CN109520608A - Sound/vibration spectrum analysis equipment and acquisition and the method for analyzing frequency information - Google Patents
Sound/vibration spectrum analysis equipment and acquisition and the method for analyzing frequency information Download PDFInfo
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
- G01H1/12—Measuring characteristics of vibrations in solids by using direct conduction to the detector of longitudinal or not specified vibrations
- G01H1/14—Frequency
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10L—SPEECH ANALYSIS OR SYNTHESIS; SPEECH RECOGNITION; SPEECH OR VOICE PROCESSING; SPEECH OR AUDIO CODING OR DECODING
- G10L25/00—Speech or voice analysis techniques not restricted to a single one of groups G10L15/00 - G10L21/00
- G10L25/03—Speech or voice analysis techniques not restricted to a single one of groups G10L15/00 - G10L21/00 characterised by the type of extracted parameters
- G10L25/18—Speech or voice analysis techniques not restricted to a single one of groups G10L15/00 - G10L21/00 characterised by the type of extracted parameters the extracted parameters being spectral information of each sub-band
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H3/00—Measuring characteristics of vibrations by using a detector in a fluid
- G01H3/04—Frequency
- G01H3/08—Analysing frequencies present in complex vibrations, e.g. comparing harmonics present
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/178—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of a laminated structure of multiple piezoelectric layers with inner electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
- H04R1/245—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges of microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R11/00—Transducers of moving-armature or moving-core type
- H04R11/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R11/00—Transducers of moving-armature or moving-core type
- H04R11/14—Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/02—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/10—Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R29/00—Monitoring arrangements; Testing arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/04—Circuits for transducers, loudspeakers or microphones for correcting frequency response
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/08—Microphones
Abstract
A kind of sound and vibration frequency specturm analysis equipment include multiple resonators with different center frequency, and multiple resonator is configured as obtaining the frequency spectrum of sound and vibration.The sound and vibration frequency specturm analysis equipment are configured as analyzing the frequency spectrum of sound and vibration based on the first frequency signal of the first mode of resonance of at least some of multiple resonator resonator and second order or the second frequency signal of higher mode of resonance.
Description
Cross reference to related applications
This application claims in the South Korea patent application No.10- submitted in Korean Intellectual Property Office on the 19th of September in 2017
The priority of 2017-0120515, and it is incorporated herein by reference its entire disclosure.
Technical field
Device and method according to example embodiment are related to sound/vibration spectrum analysis equipment and acquisition and analysis frequency letter
The method of breath.
Background technique
The spectrum analyzer of analysis sound or the frequency spectrum of vibration can be applied to mobile phone, computer, household electrical appliances, automobile, intelligence
Speech recognition, spokesman's identification, scene identification in energy domestic environment etc. etc., or can be by being mounted on building, automobile, family
For analyzing vibration information in electricity etc..
Analog-digital converter (ADC) can be passed through by will enter into the voice signal of the microphone with broadband character to carry out
Fourier transformation obtains the frequency domain information of voice signal.However, in frequency information acquisition methods, due to Fourier transformation,
Calculation amount may be very big, and since there are trade-off relations for frequency resolution and temporal resolution, it is difficult to while improving time letter
The resolution ratio of breath and frequency information.
Summary of the invention
Provide the sound/vibration spectrum analysis equipment that the frequency spectrum of sound and/or vibration is obtained including resonator array.
It provides and resolution ratio can be improved, reduce device area/size, and improve sound/vibration of the output of independent resonator
Dynamic spectrum analysis equipment.
Provide the sound/vibration spectrum analysis equipment that can get splendid resolution ratio while there is small size.
The method for providing acquisition relevant to sound/vibration spectrum analysis equipment and analysis frequency information.
One aspect according to example embodiment provides a kind of sound and vibration frequency specturm analysis equipment, including has not
With multiple resonators of centre frequency, multiple resonator is configured as obtaining the frequency spectrum of sound and vibration.The sound and vibration
Spectrum analysis equipment is configured as the first frequency of the first mode of resonance based at least some of multiple resonator resonator
Rate signal and second order or the second frequency signal of higher mode of resonance analyze the frequency spectrum of sound and vibration.
The sound and vibration frequency specturm analysis equipment can further comprise band signal divider, the band signal divider point
The first frequency signal and second order of the first mode of resonance from least some resonators in multiple resonator are higher humorous
The second frequency signal of vibration mode.
Band signal divider may include diplexer (diplexer), duplexer (duplexer) and triplexer
One of (triplexer).
Band signal divider may include low-pass filter and high-pass filter, and low-pass filter and high-pass filter
All have identical cutoff frequency.
Band signal divider can have the first mode of resonance between multiple resonator the first resonance frequency group and
Cutoff frequency between second resonance frequency group of the second mode of resonance.
Multiple resonator may include n resonator, wherein the first resonance frequency of the first mode of resonance of the first resonator
Rate can be f_11, and the second resonance frequency of the second mode of resonance of the first resonator can be f_12, and the second to the n-th resonator
The resonance frequency of first mode of resonance can be between the first resonance frequency and the second resonance frequency.
The resonance frequency of first mode of resonance of multiple resonator can be arranged with identical spaced linear.
The interval non-linear arrangement that the resonance frequency of first mode of resonance of multiple resonator can change.
Multiple resonator may include the first resonator and the second resonator, and the first resonator and the second resonator respectively may be used
With resonance frequency having the same under the first mode of resonance, the first resonator and the second resonator can be in the second modes of resonance
There is down different resonance frequencies.
The sound and vibration Frequency Analysis equipment may include having for two times or more that quantity is multiple number of resonators
Imitate band filter.
Multiple resonator may include electromechanical resonator structure.
Multiple resonator may include cantilever design.
Multiple resonator can further comprise the plastid being arranged in cantilever design.
Multiple resonator may include first group of the first resonator, and the first resonator can have different length.
A kind of electronic device may include the sound and vibration frequency specturm analysis equipment.
One aspect according to example embodiment provides a kind of sound and vibration frequency specturm analysis equipment, comprising: has not
With multiple resonators of centre frequency, multiple resonator is configured as obtaining the frequency spectrum of sound and vibration；And band signal
Divider separates the first frequency signal and second order or higher of the first mode of resonance of each resonator in multiple resonator
The second frequency signal of mode of resonance.
The sound and vibration frequency specturm analysis equipment can be configured to based on each of multiple resonator resonator
The first frequency signal and second order or the second frequency signal of higher mode of resonance of first mode of resonance of separation analyzes sound
With the frequency spectrum of vibration.
Band signal divider may include one of diplexer, duplexer and triplexer.
Band signal divider may include low-pass filter and high-pass filter, and low-pass filter and high-pass filter
It can cutoff frequency having the same.
