CN109509803B - High heat dissipation photovoltaic tile subassembly - Google Patents

High heat dissipation photovoltaic tile subassembly Download PDF

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Publication number
CN109509803B
CN109509803B CN201811621289.3A CN201811621289A CN109509803B CN 109509803 B CN109509803 B CN 109509803B CN 201811621289 A CN201811621289 A CN 201811621289A CN 109509803 B CN109509803 B CN 109509803B
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China
Prior art keywords
photovoltaic tile
heat
assembly
ventilation
air inlet
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CN201811621289.3A
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Chinese (zh)
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CN109509803A (en
Inventor
张树德
曹海波
蔡霞
倪志春
魏青竹
陈成锦
柯坡
陈恒磊
蒋建彗
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Suzhou Talesun Solar Technologies Co Ltd
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Suzhou Talesun Solar Technologies Co Ltd
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Priority to CN201811621289.3A priority Critical patent/CN109509803B/en
Publication of CN109509803A publication Critical patent/CN109509803A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • H01L31/0488Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • H01L31/0521Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells using a gaseous or a liquid coolant, e.g. air flow ventilation, water circulation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention discloses a high heat dissipation photovoltaic tile assembly, which comprises: the double-glass photovoltaic tile comprises from top to bottom in sequence: front glass, first glued membrane layer, battery piece subassembly, second glued membrane layer and back glass still are equipped with the radiator unit in the below of dual glass photovoltaic tile, connect through the heat conduction glue film between radiator unit's the connection face and the dual glass photovoltaic tile, and radiator unit's non-connection face is wrapped up by the heat preservation. The invention comprises the following steps: the double-glass photovoltaic tile, the heat-conducting adhesive, the heat-radiating component and the heat-insulating layer can be made of asbestos materials, the photovoltaic component is combined with the heat-radiating component, and heat energy generated by the operation of the component is reasonably used. According to the invention, the indoor temperature can be effectively reduced by the heat dissipation assembly, and the output power of the assembly is improved.

