CN109539662A - Using the cooling refrigerating plant of atomization - Google Patents
Using the cooling refrigerating plant of atomization Download PDFInfo
- Publication number
- CN109539662A CN109539662A CN201910023849.3A CN201910023849A CN109539662A CN 109539662 A CN109539662 A CN 109539662A CN 201910023849 A CN201910023849 A CN 201910023849A CN 109539662 A CN109539662 A CN 109539662A
- Authority
- CN
- China
- Prior art keywords
- cooling
- atomization
- cooling fin
- refrigerating plant
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 99
- 238000000889 atomisation Methods 0.000 title claims abstract description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 239000003595 mist Substances 0.000 claims abstract description 23
- 241000237983 Trochidae Species 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 3
- 230000008020 evaporation Effects 0.000 abstract description 2
- 238000001704 evaporation Methods 0.000 abstract description 2
- 230000005923 long-lasting effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 235000013361 beverage Nutrition 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/003—General constructional features for cooling refrigerating machinery
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0211—Control thereof of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
Abstract
The present invention relates to the refrigerating plants cooling using atomization of field of refrigeration equipment, including shell and it is set to the intracorporal cooling assembly of shell, cooling assembly includes main control board, cooling fin, semiconductor chilling plate and Refrigerating container for placing cooled object, the rear of cooling fin is successively arranged atomizing component and radiator fan, atomizing component includes water tank and atomizing piece, atomizing component is for generating the elegant water mist of nature, water mist is directly blowed to by radiator fan by cooling fin again, make water mist uniform fold to fin surface, heat is absorbed from cooling fin when water evaporation, to carry out fast cooling to cooling fin, heat spreading function through cooling fin, compared with traditional wind cooling temperature lowering, be atomized the type of cooling can hot end face to semiconductor chilling plate carry out fast cooling, to ensure that the cold end face of semiconductor chilling plate is more fast and effeciently freezed , and can be long lasting for normal work, so that refrigerating efficiency can be improved, overall structure is simple, and atomization process power consumption is few.
Description
Technical field
The present invention relates to field of refrigeration equipments, and in particular to using the cooling refrigerating plant of atomization.
Background technique
In the prior art, when such as needing to freeze food or drink, it will usually use refrigerator.Refrigerator is to maintain perseverance
Determine a kind of refrigeration equipment of low temperature and a kind of food or other articles is made to keep constant the product for civilian use of low temperature cold conditions.It is portable
Formula refrigerator just refers to that the refrigerator of carry-on compact structure, such as car refrigerator, portable refrigerator are international cities in recent years
Popular a new generation's refrigeration, cooling apparatus also can be used other refrigeration equipments to food or drink in addition to car refrigerator on field
It is freezed.
There are mainly two types of portable refrigerating devices currently on the market, and one is semiconductor car refrigerator, its principle is to lean on
Electronic chip refrigeration, its advantage is that small in size, can fast-refrigerating radiate bad the disadvantage is that cryogenic temperature cannot be too low；It is another
It is compressor car refrigerator, compressor is the traditional technology of conventional refrigerator, and cryogenic temperature is low, for -18 10 degree of degree, refrigerating efficiency
Height can make ice, is fresh-keeping, the disadvantage is that power consumption is big, noise is big, and volume is larger, and occupied space is more.Above two refrigeration dress
It sets and is intended to consider heat dissipation problem, according to law of conservation of energy, the better device of refrigeration effect, the heat generated can also increase therewith
Add, therefore, heat dissipation problem is always that refrigerating plant primarily solves the problems, such as.
There are two types of existing radiating modes, one is traditional air-cooled, i.e., is taken away heat using fan or natural wind,
For this radiating mode the disadvantage is that effect is poor, advantage is that structure is simple, easy to accomplish；Another directly will using water cooling
The advantages of heat transfer directly takes away heat to cold water, by cold water, water cooling is that short time heat dissipation effect is preferable, but common water
Cold to be cooled down by stagnant water, the cold water if it is flowing is then not in this problem, and the cooling disadvantage of stagnant water is water temperature
It can increase, when water temperature is increased to a certain degree, then heat dissipation effect is poor, then will affect refrigeration effect therewith.
Summary of the invention
Present invention aim to address disadvantages described above, the refrigerating plant cooling using atomization is provided, atomizing principles are used
Cooled down, cooling effect more preferably, so that refrigerating efficiency can be improved.