Band signal divider can have the first mode of resonance between multiple resonator the first resonance frequency group and
Cutoff frequency between second resonance frequency group of the second mode of resonance.
Multiple resonator may include n resonator, and the first resonance frequency of the first mode of resonance of the first resonator can
The second resonance frequency for f_11, the second mode of resonance of the first resonator can be f_12, and the first of the second to the n-th resonator is humorous
The resonance frequency of vibration mode can be between the first resonance frequency and the second resonance frequency.
One aspect according to example embodiment provides a kind of next using multiple resonators with different center frequency
The method for analyzing the frequency spectrum of sound and vibration, this method includes obtain at least some of multiple resonator resonator first
The first frequency signal of mode of resonance obtains the of the second mode of resonance of at least some resonators in multiple resonator
Two frequency signals, and analyze in the first frequency signal of the first mode of resonance and the second frequency signal of the second mode of resonance
Each.
This method can further comprise separating the first mode of resonance of at least some resonators in multiple resonator
First frequency signal and the second mode of resonance second frequency signal.
The first frequency signal of first mode of resonance of separation and the second frequency signal of the second mode of resonance can be by these
The single resonator at least some resonators in multiple resonators exports simultaneously.
This method can further comprise obtain and analyze at least some resonators in multiple resonator three ranks or
The third frequency signal of higher mode of resonance.
One aspect according to example embodiment, provides a kind of sound and vibration frequency specturm analysis equipment, including substrate, sets
The multiple resonators setting the film on substrate and being arranged on film, multiple resonator have different centre frequencies, and
Multiple resonator is configured as obtaining the frequency spectrum of sound and vibration.Each of multiple resonator includes being arranged on film
First electrode and the second electrode that is arranged on film and is spaced apart with first electrode.
The one or both ends of second electrode can be set on film.
First electrode can be spaced apart with film, and the one or both ends of first electrode can be set on film.
Detailed description of the invention
By the description below in conjunction with attached drawing to example embodiment, above-mentioned and/or other aspects will be apparent and more hold
It is readily understood, in attached drawing:
Figure 1A and 1B is for explaining the resonance that can be applied to sound/vibration spectrum analysis equipment according to example embodiment
First mode of resonance of device and the concept map of the second mode of resonance；
Fig. 2 is showing for the resonance frequency for the first mode of resonance for showing Figure 1A and 1B and the resonance frequency of the second mode of resonance
The curve graph of example；
Fig. 3 is the exemplary shooting image of the resonator array manufactured according to example embodiment；
Fig. 4 is the curve graph for showing the frequency bandwidth characteristics of resonator array of Fig. 3；
Fig. 5 is to show by the way that diplexer is connected to resonator to separate the frequency signal of the first mode of resonance and second humorous
The schematic diagram of the process of the frequency signal of vibration mode；
Fig. 6 is the first mode of resonance and the second resonant mode for being used together multiple resonators shown according to example embodiment
The exemplary curve graph of the band filter Array Design of formula；
Fig. 7 is to show that frequency filter is designed as to have the first mode of resonance and the second resonant mode using multiple resonators
The curve graph of the case where formula；
Fig. 8 is quantity, frequency resolution, the device side for illustrating resonator in the resonator array sensor according to comparative example
The figure of relationship between the output of long-pending, single resonator；
Fig. 9 is the relationship between the resonator array sensor and resulting resonance frequency shown according to comparative example
Figure；
Figure 10 is between the resonator array sensor and resulting resonance frequency shown according to example embodiment
The figure of relationship；
Figure 11 be show according to the resonator array sensor of another example embodiment and resulting resonance frequency it
Between relationship figure；
Figure 12 is to show according to example embodiment, when the sound/vibration frequencies analytical equipment using multimode signal is by making
When being manufactured with multiple resonators, the curve graph of frequency bandwidth characteristics corresponding with sound/vibration spectrum analysis equipment；
Figure 13 is to show according to another example embodiment, when the sound/vibration frequencies analytical equipment using multimode signal is logical
When crossing using the manufacture of multiple resonators, the curve graph of frequency bandwidth characteristics corresponding with sound/vibration spectrum analysis equipment；
Figure 14 is the curve graph in the case that the resonance frequency separation for the first mode of resonance for showing multiple resonators changes；
Figure 15 A and 15B are the exemplary sectional views for showing the structure of two resonators；
Figure 16 A and 16B are for explaining the first resonance frequency and the second resonance frequency by each resonator generation of Figure 15
The curve graph of rate；
Figure 17 is the perspective schematic view of the structure of sound/vibration spectrum analysis equipment according to example embodiment；
Figure 18 is the perspective schematic view according to the structure of the sound/vibration spectrum analysis equipment of another example embodiment；
Figure 19 is the exemplary cross-sectional view of the resonator structure suitable for Figure 17 and 18；
Figure 20 is the perspective view according to the resonator array of the sound/vibration spectrum analysis equipment of another example embodiment；
Figure 21 is the perspective view of the structure for the substrate that the resonator array in Figure 20 is arranged in；
Figure 22 is the perspective view for the structure for obtaining the substrate in combination of the resonator array of Figure 20 and Figure 21；
Figure 23 is the sectional view according to the structure of the resonator of another example embodiment；
Figure 24 is the sectional view according to the structure of the resonator of another example embodiment；
Figure 25 is the sectional view according to the structure of the resonator of another example embodiment；
Figure 26 is the sectional view according to the structure of the resonator of another example embodiment；
Figure 27 is the sectional view according to the structure of the resonator of another example embodiment.
Specific embodiment
Now referring in detail to example embodiment, its example is shown in the drawings, wherein identical appended drawing reference is always shown
Identical element.In addition, for the ease of explain and it is clear, each layer of size shown in the accompanying drawings may be amplified.With regard to this
For point, this example embodiment can have different forms, and can not be construed as limited to description illustrated by this paper.Cause
This, describes example embodiment solely by reference to attached drawing below, to explain various aspects of the disclosure.In layer structure, when one
Component be disposed in another component " top " or " on " when, which can be another group located immediately at this
On element, or it is located above another component in a non contact fashion.
Now, example embodiment will be described more fully with reference to the attached drawing for showing example embodiment.
It should be appreciated that when referring to an element " connection " or " coupled " to another element, the element can be directly connected to or
It is coupled to another element, or there may be elements between.In contrast, when refer to an element " being directly connected to " or
When " direct-coupling " arrives another element, intermediary element is not present.Term as used herein "and/or" includes the item that association is listed
Any and all combinations of one or more projects in mesh.
