CN109530938A - A kind of method and system laser machining wafer - Google Patents
A kind of method and system laser machining wafer Download PDFInfo
- Publication number
- CN109530938A CN109530938A CN201811625811.5A CN201811625811A CN109530938A CN 109530938 A CN109530938 A CN 109530938A CN 201811625811 A CN201811625811 A CN 201811625811A CN 109530938 A CN109530938 A CN 109530938A
- Authority
- CN
- China
- Prior art keywords
- laser
- piezoelectric ceramics
- survey
- elevation information
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of method and system for laser machining wafer, which comprises obtains the feedback time of piezoelectric ceramics；The sampling interval of laser hunting gear is determined according to the feedback time of piezoelectric ceramics, then carries out surveying high record altitude information formation elevation information according to the identified sampling interval by laser hunting gear；Real-time control is carried out using feed forward compensation mechanisms to piezoelectric ceramics according to elevation information, and Cutting Road is laser machined.It is not in overlapping phenomenon that the present invention, which can not only realize that laser is cut completely between sample interior and different Cutting Roads,；It can also be by using feed forward compensation mechanisms to piezoelectric ceramics, by the Real-time Feedback effect of high-precision elevation information cooperation high-speed controller, final realize is servo-actuated high-precision control effect to laser spot.
Description
Technical field
The present invention relates to technical field of laser processing more particularly to a kind of method and system for laser machining wafer.
Background technique
In semiconductor crystal wafer manufacture field, industry is to new type integrated circuit technology, product encapsulation ability and chip
The continuous improvement that can be required, promotes wafer to thin down, the sensibility of device is higher and higher, chip structure is more and more multiple
Miscellaneous, so that the requirement to chip scribing process is more and more diversified, such as the structure of MEMS device is very fragile, do not allow using
Using the scribing process of high pressure water cleaning, also not allowing surface, there are any dust or particles；It is covered with the chip of Low-K medium
Do not allow to cause removing to film layer in scribing and does not equally allow surface there are any dust or Sawing debris.
First step process of chip package is exactly Wafer Dicing, and the effect of Wafer Dicing technique will directly affect the property of chip
Energy and production cost.Laser scribing is increasingly becoming the mainstream of advanced manufacturing industry as a kind of precision processing technology.Wherein, laser
Stealthy scribing is to utilize laser beam focus inside fragile material, and scan along scheduled path, sends out the inside of fragile material
Changing, forms the starting point of a segmentation, forms stressor layers, then applies with external force fragile material by its separated scribing skill
Art.Due to being processed in inside wafer, material chipping, film layer removing, hot shadow is can be effectively avoided in stealthy dicing technique
A series of problems, such as area is excessive, Sawing debris splashes is rung, is next-generation advanced Wafer Dicing technology.
It is whole since the wafer after being thinned can generate certain curvature, and the flatness of wafer platform becoming larger with size
The horizontal error of breadth is also increasing.Therefore, the prior art mainly applies laser hunting gear, which passes through detection sample
The fluctuations on product surface, while feeding back to and can produce micro-displacement device, such as piezoelectric ceramics, micro-displacement axis, electric spring,
Change laser head as sample surfaces change.The used micro-displacement device of the device generally responds lower.At system
When high speed reciprocal operation, the velocity of displacement of laser head can not only generate biggish delayed action, but also in the processed of return
It is easy to appear in journey and loses step, the problems such as Working position misplaces, may finally lead to process the laser processing of road edge to surface, with
And the Cutting Road of different depths of cut generates situations such as being overlapped in stealthy cutting.
Summary of the invention
The method and system of laser processing wafer provided by the invention, can not only realize that laser cuts sample interior completely
It and between different Cutting Roads is not in overlapping phenomenon；It can also be by using feed forward compensation mechanisms to piezoelectric ceramics, it will be high-precision
The Real-time Feedback effect of the elevation information cooperation high-speed controller of degree, final realize are servo-actuated high-precision control effect to laser spot
Fruit.
In a first aspect, the present invention provides a kind of method for laser machining wafer, comprising:
Obtain the feedback time of piezoelectric ceramics；
The sampling interval of laser hunting gear is determined according to the feedback time of piezoelectric ceramics, then passes through laser hunting gear
It carries out surveying high record altitude information formation elevation information according to the identified sampling interval；
Real-time control is carried out using feed forward compensation mechanisms to piezoelectric ceramics according to elevation information, and laser is carried out to Cutting Road
Processing.
Optionally, the feedback time according to piezoelectric ceramics determines the sampling interval of laser hunting gear, then passes through
Laser hunting gear carries out surveying high record altitude information formation elevation information according to the identified sampling interval
When the feedback time of piezoelectric ceramics is T milliseconds, is then determined according to feedback time and survey high starting point to cut direction
The distance that the distance and the high terminating point of survey that need to be retracted need to be retracted to cut direction；
A survey high point is taken to carry out surveying height every T milliseconds between the high starting point of survey, the high terminating point of survey by laser hunting gear
It records altitude information and forms elevation information.
Optionally, the distance X=platform speed of service * T/2 that need to be retracted.
Optionally, described that real-time control is carried out using feed forward compensation mechanisms to piezoelectric ceramics according to elevation information, and to cutting
It cuts laser machine and includes:
Elevation information is fed back into controller；
By controller control piezoelectric ceramics to survey high starting point as actual motion initial value；
Then further according to elevation information every T milliseconds by piezoelectric ceramics the mobile corresponding position of Z axis to Cutting Road forward direction into
Row laser processing, until cutting end point.
Optionally, piezoelectric ceramics is moved to Cutting Road in Z axis every T milliseconds by corresponding position according to elevation information described
Forward direction is laser machined, until after cutting end point, the method also includes:
High point position will be surveyed to be inverted to form reversed elevation information and feed back to controller；
Piezoelectric ceramics is controlled by controller and surveys high starting point as reversed actual motion initial value to be formed by after being inverted；
Then every T milliseconds that piezoelectric ceramics is anti-to Cutting Road in the mobile corresponding position of Z axis further according to reversed elevation information
To being laser machined, up to cutting end point, so that piezoelectric ceramics is determining when being reversed laser processing to Cutting Road
Survey high point position on.