Description

High heat dissipation photovoltaic tile subassembly
Technical Field
The invention belongs to the field of solar photovoltaics, and particularly relates to a high-heat-dissipation photovoltaic tile assembly.
Background
The effective and tight combination of photovoltaic power generation and buildings is one of the hot subjects of the research in the industry, and mainly comprises photovoltaic products such as curtain wall glass of a photovoltaic module, photovoltaic tiles and the like which are combined with the buildings. Numerous designs are also emerging in the photovoltaic tile industry, such as flat-panel solar house roof designs, which can replace the wave-type assembly designs of conventional roof tiles. But the heat that photovoltaic module produced when the during operation can cause photovoltaic tile module back air convection to be worse relative ground power station, leads to the subassembly to be in the operating condition of high temperature, and the subassembly output reduces. How to reduce the temperature of the components and reasonably utilize the generated heat is the object of the invention.
The existing light Fu Wajing silicon component is designed into a photovoltaic tile at present, and then air heat dissipation is added or treatment is not performed, so that the temperature of the component is lowered slowly, and the output power of the component is lowered.
Disclosure of Invention
In order to solve the technical problems, the invention provides a high-heat-dissipation photovoltaic tile assembly.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
a high thermal dissipation photovoltaic tile assembly comprising: the double-glass photovoltaic tile comprises from top to bottom in sequence: front glass, first glued membrane layer, battery piece subassembly, second glued membrane layer and back glass still are equipped with the radiator unit in the below of dual glass photovoltaic tile, connect through the heat conduction glue film between radiator unit's the connection face and the dual glass photovoltaic tile, and radiator unit's non-connection face is wrapped up by the heat preservation.
The invention provides a high heat dissipation photovoltaic tile assembly, which comprises: the double-glass photovoltaic tile, the heat conducting adhesive layer, the heat radiating component and the heat insulating layer can be made of asbestos materials, the photovoltaic component is combined with the heat radiating component, and heat energy generated by component work is reasonably used. According to the invention, the indoor temperature can be effectively reduced by the heat dissipation assembly, and the output power of the assembly is improved.
On the basis of the technical scheme, the following improvement can be made:
as a preferable scheme, the thickness of the heat conducting glue layer is 1-4 mm.
By adopting the preferable scheme, the heat conducting adhesive has good heat conduction, temperature resistance and insulation performance, and is smeared on the connecting surface of the double-glass photovoltaic tile and the radiating component.
As a preferred solution, the connection surface of the heat dissipation assembly is wavy or zigzag.
By adopting the preferable scheme, the contact surface of the heat radiation component and the double-glass photovoltaic tile is increased.
As a preferred aspect, the heat dissipation assembly includes: the water guide pipe and the connector connected with the water guide pipe are also wrapped by adopting the heat preservation layer.
By adopting the preferable scheme, the joints are all wrapped by the heat insulation layer, and the water guide pipe and the joints are welded by argon arc welding, so that good heat dissipation performance is ensured, and leakage cannot occur.
As a preferred solution, the heat dissipation assembly is a composite tube comprising: the cooling liquid pipe is used for leading in cooling liquid, and an airflow channel is formed between the ventilation pipe and the cooling liquid pipe and is used for leading in cooling gas.
By adopting the preferable scheme, the dual cooling is realized, and the cooling effect is better.
As the preferable scheme, be equipped with a plurality of activity cores of evenly arranging in the pipeline of coolant pipe, the activity core includes: the movable blade is in contact with the inner wall of the cooling liquid pipe;
the movable core rotates under the flowing acting force of the cooling liquid.
By adopting the preferable scheme, the cooling liquid is prevented from being adhered to the inner wall of the pipeline of the cooling liquid pipe, and meanwhile, the additionally arranged movable core can improve the heat dissipation effect.
As a preferable scheme, the air inlet of the ventilation pipe extends out of the liquid inlet of the cooling liquid pipe by a distance L.
By adopting the preferable scheme, the cooling gas can be ensured to smoothly enter the ventilation pipe.
As a preferable scheme, a squeezing plug which is rotationally connected with the air inlet of the ventilation pipe is arranged at the air inlet of the ventilation pipe;
the extrusion plug is connected with the ventilation pipe through a connecting rod, one end of the connecting rod is rotationally connected with the ventilation pipe, and the other opposite end of the connecting rod is rotationally connected with the ventilation pipe;
the squeeze plug includes: the cooling air inlet device comprises a body, extrusion parts arranged at two ends of the body and protruding towards the direction away from the air inlet of the ventilation pipe, and ventilation parts arranged at the middle part of the body and recessed towards the direction close to the air inlet of the ventilation pipe, wherein ventilation openings are formed in the ventilation parts and are communicated with an external cooling air inlet device.
By adopting the preferable scheme, after the cooling gas enters from the vent of the extrusion plug, the extrusion part of the extrusion plug is extruded, so that the speed of the cooling gas entering the ventilation pipe can be effectively accelerated. The operation of pressing the pressing portion of the pressing plug may be performed manually, or may be performed by providing a cylinder or other driving means.
As a preferable scheme, the inner side pipe wall of the ventilation pipe and/or the outer side pipe wall of the cooling liquid pipe are provided with radiating strips, and the airflow channel is in a zigzag shape.
By adopting the preferable scheme, the airflow channel is in a zigzag shape, so that the heat dissipation effect is improved.
Preferably, the heat dissipation strip is provided with one or more heat dissipation through holes.
By adopting the preferable scheme, the heat dissipation effect is further improved.
Drawings
Fig. 1 is an exploded view of a high thermal dissipation photovoltaic tile assembly according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a heat dissipating assembly according to an embodiment of the present invention.
Fig. 3 is a partial cross-sectional view of a heat dissipating assembly according to an embodiment of the present invention.
Wherein: 1 double-glass photovoltaic tile, 11 front glass, 12 first adhesive film layer, 13 battery piece components, 14 second adhesive film layer, 15 back glass, 2 heat dissipation components, 21 cooling liquid pipe, 22 ventilation pipe, 3 movable core, 31 rotating end, 32 movable blade, 4 extrusion plug, 41 body, 42 extrusion part, 43 ventilation part, 44 ventilation opening, 5 connecting rod, 6 heat dissipation strip, 62 heat dissipation through hole, 7 heat conduction adhesive layer.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