Although it should be appreciated that term " first ", " second " etc. can be used herein to describe various elements, component, area
Domain, layer and/or part, but these elements, component, regions, layers, and/or portions should not be limited by these terms.These arts
Language is only used for be distinguished from each other element, component, region, layer or part.Therefore, in the premise for the introduction for not departing from example embodiment
Under, first element mentioned below, component, region, layer or part may also be referred to as second element, component, region, layer or portion
Point.
Can be used herein spatially relative term such as " lower section ", " under ", "lower", " top ", "upper", in order to describe
The relationship that one elements or features is shown in the accompanying drawings relative to another elements or features.It should be understood that spatially relative term is intended to
Different directions including the direction shown in attached drawing with external equipment in use or in operation.For example, if equipment quilt in attached drawing
Overturning, then be described as be in other elements or feature " lower section " or " under " element will be oriented in other elements or spy
" top " of sign.Therefore, term " lower section " may include above and below two kinds of orientation.Equipment can be oriented otherwise
(being rotated by 90 ° or in other directions), and space used herein can be interpreted accordingly and describe language relatively.
Terms used herein will limit example embodiment just for the sake of describing the purpose of example embodiment.
Singular " one " used herein, "one" and "the" are intended to further include plural form, unless context clearly provides
Opposite instruction.It should also be understood that term " includes " and/or "comprising" are when using in the present specification, show that there are described
Feature, entirety, step, operations, elements, and/or components, but exist or in addition add one or more of the other there is no excluding
Feature, entirety, step, operation, component, assembly unit and/or combination thereof.
Example is described referring herein to the cross-sectional view of schematic illustration ideal example embodiment (and intermediate structure) to implement
Example.Therefore, the variation for example as caused by manufacturing technology and/or tolerance relative to illustrated shape should be expected.Thus,
Example embodiment should not be construed as limited to specific region shape depicted herein, and should include for example being led due to manufacture
The form variations of cause.For example, round or bending features and/or note can be had in its edge by showing the injection zone of rectangle
Enter concentration gradient, rather than the binary variation from injection zone to non-implanted region.Similarly, by injecting the embedment region formed
It can lead to some injections in the region between embedment region and the surface injected by it.Therefore, scheme in attached drawing
The region shown is substantially schematically that their shape is not meant to the true form in region in illustrated device, nor to limit
The range of example embodiment processed.
Unless otherwise defined, otherwise all terms (including technical and scientific term) used herein have and example implementation
The identical meaning of meaning that example those of ordinary skill in the art are generally understood.It should also be understood that term is such as in everyday words
Term defined in allusion quotation should be interpreted that its meaning is consistent with the meaning in the context of the relevant technologies, without that should be solved
It is interpreted as the meaning for idealizing or excessively formalizing, unless being clearly so defined herein.
Hereinafter, sound/vibration spectrum analysis equipment according to example embodiment is described in detail with reference to the drawings and obtains
The method for taking and analyzing frequency information.In addition, for the ease of explanation and clear, the thickness or width in layer shown in figure or region
It may be amplified.The expression of similar reference marker is similarly constructed element in attached drawing.In the following description, " sound and vibration
Frequency spectrum " can indicate the frequency spectrum of sound and/or vibration, and " sound/vibration " can indicate sound and/or vibration.In addition, sound audio
" sound " used in spectrum, sound detection equipment can indicate sound, acoustics, audio etc..
Figure 1A and 1B is for explaining the resonance that can be applied to sound/vibration spectrum analysis equipment according to example embodiment
First mode of resonance of device and the concept map of the second mode of resonance.Figure 1A shows the resonance behavior of the first mode of resonance, Figure 1B
Show the resonance behavior of the second mode of resonance.
Fig. 2 is the resonance frequency f1 for the first mode of resonance for showing Figure 1A and 1B and the resonance frequency f of the second mode of resonance2
Exemplary curve graph.
A, 1B and Fig. 2 referring to Fig.1, cantilever style resonator can have the first mode of resonance (base mode of resonance) and second order or more
High mode of resonance (higher order resonances mode).The resonance frequency f of second mode of resonance2The resonance frequency of the first mode of resonance can be greater than
Rate f1.The bandwidth at frequency interval and each resonance point between mode of resonance can be such as wide according to the shape or size of resonator
Height compares and changes.Although illustrating and describing the resonator with cantilever design, the shapes/configurations of resonator be can change.
Resonator can have various types of electromechanical structures.
For example, in figs. 1 a and 1b, the angular velocity omega of the first mode of resonance1With the angular velocity omega of the second mode of resonance2It can be with
It is expressed by the following equation.
Here, " E " indicates the Young's modulus of resonator, and " I " indicates the moment of inertia, and " m " indicates quality, and " L " indicates length.?
In this case, second order resonance frequency f2It can be the first resonance frequency f1About 6.23 times.
Fig. 3 is the exemplary shooting image of the resonator array manufactured according to example embodiment.
Referring to Fig. 3, there can be different centre frequencies for obtaining multiple resonators of frequency spectrum of sound and vibration.Center
Frequency can indicate the resonance frequency of the first mode of resonance.Centre frequency can change according to the length of resonator.Correspondingly, multiple
Resonator is designed to the length for having different.It, can be by changing although instantiating the case where changing resonator length
Any one of elongated degree, width, thickness and weight or any combination change centre frequency.
Fig. 4 is the curve graph for showing the frequency bandwidth characteristics of resonator array of Fig. 3.
Referring to Fig. 4, it can be seen that generate multiple first resonance frequencies corresponding with the first mode of resonance from multiple resonators
And multiple second order resonance frequencies corresponding with the second mode of resonance.First mode resonance frequency can relatively uniform interval cloth
It sets, second mode resonance frequency can arrange at certain intervals in the frequency band for being higher than first mode resonance frequency.By resonator
Any of (corresponding resonator) amplitude (height) of second mode resonance peak for generating more than or equal to corresponding the
The amplitude (height) at one mode resonances peak.The bandwidth of second mode resonance peak shows as the bandwidth for being wider than first mode resonance peak.
It in this exemplary embodiment, can be by using the first mode of resonance and second order or all spies of higher mode of resonance
Property obtains and analyzes sound and rumble spectrum.Therefore, two or more can be obtained not simultaneously from single physical resonator
Same band filter characteristic.In other words, it can ensure multimode frequency bandwidth characteristics from single resonator.
According to example embodiment, " band signal divider (band signal separator) " can be used to separate the first resonant mode
The frequency signal (band signal) and second order of formula or the frequency signal (band signal) of higher mode of resonance.Band signal divider
It may include diplexer (diplexer), duplexer (duplexer) or triplexer.Diplexer may include coupled low pass filtered
Wave device (LPF) and high-pass filter (HPF).LPF and HPF can cutoff frequency having the same.Diplexer can be arranged to wherein
The equipment that the LPF and HPF of a shared cutoff frequency are coupled to each other is perhaps set as function corresponding thereto or can pass through
It is realized using analog circuit or digital filter.Triplexer may include LPF, bandpass filter and HPF.Band signal can be by
Diplexer and duplexer are divided into two signals, are divided into three signals by triplexer.When the first, second, and third rank resonant mode of use
Triplexer can be used when all signals of formula.Band signal divider may include multiple bandpass filters or multi-transmission filter
Device.