Optionally, the range of T milliseconds of the feedback time of the piezoelectric ceramics is 5 milliseconds to 15 milliseconds.
Optionally, the platform speed of service is more than or equal to 600mm/s.
Second aspect, the present invention provide a kind of system for laser machining wafer, comprising:
Acquiring unit, for obtaining the feedback time of piezoelectric ceramics；
Controller determines the sampling interval of laser hunting gear for the feedback time according to piezoelectric ceramics, then passes through
Laser hunting gear carried out surveying high record altitude information formation elevation information according to the identified sampling interval；And believed according to height
Breath carries out real-time control using feed forward compensation mechanisms to piezoelectric ceramics；
Laser hunting gear is high for carrying out surveying in identified survey high point position；
Piezoelectric ceramics, for driving laser to laser machine Cutting Road.
Optionally, the controller includes:
It is retracted distance determining unit, for when the feedback time of piezoelectric ceramics is T milliseconds, then determining according to feedback time
Survey the distance and survey the distance that high terminating point need to be retracted to cut direction that high starting point need to be retracted to cut direction；
High control unit is surveyed, high starting point is being surveyed for controlling laser hunting gear, is surveying between high terminating point every T milliseconds
A survey high point is taken to carry out surveying high record altitude information formation elevation information.
Optionally, the controller further include:
First control unit, for controlling piezoelectric ceramics to survey high starting point as actual motion initial value；
Positive cut-sytle pollination unit, according to elevation information every T milliseconds by piezoelectric ceramics in the mobile corresponding position of Z axis to cutting
It cuts forward direction to be laser machined, until cutting end point；
Second control unit surveys high starting point as reversed practical fortune to be formed by after being inverted for controlling piezoelectric ceramics
Start of line value；
Reverse cut control unit, for every T milliseconds that piezoelectric ceramics is mobile corresponding in Z axis according to reversed elevation information
Position is reversed laser processing to Cutting Road, until cutting end point, so that the pressure when being reversed laser processing to Cutting Road
Electroceramics is in identified survey high point position.
The method and system of laser processing wafer provided in an embodiment of the present invention, the method mainly pass through controller
Capability of fast response compensates the slow problem of reaction of piezoelectric ceramics (PZT)；When specific technical solution is the feedback according to piezoelectric ceramics
Between match the optimal sampling interval and survey according to the matched optional sampling interval of institute high, and then position is passed through by controller
Triggering mode carries out quick real-time control to piezoelectric ceramics；And it is carried out by using elevation information is formed by Cutting Road
Back and forth movement is told in laser stealth cutting.Therefore, the present embodiment the method can not only realize that laser is cut in sample completely
It is not in overlapping phenomenon between portion and different Cutting Roads；It can also be by using feed forward compensation mechanisms to piezoelectric ceramics, it will be high
The Real-time Feedback effect of the elevation information cooperation high-speed controller of precision, final realize are servo-actuated high-precision control effect to laser spot
Fruit.
Detailed description of the invention
Fig. 1 is the flow chart for the method that the embodiment of the present invention one laser machines wafer；
Fig. 2 is the elevation information schematic diagram that the record of the embodiment of the present invention one is formed；
Fig. 3 is the structural schematic diagram for the system that the embodiment of the present invention one laser machines wafer；
Fig. 4 is the structural schematic diagram for the system that the embodiment of the present invention one laser machines wafer；
Fig. 5 is the flow chart for the method that dual-laser of the embodiment of the present invention processes wafer；
Fig. 6 is the schematic diagram that the embodiment of the present invention two carries out data processing to altitude information；
Fig. 7 is the structural schematic diagram for the system that dual-laser of the embodiment of the present invention processes wafer；
Fig. 8 is the flow chart for the method that the embodiment of the present invention three laser machines wafer；
Fig. 9 is the structural schematic diagram for the system that the embodiment of the present invention three laser machines wafer.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
It is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Embodiment one
The embodiment of the present invention provides a kind of method for laser machining wafer, as shown in Figure 1, which comprises
S11, the feedback time for obtaining piezoelectric ceramics；
S12, the sampling interval that laser hunting gear is determined according to the feedback time of piezoelectric ceramics, it is then servo-actuated by laser
Device carried out surveying high record altitude information formation elevation information according to the identified sampling interval；
S13, real-time control is carried out using feed forward compensation mechanisms to piezoelectric ceramics according to elevation information, and Cutting Road is carried out
Laser processing.
The method of laser processing wafer provided in an embodiment of the present invention is mainly to pass through the capability of fast response benefit of controller
Repay the slow problem of reaction of piezoelectric ceramics (PZT)；Specific technical solution be matched according to the feedback time of piezoelectric ceramics it is optimal
Sampling interval simultaneously carries out surveying height according to the matched optional sampling interval of institute, and then passes through location triggered mode to piezoelectricity by controller
Ceramics carry out quick real-time control；And laser stealth cutting announcement is being carried out to Cutting Road by using elevation information is formed by
Tell back and forth movement.Therefore, the present embodiment the method can not only realize that laser cuts sample interior and different Cutting Roads completely
Between be not in overlapping phenomenon；It can also be by using feed forward compensation mechanisms to piezoelectric ceramics, by high-precision elevation information
Cooperate the Real-time Feedback effect of high-speed controller, final realize is servo-actuated high-precision control effect to laser spot.
Optionally, as shown in Figures 2 and 3, the feedback time according to piezoelectric ceramics determines adopting for laser hunting gear
Then sample interval survey high record altitude information and formed highly believing by laser hunting gear according to the identified sampling interval
Breath includes:
When the feedback time of piezoelectric ceramics is T milliseconds, is then determined according to feedback time and survey high starting point to cut direction
The distance that the distance and the high terminating point of survey that need to be retracted need to be retracted to cut direction；
A survey high point is taken to carry out surveying height every T milliseconds between the high starting point of survey, the high terminating point of survey by laser hunting gear
It records altitude information and forms elevation information.
Optionally, the distance X=platform speed of service * T/2 that need to be retracted.
Specifically, the present embodiment the method is to survey high starting point, survey by laser hunting gear along Cutting Road forward direction
A survey high point is taken to carry out the process for surveying high record altitude information every T milliseconds between high terminating point, therefore can be as forward direction
High feedback information is surveyed, and the positive high feedback information of survey is located at center and the average rate that practical every section of cutting action includes distance
Operation, it is ensured that forward direction surveys the accuracy of high feedback information, to guarantee the high-precision processing of laser.