To achieve the objects of the present invention, in some embodiments of a high thermal dissipation photovoltaic tile assembly,
as shown in fig. 1, a high thermal dissipation photovoltaic tile assembly comprises: the double-glass photovoltaic tile 1 comprises the following components in sequence from top to bottom: the front glass 11, the first adhesive film layer 12, the battery piece assembly 13, the second adhesive film layer 14 and the back glass 15 are arranged below the double-glass photovoltaic tile 1, the heat dissipation assembly 2 is further arranged below the double-glass photovoltaic tile 1, the connection surface of the heat dissipation assembly 2 is connected with the double-glass photovoltaic tile 1 through the heat conduction adhesive layer 3, and the non-connection surface of the heat dissipation assembly 2 is wrapped by the heat preservation layer (not shown in the figure).
The invention provides a high heat dissipation photovoltaic tile assembly, which comprises: the double-glass photovoltaic tile comprises a double-glass photovoltaic tile 1, a heat conducting adhesive layer 7, a heat radiating component 2 and a heat insulating layer. The heat preservation layer can be made of asbestos materials, the photovoltaic module is combined with the heat dissipation module 2, and heat energy generated by the module working is reasonably used. The invention can effectively utilize and reduce the indoor temperature and improve the output power of the assembly through the heat radiation assembly 2.
The first adhesive film layer 12 may be a high-permeability EVA film, and the second adhesive film layer 14 may be a high-cutoff EVA film.
In order to further optimize the implementation of the invention, in other embodiments, the remaining feature techniques are the same, except that the thickness of the thermally conductive adhesive layer 3 is 1-4 mm.
By adopting the preferable scheme, the heat conducting adhesive has good heat conduction, temperature resistance and insulation performance, and is smeared on the connecting surface of the double-glass photovoltaic tile 1 and the heat radiating component 2.
In order to further optimize the implementation effect of the present invention, in other embodiments, the other features are the same, except that the connection surface of the heat dissipating component 2 is of a wave or saw tooth type, as shown in fig. 2.
By adopting the preferable scheme, the contact surface between the heat radiation component 2 and the double-glass photovoltaic tile 1 is increased.
To further optimize the implementation of the present invention, in other embodiments, the remaining feature techniques are the same, except that the heat dissipating assembly 2 includes: the water guide pipe and the connector connected with the water guide pipe are also wrapped by adopting the heat preservation layer.
By adopting the preferable scheme, the joints are all wrapped by the heat insulation layer, and the water guide pipe and the joints are welded by argon arc welding, so that good heat dissipation performance is ensured, and leakage cannot occur.
As shown in fig. 3, in order to further optimize the implementation effect of the present invention, in other embodiments, the other feature technologies are the same, except that the heat dissipating component 2 is a composite tube, which includes: the cooling liquid pipe 21 and the ventilation pipe 22 of cover locating the cooling liquid pipe 21 outside, cooling liquid pipe 21 are used for leading to the coolant liquid, form the air current passageway between ventilation pipe 22 and the cooling liquid pipe 21 for leading to the cooling gas.
By adopting the preferable scheme, the dual cooling is realized, and the cooling effect is better. The coolant pipe 21 may be plugged at both ends by plugs before the ventilation pipe is filled with the coolant gas.
Further, a plurality of movable cores 3 uniformly arranged are provided in the pipe line of the coolant pipe 21, and the movable cores 3 include: the rotating end head and the movable blade 32 which is arranged on the rotating end head 31 and is rotationally connected with the rotating end head, and the movable blade 32 is contacted with the inner wall of the cooling liquid pipe 21;
the movable core 3 rotates under the flowing force of the cooling liquid.
By adopting the preferable scheme, the cooling liquid is prevented from being adhered to the inner wall of the pipeline of the cooling liquid pipe 21, and meanwhile, the additionally arranged movable core 3 can improve the heat dissipation effect.
Further, the air inlet of the ventilation pipe 22 extends a distance L from the air inlet of the coolant pipe 21.
With the above preferred arrangement, it is ensured that the cooling gas can smoothly enter the ventilation pipe 22.
Further, a squeeze plug 4 rotatably connected with the air inlet of the air pipe 22 is arranged at the air inlet;
the extrusion plug 4 is connected with the ventilation pipe 22 through a connecting rod 5, one end of the connecting rod 5 is rotationally connected with the ventilation pipe 22, and the opposite end of the connecting rod is rotationally connected with the ventilation pipe 22;
the squeeze plug 4 includes: the cooling device comprises a body 41, extrusion parts 42 arranged at two ends of the body 41 and protruding towards the direction away from the air inlet of the ventilation pipe 22, and a ventilation part 43 arranged at the middle part of the body 41 and recessed towards the direction close to the air inlet of the ventilation pipe 22, wherein a ventilation opening 44 is arranged on the ventilation part 43, and the ventilation opening 44 is communicated with an external cooling gas inlet device.
With the above preferred arrangement, the extrusion portion 42 of the extrusion plug is extruded after the cooling gas is introduced from the extrusion plug vent 44, so that the velocity of the cooling gas entering the ventilation pipe 22 can be effectively increased. The operation of pressing the pressing portion 42 of the pressing plug may be performed manually, or may be performed by providing a cylinder or other driving means.
Further, heat radiation strips 6 are arranged on the inner side pipe wall of the ventilation pipe 22 and/or the outer side pipe wall of the cooling liquid pipe 21, and the airflow channel is in a zigzag shape.
By adopting the preferable scheme, the airflow channel is in a zigzag shape, so that the heat dissipation effect is improved. It should be noted that the first heat dissipating strip is disposed on the wall of the ventilation tube 22 where the air inlet of the ventilation tube 22 extends a distance L from the air inlet of the coolant tube 21.
Further, one or more heat dissipation through holes 61 are provided in the heat dissipation bar 6.
By adopting the preferable scheme, the heat dissipation effect is further improved.
It should be noted that, for the preferred embodiment of the present invention, it is possible for a person skilled in the art to make several variations and modifications without departing from the inventive concept of the present invention, which fall within the protection scope of the present invention.