Fig. 5 is to show by the way that diplexer is connected to resonator to separate the frequency signal of the first mode of resonance and second humorous
The schematic diagram of the process of the frequency signal of vibration mode.
Referring to Fig. 5, the exemplary diplexer as band signal divider may be connected to resonator.Diplexer can be it
In share LPF and the HPF equipment or function coupled to each other of a cutoff frequency.It is generated by single physical resonator first humorous
Vibration mode frequency signal (resonance frequency: f1) and the second cavity mode frequencies signal (resonance frequency: f2) can be by the diplexer same time-division
From and export.The sense amplifier Amp for amplified signal can be further provided between resonator and diplexer.
It can be changed by being separated from each other signal using the first mode of resonance signal and second order or higher mode of resonance signal
Kind signal processing and resolution ratio.If the first mode of resonance signal and second order or higher mode of resonance signal do not separate, signal can
It can be exported with admixture, resolution ratio may not be improved in this way.However, in some cases, band signal can not used
Divider.
Single band signal divider can be used for this multiple resonator by being commonly connected to multiple resonators.Alternatively,
Band signal divider can be connected to each resonator one by one or multiple resonators are divided into multiple groups, be then each group
One band signal divider is provided.
Fig. 6 is the first mode of resonance and the second resonant mode for being used together multiple resonators shown according to example embodiment
The exemplary curve graph of the band filter Array Design of formula.
First can be designed when realizing two or more band filter characteristic with single physical resonator referring to Fig. 6
The resonance frequency group of mode of resonance and the resonance frequency group of the second mode of resonance, to be smoothly connected to each other (naturally).
Assuming that multiple resonators include n resonator, the first mode of resonance of the first resonator (low-limit frequency resonator)
Resonance frequency be f_11, the resonance frequency of the second mode of resonance of the first resonator is f_12, can be by the second to n-th resonance
The resonance frequency of first mode of resonance of device is designed as being arranged between f_11 and f_12.In Fig. 6, " f_n1 " is indicated n-th
The resonance frequency of first mode of resonance of resonator, " f_n2 " indicate the resonance frequency of the second mode of resonance of n-th of resonator.
In this state, the cutoff frequency of band signal divider such as diplexer may be provided at the first resonant mode in multiple resonators
Between the resonance frequency group of formula and the resonance frequency group of the second mode of resonance.
From n physical resonant device in total, (2 × n) a filter arrangement of the entire concern frequency range of covering can get
Effect.
Fig. 7 is to show to use 32 (32), 64 (64) He Jiushi about about 7kHz or smaller frequency range
Multi-band filter architecture is the curve graph with the case where the first and second modes of resonance by a resonator in six (96).Therefore, may be used
Realization is able to use relatively few number of resonator to cover the sound/vibration spectrum analysis of relatively wide frequency range and set
It is standby.
Fig. 8 is quantity, frequency resolution, the device side for illustrating resonator in the resonator array sensor according to comparative example
The figure of relationship between the output of long-pending, single resonator.There are multiple resonators according to the resonator array sensor of comparative example,
Each resonator only includes a band filter, that is, a channel.In other words, it is humorous that first is used only in each resonator
Shake mode signal.
Referring to Fig. 8, since the resolution ratio of frequency band and the quantity of resonator are identical, the quantity of resonator increases to improve and differentiate
Rate.However, when the quantity of resonator increases, device area increases, therefore minimizes and become difficult, application field is limited, and cost
It improves.In addition, to reduce the size of single resonator to increase the quantity of resonator while retainer member area.Cause
This, may reduce output, and may will limit the design of resonance frequency.
Fig. 9 is the relationship between the resonator array sensor and resulting resonance frequency shown according to comparative example
Figure.
Referring to Fig. 9, a resonance frequency can correspond to each resonator.In this case, the quantity of resonator and have
Imitate the quantity of band filter, that is, the number of channel can be the same.The width means of whole equipment are W.
Figure 10 be show resonator array sensor (sound/vibration spectrum analysis equipment) according to example embodiment and by
The figure of relationship between this resonance frequency generated.
Referring to Fig.1 0, due to having used both the first mode of resonance signal and the second mode of resonance signal, compared with Fig. 9
Example is compared, and the resonator that half quantity can be used only is the effective band filter (channel) that can ensure that identical quantity.Work as device
Width/area when halving, it can be ensured that same or better performance.In addition, believing when by using second order or higher mode of resonance
Number to reduce number of resonators, and when increasing the size of single resonator with the quantity same degree of reduction, for example, when logical
Crossing halves the quantity of resonator using second order mode of resonance signal, while doubles the size of single resonator (for identical
Region) when, the output of single resonator can increase.
Figure 11 is the resonator array sensor (sound/vibration spectrum analysis equipment) shown according to another example embodiment
The figure of relationship between resulting resonance frequency.
As shown in figure 11, by using both the first mode of resonance and the second mode of resonance, with the identical number of the comparative example of Fig. 9
The resonator of amount is the effective band filter characteristic that can ensure that two times.It in other words, can be with device of the same area
In ensure two times of efficient channel number.When the three rank modes of resonance for further using at least some of multiple resonators resonator
When frequency signal, two times or more of band filter characteristic can get.
Figure 12 and Figure 13 is to show according to example embodiment, when the sound/vibration frequencies analytical equipment using multimode signal
When being manufactured by using multiple resonators (64 (64) resonator), frequency band corresponding with sound/vibration spectrum analysis equipment
The curve graph of characteristic.
Figure 12 shows the case where interval relative narrower between the resonance frequency of the first mode of resonance.It is humorous that Figure 13 shows first
Relatively wide situation is spaced between the resonance frequency of vibration mode.When the first mode of resonance as shown in figure 12 resonance frequency it
Between interval it is narrow when, between the first mode of resonance group and the second mode of resonance group there may be loss frequency band.However, Figure 13's
In the case of, it can be seen that the first mode of resonance group is suitably connect with the second mode of resonance group, therebetween without loss frequency band.
Assuming that multiple resonators include n resonator, the first mode of resonance of n-th of resonator (maximum frequency resonator)
Resonance frequency be f_n1, the resonance frequency of the second mode of resonance of first resonator (minimum frequency resonator) is f_12,
The resonance frequency of second mode of resonance of the second resonator is f_22, and [(f_12)-(f_n1)] can be less than or equal to about two times
In the value of [(f_22)-(f_12)].However, this is an example, embodiment is not limited to this.According to the purposes and class of equipment
Type, above-mentioned condition may not be able to meet.