Optionally, described that real-time control is carried out using feed forward compensation mechanisms to piezoelectric ceramics according to elevation information, and to cutting
It cuts laser machine and includes:
Elevation information is fed back into controller；
By controller control piezoelectric ceramics to survey high starting point as actual motion initial value；
Then further according to elevation information every T milliseconds by piezoelectric ceramics the mobile corresponding position of Z axis to Cutting Road forward direction into
Row laser processing, until cutting end point.
Optionally, piezoelectric ceramics is moved to Cutting Road in Z axis every T milliseconds by corresponding position according to elevation information described
Forward direction is laser machined, until after cutting end point, the method also includes:
High point position will be surveyed to be inverted to form reversed elevation information and feed back to controller；
Piezoelectric ceramics is controlled by controller and surveys high starting point as reversed actual motion initial value to be formed by after being inverted；
Then every T milliseconds that piezoelectric ceramics is anti-to Cutting Road in the mobile corresponding position of Z axis further according to reversed elevation information
To being laser machined, up to cutting end point, so that piezoelectric ceramics is determining when being reversed laser processing to Cutting Road
Survey high point position on.
Specifically, carrying out laser processing in the present embodiment the method forward or backwards to Cutting Road is average rate operation,
And to Cutting Road forward direction and it is reversed T milliseconds of interval between each movement of laser cutting movement, such as T=10.Guarantee
It is enough to survey high point position and be inverted to form reversed elevation information and successfully feed back to controller；And led to using the time interval by controller
It crosses inner high speed calculation function and quickly controls piezoelectric ceramics to be formed by the high starting point of survey after being inverted as reversed actual motion
Initial value, and then guarantee that focal position of laser is close to actual processing position as far as possible by that will laser machine to be set as traveling at the uniform speed
It sets, in addition can also be further ensured that piezoelectricity is made pottery when carrying out reverse cut to Cutting Road by the time interval of one reaction of setting
Porcelain is constant in the running position of each point.
Optionally, the range of T milliseconds of the feedback time of the piezoelectric ceramics is 5 milliseconds to 15 milliseconds.
Optionally, the platform speed of service is more than or equal to 600mm/s.
In conclusion the present embodiment the method mainly passes through one feedforward work of setting, (the i.e. positive high feedback of survey is high
Spend information) and two cutting actions (Cutting Road is laser machined forward or backwards), effectively improve laser processing precision.Example
Such as, the relatively low velocity that practical high-precision operation feedback time T of the present embodiment the method based on piezoelectric ceramics is 10 milliseconds, is adopted
With feed forward compensation mechanisms, the elevation information of higher position precision in Cutting Road is obtained using laser hunting gear；Then directly anti-
It feeds controller, uses controller inner high speed calculation function, realize the real-time control to piezoelectric ceramics (PZT).Also, due to
The runing time of piezoelectric ceramics is slower, is 10 milliseconds or so.Therefore, laser hunting gear takes in practical 10 milliseconds of operation sections
Between position feed back to controller, to guarantee that focal position of laser is close to actual processing position as far as possible.When to Cutting Road
When being reversed laser processing (cutting), then forward direction is surveyed into high point position signal and be inverted feedback high-speed controller, to guarantee to press
Electroceramics is constant in the running position of each point, to solve reverse cut Working position problem of misalignment, improves in stealthy cutting
The Cutting Road of different depths of cut generates situations such as overlapping.
The embodiment of the present invention also provides a kind of system for laser machining wafer, as shown in figure 3, the system comprises:
Acquiring unit, for obtaining the feedback time of piezoelectric ceramics；
Controller determines the sampling interval of laser hunting gear for the feedback time according to piezoelectric ceramics, then passes through
Laser hunting gear carried out surveying high record altitude information formation elevation information according to the identified sampling interval；And believed according to height
Breath carries out real-time control using feed forward compensation mechanisms to piezoelectric ceramics；
Laser hunting gear 17 is high for carrying out surveying in identified survey high point position；
Piezoelectric ceramics 14, the laser for driving laser processing unit to be emitted laser machine Cutting Road.
The system of laser processing wafer provided in an embodiment of the present invention is mainly to pass through the capability of fast response benefit of controller
Repay the slow problem of reaction of piezoelectric ceramics (PZT) 14；Specific technical solution be matched according to the feedback time of piezoelectric ceramics it is optimal
Sampling interval and survey according to the matched optional sampling interval of institute it is high, and then by controller by location triggered mode to pressure
Electroceramics carries out quick real-time control；And laser stealth cutting is being carried out to Cutting Road by using elevation information is formed by
Tell back and forth movement.Therefore, system described in the present embodiment can not only realize that laser cuts sample interior and different cuttings completely
It is not in overlapping phenomenon between road；High-precision height can also be believed by using feed forward compensation mechanisms to piezoelectric ceramics
The Real-time Feedback effect of breath cooperation high-speed controller, final realize are servo-actuated high-precision control effect to laser spot.
Optionally, the controller includes:
It is retracted distance determining unit, for when the feedback time of piezoelectric ceramics is T milliseconds, then determining according to feedback time
Survey the distance and survey the distance that high terminating point need to be retracted to cut direction that high starting point need to be retracted to cut direction；
High control unit is surveyed, high starting point is being surveyed for controlling laser hunting gear, is surveying between high terminating point every T milliseconds
A survey high point is taken to carry out surveying high record altitude information formation elevation information.
Optionally, the controller further include:
First control unit, for controlling piezoelectric ceramics to survey high starting point as actual motion initial value；
Positive cut-sytle pollination unit, according to elevation information every T milliseconds by piezoelectric ceramics in the mobile corresponding position of Z axis to cutting
It cuts forward direction to be laser machined, until cutting end point；
Second control unit surveys high starting point as reversed practical fortune to be formed by after being inverted for controlling piezoelectric ceramics
Start of line value；
Reverse cut control unit, for every T milliseconds that piezoelectric ceramics is mobile corresponding in Z axis according to reversed elevation information
Position is reversed laser processing to Cutting Road, until cutting end point, so that the pressure when being reversed laser processing to Cutting Road
Electroceramics is in identified survey high point position.