Claims (7)

1. A high thermal dissipation photovoltaic tile assembly comprising: the double-glass photovoltaic tile comprises from top to bottom: the solar photovoltaic tile comprises front glass, a first adhesive film layer, a battery piece assembly, a second adhesive film layer and back glass, and is characterized in that a heat dissipation assembly is further arranged below the dual-glass photovoltaic tile, the connection surface of the heat dissipation assembly is connected with the dual-glass photovoltaic tile through a heat conduction adhesive layer, and the non-connection surface of the heat dissipation assembly is wrapped by a heat preservation layer; the heat dissipation assembly is a composite tube, the composite tube includes: the cooling liquid pipe is used for passing cooling liquid, and an airflow channel is formed between the cooling liquid pipe and is used for passing cooling gas; an extrusion plug rotationally connected with the air inlet of the ventilation pipe is arranged at the air inlet of the ventilation pipe; the extrusion plug is connected with the ventilation pipe through a connecting rod, one end of the connecting rod is rotationally connected with the ventilation pipe, and the other opposite end of the connecting rod is rotationally connected with the ventilation pipe; the squeeze plug includes: the cooling air inlet device comprises a body, extrusion parts arranged at two ends of the body and protruding towards the direction away from the air inlet of the ventilation pipe, ventilation parts arranged at the middle part of the body and recessed towards the direction close to the air inlet of the ventilation pipe, and ventilation openings arranged on the ventilation parts and communicated with an external cooling air inlet device.
2. The high thermal dissipation photovoltaic tile assembly of claim 1, wherein the thermally conductive adhesive layer has a thickness of 1-4 mm.
3. The high thermal dissipation photovoltaic tile assembly of claim 1, wherein the connection surface of the thermal dissipation assembly is corrugated or saw-tooth.
4. The high thermal dissipation photovoltaic tile assembly of claim 1, wherein a plurality of evenly arranged movable cores are disposed within the coolant tube conduit, the movable cores comprising: the movable blade is in contact with the inner wall of the cooling liquid pipe;
the movable core rotates under the flowing acting force of the cooling liquid.
5. The high thermal dissipation photovoltaic tile assembly of claim 1, wherein the air inlet of the vent tube extends a distance L from the liquid inlet of the coolant tube.
6. The high thermal dissipation photovoltaic tile assembly of claim 1, wherein heat dissipating strips are provided on the inside tube wall of the ventilation tube and/or the outside tube wall of the coolant tube, and the airflow channel is tortuous.
7. The high thermal dissipation photovoltaic tile assembly of claim 6, wherein one or more thermal vias are provided in the heat sink strip.
CN201811621289.3A 2018-12-28 2018-12-28 High heat dissipation photovoltaic tile subassembly Active CN109509803B (en)