In the example embodiment of Figure 12 and Figure 13, the resonance frequency of the first mode of resonance of multiple resonators can be identical
Spaced linear arrangement.In this case, the resonance frequency of the second mode of resonance can be arranged with identical spaced linear.Term
" identical interval " can be the concept including approximate and essentially identical interval.In another example embodiment, multiple resonance
The resonance frequency of first mode of resonance of device can be with non-linear arrangement, so that interval can change.One example is in Figure 14
It shows.
Figure 14 is the curve graph in the case that the resonance frequency separation for the first mode of resonance for showing multiple resonators changes.
Referring to Fig.1 4, the resonance frequency of the first mode of resonance can non-linearly be arranged as having towards right side in figure, that is, increase in frequency
On the direction added, it is spaced the trend gradually increased.The resonance frequency of the second mode of resonance with similar trend can be non-linear
Ground arrangement.The resonance characteristic of each resonator can by change resonator any of length, width, thickness and weight or
Any combination controls.
Multiple resonators applied to sound/vibration spectrum analysis equipment according to example embodiment can have minute yardstick or
Smaller electromechanical structure.Resonator can be manufactured with MEMS (MEMS) technique.In addition, each resonator can have band one
The structure that the cantilever design of a fixing end or two ends are fixed.In addition, the vibration section that each resonator can be flexible rod-type is (removable
Dynamic portion) and the plastid that is arranged on vibration section (movable part).The resonance characteristic of resonator can be according to vibration section and plastid
Size, weight etc. control.
According to additional example embodiment, multiple resonators may include the first and second resonators, and first and second
Resonator can the resonance frequency of the first mode of resonance having the same and the resonance frequency of the second different modes of resonance.This can be with
Structure and size by adjusting the first and second resonators etc. are realized.Illustrate it with reference to Figure 15 A, 15B and Figure 16 A, 16B
Example.
Figure 15 A and 15B are the exemplary sectional views for showing the structure of two resonators.Figure 15 A shows including rod-type
The first resonator of one vibration section (movable part) 1a and the first plastid 2a that one end is set.Figure 15 B is shown including second
The second resonator of vibration section 1b and the second plastid 2b.First plastid 2a is relatively light (light weight), and the second plastid 2b is relatively
Weight (quality weight).The length of the flexure region of first vibration section 1a is relatively long (long flexure), the flexible region of second vibration section 1b
The length in domain is relatively short (short flexure).
Figure 16 A and 16B are for explaining the first resonance generated respectively by the first and second resonators of Figure 15 A and 15B
Frequency f1With the second resonance frequency f2Curve graph.The curve of Figure 16 A illustrate the first resonator about Figure 15 A as a result, figure
The curve of 16B illustrates the result of the second resonator about Figure 15 B.6A and 16B referring to Fig.1, the first of the first resonator are humorous
Vibration frequency f1 can be identical or essentially identical with the first resonance frequency f1 of the second resonator.Second resonance frequency of the first resonator
f2It can be with the second resonance frequency f of the second resonator2It is different.Second resonance frequency f of the second resonator2It is humorous that first can be greater than
Second resonance frequency f of vibration device2.For example, the second resonance frequency f of the first resonator2It can be the first resonance of the first resonator
About the seven (7) of frequency f1 times.Second resonance frequency f of the second resonator2It can be the first resonance frequency f of the second resonator1
About 12 (12) times.In this way, can be opposite to adjust second order resonance frequency by the configuration/shape and size that control resonator
Interval in the relative magnitude of the first resonance frequency, i.e., between them.
In the following description, the method for briefly describing acquisition according to example embodiment and analyzing frequency information, that is, obtain
With the method for analysis sound/vibration frequency spectrum.In conjunction with the knot of the sound/vibration spectrum analysis equipment described referring to figs. 1A to Figure 16 B
Structure and principle understand the method for analysis sound/vibration frequency spectrum according to example embodiment.
According to example embodiment, sound/vibration frequency spectrum is analyzed using multiple resonators with different center frequency
Method can include: obtain the frequency signal of the first mode of resonance of at least some resonators, obtain at least some resonators
The second mode of resonance frequency signal, and analyze the first mode of resonance frequency signal and the second mode of resonance frequency signal
Each of.
The analysis method may further include the frequency for separating the first mode of resonance of at least some resonators
The frequency signal of signal and the second mode of resonance.In this case, individually resonator can be simultaneously at least one of resonator
Export the frequency signal of the first mode of resonance and the second mode of resonance for mutually separating with the frequency signal of the first mode of resonance
Frequency signal.In addition, the analysis method can further comprise obtaining and analyzing three ranks or more of at least some resonators
The frequency signal of high mode of resonance.
According to example embodiment, the method for arranging of multiple resonators or the knot of each resonator can be changed in many ways
Structure, size etc..In following description, the structure of the arrangement resonator of multiple resonators is described with reference to Figure 17 to Figure 27
Example.
Figure 17 is the perspective schematic view of the structure of sound/vibration spectrum analysis equipment according to example embodiment.
Referring to Fig.1 7, it may include supporting substrate 710 and cloth according to the sound/vibration spectrum analysis equipment of this example embodiment
Set resonator array 730 on it.Through-hole H1 can be formed in supporting substrate 710.Resonator array 730 may be arranged at support
In region on substrate 710 around through-hole H1.Resonator array 730 may include multiple resonator R with different center frequency.
Each resonator R can have any of its length, width, thickness and weight or any combination different from another resonator
Structure.In this example embodiment, at least some of resonator R has different length.Resonator R can be by surrounding through-hole H1
Region extend to the inside of through-hole H1.Through-hole H1 can provide the space of resonator R vibration.Although through-hole H1 is illustrated as justifying
Shape, but the present disclosure is not limited thereto, and through-hole H1 can have polygonal shape or various other closed-curve shapes.Resonator
R respectively may have about several microns or smaller width, about several microns or smaller thickness, about several millimeters or smaller length
Degree.Resonator R can be manufactured with MEMS technology.Resonator R may be in response to external signal, vibrate along the vertical direction in the Z-axis direction.
Figure 18 is the perspective schematic view according to the structure of the sound/vibration spectrum analysis equipment of another example embodiment.
Referring to Fig.1 8, it may include being formed with rectangle according to the sound/vibration spectrum analysis equipment of this example embodiment
The supporting substrate 810 of through-hole H2 and the resonator array 830 being disposed thereon.Resonator array 830 can be divided into multiple groups of G1
And G2.The resonator R of the resonator R and second group of G2 of first group of G1 can be facing with each other.The length of the resonator R of first group of G1 can
To increase in a first direction, and the length of the resonator R of second group of G2 can increase in a direction opposite the first direction.