In conclusion as shown in Figure 3 and Figure 4, laser processing beam 16 is successively by coaxial in system described in the present embodiment
Lens barrel 13, PZT14,50X processing object lens 15 focus on the surface of wafer 19 to be processed；It is additionally provided on coaxial lens barrel 13
CCD11 and detection light source 12 are for detecting laser processing beam；And by 18 fixed laser hunting gear 17 of stationary backplate with it is upper
State optical element；So that laser hunting gear 17 surveys high focus B and passes through the laser processing light that PZT14,50X process object lens 15
The focus A of beam is fixed height C, and laser hunting gear 17 is surveyed high obtained altitude information and feeds back to controller control pressure by raising
The accuracy of electroceramics.
The system of the present embodiment can be used for executing the technical solution of above method embodiment, realization principle and technology
Effect is similar, and details are not described herein again.
Embodiment two
Due to the problem of in equipment high-speed cruising, the reaction of laser hunting gear can not keep up with sample surfaces variation slowly, nothing
Method realizes laser processing machining accuracy of the focus from sample surfaces variation ± 1um.Therefore the embodiment of the present invention provides a kind of laser
The method for processing wafer, as shown in Figure 5, which comprises
S21, the altitude information that Cutting Road to be processed is obtained by laser hunting gear；
S22, data processing is carried out to acquired altitude information according to the feedback time of piezoelectric ceramics and forms positive back-pressure
Electroceramics motion compensation table；
S23, when being laser machined forward or backwards to Cutting Road, compensated all in accordance with the positive and negative piezo ceramic motion
Table controls piezoelectric ceramics and carries out real-time control using feed forward compensation mechanisms.
The method of laser processing wafer provided in an embodiment of the present invention mainly can be automatic according to the fluctuating of crystal column surface
The height for adjusting laser cutting head keeps scheduled laser focal, solves in equipment high-speed cruising, the reaction of laser hunting gear
Slowly the problem of sample surfaces variation can not be kept up with, realizes laser processing machining accuracy of the focus from sample surfaces variation ± 1um.It is first
It is first obtained by laser hunting gear in the altitude information of Cutting Road to be processed through a large amount of intensive altitude informations of measurement, measurement
Interval time seldom obtains a large amount of altitude information；Then according still further to the feedback time of piezoelectric ceramics to acquired altitude information
It carries out data processing and forms positive and negative piezo ceramic motion compensation table, such as to the feedback time according to piezoelectric ceramics to acquired
Altitude information screened, average treatment, curve matching etc. form high-precision positive and negative piezo ceramic motion compensation table；Finally
Quick real-time control is carried out to piezoelectric ceramics by location triggered mode；It can be effectively solved the piezoelectric ceramics control of different delayed time
The adaptability problem of processing procedure sequence, and simplify the required precision that hardware assembles by using feed forward compensation mechanisms, make hardware design more
It is flexible.
In addition, the present embodiment the method (is surveyed by laser hunting gear forward direction high anti-by one feedforward work of setting
Feedback altitude information is formed by positive and negative piezo ceramic motion compensation table) and two cutting actions (to Cutting Road forward or backwards into
Row laser processing), it solves the problems, such as the fluctuation up and down of two-way invisible cutting Cutting Road distance, effectively improves laser processing precision, make
Cutting speed up to 2000mm/s, reachable ± 1 μm of cutting accuracy；And then it can realize and change little wafer to surface smoothness
Surface high-speed cutting.
Optionally, as shown in Figure 5 and Figure 6, the altitude information that Cutting Road to be processed is obtained by laser hunting gear
Include:
Preset to survey distance that high starting point need to be retracted to cut direction and survey high terminating point needs to contract to cut direction
Into distance；Include distance in practical every section of cutting action (i.e. Cutting Road) for example, presetting unidirectionally to carry out surveying rise and off normal
Each retraction 2mm of start position or so as surveying high starting point, survey high terminating point；
It surveying high starting point, surveying between high terminating point, it is to be processed according to high sampling time acquisition is surveyed by laser hunting gear
Cutting Road altitude information；
Optionally, described to survey high sampling timeframe as 0.5ms-5ms；Wherein, the sampling precision when sampling time is 0.5ms
Highest.
In addition, it may include complete for unidirectionally surveying the high target phase for obtaining Cutting Road altitude information to be processed by laser hunting gear
Journey at the uniform velocity surveys high, whole speed change survey height and average rate survey in part is high；And unidirectional instantaneous velocity when surveying high operation is not more than
2000mm/s。
Optionally, the feedback time according to piezoelectric ceramics carries out data processing to acquired altitude information and is formed
Positive and negative piezo ceramic motion compensation table includes:
The movement velocity and motion delay of laser hunting gear are obtained, and according to the exercise data and fortune of laser hunting gear
Dynamic Delay computing obtains the corresponding practical X-axis position of Cutting Road and its corresponding altitude information；
Feedback time, the laser processing speed of piezoelectric ceramics are obtained, and according to the feedback time of piezoelectric ceramics, laser processing
Speed determines positive and negative piezo ceramic motion compensation table.
Optionally, the feedback time for obtaining piezoelectric ceramics, laser processing speed, and when according to the feedback of piezoelectric ceramics
Between, laser processing speed determine that positive and negative piezo ceramic motion compensation table includes:
Feedback time, the laser processing data of piezoelectric ceramics are obtained, and are added according to the feedback time and laser of piezoelectric ceramics
Compensation point coordinate is calculated in number evidence；
Node to be compensated is filtered out in surveying high data according to compensation point coordinate, and generates positive and negative piezo ceramic motion compensation
Table；Wherein,
The positive and negative piezo ceramic motion compensation table includes that positive cutting piezo ceramic motion compensates table, reverse cut piezoelectricity
Ceramic sports compensate table.
Optionally, described when being laser machined forward or backwards to Cutting Road, all in accordance with the positive and negative piezoelectric ceramics
Motion compensation table control piezoelectric ceramics carries out real-time control using feed forward compensation mechanisms
When Cutting Road is laser machined, judges laser motion direction and survey the determining laser processing direction in high direction, and
The piezo ceramic motion compensation table of its corresponding direction is called according to laser processing direction；
When being laser machined forward or backwards to Cutting Road, according to the piezo ceramic motion compensation for calling corresponding direction
Table control piezoelectric ceramics is laser machined using feed forward compensation mechanisms.
