CN109548374A - A kind of intelligence air-duct apparatus and its implementation - Google Patents
A kind of intelligence air-duct apparatus and its implementation Download PDFInfo
- Publication number
- CN109548374A CN109548374A CN201811480572.9A CN201811480572A CN109548374A CN 109548374 A CN109548374 A CN 109548374A CN 201811480572 A CN201811480572 A CN 201811480572A CN 109548374 A CN109548374 A CN 109548374A
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- CN
- China
- Prior art keywords
- air
- duct
- duct apparatus
- intelligence
- described device
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/023—Handles; Grips
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a kind of intelligent air-duct apparatus and its implementation, described device includes: the first air duct that the multiple fans of setting radiate;The second air duct that separate fan radiates is set;Respectively with two different air ducts, two different regions of temperature are kept apart by Physical realization, separately do radiating treatment.The embodiment of the present invention can effectively disperse the heat of electronic product generation, improve the service life and working efficiency of electronic product.
Description
Technical field
The present invention relates to server technology, espespecially a kind of intelligent air-duct apparatus and its implementation.
Background technique
Electronic product can generate biggish heat in running, in server operation, generate a large amount of heat, be
Its internal temperature rise and stable operation are maintained, in order to effectively disperse the heat of electronic product generation, improves making for electronic product
With service life and working efficiency, needs in time to discharge its internal heat, otherwise can reduce the service life and work of electronic product
Make efficiency.
Specifically, the number of fans that high-density server system can generally be supported in the chassis space of 2U is at 8, even
10.It, can be by disposing high density server in computer room since high density server can make full use of computer room space
Under conditions of some computer rooms, the capacity of expanding data service.
With the increasing of subscriber traffic, the power consumption at mainboard end is increasing, and calorific value is consequently increased, cause entirely be
The heat of the accumulation of system is also increasing.Meanwhile large-sized supply port stops distinguished and admirable, will affect node in case box
Heat dissipation.Heat sink conception in general cabinet: traditional open heat dissipation is mainly used.
As it can be seen that the prior art is all by carrying out driving hot operation by radiator fan, to reach electronic product rapid cooling
Purpose.In the hot operating process of drive of radiator fan, the rotation of radiator fan will lead to outer gas stream into the electronic product
Inside, to carry out dissipating heat to heat source, however since the outer gas stream is largely imported in electronic product, so that being easy in electricity
Sub- interiors of products accumulates heat.
Therefore, the design of traditional open radiating mode is simple, and heat dissipation effect is unstable, it is difficult to which realization is precisely controlled.In wind
When fan rotation, fan is in full-speed state, and long-play seriously affects the service life of radiator fan when full load condition.
In addition Duct design is unreasonable, is easy not being able to satisfy heat dissipation, the dedusting demand of different product in internal heat accumulation amount, using rise
Come inconvenient.
Summary of the invention
In order to solve the above-mentioned technical problem, the embodiment of the invention provides a kind of intelligent air-duct apparatus and its realization sides
Method can effectively disperse the heat of electronic product generation, improve the service life and working efficiency of electronic product.
In order to reach the object of the invention, on the one hand, the embodiment of the invention provides a kind of intelligent air-duct apparatus, comprising:
The first air duct that multiple fans radiate is set;
The second air duct that separate fan radiates is set;
Respectively with two different air ducts, two different regions of temperature are kept apart by Physical realization, is separated
Do radiating treatment.
Further, described device is made of the organic plastics of anti-flammability.
Further, described device is using compatible handle design structure.
Further, described device, which uses, exempts from screw click-on design structure.
Further, server bulk temperature is reduced by 5 degrees Celsius by described device.
On the other hand, the embodiment of the invention also provides a kind of implementation methods of intelligent air-duct apparatus, comprising:
The first air duct that multiple fans radiate and the second air duct that setting separate fan radiates are set, used respectively
Two different air ducts are kept apart two different regions of temperature by Physical realization, separately do radiating treatment.
Further, the method is used in intelligent air-duct apparatus using compatible handle design.
Further, the method is using exempting from screw click-on design in intelligent air-duct apparatus.
Further, server bulk temperature is reduced by 5 degrees Celsius by the method.
The first air duct that the embodiment of the present invention is radiated by the way that multiple fans are arranged;It is arranged what separate fan radiated
Second air duct;Respectively with two different air ducts, two different regions of temperature are kept apart by Physical realization, is separated
Do radiating treatment.The embodiment of the present invention can be improved complete machine heat dissipation effect, reduce temperature rise, meanwhile, installation is succinct efficient, can improve
Production efficiency.
Other features and advantages of the present invention will be illustrated in the following description, also, partly becomes from specification
It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention can be by specification, right
Specifically noted structure is achieved and obtained in claim and attached drawing.
Detailed description of the invention
Attached drawing is used to provide to further understand technical solution of the present invention, and constitutes part of specification, with this
The embodiment of application technical solution for explaining the present invention together, does not constitute the limitation to technical solution of the present invention.
Fig. 1 is the structure chart of intelligence of embodiment of the present invention air-duct apparatus;
Fig. 2 is double Duct design structure charts in intelligence of embodiment of the present invention air-duct apparatus;
Fig. 3 is the Facad structure figure of intelligence of embodiment of the present invention air-duct apparatus;
Fig. 4 is the inverse layer structure figure of intelligence of embodiment of the present invention air-duct apparatus;
Fig. 5 is the compatible handle design structure chart in intelligence of embodiment of the present invention air-duct apparatus;
Fig. 6 is to exempt from screw click-on design structure chart in intelligence of embodiment of the present invention air-duct apparatus;
The flow chart of the implementation method of Fig. 7 intelligence air-duct apparatus of the embodiment of the present invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention
Embodiment be described in detail.It should be noted that in the absence of conflict, in the embodiment and embodiment in the application
Feature can mutual any combination.
Step shown in the flowchart of the accompanying drawings can be in a computer system such as a set of computer executable instructions
It executes.Also, although logical order is shown in flow charts, and it in some cases, can be to be different from herein suitable
Sequence executes shown or described step.
Fig. 1 is the structure chart of intelligence of embodiment of the present invention air-duct apparatus, as shown in Figure 1, the intelligence of the embodiment of the present invention
Change air-duct apparatus, take the double air duct intelligent design of novel intelligent: including: the first air duct that the multiple fans of setting radiate
101 the second air ducts 102 radiated with setting separate fan;It is respectively with two different air ducts, two temperature are different
Region is kept apart by Physical realization, separately does radiating treatment.
When the embodiment of the present invention can start operation after electronic product starting, internal Duct design is realized, to radiate
The heat of electronic product inner accumulation can be guided out outside by fan, to carry out heat dissipation operation.
The embodiment of the present invention propose intelligent Duct design (Intelligentization Air duct design,
IN ADD) it is exactly greatly to be dropped to solve the problems, such as that electronic product radiating effect is unstable, radiator fan service life is low
Server overload operation may be implemented in low server internal device temperature rise.
Specifically, Fig. 2 is double Duct design structure charts in intelligence of embodiment of the present invention air-duct apparatus, as shown in Fig. 2,
Double Duct designs that the embodiment of the present invention is realized, high thermal region and low heat area 102nd area of the first air duct 101 and the second air duct
It separates, respectively with different air ducts, two different regions of temperature is kept apart by Physical realization, are separately done at heat dissipation
Reason in the bigger fan of the diligent rate of high thermal region and increases number of fans raising rotation speed of the fan, makes high thermal region as early as possible accumulation
Heat be discharged cabinet.Matched cooling system is equipped with using independent fan system in low heat area.It is only in this way
Vertical double Duct designs, can reach better heat dissipation effect, and electronic product such as server bulk temperature is reduced by 5 degrees Celsius, is made
Overall performance, which reaches, to be increased substantially.
Fig. 3 is the Facad structure figure of intelligence of embodiment of the present invention air-duct apparatus, and Fig. 4 is intelligence of embodiment of the present invention wind
The inverse layer structure figure of road device, as shown in Figure 3 and Figure 4, described device are made of the organic plastics of anti-flammability, flare are occurring
When, which is not in burning, can effectively prevent the further sprawling of the intensity of a fire.
Fig. 5 is the compatible handle design structure chart in intelligence of embodiment of the present invention air-duct apparatus, as shown in figure 5, institute
Device is stated using compatible handle design structure, is Duct design compatibility overleaf to handle design, pacifies installation and dismantling in production
It is succinct when unloading, convenient.
Fig. 6 is to exempt from screw click-on design structure chart in intelligence of embodiment of the present invention air-duct apparatus, as shown in fig. 6, institute
Device is stated using screw click-on design structure is exempted from, efficiently solves the problems, such as that traditional screw design aoxidizes for a long time, simultaneously
It has obtained significantly improving in the production efficiency of production installation.
Technical solution of the embodiment of the present invention generates a large amount of heat, in server operation to maintain inside it
Temperature rise and stable operation, design through the embodiment of the present invention can in time discharge internal heat, reduce internal temperature rise, improve
Overall efficiency, while installation is succinct efficient, can improve production efficiency.
Fig. 7 is the flow chart of the implementation method of intelligence of embodiment of the present invention air-duct apparatus, as shown in fig. 7, the realization
Method includes:
Step 100: the first air duct that multiple fans radiate and the second wind that setting separate fan radiates are set
Road is kept apart two different regions of temperature by Physical realization respectively with two different air ducts, separately does and radiate
Processing.
Further, the method is used in intelligent air-duct apparatus using compatible handle design.
Further, the method is using exempting from screw click-on design in intelligent air-duct apparatus.
Further, server bulk temperature is reduced by 5 degrees Celsius by the method.
The embodiment of the present invention is further illustrated below by specific embodiment:
Steps are as follows for the realization of this method:
Simple handle design is more convenient during installation;
Click-on design, it is more convenient to install;
With complete machine close contact, good heat dissipation effect is realized;
It is able to achieve the through-flow of double air ducts in double Duct designs, reaches good heat dissipation effect under high temperature environment;
By above step, the confirmation of the inspection to intelligent air duct can be completed.
The embodiment of the present invention is radiated by the way that the first air duct that multiple fans radiate is arranged with setting separate fan
The second air duct two different regions of temperature are kept apart by Physical realization respectively with two different air ducts, point
It opens and does radiating treatment.The embodiment of the present invention can be improved complete machine heat dissipation effect, reduce temperature rise, meanwhile, installation is succinct efficient, can mention
High efficiency.
Although disclosed herein embodiment it is as above, the content only for ease of understanding the present invention and use
Embodiment is not intended to limit the invention.Technical staff in any fields of the present invention is taken off not departing from the present invention
Under the premise of the spirit and scope of dew, any modification and variation, but the present invention can be carried out in the form and details of implementation
Scope of patent protection, still should be subject to the scope of the claims as defined in the appended claims.
Claims (9)
1. a kind of intelligence air-duct apparatus, which is characterized in that described device includes:
The first air duct that multiple fans radiate is set;
The second air duct that separate fan radiates is set;
Respectively with two different air ducts, two different regions of temperature are kept apart by Physical realization, are separately done scattered
Heat treatment.
2. intelligence air-duct apparatus according to claim 1, which is characterized in that described device uses organic modeling of anti-flammability
Material is made.
3. intelligence air-duct apparatus according to claim 1, which is characterized in that described device is using compatible handle design
Structure.
4. intelligence air-duct apparatus according to claim 1, which is characterized in that described device, which uses, exempts from screw click-on design
Structure.
5. intelligence air-duct apparatus according to claim 1-4, which is characterized in that described device is whole by server
5 degrees Celsius of temperature reduction.
6. a kind of implementation method of intelligence air-duct apparatus characterized by comprising
The first air duct that multiple fans radiate and the second air duct that setting separate fan radiates are set, respectively with two
Different air ducts is kept apart two different regions of temperature by Physical realization, separately does radiating treatment.
7. the implementation method of intelligence air-duct apparatus according to claim 6, which is characterized in that the method is using compatibility
Property handle design be used in intelligent air-duct apparatus.
8. the implementation method of intelligence air-duct apparatus according to claim 6, which is characterized in that the method, which uses, exempts from spiral shell
Silk click-on design is used in intelligent air-duct apparatus.
9. according to the implementation method of the described in any item intelligent air-duct apparatus of claim 6-8, which is characterized in that the method
Server bulk temperature is reduced by 5 degrees Celsius.
Priority Applications (1)
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CN201811480572.9A CN109548374A (en) | 2018-12-05 | 2018-12-05 | A kind of intelligence air-duct apparatus and its implementation |
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CN201811480572.9A CN109548374A (en) | 2018-12-05 | 2018-12-05 | A kind of intelligence air-duct apparatus and its implementation |
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CN109548374A true CN109548374A (en) | 2019-03-29 |
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CN201811480572.9A Pending CN109548374A (en) | 2018-12-05 | 2018-12-05 | A kind of intelligence air-duct apparatus and its implementation |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111895463A (en) * | 2020-08-05 | 2020-11-06 | 宁波方太厨具有限公司 | Kitchen range panel and gas kitchen range comprising same |
Citations (5)
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US20050152112A1 (en) * | 2004-01-08 | 2005-07-14 | Apple Computer Inc. | Apparatus for air cooling of an electronic device |
CN201540526U (en) * | 2009-12-24 | 2010-08-04 | 曙光信息产业(北京)有限公司 | Blade server with modified three-channel heat dissipation air duct structure |
CN101799709A (en) * | 2009-12-24 | 2010-08-11 | 曙光信息产业(北京)有限公司 | Blade server with three-duct heat-emission duct structure |
CN102073357A (en) * | 2010-12-23 | 2011-05-25 | 北京中科大洋科技发展股份有限公司 | Low-noise machine case for integrated computer server |
CN105407687A (en) * | 2015-10-27 | 2016-03-16 | 上海斐讯数据通信技术有限公司 | Pull fan module |
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2018
- 2018-12-05 CN CN201811480572.9A patent/CN109548374A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20050152112A1 (en) * | 2004-01-08 | 2005-07-14 | Apple Computer Inc. | Apparatus for air cooling of an electronic device |
CN201540526U (en) * | 2009-12-24 | 2010-08-04 | 曙光信息产业(北京)有限公司 | Blade server with modified three-channel heat dissipation air duct structure |
CN101799709A (en) * | 2009-12-24 | 2010-08-11 | 曙光信息产业(北京)有限公司 | Blade server with three-duct heat-emission duct structure |
CN102073357A (en) * | 2010-12-23 | 2011-05-25 | 北京中科大洋科技发展股份有限公司 | Low-noise machine case for integrated computer server |
CN105407687A (en) * | 2015-10-27 | 2016-03-16 | 上海斐讯数据通信技术有限公司 | Pull fan module |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111895463A (en) * | 2020-08-05 | 2020-11-06 | 宁波方太厨具有限公司 | Kitchen range panel and gas kitchen range comprising same |
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Application publication date: 20190329 |