Therefore, because the arragement construction, can reduce the space that all resonator R are occupied.
" the band signal divider " of the resonator of Figure 17 and Figure 18 can be further provided connected to.Band signal divider
It may include such as diplexer, duplexer or triplexer.
Figure 19 is the exemplary cross-sectional view of the structure of a resonator suitable for the resonator R of Figure 17 and 18.
Referring to Fig.1 9, resonator R may include the fixed part 10 for being fixed on supporting substrate 810, in response to sound/vibration signal
The detecting part 30 of mobile moving portion 20 and the movement for sensing moving portion 20.Detecting part 30 can vibrate together with moving portion 20.
Therefore, it can be said that moving portion 20 and detecting part 30 constitute one " vibration section (moving portion) ".In addition, resonator R can be wrapped further
Plastid 40 is included to provide a certain amount of quality to moving portion 20.
Moving portion 20 can be formed with elastic membrane.Elastic membrane can have one fixed width and the length greater than width.Elastic membrane
Length and width can be together with the quality of plastid 40 determining resonator R resonance characteristic factor.The material of elastic membrane
Silicon, metal, polymer etc. can be used.
Detecting part 30 may include the sensed layer for sensing the movement of moving portion 20.Detecting part 30 may include such as piezoelectricity device
Part.In this case, detecting part 30, which can have, stacks first electrode layer, the structure of piezoelectric material layer and the second electrode lay.Pressure
The material of material layer, i.e. piezoelectric material may include ZnO, SnO, lead zirconate titanate (PZT), ZnSnO3, polyvinylidene fluoride
(PVDF), poly- (vinylidene fluoride-trifluoro-ethylene) (P (VDF-TrFE)), AlN, lead magnesium niobate-lead titanate (PMN-PT) etc..Make
For the first and second electrode layers, metal or metal compound material or various other conductive materials can be used.
Figure 20 is the perspective view according to the resonator array of the sound/vibration spectrum analysis equipment of another example embodiment.
Figure 21 is the perspective view of the structure for the substrate that the resonator array in Figure 20 is arranged in.Figure 22 is by the resonator array of Figure 20
The perspective view of the structure obtained with the substrate in combination of Figure 21.Figure 22 is the perspective view from the bottom of substrate 110.
Referring to Figure 20 to Figure 22, sound/vibration spectrum analysis equipment may include substrate 110, film 120 and multiple resonators
130.Such as silicon substrate can be used as substrate 110, but the present disclosure is not limited thereto, other a variety of materials can be used for this.Cavity 110a can
Certain depth is formed from a surface of substrate 110.
Resonator 130 may be arranged on film 120.Film 120 may be arranged on the surface of substrate 110, cover cavity 110a.?
In this case, resonator 130 may be arranged in cavity 110a.The inside of cavity 110a can remain vacuum state.Cavity
The inside of 110a is positively retained under the pressure forced down than atmosphere, for example, about 100 supports or smaller vacuum degree, specifically, about
1000 millitorrs are smaller, and but the present disclosure is not limited thereto.Although film 120 may include for example silicon, silica, silicon nitride, metal or
Polymer, but this is only example, and various other materials can be used.
Film 120 is provided to receive the voice signal in broadband.For example, although film 120 can be arranged to range of receiving
In the voice signal of the audio-band of about 20Hz to about 20kHz, but the present disclosure is not limited thereto.Film 120 can be arranged to
Receive sound/vibration of the sound/vibration signal or about 20Hz or lower infra-acoustic frequency band of about 20kHz or higher ultrasonic wave frequency band
Dynamic signal.
Resonator 130 can be arranged in the form on the surface of film 120.Resonator 130 may be provided at the inner surface of film 120
On, towards the cavity 110a being formed in substrate 110, to be located at the inside for the cavity 110a for being maintained at vacuum state.In this way, working as
When periphery keeps vacuum state, the Q factor (quality factor) of resonator 130 can be enhanced.Resonator 130 can be arranged to sense
The sound/vibration frequencies of different frequency bands.For this purpose, at least some resonators 130 can have different sizes.For example, at least some
Resonator 130 can have different length, width or thickness.It can example although set up the quantity of the resonator 130 on film 120
In this way tens to thousands of, and but the present disclosure is not limited thereto, and the quantity of resonator 130 can differently change according to design condition
Become.
Each resonator 130 can have can be with the structure of electrostatic methods sense vibrations.Each resonator 130 may include setting
Set the first electrode 131 on film 120 and the second electrode 132 in face of first electrode 131.Second electrode 132 includes and
The spaced multiple second electrodes 132 with different length of one electrode 131.Two ends of each second electrode 132 can be consolidated
Surely film 120 is arrived.First and second electrodes 131 and 132 may include conductive material, for example, with outstanding electric conductivity metal or
Alloy.However, the present disclosure is not limited thereto, first electrode 131 and second electrode 132 may include that such as tin indium oxide (ITO) is transparent
Conductive material.
First electrode 131 may be provided in film 120 on the inner surface for contacting cavity 110a.First electrode 131 can be public affairs
Common electrode.With above-mentioned difference, first electrode 131 can be the single electrode being correspondingly arranged with second electrode 132.With first electrode
131 second electrodes 132 for being spaced apart setting may have about several microns or smaller width, about several microns or smaller thickness
And about several millimeters or smaller length.
In the resonator 130 as above configured, when second electrode 132 is vibrated according to the movement of film 120, first electrode
Interval between 131 and second electrode 132 changes, and correspondingly, the capacitor between first electrode 131 and second electrode 132
Change.The electric signal from first electrode 131 and second electrode 132 can be sensed based on the variation of capacitor.Then, Mei Gexie
Vibration device 130 can sense the sound/vibration frequencies of certain frequency band.The frequency band that resonator 130 can sense can be based on resonator 130
Size such as length and determine.
" the band signal divider " of resonator 130 can be further provided connected to.Band signal divider may include,
Such as, diplexer, duplexer or triplexer.
Figure 23 is the sectional view according to the structure of the resonator 230 of another example embodiment.
Referring to Figure 23, resonator 230 can be the electrostatic resonator being arranged on film 120.Can in the inner surface of film 120,
It is arranged at resonator 230 and is further formed the first insulating layer 121.When film 120 includes conductive material, the first insulating layer 121
By resonator 230 and 120 mutual insulating of film.When film 120 is formed by insulating materials, the first insulating layer 121 can not be formed.
Resonator 230 may include be separated from each other setting first electrode 231 and second electrode 232 and be arranged second
Second insulating layer 233 of the electrode 232 on the surface of first electrode 231.Although Figure 23 shows the only shape in second electrode 232
At the example of second insulating layer 233, second insulating layer 233 can also be formed in first electrode 231 or first electrode 231 and
On two electrodes 232.Resonator 230 can be fabricated to fine size by MEMS technology.