The purpose of the present invention is what is be accomplished by the following way:
Using the cooling refrigerating plant of atomization, including shell and it is set to the intracorporal cooling assembly of shell, cooling assembly includes master control
Circuit board, cooling fin, semiconductor chilling plate and the Refrigerating container for placing cooled object, semiconductor chilling plate and governor circuit
Plate is electrically connected, and the surface of Refrigerating container, the hot end face of semiconductor chilling plate are close in the cold end face of semiconductor chilling plate
It is close to the surface of cooling fin, the rear of cooling fin is successively arranged atomizing component and radiator fan, and radiator fan and atomizing piece are equal
It is electrically connected with main control board, the blowing mouth of radiator fan faces the rear end of cooling fin, and atomizing component includes water storage
The lower end of case and atomizing piece, water tank is equipped with water outlet, and atomizing piece is mounted on water outlet, the water sprayed when atomizing piece being made to work
Mist is blown into cooling fin by radiator fan, to be radiated by water mist to cooling fin.
In above description, as a preferred option, the lower end of the water tank be downwardly extending two it is symmetrical
It is atomized arm, there are two water outlet is set altogether, is located at the lower ends of two atomization arms, there are two atomizing piece is set altogether, respectively corresponds peace
On two water outlets.
In above description, as a preferred option, two type arched structures of atomization arm.
In above description, as a preferred option, two atomizing pieces are oppositely arranged, and the water mist for spraying two atomizing pieces is equal
It is concentrated to middle part.
In above description, as a preferred option, it is downwardly extending an atomization arm in the middle part of the lower end of the water tank,
Water outlet is located at the lower end of atomization arm.
In above description, as a preferred option, the atomizing piece sprays forward water mist, and water mist is made to be injected directly into cooling fin
Rear end.
In above description, as a preferred option, the top surface of the water tank adds equipped with what is be connected with the inside of water tank
The mouth of a river, and sealing cover is equipped on filler.
In above description, as a preferred option, the main control board is also connected with control button and power supply interface, control
Key and power supply interface processed all extend to the surface of shell.
In above description, as a preferred option, the cooling fin is aluminium extruded formula cooling fin, the front end of cooling fin be for
It is close to the thermal conductive surface in the hot end face of semiconductor chilling plate, the rear end of cooling fin is equipped with radiating fin.
In above description, as a preferred option, the shell includes main case and top shell, and top shell pairing lid is closed in host
The top of shell, the trailing flank of main case are equipped with air-intake window, and the left and right side of main case is equipped with the row matched with cooling fin position
Air regulator mouth.
The invention has the advantages that: atomizing component and radiator fan, atomization group are equipped at the rear of cooling fin
Water mist is directly blowed to cooling fin for generating the elegant water mist of nature, then by radiator fan by part, makes water mist uniform fold extremely
Fin surface, when water mist encounters the cooling fin of high temperature, water mist will be evaporated, and absorb heat from cooling fin when water evaporation,
To carry out fast cooling to cooling fin, the heat spreading function through cooling fin can quickly be carried out the hot end face of semiconductor chilling plate
Quickly sufficiently cooling, compared with traditional wind cooling temperature lowering, the atomization type of cooling can hot end face to semiconductor chilling plate carry out it is fast
Prompt drop temperature, to ensure that the cold end face of semiconductor chilling plate is more fast and effeciently freezed, and can be long lasting for normal work
Make, so that refrigerating efficiency can be improved, overall structure is simply small and exquisite, and atomization process power consumption is few, and does not generate any noise, whole
It is safe and efficient.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the embodiment of the present invention one；
Fig. 2 is the structural decomposition diagram of the embodiment of the present invention one；
Fig. 3 is the schematic perspective view of atomizing component in the embodiment of the present invention one；
Fig. 4 is the schematic perspective view of the embodiment of the present invention two；
Fig. 5 is the structural decomposition diagram of the embodiment of the present invention two；
Fig. 6 is the schematic perspective view of atomizing component in the embodiment of the present invention two；
In figure, 1 is main control board, and 2 be Refrigerating container, and 3 be semiconductor chilling plate, and 4 be cooling fin, and 5 be atomizing component, 501
For water tank, 502 be atomizing piece, and 503 be atomization arm, and 504 be sealing cover, and 6 be radiator fan, and 7 be main case, and 8 be top shell, 9
It is power supply interface for control button, 10,11 be air-intake window, and 12 be discharge window.
Specific embodiment
Present invention is further described in detail with specific embodiment with reference to the accompanying drawing.
Embodiment one
The present embodiment, referring to Fig.1-3, the refrigerating plant cooling using atomization of specific implementation include shell and are set to shell
Interior cooling assembly, cooling assembly include main control board 1, cooling fin 4, semiconductor chilling plate 3 and for placing cooled object
Refrigerating container 2, the opening upwards of Refrigerating container 2, the Refrigerating container 2 of the present embodiment is cylindrical cavernous structure, can be used for putting
Beverage bottle is set, convenient for freezing to beverage, semiconductor chilling plate 3 is electrically connected with main control board 1, main control board
1 is also connected with control button 9 and power supply interface 10, and control button 9 and power supply interface 10 all extend to the surface of shell, semiconductor
The rear end face of Refrigerating container 2 is close in the cold end face of cooling piece 3, before cooling fin 4 is close in the hot end face of semiconductor chilling plate 3
End face.