Optionally, described when being laser machined forward or backwards to Cutting Road, according to the piezoelectricity for calling corresponding direction
Ceramic sports compensation table control piezoelectric ceramics carries out laser processing using feed forward compensation mechanisms
It to survey high starting point as actual motion starting point, is triggered by controller interior location, is triggered in piezoelectric ceramics
Position sends triggering command, and compensates table real-time control piezoelectric ceramics forward direction to cutting according to the positive piezo ceramic motion of calling
Road is cut, until cutting end point；
Mobile Z axis leapfrog, transfers reverse cut piezo ceramic motion compensation table, reversed servo-actuated cutting is carried out, until completing
The cutter number of setting.
In conclusion the present embodiment the method is will to measure to be carried out in two steps with lag function；On the one hand can pass through
Location triggered mode carries out quick real-time control to piezoelectric ceramics.On the other hand the practical height of piezoelectric ceramics (PZT) can be based on
The relatively low velocity that precision operation feedback time is 6 milliseconds is cut using feed forward compensation mechanisms using high-rate laser hunting gear
The altitude information of higher position precision in cutting.Then it is fed directly to controller, using controller inner high speed calculation function,
Realize the real-time control to PZT.Every 0.5 millisecond of laser hunting gear takes an altitude information and corresponding X-axis position；And according to
Laser hunting gear delay time t and laser hunting gear movement velocity, calculate actual X-axis position and altitude information.Again
Postponed according to 6 milliseconds of controls of laser cutting speed and PZT, when calculating the movement of positive and negative both direction, PZT fixed point sends X-axis
Immediate position is finally picked out as node to be compensated respective heights data in position from altitude information.At high speed according to survey
Difference, X-axis compensates position and absolute fix distance is less than 1mm, to guarantee that focal position of laser is close to reality as far as possible
Working position.This processing method guarantee piezoelectric ceramics is constant for the running position of same point when positive and negative both direction moves,
To solve the problems, such as the fluctuation up and down of two-way invisible cutting Cutting Road distance, and can reach in the case where guaranteeing PTZ delay
Maximum control precision.
The embodiment of the present invention also provides a kind of system for laser machining wafer, as shown in fig. 7, the system comprises:
Laser hunting gear 22, for obtaining the altitude information of Cutting Road to be processed；
Data processing unit carries out data processing to acquired altitude information for the feedback time according to piezoelectric ceramics
And form positive and negative piezo ceramic motion compensation table；
Piezoelectric ceramics 24, for driving laser to laser machine Cutting Road forward or backwards；
Controller, for when being laser machined forward or backwards to Cutting Road, all in accordance with the positive and negative piezoelectric ceramics
Motion compensation table controls piezoelectric ceramics and carries out real-time control using feed forward compensation mechanisms.
The system of laser processing wafer provided in an embodiment of the present invention mainly can be by controller according to crystal column surface
It rises and falls and automatically adjusts the height of laser cutting head, keep scheduled laser focal, solve in equipment high-speed cruising, laser is servo-actuated
Device reaction can not keep up with the problem of sample surfaces variation slowly, realize laser processing focus adding from sample surfaces variation ± 1um
Work precision.It is obtained first by laser hunting gear in the altitude information of Cutting Road to be processed through a large amount of intensive height of measurement
Data, interval time of measurement seldom obtain a large amount of altitude information；Then again by data processing unit according to the anti-of piezoelectric ceramics
The feedback time carries out data processing to acquired altitude information and forms positive and negative piezo ceramic motion compensation table, such as to according to pressure
The feedback time of electroceramics screens acquired altitude information, average treatment, curve matching etc. formed it is high-precision just
Back-pressure electroceramics motion compensation table；Quick real-time control is finally carried out to piezoelectric ceramics by location triggered mode by controller；
It can be effectively solved the adaptability problem of the piezoelectric ceramics control program of different delayed time, and by using feed forward compensation mechanisms letter
The required precision for changing hardware assembly, keeps hardware design more flexible.
In addition, system described in the present embodiment (is surveyed by laser hunting gear forward direction high anti-by one feedforward work of setting
Feedback altitude information is formed by positive and negative piezo ceramic motion compensation table) and two cutting actions (to Cutting Road forward or backwards into
Row laser processing), it solves the problems, such as the fluctuation up and down of two-way invisible cutting Cutting Road distance, effectively improves laser processing precision, make
Cutting speed up to 2000mm/s, reachable ± 1 μm of cutting accuracy；And then it can realize and change little wafer to surface smoothness
Surface high-speed cutting.
Optionally, the system also includes:
Distance retraction setting unit surveys the distance and survey that high starting point need to be retracted to cut direction for presetting
The distance that high terminating point need to be retracted to cut direction.
Optionally, the data processing unit includes:
Computing module, for obtaining the movement velocity and motion delay of laser hunting gear, and according to laser hunting gear
Exercise data and motion delay the corresponding practical X-axis position of Cutting Road and its corresponding altitude information is calculated；
Table determining module is compensated, for obtaining feedback time, the laser processing speed of piezoelectric ceramics, and according to piezoelectric ceramics
Feedback time, laser processing speed determine positive and negative piezo ceramic motion compensation table.
In conclusion as shown in fig. 7, along 27 direction laser processing beam 25 of Y motion axis in system described in the present embodiment
Successively focused in wafer to be processed by coaxial lens barrel 23, PZT24, processing object lens 26；Laser is set on Z kinematic axis 21
Hunting gear 22 and coaxial lens barrel 23；By in Fig. 7 XY process plane 28 show 0 focus 29 of laser hunting gear and
The position of laser spot 210.
The system of the present embodiment can be used for executing the technical solution of above method embodiment, realization principle and technology
Effect is similar, and details are not described herein again.