Figure 24 is the sectional view according to the structure of the resonator 330 of another example embodiment.
Referring to Figure 24, the first insulating layer 121 can be formed at offer resonator 330 in the inner surface of film 120.With first
One end of second electrode 332 that electrode 331 is spaced apart setting is fixed on film 120, and the other end of second electrode 332 can be with the
One electrode 131 is spaced apart without being fixed on film 120.Therefore, resonator 330 can have cantilever design.
Figure 25 is the sectional view according to the structure of the resonator 430 of another example embodiment.
It is different from resonator 230 shown in Figure 23 referring to Figure 25, in resonator 430, one end of second electrode 432 and
One end of second insulating layer 433 is fixed on film 120, and the other end can be spaced apart with first electrode 431 without being fixed on film
On 120.
Figure 26 is the sectional view according to the structure of the resonator 530 of another example embodiment.
As shown in figure 26, resonator 530 can be the piezo-electric resonator being arranged on film 120.Resonator 530 may include that
The first electrode 531 being spaced apart around here and second electrode 532 and setting are between first electrode 531 and second electrode 532
Piezoelectric layer 533.The both ends of first electrode 531 are all fixed on the inner surface of film 120, and the central part of first electrode 531 can
It is separated with film 120.Piezoelectric layer 533 may include the piezoelectric material that can be produced electricl energy by deformation.
In the resonator 530 as above configured, when resonator 530 is vibrated according to the movement of film 120, it is arranged first
Piezoelectric layer 533 between electrode 531 and second electrode 532 deforms.Deformation based on piezoelectric layer 533 can be sensed from first electrode
531 and second electrode 532 electric signal.Therefore, resonator 530 optionally senses the sound/vibration frequencies of certain frequency band.
The frequency band that resonator 530 senses can be adjusted by the length of resonator 530, width or thickness.
Figure 27 is the sectional view according to the structure of the resonator 630 of another example embodiment.
Referring to Figure 27, different from the resonator 530 in Figure 26, in resonator 630, one end of first electrode 631, second
One end of electrode 632 and one end of piezoelectric layer 633 are all fixed to film 120, and the other end and film 120 separate and be not affixed to film
120。
When resonator 630 have cantilever design when, as described with reference to Fig. 1, it may occur however that the vibration of the first mode of resonance and
The vibration of second order or higher mode of resonance.In addition, when the both ends of resonator are all fixed and middle section vibrates, it may occur however that the
The vibration of the vibration of one mode of resonance and second order or higher mode of resonance.In this case, in the first and second modes of resonance
The form of the vibration of the middle section of resonator may be different.In addition, in single resonator, the resonance frequency of the first mode of resonance
The vibration of the resonance frequency of the vibration and the second mode of resonance of rate can generate independently of one another, or can generate simultaneously.
The arrangement and structure of the resonator of 7 to Figure 27 descriptions are example referring to Fig.1, and can be changed in many ways.It is various
It arranges shape and various resonator structures is all possible.
Above sound according to example embodiment/vibration frequency specturm analysis equipment and analysis method can be applied to various fields.
For example, sound/vibration spectrum analysis equipment can be realized by chip-shaped acoustic sensor, and it can be applied to mobile electricity
Speech recognition, spokesman's identification, scene identification in the environment such as words, computer, household electrical appliances, vehicle and smart home etc..In addition, sound
Sound/vibration frequency specturm analysis equipment can realize by chip-shaped vibrating sensor, and can be by being mounted on building, vehicle
, be used to analyze vibration information on household electrical appliances etc..It makes an uproar in addition, sound/vibration spectrum analysis equipment can be used for reducing or eliminating
Sound, or improve the field of speech quality.In addition, sound/vibration arrangements for analyzing frequency can be applied to various fields, such as hearing aid
Device, safety and protection etc..
As common in the field of present inventive concept, with functional block, unit and/or module to describe and in attached drawing
In example embodiment is shown.It will be understood by those skilled in the art that these blocks, unit and/or module pass through such as logic circuit, divide
Realize to electronics (or optics) circuit physicals such as vertical component, microprocessor, hard-wired circuit, memory component, wiring connection,
Described in electronics (or optics) circuit can be used based on the manufacturing technology of semiconductor or other technologies of preparing and formed.Block,
In the case that unit and/or module are realized by microprocessor etc., software (for example, microcode) is can be used to program to hold in they
The various functions that row is discussed herein, and can be optionally by firmware and/or software-driven.Alternatively, each piece, unit and/
Or module can be realized or be implemented as the specialized hardware of some functions by specialized hardware and execute the processing of other function
The combination of device (for example, microprocessor and associated circuit of one or more programmings).In addition, not departing from present inventive concept
Range in the case where, each of embodiment piece, unit and/or module can be physically divided into two or more interaction and point
Vertical block, unit and/or module.In addition, in the case where not departing from the range of present inventive concept, block, the list of example embodiment
Member and/or module can physically be combined into more complicated block, unit and/or module.
It is appreciated that example embodiment as described herein should be to be considered merely as describing significance, rather than in order to limit
Purpose.Other classes that can be used in other example embodiments can be considered as to the description of features or aspect in each example embodiment
Like features or aspect.
Although example embodiment has been described with reference to the drawings, it will be appreciated by the skilled addressee that not departing from power
In the case where spirit and scope defined by benefit requirement, a variety of changes in form and details can be carried out.
Claims (25)
1. a kind of sound and vibration frequency specturm analysis equipment, comprising:
Multiple resonators with different center frequency, the multiple resonator are configured as obtaining the frequency spectrum of sound and vibration,
Wherein the sound and vibration frequency specturm analysis equipment are configured as based at least some of the multiple resonator resonance
The first frequency signal and second order of first mode of resonance of device or the second frequency signal of higher mode of resonance come analyze sound and
The frequency spectrum of vibration.
2. sound as described in claim 1 and vibration frequency specturm analysis equipment further comprise band signal divider, the frequency
Band signal divider separates the first frequency of the first mode of resonance of at least some resonators in the multiple resonator
The second frequency signal of signal and second order or higher mode of resonance.
3. sound as claimed in claim 2 and vibration frequency specturm analysis equipment, wherein the band signal divider includes double news
One of device, duplexer and triplexer.
4. sound as claimed in claim 2 and vibration frequency specturm analysis equipment, wherein the band signal divider includes low pass
Filter and high-pass filter, and
Low-pass filter and high-pass filter all have identical cutoff frequency.
5. sound as claimed in claim 2 and vibration frequency specturm analysis equipment, wherein the band signal divider have between
Second resonance frequency group of the first resonance frequency group of the first mode of resonance of the multiple resonator and the second mode of resonance it
Between cutoff frequency.