The rear of cooling fin 4 is successively arranged atomizing component 5 and radiator fan 6, radiator fan 6 and atomizing piece 502 with master
Control circuit board 1 is electrically connected, and the blowing mouth of radiator fan 6 faces the rear end of cooling fin 4, and atomizing component 5 includes water storage
Case 501 and atomizing piece 502, the top surface of water tank 501 are equipped with the filler be connected with the inside of water tank 501, and in filler
It is equipped with sealing cover 504, the lower end of water tank 501 is equipped with water outlet, and atomizing piece 502 is mounted on water outlet.The present embodiment
The lower end of water tank 501 is downwardly extending two symmetrical atomization arms 503, two type arched structures of atomization arm 503,
There are two water outlet is set altogether, the lower ends of two atomization arms 503 are located at, there are two atomizing piece 502 is set altogether, respectively correspond installation
On two water outlets, two atomizing pieces 502 are oppositely arranged, and the water mist for spraying two atomizing pieces 502 is concentrated to middle part.Make
The water mist that two atomizing pieces 502 spray when working is blown into the rear end of cooling fin 4 by radiator fan 6, thus by water mist to scattered
Backing 4 radiates.
The cooling fin 4 of the present embodiment is aluminium extruded formula cooling fin 4, and the front end of cooling fin 4 is for being close to semiconductor refrigerating
The rear end of the thermal conductive surface in the hot end face of piece 3, cooling fin 4 is equipped with radiating fin.Shell includes main case 7 and top shell 8, and top shell 8 is matched
Lid is closed at the top of main case 7, the trailing flank of main case 7 is equipped with air-intake window 11, and the left and right side of main case 7 is equipped with and dissipates
The discharge window 12 of 4 position of backing pairing.
Embodiment two
The present embodiment, referring to Fig. 4-6, the refrigerating plant cooling using atomization of specific implementation includes shell and is set to shell
Interior cooling assembly, cooling assembly include main control board 1, cooling fin 4, semiconductor chilling plate 3 and for placing cooled object
Refrigerating container 2, the opening upwards of Refrigerating container 2, the Refrigerating container 2 of the present embodiment is cylindrical cavernous structure, can be used for putting
Beverage bottle is set, convenient for freezing to beverage, semiconductor chilling plate 3 is electrically connected with main control board 1, main control board
1 is also connected with control button 9 and power supply interface 10, and control button 9 and power supply interface 10 all extend to the surface of shell, semiconductor
The rear end face of Refrigerating container 2 is close in the cold end face of cooling piece 3, before cooling fin 4 is close in the hot end face of semiconductor chilling plate 3
End face.
The rear of cooling fin 4 is successively arranged atomizing component 5 and radiator fan 6, radiator fan 6 and atomizing piece 502 with master
Control circuit board 1 is electrically connected, and the blowing mouth of radiator fan 6 faces the rear end of cooling fin 4, and atomizing component 5 includes water storage
Case 501 and atomizing piece 502, the top surface of water tank 501 are equipped with the filler be connected with the inside of water tank 501, and in filler
It is equipped with sealing cover 504, the lower end of water tank 501 is equipped with water outlet, and atomizing piece 502 is mounted on water outlet.The present embodiment
An atomization arm 503 is downwardly extending in the middle part of the lower end of water tank 501, water outlet is located at the lower end of atomization arm 503, atomizing piece
502 spray forward water mist, while the rear end of cooling fin 4 is blown by radiator fan 6, to be carried out by water mist to cooling fin 4
Heat dissipation.
The cooling fin 4 of the present embodiment is aluminium extruded formula cooling fin 4, and the front end of cooling fin 4 is for being close to semiconductor refrigerating
The rear end of the thermal conductive surface in the hot end face of piece 3, cooling fin 4 is equipped with radiating fin.Shell includes main case 7 and top shell 8, and top shell 8 is matched
Lid is closed at the top of main case 7, the trailing flank of main case 7 is equipped with air-intake window 11, and the left and right side of main case 7 is equipped with and dissipates
The discharge window 12 of 4 position of backing pairing.
The above content is specific preferred embodiment is combined, further detailed description of the invention, and it cannot be said that originally
The specific implementation of invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, not
Under the premise of being detached from present inventive concept, a number of simple deductions or replacements can also be made, is regarded as protection scope of the present invention.