Embodiment three
Due to existing wafer laser cut it is higher to the coherence request of depth of cut, precision at least in the micron-scale, but
It is cutting at high speed and crystal column surface out-of-flatness composition conflict factor, easily causes focussing plane in the case of high-speed motion
It is detached from wafer plane, the breakpoint situation of crystal column surface cutting occurs, and frequently updates laser hunting gear setting value and also can
Cause the oscillation error of laser hunting gear.Therefore, the embodiment of the present invention provides a kind of method for laser machining wafer, such as Fig. 8
It is shown, which comprises
S31, Cutting Road to be processed is scanned, and obtains the altitude information of the Cutting Road by laser hunting gear；
S32, altitude information is fitted to the altitude curve to form the Cutting Road；
S33, the height set in default cutting apart from interior laser hunting gear, and root are determined according to the altitude curve
Cutting Road is laser machined apart from interior in default cutting according to the height set control piezoelectric ceramics of laser hunting gear.
The method of laser processing wafer provided in an embodiment of the present invention mainly passes through scan incision road, between the shortest distance
Away from the altitude information for recording each position, an altitude curve is fitted to according to the altitude information recorded on whole Cutting Road,
Due to crystal column surface irregularities be typically all be in tendency variation, will not be mutated, thus the altitude curve with apart from crystalline substance
The actual height height of curve of circular surfaces matches.
Meanwhile laser hunting gear is from height set signal is received to the practical moving process for moving to setting value position
It is non-phase step type, like B-H loop, cutting speed is faster for mass motion track, and process form is more obvious, and therefore, is cutting at a high speed
Height maxima of one section of cutting in or minimum value can be considered as to the target set point of servomechanism, not only when cutting movement
Ensure that laser focussing plane always influences the requirement of technological effect with Cutting Road surface distance in the micron-scale and not, but avoid by
Laser hunting gear is in concussion state at any time, causes to control error.
Therefore, the present embodiment the method first aspect can reach in wafer cutting technique laser focussing plane always
With Cutting Road surface always in sustained height, it will not rise and fall with Cutting Road apparent height and breakpoint phenomenon occur, and laser is servo-actuated
Device controls precision in ± 1 μ m；Second aspect can also greatly improve under the premise of not influencing technique cutting effect
Cutting speed shortens the process time, improves equipment capacity；The third aspect can also reduce laser hunting gear a small range
Frequently concussion reduces measurement error, and increases service life of equipment to a certain extent.
Optionally, described to scan Cutting Road to be processed, and the altitude information of the Cutting Road is obtained by laser hunting gear
Include:
Preset laser hunting gear height zero point value, mobile Z axis, control laser hunting gear within a preset range into
Row movement；
Preset the high starting point P of survey of Cutting Roada, survey high terminating point Pb；
Surveying high starting point Pa, survey high terminating point PbBetween, it is focused and is put down according to location interval d measurement by laser hunting gear
Identity distance is stored in array H [k] from material surface height, and by measured altitude information, k=(Pa-Pb)/d；Wherein, k round numbers.
Optionally, the altitude curve line to form the Cutting Road that altitude information is fitted is according in array H [k]
Altitude information do curve matching formed altitude curve H~；Wherein,
H~=f (P, H, C), H~be any point fitting height.
Optionally, described determined according to the altitude curve sets in height of the default cutting apart from interior laser hunting gear
Value includes:
Preset technique cutting speed Vpro, it is servo-actuated more new settings interval time Tset, updated at interval of distance D primary sharp
The height set of light hunting gear, wherein D=VproTset, and D > d；
Obtain the starting point height value H of every section of distance D lengtha, end point height value Hb, maximum height value HtopWith minimum height
Angle value Hbot；
Compare starting point height value HaWith end point height value HbDetermine the height set H of laser hunting gearset。
Optionally, the relatively starting point height value HaWith end point height value HbDetermine that the height of laser hunting gear is set
Definite value HsetInclude:
Work as Ha> HbWhen, then Hset=Htop；
Work as Ha< HbWhen, then Hset=Hbot。
Optionally, the range of the location interval d are as follows: 1mm≤d≤100mm.
Optionally, the method also includes:
When being laser machined forward or backwards to Cutting Road, all in accordance with the servo-actuated dress of the laser determined by altitude curve
The height set control piezoelectric ceramics set.
For example, the present embodiment the method concrete scheme can execute in accordance with the following steps:
Laser hunting gear height zero point value is preset, mobile Z axis controls the moving range of laser hunting gear
In micron-sized adjustable extent；
Presetting a Cutting Road start position is Pa, final position Pb, whole Cutting Road is scanned, with location interval d
(1mm≤d≤100mm) measures focussing plane apart from crystal column surface height, successively records all altitude information deposits array H [k],
K=(Pa-Pb)/d, k round numbers；
Curve matching is done according to the altitude information in array H [k], the fitting at any point H~=f (P, H, C), H~be
Highly；
Set technique cutting speed Vpro, it is servo-actuated more new settings interval time Tset, at interval of distance D update a laser with
The height set of dynamic device, D=VproTset, meet condition D > d；
Take the starting point height value H of each section of D lengtha, end point height value Hb, maximum height value HtopWith minimum height values
Hbot, high speed setting value Hset
Work as Ha> HbWhen, then Hset=Htop；
Work as Ha< HbWhen, then Hset=Hbot。
The embodiment of the present invention also provides a kind of system for laser machining wafer, as shown in figure 9, the system comprises:
Laser hunting gear 31 for scanning Cutting Road to be processed, and obtains the altitude information of the Cutting Road；
Curve matching unit 32, for altitude information to be fitted to the altitude curve to form the Cutting Road；
Piezoelectric ceramics 33, for driving laser to laser machine Cutting Road；
Controller 34 is set for being determined according to the altitude curve in height of the default cutting apart from interior laser hunting gear
Definite value, and piezoelectric ceramics is controlled according to the height set of laser hunting gear, Cutting Road is swashed apart from interior in default cutting
Light processing.
The system of laser processing wafer provided in an embodiment of the present invention mainly passes through scan incision road, between the shortest distance
Away from the altitude information for recording each position, it is fitted to by curve matching unit according to the altitude information recorded on whole Cutting Road
One altitude curve, being typically all due to the irregularities of crystal column surface is in tendency variation, will not be mutated, therefore the height
Curve is matched with the actual height height of curve apart from crystal column surface.