6. sound as described in claim 1 and vibration frequency specturm analysis equipment, wherein the multiple resonator includes n resonance
Device,
First resonance frequency of the first mode of resonance of the first resonator is f_11,
Second resonance frequency of the second mode of resonance of the first resonator is f_12, and
The resonance frequency of first mode of resonance of the second to the n-th resonator between the first resonance frequency and the second resonance frequency it
Between.
7. sound as described in claim 1 and vibration frequency specturm analysis equipment, wherein the first resonant mode of the multiple resonator
The resonance frequency of formula is arranged with identical spaced linear.
8. sound as described in claim 1 and vibration frequency specturm analysis equipment, wherein the first resonant mode of the multiple resonator
Interval non-linear arrangement of the resonance frequency of formula to change.
9. sound as described in claim 1 and vibration frequency specturm analysis equipment, wherein the multiple resonator includes the first resonance
Device and the second resonator,
Resonance frequency having the same under first resonator and each comfortable first mode of resonance of the second resonator, and
First resonator and the second resonator have different resonance frequencies under the second mode of resonance.
10. sound as described in claim 1 and vibration frequency specturm analysis equipment, wherein the sound and vibration frequency specturm analysis equipment
Two times or more of the effective band filter including the quantity that quantity is the multiple resonator.
11. sound as described in claim 1 and vibration frequency specturm analysis equipment, wherein the multiple resonator includes electromechanical resonance
Device structure.
12. sound as described in claim 1 and vibration frequency specturm analysis equipment, wherein the multiple resonator includes cantilever knot
Structure.
13. sound as claimed in claim 12 and vibration frequency specturm analysis equipment, wherein the multiple resonator further comprises
Plastid in cantilever design is set.
14. sound as described in claim 1 and vibration frequency specturm analysis equipment, wherein the multiple resonator includes first group
First resonator, and
First resonator has different length.
15. a kind of electronic device including sound as described in claim 1 and vibration frequency specturm analysis equipment.
16. a kind of sound and spectrum analysis equipment, comprising:
Multiple resonators with different center frequency, the multiple resonator are configured as obtaining the frequency spectrum of sound and vibration；
And
Band signal divider separates the first frequency letter of the first mode of resonance of each resonator in the multiple resonator
Number and second order or higher mode of resonance second frequency signal.
17. sound as claimed in claim 16 and vibration frequency specturm analysis equipment, wherein the sound and vibration frequency specturm analysis are set
The first frequency letter of standby the first mode of resonance for being configured as the separation based on each of the multiple resonator resonator
Number and the second frequency signal of second order or higher mode of resonance analyze the frequency spectrum of sound and vibration.
18. sound as claimed in claim 16 and vibration frequency specturm analysis equipment, wherein the band signal divider includes double
Interrogate one of device, duplexer and triplexer.
19. sound as claimed in claim 16 and vibration frequency specturm analysis equipment, wherein the band signal divider includes low
Bandpass filter and high-pass filter, and
Low-pass filter and high-pass filter all have identical cutoff frequency.
20. sound as claimed in claim 16 and vibration frequency specturm analysis equipment are situated between wherein the band signal divider has
In the first resonance frequency group of the first mode of resonance of the multiple resonator and the second resonance frequency group of the second mode of resonance
Between cutoff frequency.
21. sound as claimed in claim 16 and vibration frequency specturm analysis equipment, wherein the multiple resonator includes n resonance
Device,
First resonance frequency of the first mode of resonance of the first resonator is f_11,
Second resonance frequency of the second mode of resonance of the first resonator is f_12, and
The resonance frequency of first mode of resonance of the second to the n-th resonator between the first resonance frequency and the second resonance frequency it
Between.
22. a kind of method using the analysis sound and rumble spectrum of multiple resonators with different center frequency, the method
Include:
Obtain the first frequency signal of the first mode of resonance of at least some of the multiple resonator resonator；
Obtain the second frequency signal of the second mode of resonance of at least some resonators in the multiple resonator；And
Analyze each of the first frequency signal of the first mode of resonance and the second frequency signal of the second mode of resonance.
23. method as claimed in claim 22, further comprise separate it is described at least some humorous in the multiple resonator
The first frequency signal of first mode of resonance of vibration device and the second frequency signal of the second mode of resonance.
24. method as claimed in claim 23, wherein the first frequency signal and the second resonance of the first mode of resonance separated
The second frequency signal of mode is same by the single resonator at least some resonators in the multiple resonator
When export.
25. method as claimed in claim 22, further comprise obtain and analyze in the multiple resonator it is described at least
Three ranks of some resonators or the third frequency signal of higher mode of resonance.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170120515A KR102475893B1 (en) | 2017-09-19 | 2017-09-19 | Sound/vibration spectrum analyzing device and methods of acquiring and analyzing frequency information |
| KR10-2017-0120515 | 2017-09-19 |
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| CN109520608A true CN109520608A (en) | 2019-03-26 |
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| Country | Link |
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| US (1) | US10141007B1 (en) |
| EP (1) | EP3457098B1 (en) |
| KR (1) | KR102475893B1 (en) |
| CN (1) | CN109520608B (en) |
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| CN111579054A (en) * | 2020-06-22 | 2020-08-25 | 北京卫星环境工程研究所 | MEMS-based vibration sensor and vibration frequency measuring method |
| CN113847689A (en) * | 2021-09-23 | 2021-12-28 | 佛山市顺德区美的电子科技有限公司 | Air conditioner resonance control method and device, air conditioner and storage medium |
| CN114623984A (en) * | 2022-05-16 | 2022-06-14 | 之江实验室 | Acoustic imager based on heterogeneous microphone array |
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| KR101718214B1 (en) * | 2015-06-09 | 2017-03-20 | 한국과학기술원 | Low power piezoelectric voice recognition sensor used for IoT |
| KR20180037841A (en) * | 2016-10-05 | 2018-04-13 | 삼성전자주식회사 | Filter system comprising resonators |
| US20210145398A1 (en) * | 2017-09-05 | 2021-05-20 | Bat Call D. Adler Ltd. | Electronic stethoscope with enhanced features |
| KR102566412B1 (en) * | 2019-01-25 | 2023-08-14 | 삼성전자주식회사 | Apparatus for controlling driving of vehicle and method thereof |
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Also Published As
| Publication number | Publication date |
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| EP3457098A1 (en) | 2019-03-20 |
| EP3457098B1 (en) | 2022-05-04 |
| US10141007B1 (en) | 2018-11-27 |
| KR20190032055A (en) | 2019-03-27 |
| CN109520608B (en) | 2022-06-10 |
| KR102475893B1 (en) | 2022-12-08 |
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