Claims (10)
1. using the cooling refrigerating plant of atomization, including shell and it is set to the intracorporal cooling assembly of shell, cooling assembly includes master
Control circuit board, cooling fin, semiconductor chilling plate and the Refrigerating container for placing cooled object, semiconductor chilling plate and master control electricity
Road plate is electrically connected, and the surface of Refrigerating container, the hot end of semiconductor chilling plate are close in the cold end face of semiconductor chilling plate
It is close to the surface of cooling fin in face, it is characterised in that: the rear of cooling fin is successively arranged atomizing component and radiator fan, radiation air
Fan and atomizing piece are electrically connected with main control board, and the blowing mouth of radiator fan faces the rear end of cooling fin, atomization
Component includes water tank and atomizing piece, and the lower end of water tank is equipped with water outlet, and atomizing piece is mounted on water outlet, makes atomizing piece work
As when the water mist that sprays cooling fin is blown by radiator fan, to be radiated by water mist to cooling fin.
2. the refrigerating plant cooling using atomization according to claim 1, it is characterised in that: the lower end of the water tank is downward
Two symmetrical atomization arms are extended to form, there are two water outlet is set altogether, are located at the lower ends of two atomization arms, atomizing piece
There are two setting altogether, respectively corresponds and be mounted on two water outlets.
3. the refrigerating plant cooling using atomization according to claim 2, it is characterised in that: two type arched knots of atomization arm
Structure.
4. the refrigerating plant cooling using atomization according to claim 2, it is characterised in that: two atomizing pieces are oppositely arranged,
The water mist for spraying two atomizing pieces is concentrated to middle part.
5. the refrigerating plant cooling using atomization according to claim 1, it is characterised in that: in the middle part of the lower end of the water tank
It is downwardly extending an atomization arm, water outlet is located at the lower end of atomization arm.
6. the refrigerating plant cooling using atomization according to claim 5, it is characterised in that: the atomizing piece sprays forward water
Mist makes water mist be injected directly into the rear end of cooling fin.
7. according to claim 1 using the refrigerating plant that atomization is cooling described in -6 any one, it is characterised in that: the water tank
Top surface be equipped with the filler that be connected with the inside of water tank, and equipped with sealing cover on filler.
8. according to claim 1 using the refrigerating plant that atomization is cooling described in -6 any one, it is characterised in that: the master control electricity
Road plate is also connected with control button and power supply interface, and control button and power supply interface all extend to the surface of shell.
9. according to claim 1 using the refrigerating plant that atomization is cooling described in -6 any one, it is characterised in that: the cooling fin
For aluminium extruded formula cooling fin, the front end of cooling fin is the thermal conductive surface for being close to the hot end face of semiconductor chilling plate, cooling fin
Rear end is equipped with radiating fin.
10. according to claim 1 using the refrigerating plant that atomization is cooling described in -6 any one, it is characterised in that: the shell
Including main case and top shell, top shell pairing lid is closed at the top of main case, and the trailing flank of main case is equipped with air-intake window, main case
Left and right side be equipped with the discharge window matched with cooling fin position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910023849.3A CN109539662A (en) | 2019-01-10 | 2019-01-10 | Using the cooling refrigerating plant of atomization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910023849.3A CN109539662A (en) | 2019-01-10 | 2019-01-10 | Using the cooling refrigerating plant of atomization |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109539662A true CN109539662A (en) | 2019-03-29 |
Family
ID=65834895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910023849.3A Pending CN109539662A (en) | 2019-01-10 | 2019-01-10 | Using the cooling refrigerating plant of atomization |
Country Status (1)
| Country | Link |
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| CN (1) | CN109539662A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110989810A (en) * | 2020-02-07 | 2020-04-10 | 苏州溢博伦光电仪器有限公司 | Evaporation formula electronic chip forced air cooling heat abstractor |
| CN113766803A (en) * | 2021-07-23 | 2021-12-07 | 上海闻泰信息技术有限公司 | Spray cooling heat dissipation device |
| CN113819668A (en) * | 2021-09-09 | 2021-12-21 | 珠海格力电器股份有限公司 | Refrigerating device |
| CN114294735A (en) * | 2021-12-10 | 2022-04-08 | 珠海格力电器股份有限公司 | Air conditioning device and cooling fan |
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| CN113766803A (en) * | 2021-07-23 | 2021-12-07 | 上海闻泰信息技术有限公司 | Spray cooling heat dissipation device |
| CN113819668A (en) * | 2021-09-09 | 2021-12-21 | 珠海格力电器股份有限公司 | Refrigerating device |
| CN114294735A (en) * | 2021-12-10 | 2022-04-08 | 珠海格力电器股份有限公司 | Air conditioning device and cooling fan |
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