Meanwhile laser hunting gear is from height set signal is received to the practical moving process for moving to setting value position
It is non-phase step type, like B-H loop, cutting speed is faster for mass motion track, and process form is more obvious, and therefore, is cutting at a high speed
Height maxima of one section of cutting in or minimum value can be considered as to the target set point of servomechanism, not only when cutting movement
Ensure that laser focussing plane always influences the requirement of technological effect with Cutting Road surface distance in the micron-scale and not, but avoid by
Laser hunting gear is in concussion state at any time, causes to control error.
Therefore, system first aspect described in the present embodiment can reach in wafer cutting technique laser focussing plane always
With Cutting Road surface always in sustained height, it will not rise and fall with Cutting Road apparent height and breakpoint phenomenon occur, and laser is servo-actuated
Device controls precision in ± 1 μ m；Second aspect can also greatly improve under the premise of not influencing technique cutting effect
Cutting speed shortens the process time, improves system production capacity；The third aspect can also reduce laser hunting gear a small range
Frequently concussion reduces measurement error, and increases system service life to a certain extent.
Optionally, the system also includes:
Setting unit, for presetting laser hunting gear height zero point value, mobile Z axis controls laser hunting gear
It is moved within a preset range；And preset the high starting point P of survey of Cutting Roada, survey high terminating point Pb。
Optionally, the controller includes:
Parameter setting module, for presetting technique cutting speed Vpro, it is servo-actuated more new settings interval time Tset, every
Gauge updates the height set of a laser hunting gear from D, wherein D=VproTset, and D > d；
Module is obtained, for obtaining the starting point height value H of every section of distance D lengtha, end point height value Hb, maximum height
Value HtopWith minimum height values Hbot；
Determining module, for comparing starting point height value HaWith end point height value HbDetermine the height of laser hunting gear
Setting value Hset。
The system of the present embodiment can be used for executing the technical solution of above method embodiment, realization principle and technology
Effect is similar, and details are not described herein again.
Those of ordinary skill in the art will appreciate that realizing all or part of the process in above-described embodiment method, being can be with
Relevant hardware is instructed to complete by computer program, the program can be stored in a computer-readable storage medium
In, the program is when being executed, it may include such as the process of the embodiment of above-mentioned each method.Wherein, the storage medium can be magnetic
Dish, CD, read-only memory (Read-Only Memory, ROM) or random access memory (Random Access
Memory, RAM) etc..
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by those familiar with the art, all answers
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (10)
1. a kind of method for laser machining wafer characterized by comprising
Obtain the feedback time of piezoelectric ceramics；
The sampling interval of laser hunting gear is determined according to the feedback time of piezoelectric ceramics, then by laser hunting gear according to
The identified sampling interval carries out surveying high record altitude information formation elevation information；
Real-time control is carried out using feed forward compensation mechanisms to piezoelectric ceramics according to elevation information, and laser is carried out to Cutting Road and is added
Work.
2. the method according to claim 1, wherein the feedback time according to piezoelectric ceramics determine laser with
Then the sampling interval of dynamic device carries out surveying high record altitude information according to the identified sampling interval by laser hunting gear
Forming elevation information includes:
When the feedback time of piezoelectric ceramics is T milliseconds, then determine that survey high starting point needs to contract to cut direction according to feedback time
Into distance and survey the distance that high terminating point need to be retracted to cut direction；
A survey high point is taken to carry out surveying high record every T milliseconds between the high starting point of survey, the high terminating point of survey by laser hunting gear
Altitude information forms elevation information.
3. according to the method described in claim 2, it is characterized in that, the distance X=platform speed of service * T/2 that need to be retracted.
4. method according to claim 1 to 3, which is characterized in that described to be used according to elevation information to piezoelectric ceramics
Feed forward compensation mechanisms carry out real-time control, and carry out laser processing to Cutting Road and include:
Elevation information is fed back into controller；
By controller control piezoelectric ceramics to survey high starting point as actual motion initial value；
Then piezoelectric ceramics swashs Cutting Road forward direction in the mobile corresponding position of Z axis every T milliseconds further according to elevation information
Light processing, until cutting end point.
5. according to the method described in claim 4, it is characterized in that, piezoelectricity is made pottery every T milliseconds according to elevation information described
Porcelain laser machines Cutting Road forward direction in the mobile corresponding position of Z axis, until after cutting end point, the method also includes:
High point position will be surveyed to be inverted to form reversed elevation information and feed back to controller；
Piezoelectric ceramics is controlled by controller and surveys high starting point as reversed actual motion initial value to be formed by after being inverted；
Then further according to reversed elevation information every T milliseconds by piezoelectric ceramics the mobile corresponding position of Z axis to Cutting Road reversely into
Row laser processing, until cutting end point, so that piezoelectric ceramics is in identified survey when being reversed laser processing to Cutting Road
In high point position.
6. according to the method in claim 2 or 3, which is characterized in that T milliseconds of feedback time of range of the piezoelectric ceramics
It is 5 milliseconds to 15 milliseconds.
7. according to the method described in claim 3, it is characterized in that, the platform speed of service is more than or equal to 600mm/s.
8. a kind of system for laser machining wafer characterized by comprising
Acquiring unit, for obtaining the feedback time of piezoelectric ceramics；
Controller determines the sampling interval of laser hunting gear for the feedback time according to piezoelectric ceramics, then passes through laser
Hunting gear carried out surveying high record altitude information formation elevation information according to the identified sampling interval；And according to elevation information pair
Piezoelectric ceramics carries out real-time control using feed forward compensation mechanisms；
Laser hunting gear is high for carrying out surveying in identified survey high point position；
Piezoelectric ceramics, for driving laser to laser machine Cutting Road.
9. system according to claim 8, which is characterized in that the controller includes:
It is retracted distance determining unit, for when the feedback time of piezoelectric ceramics is T milliseconds, then determining according to feedback time and surveying height
The distance and survey the distance that high terminating point need to be retracted to cut direction that starting point need to be retracted to cut direction；
High control unit is surveyed, takes one every T milliseconds between the high starting point of survey, the high terminating point of survey for controlling laser hunting gear
High point is surveyed to carry out surveying high record altitude information formation elevation information.