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CN109509803A CN109509803A (en) 2019-03-22
CN109509803B true CN109509803B (en) 2024-04-09

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9805850D0 (en) * 1998-03-20 1998-05-13 Sobegina Trading Limited Whirlwind tube
JP2004214623A (en) * 2002-12-16 2004-07-29 Denso Corp Refrigerant cooled type double-sided cooling semiconductor device
JP2007166721A (en) * 2005-12-12 2007-06-28 Hikita Kogyo Kk Electric power generator
JP2007258624A (en) * 2006-03-27 2007-10-04 Toyota Motor Corp Semiconductor cooling apparatus
CN201414093Y (en) * 2009-03-26 2010-02-24 重庆大学 Solar photovoltaic power-heat conversion device based on cooling of flat heat pipe
CN102136507A (en) * 2010-12-02 2011-07-27 无锡中阳新能源科技有限公司 Light transmission body regulatory photovoltaic/thermal (PV/T) integrated device
CN207441727U (en) * 2017-10-27 2018-06-01 无锡英富光能有限公司 A kind of photovoltaic module
CN108574455A (en) * 2018-06-11 2018-09-25 甘肃自然能源研究所 A kind of photovoltaic and photothermal electric hybrid module of cogeneration of heat and power
CN207938628U (en) * 2018-03-28 2018-10-02 浙江汇盈电子有限公司 A kind of photovoltaic electrification component
CN209087870U (en) * 2018-12-28 2019-07-09 苏州腾晖光伏技术有限公司 A kind of high heat dissipation photovoltaic tile component

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9805850D0 (en) * 1998-03-20 1998-05-13 Sobegina Trading Limited Whirlwind tube
JP2004214623A (en) * 2002-12-16 2004-07-29 Denso Corp Refrigerant cooled type double-sided cooling semiconductor device
JP2007166721A (en) * 2005-12-12 2007-06-28 Hikita Kogyo Kk Electric power generator
JP2007258624A (en) * 2006-03-27 2007-10-04 Toyota Motor Corp Semiconductor cooling apparatus
CN201414093Y (en) * 2009-03-26 2010-02-24 重庆大学 Solar photovoltaic power-heat conversion device based on cooling of flat heat pipe
CN102136507A (en) * 2010-12-02 2011-07-27 无锡中阳新能源科技有限公司 Light transmission body regulatory photovoltaic/thermal (PV/T) integrated device
CN207441727U (en) * 2017-10-27 2018-06-01 无锡英富光能有限公司 A kind of photovoltaic module
CN207938628U (en) * 2018-03-28 2018-10-02 浙江汇盈电子有限公司 A kind of photovoltaic electrification component
CN108574455A (en) * 2018-06-11 2018-09-25 甘肃自然能源研究所 A kind of photovoltaic and photothermal electric hybrid module of cogeneration of heat and power
CN209087870U (en) * 2018-12-28 2019-07-09 苏州腾晖光伏技术有限公司 A kind of high heat dissipation photovoltaic tile component

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