized construction and reinforcement means |
| CN108155158A (en) * | 2017-12-22 | 2018-06-12 | 中国电子科技集团公司第四十七研究所 | The 3D encapsulating structures of mass storage circuit |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190402 |
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| RJ01 | Rejection of invention patent application after publication |