10. system according to claim 8 or claim 9, which is characterized in that the controller further include:
First control unit, for controlling piezoelectric ceramics to survey high starting point as actual motion initial value；
Piezoelectric ceramics is moved corresponding position to Cutting Road in Z axis every T milliseconds according to elevation information by positive cut-sytle pollination unit
Forward direction is laser machined, until cutting end point；
Second control unit surveys high starting point as reversed actual motion to be formed by after being inverted for controlling piezoelectric ceramics
Initial value；
Reverse cut control unit, for piezoelectric ceramics to be moved corresponding position in Z axis every T milliseconds according to reversed elevation information
Laser processing is reversed to Cutting Road, until cutting end point, so that piezoelectricity is made pottery when being reversed laser processing to Cutting Road
Porcelain is in identified survey high point position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811625811.5A CN109530938B (en) | 2018-12-28 | 2018-12-28 | Method and system for processing wafer by laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811625811.5A CN109530938B (en) | 2018-12-28 | 2018-12-28 | Method and system for processing wafer by laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109530938A true CN109530938A (en) | 2019-03-29 |
| CN109530938B CN109530938B (en) | 2020-07-21 |
Family
ID=65857816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811625811.5A Active CN109530938B (en) | 2018-12-28 | 2018-12-28 | Method and system for processing wafer by laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109530938B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114939737A (en) * | 2022-06-10 | 2022-08-26 | 苏州迈为科技股份有限公司 | Laser processing device, method, storage medium and electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100197207B1 (en) * | 1996-11-22 | 1999-06-15 | 김덕중 | Micro-cutting system using piezoelectric material |
| CN102280572A (en) * | 2011-04-15 | 2011-12-14 | 重庆大学 | Composite linear control method of hysteresis characteristic of piezoelectric ceramic actuator and realization circuit thereof |
| CN102486477A (en) * | 2010-12-04 | 2012-06-06 | 中国科学院沈阳自动化研究所 | Model-based hysteresis feed-forward correction method of piezoelectric ceramic scanner |
| CN102621889A (en) * | 2012-03-27 | 2012-08-01 | 中国科学院光电技术研究所 | Composite control method for piezoelectric ceramic positioning |
| CN105159069A (en) * | 2015-08-03 | 2015-12-16 | 北京理工大学 | Displacement control method of piezoelectric ceramics actuator |
| CN105242542A (en) * | 2015-10-30 | 2016-01-13 | 中国兵器工业集团第二O二研究所 | Cannon servo-actuated system feedforward control method with time lag taken into consideration |
| CN103336429B (en) * | 2013-06-24 | 2016-08-17 | 中国科学院长春光学精密机械与物理研究所 | A kind of high-accuracy control method of piezoelectric ceramic actuator |
| CN108393579A (en) * | 2017-02-07 | 2018-08-14 | 京东方科技集团股份有限公司 | Laser processing device and laser processing |
-
2018
- 2018-12-28 CN CN201811625811.5A patent/CN109530938B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100197207B1 (en) * | 1996-11-22 | 1999-06-15 | 김덕중 | Micro-cutting system using piezoelectric material |
| CN102486477A (en) * | 2010-12-04 | 2012-06-06 | 中国科学院沈阳自动化研究所 | Model-based hysteresis feed-forward correction method of piezoelectric ceramic scanner |
| CN102280572A (en) * | 2011-04-15 | 2011-12-14 | 重庆大学 | Composite linear control method of hysteresis characteristic of piezoelectric ceramic actuator and realization circuit thereof |
| CN102621889A (en) * | 2012-03-27 | 2012-08-01 | 中国科学院光电技术研究所 | Composite control method for piezoelectric ceramic positioning |
| CN103336429B (en) * | 2013-06-24 | 2016-08-17 | 中国科学院长春光学精密机械与物理研究所 | A kind of high-accuracy control method of piezoelectric ceramic actuator |
| CN105159069A (en) * | 2015-08-03 | 2015-12-16 | 北京理工大学 | Displacement control method of piezoelectric ceramics actuator |
| CN105242542A (en) * | 2015-10-30 | 2016-01-13 | 中国兵器工业集团第二O二研究所 | Cannon servo-actuated system feedforward control method with time lag taken into consideration |
| CN108393579A (en) * | 2017-02-07 | 2018-08-14 | 京东方科技集团股份有限公司 | Laser processing device and laser processing |
Non-Patent Citations (1)
| Title |
|---|
| 崔玉国等: "压电微动工作台的位移复合控制", 《机械工程学报》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114939737A (en) * | 2022-06-10 | 2022-08-26 | 苏州迈为科技股份有限公司 | Laser processing device, method, storage medium and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109530938B (en) | 2020-07-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109530937A (en) | A kind of method and system laser machining wafer | |
| US7994451B2 (en) | Laser beam processing machine | |
| US7714249B2 (en) | Laser beam processing machine | |
| US10500677B2 (en) | Laser machining systems and methods with vision correction and/or tracking | |
| US20050224475A1 (en) | Laser beam processing machine | |
| JP5122773B2 (en) | Laser processing machine | |
| CN101522361B (en) | Laser working method | |
| US20050236381A1 (en) | Laser beam processing machine | |
| KR101253791B1 (en) | Laser beams irradiation apparatuses and laser machine | |
| US8847108B2 (en) | Laser beam machining apparatus with detection laser beam oscillator | |
| KR102003566B1 (en) | Laser machining apparatus | |
| CN102950383B (en) | Method for punching and laser processing device | |
| CN105269159A (en) | Chip manufacturing method | |
| KR20060126708A (en) | Laser processing method and device | |
| US20080217301A1 (en) | Laser beam processing machine | |
| CN102794567A (en) | Laser processing apparatus | |
| KR20110140094A (en) | Dicing methods | |
| KR102437379B1 (en) | Laser machining device and laser machining method | |
| US20080205458A1 (en) | Laser beam irradiation apparatus and laser beam machining apparatus | |
| CN103223558A (en) | Laser processing apparatus | |
| JP2008119741A (en) | Laser beam machining apparatus and method of machining wafer | |
| CN109530938A (en) | A kind of method and system laser machining wafer | |
| US20200269357A1 (en) | Laser processing device and laser processing method | |
| CN109530939A (en) | A kind of method and system laser machining wafer | |
| EP1892502B1 (en) | Surface position detector and laser beam processing machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |