CN109508578A - Display module and forming method thereof - Google Patents
Display module and forming method thereof Download PDFInfo
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- CN109508578A CN109508578A CN201710829844.0A CN201710829844A CN109508578A CN 109508578 A CN109508578 A CN 109508578A CN 201710829844 A CN201710829844 A CN 201710829844A CN 109508578 A CN109508578 A CN 109508578A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/145—Illumination specially adapted for pattern recognition, e.g. using gratings
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/94—Hardware or software architectures specially adapted for image or video understanding
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
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Abstract
A kind of display module and forming method thereof, forming method includes: offer flexible plastic substrates；Device layer is formed in the flexible plastic substrates, the device layer and the flexible plastic substrates are used to form optical sensor；Cover sheet and the light-emitting display panel positioned at the cover sheet surface are provided；By the light-emitting display panel and the opposite fitting of the optical sensor.By forming device layer directly in flexible plastic substrates to constitute optical sensor, to achieve the purpose that take into account high yield and small thickness.
Description
Technical field
The present invention relates to optical finger prints to identify field more particularly to a kind of display module and forming method thereof.
Background technique
Fingerprint imaging identification technology is the fingerprint image that human body is collected by fingerprint sensor, then and in system
Existing fingerprint imaging information is compared, and whether carrying out correct judgment, and then realizes the technology of identification.The side used due to it
Just property and the uniqueness of somatic fingerprint, fingerprint identification technology have been widely used in every field.Such as public security bureau, customs
Etc. field of safety check, consumer product areas such as the access control system and PC of building and mobile phone etc..
The implementation of fingerprint imaging identification technology has the multiple technologies such as optical imagery, capacitance imaging, ultrasonic imaging.Relatively
For, optical finger print imaging technique, imaging effect is relatively preferable, and equipment cost is relatively low.
On the other hand, in the prior art, light-emitting display panel is small in size with its, light-weight, and the advantages such as Low emissivity are wide
It is general to be applied in various electronic products.In the prior art, have and carry out light-emitting display panel and optical finger print imaging film layer
In conjunction with reference, so that display panel be made to realize the integrated of fingerprint recognition and image display function.
But the thickness of the display module with fingerprint identification function is often larger, and existing thinning technique can be described
Higher yield loss is caused in the manufacturing process of display module, it is difficult to guarantee the production yield of display module.
Summary of the invention
Problems solved by the invention is to provide a kind of display module and forming method thereof, before guaranteeing display module yield
It puts, reduces the thickness of the display module.
To solve the above problems, the present invention provides a kind of forming method of display module, comprising:
Flexible plastic substrates are provided；Device layer, the device layer and the flexibility are formed in the flexible plastic substrates
Plastic base is used to form optical sensor；Cover sheet and the self-luminous display surface positioned at the cover sheet surface are provided
Plate；By the light-emitting display panel and the opposite fitting of the optical sensor；The cover sheet is aobvious backwards to the self-luminous
The surface for showing panel is sensing face, and light produced by the light-emitting display panel is formed in the sensing face carries fingerprint
The reflected light of information；The optical sensor is for acquiring the reflected light to obtain fingerprint image.
Optionally, the thickness of the flexible plastic substrates is less than or equal to 0.2mm.
Optionally, the material of the flexible plastic substrates is polyimide plastic or poly terephthalic acid class plastics.
Optionally, the optical sensor is optical sensor based on amorphous silicon film transistor, is based on low-temperature polysilicon
The optical sensor of silicon thin film transistor or optical sensor based on indium gallium zinc oxide thin film transistor (TFT).
Optionally, it is formed after the device layer, by the light-emitting display panel and the opposite patch of the optical sensor
Before conjunction, further includes: light is provided and collimates panel, the light collimation panel has the first surface and second surface being disposed opposite to each other；
By first surface fitting opposite with the surface of the optical sensor；By the second surface and the self-luminous display surface
The surface of plate is opposite to be bonded.
Optionally, the thickness of the light collimation panel is less than 0.5mm.
Optionally, after providing light collimation panel, by the first surface and the optical sensor of light collimation panel
The opposite fitting in surface before, further includes: form filter layer on the first surface；Adherency is formed on the filter layer
Layer；By the fitting opposite with the surface of the adhesion layer of the surface of the optical sensor.
Optionally, it is formed after the device layer, by the first surface and the optical sensor of light collimation panel
The opposite fitting in surface before, further includes: form filter layer on the device layer；Adhesion layer is formed on the filter layer；
By the fitting opposite with first face of the surface of the adhesion layer.
Optionally, the thickness of the adhesion layer is less than or equal to 50 μm.
Optionally, the filter layer is ink layer or multilayer dielectricity reflecting layer.
Optionally, the filter layer is ink layer；The filter layer is formed by way of silk-screen printing.
Optionally, the filter layer is ink layer；The filter layer thickness is less than 20 μm.
Optionally, the filter layer is multilayer dielectricity reflecting layer；The filter layer is formed by way of sputtering or being deposited.
Optionally, the filter layer is multilayer dielectricity reflecting layer；The filter layer thickness is less than 5 μm.
Correspondingly, the present invention also provides a kind of display modules, comprising:
Optical sensor, the optical sensor include flexible plastic substrates and the device in the flexible plastic substrates
Part layer；Light-emitting display panel is located above the optical sensor；Cover sheet is located above the self-emission panel；Institute
It is sensing face that cover sheet, which is stated, backwards to the surface of the light-emitting display panel, and light produced by the light-emitting display panel exists
The reflected light for carrying finger print information is formed in the sensing face；The optical sensor is for acquiring the reflection to be referred to
Print image.
Optionally, the material of the flexible plastic substrates is polyimide plastic or poly terephthalic acid class plastics.
Optionally, the thickness of the flexible plastic substrates is less than or equal to 0.2mm.
Optionally, the optical sensor is optical sensor based on amorphous silicon film transistor, is based on low-temperature polysilicon
The optical sensor of silicon thin film transistor or optical sensor based on indium gallium zinc oxide thin film transistor (TFT).
Optionally, further includes: light collimates panel, and the light collimation panel is located at the optical sensor and the self-luminous
Between display panel.
Optionally, the light collimation panel has the first surface and second surface for being disposed opposite to each other and being parallel to each other；It is described
Optical collimator panel includes: multiple smooth collimation units, the smooth collimation unit and the first surface and second surface institute
It is the first angle at angle, first angle is greater than or equal to 40 ° and is less than or equal to 90 °；The smooth collimation unit includes
Sandwich layer and cortex, the sandwich layer are uniformly distributed between first surface and second surface, the cortex be filled in adjacent sandwich layer it
Between；The sandwich layer is in be evenly spaced between each other, and the cortex surrounds the sandwich layer.
Optionally, the core material is to the absorptivity of visible light less than 20%.
Optionally, the cortical material is greater than 50% to the absorptivity of visible light.
Optionally, the depth-width ratio of the sandwich layer is greater than 10.
Optionally, the distance between adjacent sandwich layer is less than 30 μm.
Optionally, between the light collimation panel and the optical sensor, further includes: adhesion layer is located at the optics
On sensor；Filter layer is located on the adhesion layer.
Optionally, between the light collimation panel and the optical sensor, further includes: filter layer is located at the optics
On sensor；Adhesion layer is located on the filter layer.
Optionally, the material of the adhesion layer is transparent optical cement.
Optionally, the filter layer is greater than 50% to the absorptivity of near infrared light.
Optionally, the filter layer is greater than 50% to the transmitance of visible light.
Optionally, the light-emitting display panel is OLED display panel.
Optionally, the self-emission panel includes multiple luminescence units, and the luminescence unit includes transparent area, the light transmission
Area's area accounts for 5% to the 20% of the luminescence unit area.
Optionally, the optical sensor includes photosensitive pixel, and the sensor devices in each photosensitive pixel are amorphous
Silicon PIN photoelectric diode.
Compared with prior art, technical solution of the present invention has the advantage that
Technical solution of the present invention, by directly forming device layer in flexible plastic substrates, the device layer and described soft
Property plastic base is used to form optical sensor；Light-emitting display panel and protective layer are integrated on the optical sensor again；
Using reflected light of the light produced by the light-emitting display panel in the sensing face, fingerprint image is formed.Due to described
The material of flexible plastic substrates is often high molecular polymer, toughness with higher, is also not easy in the lesser situation of thickness
Occur damaged；Therefore the use of the flexible plastic substrates, can not only effectively reduce the thickness of the optical sensor, reduce
The thickness of the display module, but also the yield loss in the optical sensor forming process can be effectively reduced；So
The use of the flexible plastic substrates can achieve the purpose that take into account high yield and small thickness.
In optinal plan of the present invention, the material of the flexible plastic substrates is polyimide plastic or poly terephthalic acid class
Plastics.Polyimide plastic gathers to stupid diformazan acids plastics with preferable mechanical performance, stronger toughness, even if in thickness
In the case where less than or equal to 0.2mm, it is also able to maintain lesser breakage rate, so the material of the flexible plastic substrates is set
It is set to polyimide plastic or poly- to stupid diformazan acids plastics, the thickness of the optical sensor can be effectively reduced, additionally it is possible to
Maintain preferable manufacturing yield；Furthermore polyimide plastic or poly- also there is preferable thermal stability to stupid diformazan acids plastics
Can, can high temperature resistant, the various process conditions being able to bear during semiconductor fabrication process advantageously ensure that the optics passes
The performance of sensor is conducive to the base for preferably realizing fingerprint recognition and image display function, is conducive to take into account high yield and small
The technical requirements of thickness；Moreover, polyimide plastic or poly- there are also preferable isolation performance, Neng Gouyou to stupid diformazan acids plastics
Effect prevents steam from penetrating into inside the display module, is conducive to the raising of formed display module stability.
In optinal plan of the present invention, further includes: be arranged between the optical sensor and the light-emitting display panel
Light collimates panel.The light collimation panel can collimate optical sensor light collected, so as to have
Effect improves the fingerprint identification function of the display module；And the thickness of the light collimation panel is less than 0.5mm, so as to protect
The thinning for demonstrate,proving the display module is conducive to the thickness for reducing the display module.
In optinal plan of the present invention, comprising: it is collimated in the light and filter layer is set between panel and the optical sensor,
So as to effectively filter out environment light, be conducive to the quality for improving obtained fingerprint image；And the filter layer can be formed
It is collimated on panel in the light, so that the optical sensor is avoided to be influenced by the high temperature in the optical filtering layer formation process,
Be conducive to maintain the performance of the optical sensor；The filter layer can also be formed on the optical sensor, to drop
Scattering process of the low filter layer to the reflected light, reduces influence of the filter layer to fingerprint image quality.
Detailed description of the invention
Fig. 1 to Fig. 5 is that the invention shows the corresponding the schematic diagram of the section structure of the one each step of embodiment of mould group forming method；
Fig. 6 and Fig. 7 is that the invention shows the corresponding cross-section structure signals of each step of another embodiment of mould group forming method
Figure.
Specific embodiment
It can be seen from background technology that often thickness is larger for the existing display module with fingerprint identification function, and existing thinning
Technique can cause higher yield loss in the fabrication process again, it is difficult to realize taking into account for manufacturing yield and mould group thinning.
To solve the technical problem, the present invention provides a kind of display module and forming method thereof, by flexiplast
Device layer is formed on substrate, directly to form optical sensor；Light-emitting display panel is integrated on the optical sensor again
And protective layer.The use of the flexible plastic substrates can be realized taking into account for high yield and small thickness.
To make the above purposes, features and advantages of the invention more obvious and understandable, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
Referring to figs. 1 to Fig. 5, show that the invention shows the corresponding section knots of the one each step of embodiment of mould group forming method
Structure schematic diagram.
With reference to Fig. 1, flexible plastic substrates 110 are provided.
For constituting the optical sensor, the formation for the subsequent device layer provides the flexible plastic substrates 110
Technological operation platform and basis.
Since the material of the flexible plastic substrates 110 is often high molecular polymer, toughness with higher, in thickness
Also it is not susceptible to breakage in lesser situation, therefore forms the optical sensor in the flexible plastic substrates 110, it can
Effectively reduce the thickness of formed optical sensor, additionally it is possible to the yield loss in the optical sensor forming process is reduced,
It is advantageously implemented taking into account for manufacturing yield and mould group thinning.
In the present embodiment, the thickness of the flexible plastic substrates 110 is less than or equal to 0.2mm.The flexible plastic substrates
110 thickness should not be too big.If the thickness of the flexible plastic substrates 110 is too big, it will cause formed optical sensors
Thickness is excessive, and the thickness that will affect formed display module reduces, and is unfavorable for mould group thinning.
In the present embodiment, the material of the flexible plastic substrates 110 is polyimides (Polyimide, PI) plastics or gathers
Terephthaldehyde's acids (Polyethylene Terephthalate, PET) plastics.
Polyimide plastic or it is poly- there is preferable mechanical performance to stupid diformazan acids plastics, stronger toughness, though
In the case that thickness is less than or equal to 0.2mm, it is also able to maintain lesser breakage rate, so by the material of the flexible plastic substrates
Material is set as polyimide plastic or gathers to stupid diformazan acids plastics, can effectively reduce the thickness of the optical sensor, also
It is able to maintain that preferable manufacturing yield；In addition, polyimide plastic or poly- also having preferable heat steady in stupid diformazan acids plastics
It is qualitative can, can high temperature resistant, the various process conditions being able to bear during semiconductor fabrication process advantageously ensure that the light
The performance for learning sensor is conducive to preferably realize the integrated of fingerprint recognition and image display function, is conducive to take into account high yield
With the technical requirements of small thickness；Moreover, polyimide plastic or poly- there are also preferable isolation performance, energy to stupid diformazan acids plastics
It enough effectively prevent steam to penetrate into inside the display module, is conducive to the raising of formed display module stability.
It should be noted that as shown in Figure 1, the flexible plastic substrates 110 have the behaviour being disposed opposite to each other in the present embodiment
Make face 112 and the back side 111, to be subsequently used for forming device layer on the operating surface 112, to constitute the optical sensor.
With reference to Fig. 2, device layer 120, the device layer 120 and the flexibility are formed in the flexible plastic substrates 110
Plastic base 110 is used to form optical sensor 100.
It should be noted that since flexible plastic substrates 110 are than relatively thin, so rigidity is not enough.In the production of device layer 120
It is not easy to the transfer or fixation of flexible plastic substrates 110 in the process.So general all can be fixed by flexible plastic substrates 110 in advance
On a rigid substrates, such as glass plate or stainless steel plate, then carry out the production of device layer 120；It is made to device layer 120
After the completion, just flexible plastic substrates 110 are entirely separated from rigid substrates together with device layer 120.
The device layer 120 with the flexible plastic substrates 110 together, for constituting the optical sensor 100.It is described
There are sensor devices, for acquiring the reflected light to obtain fingerprint image in device layer 120.
It should be noted that since the flexible plastic substrates 110 are plastic material, in the present embodiment, the light
Learning sensor 100 is based on amorphous silicon film transistor (Amorphous Silicon Thin Film Transistor, a-
Si:H TFT) optical sensor.But in other embodiments of the invention, the optical sensor is also possible to more based on low temperature
The optics of polycrystal silicon film transistor (Low Temperature Poly Si Thin Film Transistor, LTP-Si TFT)
Sensor is based on indium gallium zinc oxide thin film transistor (TFT) (Indium Gallium Zinc Oxide Thin Film
Transistor, IGZO TFT) optical sensor.
Specifically, the step of forming device layer 120 includes: to form photoreceptor in the flexible plastic substrates 110
Part 122；Form the protective layer 121 for covering the sensor devices 122 and at least partly described substrate 110.
In the present embodiment, the optical sensor 100 includes photosensitive pixel, the sensor devices in each photosensitive pixel
122 be amorphous silicon PIN photodiode, that is to say, that the sensor devices 122 in the device layer 120 of each photosensitive pixel are non-
Crystal silicon PIN photodiode.
In the present embodiment, since the flexible plastic substrates 110 are plastic material, the material of the protective layer 121
For one or both of amorphous silica and amorphous silicon nitride.The protective layer 121 can by sputtering or
The modes such as vapor deposition are formed on the operating surface of the flexible plastic substrates 110.
It should be noted that being formed after the device layer 120, the forming method with reference to Fig. 3 further include: provide light
Panel 130 is collimated, the light collimation panel 130 has the first surface 131 and second surface 132 being disposed opposite to each other；By described
The fitting opposite with the surface of the optical sensor 100 of one surface 131；The second surface 132 is shown with the self-luminous
The surface of panel 140 is opposite to be bonded.
The light collimation panel 130 is used to collimate reflected light, permission special angle range (such as 50 ° to 55 °
In range) light largely can collimate panel 130 through light, the light overwhelming majority of other angles is all predominantly absorbed.To
The stray light in the acquired reflected light of the optical sensor 100 is reduced, the quality for improving obtained fingerprint image is conducive to.
As shown in figure 3, the light collimation panel 130 has the first table for being disposed opposite to each other and being parallel to each other in the present embodiment
Face 131 and second surface 132；The light collimation panel 130 includes: multiple smooth collimation units (not indicating in figure), the light are quasi-
Straight unit and the first surface 131 and 132 angle of the second surface are the first angle (not shown), described the
One angle is greater than or equal to 40 ° and is less than or equal to 90 °；The smooth collimation unit includes sandwich layer (not shown) and cortex
(not shown), the sandwich layer are uniformly distributed between the first surface and the second surface, and the cortex is filled in
Between adjacent sandwich layer；The sandwich layer is in be evenly spaced between each other, and the cortex surrounds the sandwich layer.
In the present embodiment, the main sandwich layer using light collimation unit of light collimation panel 130 is come across light, and cortex
Then for absorbing light, sandwich layer and cortex cooperation, to have the function that above-mentioned light collimation, reduce stray light.
By the effect of sandwich layer it is found that the lower sandwich layer the better to the absorptivity of visible light.For guarantee across light intensity foot
Enough, in the present embodiment, the core material is to the absorptivity of visible light less than 20%.By the effect of cortex it is found that cortex is to can
The higher the better for light-exposed absorptivity, and in other words, cortex is then preferably higher to the absorptivity of visible light, except to special angle
Light is absorbed.To guarantee effectively to absorb respective ray of light, in the present embodiment, suction of the cortical material to visible light
Yield is greater than 50%.So light (visible light) is usually only divided into two kinds of situations: the first feelings after entering light collimation panel 130
Condition is absorbed by cortex；Second situation passes through light along sandwich layer and collimates panel 130.
In the present embodiment, the depth-width ratio of the sandwich layer is greater than 10.The depth-width ratio of the sandwich layer should not be too small.The sandwich layer
If depth-width ratio is too small, the height of the sandwich layer is too small, and width is excessive, is unfavorable for guaranteeing that the sandwich layer imitates the collimation of light
Fruit.
In addition, the distance between adjacent adjacent sandwich layer is less than 30 μm.The distance between adjacent sandwich layer should not be too big.Adjacent core
If distance is too big between layer, the depth-width ratio of the sandwich layer can be made too small, be unfavorable for the sandwich layer to the collimating effect of light.
It should be noted that the thickness of the light collimation panel 130 is less than 0.5mm in the present embodiment.The smooth collimation plane
The thickness of plate 130 should not be too big, if the thickness of light collimation panel 130 is too big, it is thick to will affect the entire display module
The control of degree is likely to result in the excessive problem of formed display module thickness.So by the thickness of light collimation panel 130
It is set smaller than the way of 0.5mm, can guarantee the thinning of the display module, is conducive to the display module integral thickness
Control.
With continued reference to Fig. 3, in the present embodiment, after providing light collimation panel 130, by the of light collimation panel 130
Before the fitting opposite with the surface of the optical sensor 100 of one surface 131, further includes: formed on the first surface 131
Filter layer 170；Adhesion layer 160 is formed on the filter layer 170；By the surface of the optical sensor 100 and the adherency
The surface of layer 160 is opposite to be bonded.
Filter layer 170 is used for filtering environmental light, to improve the quality of obtained fingerprint image.
By the filter layer 170 effect it is found that absorptivity of the filter layer 170 to infrared light the higher the better.To protect
Card preferably filters out effect to environment light, and in the present embodiment, the filter layer 170 is to the absorptivity of near infrared light greater than 50%.
In addition, by the principle of fingerprint image acquisition, it is found that the filter layer 170 is to visible light transmittance, the higher the better.In order to guarantee
State the acquisition of fingerprint image, in the present embodiment, the filter layer 170 is greater than 50% to the transmitance of visible light.So the filter
Photosphere 170 can effectively remove the infrared light in environment light, especially environment light, and can effectively ensure that the saturating of visible light
It penetrates, guarantees the acquisition of clear fingerprint image.
Specifically, the filter layer 170 is ink layer, the filter layer 170 can be formed by way of silk-screen printing.
In the present embodiment, the thickness of the filter layer 170 is less than 20 μm.The thickness of the filter layer 170 should not be too big.Institute
If the thickness for stating filter layer 170 is too big, the integral thickness of formed display module may be influenced, is unfavorable for forming display mould
The reduction of group thickness.
The adhesion layer 160 collimates the company of fitting between panel 130 and the optical sensor 100 for realizing the light
It connects.
In the present embodiment, the material of the adhesion layer 160 is transparent optical cement, so as to which the filter layer is effectively reduced
The influence that 160 pairs of fingerprint images obtain, is conducive to the acquisition of high quality fingerprint image.
In the present embodiment, the thickness of the adhesion layer 160 is less than or equal to 50 μm.The thickness of the adhesion layer 160 is unsuitable
It is too big.If the thickness of the filter layer 170 is too big, the integral thickness of formed display module may be influenced, institute's shape is unfavorable for
At the reduction of display module thickness.
Form the filter layer 170 on light collimation panel 130, and by the adhesion layer 160 realize with it is described
Optical sensor 100 is fitted and connected；This way can be avoided the optical sensor 100 by 170 shape of filter layer
At the influence of technique, the optical sensor 100 especially can be avoided by the high temperature in 170 forming process of filter layer
It influences, is conducive to the performance for maintaining the optical sensor 100.
With reference to Fig. 4, cover sheet 150 and the light-emitting display panel 140 positioned at 150 surface of cover sheet are provided.
The cover sheet 150 covers the light-emitting display panel 140 and the optical sensor, plays protection and makees
With；The light-emitting display panel 140 is for realizing image display function.
In the present embodiment, the cover sheet 150 is the cover-plate glass of the light-emitting display panel 140.
In the present embodiment, the light-emitting display panel 140 includes the first transparent substrates (not indicating in figure), the second light transmission
Substrate (not indicated in figure) and self-luminescence circuit layer (not indicated in figure).Self-luminescence circuit layer is located at the first transparent substrates and second
Between transparent substrates.
The light-emitting display panel 140 includes multiple luminescence units (not indicating in figure).Each luminescence unit includes saturating
Light area and alternatively non-transparent district, so light can project the light-emitting display panel 140.
It should be noted that the transparent area area accounts for 5% to the 20% of the luminescence unit area.The transparent area face
Product account for the luminescence unit area ratio should not it is too high also should not be too low.The transparent area area accounts for the luminescence unit area
If ratio it is too low, transmission of the light-emitting display panel 140 to light may be will affect, clear finger may be will affect
The acquisition of print image；If the ratio that the transparent area area accounts for the luminescence unit area is too high, may will affect described
The self-luminosity energy of light-emitting display panel 140 is unfavorable for the realization of the display module image display function.
Specifically, the light-emitting display panel 140 can be OLED display panel, so the self-luminescence circuit layer
Display pixel cells may include anode layer, hole injection layer (HIL), luminescent layer (EML), electron injecting layer (EIL) and cathode
Layer etc. structures, can also have hole transmission layer (HTL) and electron transfer layer (ETL), can also include drive OLED TFT,
Drive the structures such as metal wire and storage capacitance.The specific technical solution of the light-emitting display panel 140 is same as the prior art,
Details are not described herein by the present invention.
In conjunction with reference Fig. 5, by the light-emitting display panel 140 and the opposite fitting of the optical sensor 100.
In the present embodiment, the light collimation panel 130 is also fitted on the optical sensor 100, so described spontaneous
The surface of display panel 140 is opposite with the second surface 132 of light collimation panel 130 to be bonded.Specifically, can be by transparent
Optical cement realizes the fitting between the spontaneous display panel 140 and light collimation panel 130.
It should be noted that as shown in figure 4, in the present embodiment, after forming the optical sensor 100, by institute
Before stating light-emitting display panel 140 and the opposite fitting of the optical sensor 100, the forming method further include: described
Lamination reinforcement plate 103 on the back side 111 of flexible plastic substrates 110.
Since the flexible plastic substrates 110 are easy to happen deformation, may there is a problem of mechanical support deficiency, so
The stiffening plate 103 in technical process for providing additional mechanical support.
In the present embodiment, the material of the stiffening plate 103 is stainless steel, can be by double faced adhesive tape together in the flexible modeling
On the back side 111 for expecting substrate 110.Specifically, the thickness of the stiffening plate 103 is less than or equal to 0.2mm.
In addition, minimizing the thickness of formed display module to effectively control the integral thickness of formed display module
It spends, in the present embodiment, after by the light-emitting display panel 140 and the opposite fitting of the optical sensor 100, the shape
At method further include: remove the stiffening plate 103.
It should be noted that the light-emitting display panel 140 and the optical sensor 100 are bonded it relatively
Afterwards, further includes: the optical sensor 100 is read with signal by chip 160 by flexible circuit board 170 and is connected.Specifically, institute
State 170 one end of flexible circuit board by anisotropic conductive film (Anisotropic Conductiveadhesive Film,
ACF) it is connected with the flexible plastic substrates 110；The other end reads chip 160 with the signal and is connected.
As shown in figure 5, the cover sheet 150 is sensing face 151 backwards to the surface of the light-emitting display panel 140,
Light produced by the light-emitting display panel 140 forms the reflected light for carrying finger print information in the sensing face 151；Institute
Optical sensor 100 is stated for acquiring the reflected light to obtain fingerprint image.
In the present embodiment, light caused by the light-emitting display panel 140 occurs anti-in the sensing face 151
It penetrates and reflects；In finger pressing when in the sensing face 151, the light reflected forms the reflection for carrying finger print information
Light；Light-emitting display panel 140 described in the reflection light transmission collimates through light collimation panel 130, is projected to the optics
On sensor 100；The optical sensor 100 acquires the reflected light, to obtain fingerprint image.
Correspondingly, with reference to Fig. 5, show that the invention shows the schematic diagram of the section structure of one embodiment of mould group.
The display module includes:
Optical sensor 100, the optical sensor 100 is including flexible plastic substrates 110 and is located at the flexiplast
Device layer 120 on substrate 110；Light-emitting display panel 140 is located at 100 top of optical sensor；Cover sheet 150,
Above the self-emission panel 140；The cover sheet 150 is sense backwards to the surface of the light-emitting display panel 140
Survey face 151, light produced by the light-emitting display panel 140 is formed in the sensing face 151 carries finger print information
Reflected light；The optical sensor 100 is for acquiring the reflection to obtain fingerprint image.
The flexible plastic substrates 110 are mentioned for constituting the optical sensor 100 for the formation of the device layer 120
For technological operation platform and basis.
Since the material of the flexible plastic substrates 110 is often high molecular polymer, toughness with higher, in thickness
Also it is not susceptible to breakage in lesser situation, therefore forms the optical sensor in the flexible plastic substrates 110, it can
Effectively reduce the thickness of formed optical sensor, additionally it is possible to the yield loss in the optical sensor forming process is reduced,
It is advantageously implemented taking into account for manufacturing yield and mould group thinning.
In the present embodiment, the thickness of the flexible plastic substrates 110 is less than or equal to 0.2mm.The flexible plastic substrates
110 thickness should not be too big.If the thickness of the flexible plastic substrates 110 is too big, it will cause formed optical sensors
Thickness is excessive, and the thickness that will affect formed display module reduces, and is unfavorable for mould group thinning.
In the present embodiment, the material of the flexible plastic substrates 110 is polyimides (Polyimide, PI) plastics or gathers
Terephthaldehyde's acids (Polyethylene Terephthalate, PET) plastics.
Polyimide plastic or poly terephthalic acid class plastics have a preferable mechanical performance, stronger toughness, even if
In the case that thickness is less than or equal to 0.2mm, it is also able to maintain lesser breakage rate, so by the material of the flexible plastic substrates
Material is set as polyimide plastic or gathers to stupid diformazan acids plastics, can effectively reduce the thickness of the optical sensor, also
It is able to maintain that preferable manufacturing yield；In addition, polyimide plastic or poly- also having preferable heat steady in stupid diformazan acids plastics
It is qualitative can, can high temperature resistant, the various process conditions being able to bear during semiconductor fabrication process advantageously ensure that the light
The performance for learning sensor is conducive to preferably realize the integrated of fingerprint recognition and image display function, is conducive to take into account high yield
With the technical requirements of small thickness；Moreover, polyimide plastic or poly- there are also preferable isolation performance, energy to stupid diformazan acids plastics
It enough effectively prevent steam to penetrate into inside the display module, is conducive to the raising of formed display module stability.
It should be noted that the flexible plastic substrates 110 have 112 He of operating surface being disposed opposite to each other in the present embodiment
The back side 111, the operating surface 112 are used to form the device layer 120, to constitute the optical sensor 100.
The device layer 120 with the flexible plastic substrates 110 together, for constituting the optical sensor 100.It is described
There are sensor devices, for acquiring the reflected light to obtain fingerprint image in device layer 120.
It should be noted that since the flexible plastic substrates 110 are plastic material, in the present embodiment, the light
Learning sensor 100 is based on amorphous silicon film transistor (Amorphous Silicon Thin Film Transistor, a-
Si:H TFT) optical sensor.But in other embodiments of the invention, the optical sensor is also possible to more based on low temperature
The optics of polycrystal silicon film transistor (LowTemperature Poly Si Thin Film Transistor, LTP-Si TFT)
Sensor is based on indium gallium zinc oxide thin film transistor (TFT) (Indium Gallium Zinc Oxide Thin Film
Transistor, IGZO TFT) optical sensor.
The device layer 120 includes: the sensor devices 122 in the flexible plastic substrates 110；And covering institute
State the protective layer 121 of sensor devices 122 and at least partly described substrate 110.
In the present embodiment, the optical sensor 100 includes photosensitive pixel, the sensor devices in each photosensitive pixel
122 be amorphous silicon PIN photodiode, that is to say, that the sensor devices 122 in the device layer 120 of each photosensitive pixel are non-
Crystal silicon PIN photodiode.
In the present embodiment, since the flexible plastic substrates 110 are plastic material, the material of the protective layer 121
For one or both of amorphous silica and amorphous silicon nitride.
As shown in figure 5, in the present embodiment, the display module further include: light collimates panel 130, and the light collimates panel
130 between the optical sensor 100 and the light-emitting display panel 140.
The light collimation panel 130 is acquired for collimating to reflected light to reduce the optical sensor 100
The incidence angle of reflected light is conducive to the quality for improving obtained fingerprint image.
In the present embodiment, light collimation panel 130, which has, to be disposed opposite to each other and the first surface 131 being parallel to each other and second
Surface 132；Light collimation panel 130 includes: multiple smooth collimation units (not indicating in figure), the smooth collimation unit with it is described
First surface 131 and 132 angle of the second surface are the first angle (not shown), first angle be greater than or
Equal to 40 ° and it is less than or equal to 90 °；The smooth collimation unit includes sandwich layer (not shown) and cortex (not shown),
The sandwich layer is uniformly distributed between the first surface and the second surface, and the cortex is filled between adjacent sandwich layer；
The sandwich layer is in be evenly spaced between each other, and the cortex surrounds the sandwich layer.
The main sandwich layer using light collimation unit of light collimation panel 130 is come across light, and cortex is then used to absorb
Light, sandwich layer and cortex cooperation, to have the function that above-mentioned light collimation, reduce stray light.
By the effect of sandwich layer it is found that the lower sandwich layer the better to the absorptivity of visible light.For guarantee across light intensity foot
Enough, in the present embodiment, the core material is to the absorptivity of visible light less than 20%.By the effect of cortex it is found that cortex is to can
The higher the better for light-exposed absorptivity, and in other words, cortex is then preferably higher to the absorptivity of visible light, except to special angle
Light is absorbed.To guarantee effectively to absorb respective ray of light, in the present embodiment, suction of the cortical material to visible light
Yield is greater than 50%.So light (visible light) is usually only divided into two kinds of situations: the first feelings after entering light collimation panel 130
Condition is absorbed by cortex；Second situation passes through light along sandwich layer and collimates panel 130.
In the present embodiment, the depth-width ratio of the sandwich layer is greater than 10.The depth-width ratio of the sandwich layer should not be too small.The sandwich layer
If depth-width ratio is too small, the height of the sandwich layer is too small, and width is excessive, is unfavorable for guaranteeing that the sandwich layer imitates the collimation of light
Fruit.
In addition, the distance between adjacent adjacent sandwich layer is less than 30 μm.The distance between adjacent sandwich layer should not be too big.Adjacent core
If distance is too big between layer, the depth-width ratio of the sandwich layer can be made too small, be unfavorable for the sandwich layer to the collimating effect of light.
In the present embodiment, the thickness of the light collimation panel 130 is less than 0.5mm.The thickness of the light collimation panel 130 is not
It is preferably too big, if the thickness of light collimation panel 130 is too big, it will affect the control of the entire display module thickness, it may
It will cause the excessive problem of formed display module thickness.So the thickness of light collimation panel 130 is set smaller than
The way of 0.5mm can guarantee the thinning of the display module, be conducive to the control of the display module integral thickness.
It should be noted that in the present embodiment, it is described between the light collimation panel 130 and the optical sensor 100
Display module further include: adhesion layer 160 is located on the optical sensor 100；Filter layer 170 is located at the adhesion layer 160
On, i.e., the described adhesion layer 160 and the filter layer 170 are sequentially located at the optical sensor 100 and light collimation panel 130
Between.
Filter layer 170 is used for filtering environmental light, to improve the quality of obtained fingerprint image.
By the filter layer 170 effect it is found that absorptivity of the filter layer 170 to infrared light the higher the better.To protect
Card preferably filters out effect to environment light, and in the present embodiment, the filter layer 170 is to the absorptivity of near infrared light greater than 50%.
In addition, by the principle of fingerprint image acquisition, it is found that the filter layer 170 is to visible light transmittance, the higher the better.In order to guarantee
State the acquisition of fingerprint image, in the present embodiment, the filter layer 170 is greater than 50% to the transmitance of visible light.So the filter
Photosphere 170 can effectively remove the infrared light in environment light, especially environment light, and can effectively ensure that the saturating of visible light
It penetrates, guarantees the acquisition of clear fingerprint image.
Specifically, the filter layer 170 is ink layer in the present embodiment.
The thickness of the filter layer 170 is less than 20 μm.The thickness of the filter layer 170 should not be too big.The filter layer 170
If thickness it is too big, the integral thickness of formed display module may be influenced, be unfavorable for subtracting for formed display module thickness
It is small.
The adhesion layer 160 collimates the company of fitting between panel 130 and the optical sensor 100 for realizing the light
It connects.
In the present embodiment, the material of the adhesion layer 160 is transparent optical cement, so as to which the filter layer is effectively reduced
The influence that 160 pairs of fingerprint images obtain, is conducive to the acquisition of high quality fingerprint image.
In the present embodiment, the thickness of the adhesion layer 160 is less than or equal to 50 μm.The thickness of the adhesion layer 160 is unsuitable
It is too big.If the thickness of the filter layer 170 is too big, the integral thickness of formed display module may be influenced, institute's shape is unfavorable for
At the reduction of display module thickness.
Form the filter layer 170 on light collimation panel 130, and by the adhesion layer 160 realize with it is described
Optical sensor 100 is fitted and connected；This way can be avoided the optical sensor 100 by 170 shape of filter layer
At the influence of technique, the optical sensor 100 especially can be avoided by the high temperature in 170 forming process of filter layer
It influences, is conducive to the performance for maintaining the optical sensor 100.
The cover sheet 150 covers the light-emitting display panel 140 and the optical sensor, plays protection and makees
With；The light-emitting display panel 140 is for realizing image display function.
In the present embodiment, the cover sheet 150 is the cover-plate glass of the light-emitting display panel 140.
In the present embodiment, the light-emitting display panel 140 includes the first transparent substrates (not indicating in figure), the second light transmission
Substrate (not indicated in figure) and self-luminescence circuit layer (not indicated in figure).Self-luminescence circuit layer is located at the first transparent substrates and second
Between transparent substrates.
The light-emitting display panel 140 includes multiple luminescence units (not indicating in figure).Each luminescence unit includes saturating
Light area and alternatively non-transparent district, so light can project the light-emitting display panel 140.
It should be noted that the transparent area area accounts for 5% to the 20% of the luminescence unit area.The transparent area face
Product account for the luminescence unit area ratio should not it is too high also should not be too low.The transparent area area accounts for the luminescence unit area
If ratio it is too low, transmission of the light-emitting display panel 140 to light may be will affect, clear finger may be will affect
The acquisition of print image；If the ratio that the transparent area area accounts for the luminescence unit area is too high, may will affect described
The self-luminosity energy of light-emitting display panel 140 is unfavorable for the realization of the display module image display function.
Specifically, the light-emitting display panel 140 can be OLED display panel, so the self-luminescence circuit layer
Display pixel cells may include anode layer, hole injection layer (HIL), luminescent layer (EML), electron injecting layer (EIL) and cathode
Layer etc. structures, can also have hole transmission layer (HTL) and electron transfer layer (ETL), can also include drive OLED TFT,
Drive the structures such as metal wire and storage capacitance.The specific technical solution of the light-emitting display panel 140 is same as the prior art,
Details are not described herein by the present invention.
It should be noted that in the present embodiment, the display module further include: signal reads chip 160, and the signal is read
Chip 160 is connected by flexible circuit board 170 with the optical sensor 100 out.Specifically, the flexible circuit board 170 1
End is connected by anisotropic conductive film with the flexible plastic substrates 110；The other end reads 160 phase of chip with the signal
Even.
As shown in figure 5, the cover sheet 150 is sensing face 151 backwards to the surface of the light-emitting display panel 140,
Light produced by the light-emitting display panel 140 forms the reflected light for carrying finger print information in the sensing face 151；Institute
Optical sensor 100 is stated for acquiring the reflected light to obtain fingerprint image.
In the present embodiment, light caused by the light-emitting display panel 140 occurs anti-in the sensing face 151
It penetrates and reflects；In finger pressing when in the sensing face 151, the light reflected forms the reflection for carrying finger print information
Light；Light-emitting display panel 140 described in the reflection light transmission collimates through light collimation panel 130, is projected to the optics
On sensor 100；The optical sensor 100 acquires the reflected light, to obtain fingerprint image.
With reference to Fig. 6 and Fig. 7, show that the invention shows the corresponding sections of each step of another embodiment of mould group forming method
Structural schematic diagram.
The present embodiment and aforementioned display module forming method embodiment something in common, details are not described herein by the present invention.This reality
Apply example and previous embodiment the difference is that, in the present embodiment, formed after the device layer 220, by the smooth collimation plane
Before the fitting opposite with the surface of the optical sensor 200 of the first surface 231 of plate 230, further includes: as shown in fig. 6, in institute
State formation filter layer 270 on device layer 220；Adhesion layer 260 is formed on the filter layer 270；As shown in fig. 7, by described viscous
The surface of attached layer 260 is opposite with first face 231 to be bonded.
In the present embodiment, the filter layer 270 is multilayer dielectricity reflecting layer, filters out certain wave by the principle of interference of light wave
Long environment light.
The filter layer 270 includes the silicon oxide layer and titanium oxide layer being arranged alternately.Light is being irradiated to the filter layer
When 270, reflection and transmission can be occurred in each interface of the silicon oxide layer and the titanium oxide layer, the light that is reflected and
Constructive interference may occur between incident light, to improve the light intensity of institute's reflection light, keep more energy described
Filter layer 270 reflects, to reduce the transmissivity of transmitted ray；Alternatively, can also between the light of the light and incidence that are reflected
Destructive interference can occur, to reduce the light intensity of institute's reflection light, make more energy through the filter layer 270, thus
Improve the transmissivity of transmitted ray.
It is to occur that the thickness of the wavelength of light, the thickness of silicon oxide layer and titanium oxide layer, which determines between reflected light,
Constructive interference or destructive interference；So the setting of the thickness by the thickness and titanium oxide layer of the silicon oxide layer, makes specific
Light reflectivity in wavelength band is higher, and transmissivity is lower；Keep the light transmission in particular range of wavelengths higher, and reflectivity compared with
It is low；To enable the filter layer to filter out the light in particular range of wavelengths.
Light is reflected in the interface of the silicon oxide layer and the titanium oxide layer, so in the filter layer 270
The sum of the number of plies of the silicon oxide layer and the number of plies of the titanium oxide layer are in 5 to 60 ranges.Oxygen described in the filter layer 270
If the sum of the number of plies of SiClx layer and the number of plies of the titanium oxide layer are too small, the filter layer 270 may be will affect to environment
The filtration result of light is unfavorable for providing the quality of fingerprint image；The number of plies of silicon oxide layer described in the filter layer 270 and described
If the sum of number of plies of titanium oxide layer is excessive, it is unfavorable for the transmission of light, it is also possible to it is unfavorable for the raising of fingerprint image quality,
And the number of plies of the silicon oxide layer and the number of plies of the titanium oxide layer are excessive, will increase the thickness of the filter layer, are unfavorable for
The control of the display module integral thickness.
In addition, 270 thickness of filter layer is less than 5 μm in the present embodiment.The integral thickness of the filter layer 270 is unsuitable
It is too big.If the integral thickness of the filter layer 270 is too big (for example being greater than 10um), Production Time be will increase, and cost can increase
Add.In addition, general thickness is too big, overall stress in thin film is too big, so that film layer can fracture and flake off.
In the present embodiment, the filter layer 270 is the multilayer dielectricity reflecting layer that silicon oxide layer, titanium oxide layer are arranged alternately；
So the filter layer 270 can form the filter layer 270 by way of sputtering or being deposited.
Correspondingly, with reference to Fig. 7, show that the invention shows the schematic diagram of the section structure of another embodiment of mould group.
The present embodiment and aforementioned display module embodiment something in common, details are not described herein by the present invention.The present embodiment is with before
State display module embodiment the difference is that, in the present embodiment, light collimation panel 230 and the optical sensor 200
Between, further includes: filter layer 270 is located on the optical sensor 200；Adhesion layer 260 is located on the filter layer 270,
The i.e. described filter layer 270 and the adhesion layer 260 be sequentially located at the optical sensor 100 and the light collimation panel 130 it
Between.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (32)
1. a kind of forming method of display module characterized by comprising
Flexible plastic substrates are provided；
Device layer is formed in the flexible plastic substrates, the device layer and the flexible plastic substrates are used to form optics biography
Sensor；
Cover sheet and the light-emitting display panel positioned at the cover sheet surface are provided；
By the light-emitting display panel and the opposite fitting of the optical sensor；
The cover sheet is sensing face backwards to the surface of the light-emitting display panel, produced by the light-emitting display panel
Light forms the reflected light for carrying finger print information in the sensing face；
The optical sensor is for acquiring the reflected light to obtain fingerprint image.
2. forming method as described in claim 1, which is characterized in that the thickness of the flexible plastic substrates is less than or equal to
0.2mm。
3. forming method as claimed in claim 1 or 2, which is characterized in that the material of the flexible plastic substrates is that polyamides is sub-
Amine plastics or poly terephthalic acid class plastics.
4. forming method as described in claim 1, which is characterized in that the optical sensor is based on amorphous silicon membrane crystal
The optical sensor of pipe, the optical sensor based on low-temperature polysilicon film transistor are based on indium gallium zinc oxide film crystal
The optical sensor of pipe.
5. forming method as described in claim 1, which is characterized in that formed after the device layer, the self-luminous is shown
Before showing that panel and the optical sensor are bonded relatively, further includes:
Light is provided and collimates panel, the light collimation panel has the first surface and second surface being disposed opposite to each other；
By first surface fitting opposite with the surface of the optical sensor；
By second surface fitting opposite with the surface of the light-emitting display panel.
6. forming method as claimed in claim 5, which is characterized in that the thickness of the light collimation panel is less than 0.5mm.
7. forming method as claimed in claim 5, which is characterized in that after providing light collimation panel, by the smooth collimation plane
Before the fitting opposite with the surface of the optical sensor of the first surface of plate, further includes:
Filter layer is formed on the first surface；
Adhesion layer is formed on the filter layer；
By the fitting opposite with the surface of the adhesion layer of the surface of the optical sensor.
8. forming method as claimed in claim 5, which is characterized in that formed after the device layer, by the smooth collimation plane
Before the fitting opposite with the surface of the optical sensor of the first surface of plate, further includes:
Filter layer is formed on the device layer；
Adhesion layer is formed on the filter layer；
By the fitting opposite with first face of the surface of the adhesion layer.
9. forming method as claimed in claim 7 or 8, which is characterized in that the thickness of the adhesion layer is less than or equal to 50 μm.
10. forming method as claimed in claim 7 or 8, which is characterized in that the filter layer is that ink layer or multilayer dielectricity are anti-
Penetrate layer.
11. forming method as claimed in claim 10, which is characterized in that the filter layer is ink layer；
The filter layer is formed by way of silk-screen printing.
12. forming method as claimed in claim 10, which is characterized in that the filter layer is ink layer；
The filter layer thickness is less than 20 μm.
13. forming method as claimed in claim 10, which is characterized in that the filter layer is multilayer dielectricity reflecting layer；
The filter layer is formed by way of sputtering or being deposited.
14. forming method as claimed in claim 10, which is characterized in that the filter layer is multilayer dielectricity reflecting layer；
The filter layer thickness is less than 5 μm.
15. a kind of display module characterized by comprising
Optical sensor, the optical sensor include flexible plastic substrates and the device in the flexible plastic substrates
Layer；
Light-emitting display panel is located above the optical sensor；
Cover sheet is located above the self-emission panel；
The cover sheet is sensing face backwards to the surface of the light-emitting display panel, produced by the light-emitting display panel
Light forms the reflected light for carrying finger print information in the sensing face；
The optical sensor is for acquiring the reflection to obtain fingerprint image.
16. display module as claimed in claim 15, which is characterized in that the material of the flexible plastic substrates is polyimides
Plastics or poly terephthalic acid class plastics.
17. display module as claimed in claim 15, which is characterized in that the thickness of the flexible plastic substrates is less than or equal to
0.2mm。
18. display module as claimed in claim 15, which is characterized in that the optical sensor is based on amorphous silicon membrane crystalline substance
The optical sensor of body pipe, the optical sensor based on low-temperature polysilicon film transistor are brilliant based on indium gallium zinc oxide film
The optical sensor of body pipe.
19. display module as claimed in claim 15, which is characterized in that further include: light collimates panel, and the light collimates panel
Between the optical sensor and the light-emitting display panel.
20. display module as claimed in claim 19, which is characterized in that light collimation panel, which has, to be disposed opposite to each other and mutually
Parallel first surface and second surface；
The optical collimator panel includes: multiple smooth collimation units, the smooth collimation unit and the first surface and described the
Two surface angles are the first angle, and first angle is greater than or equal to 40 ° and is less than or equal to 90 °；
The smooth collimation unit includes sandwich layer and cortex, and the sandwich layer is uniformly distributed between first surface and second surface, institute
Cortex is stated to be filled between adjacent sandwich layer；
The sandwich layer is in be evenly spaced between each other, and the cortex surrounds the sandwich layer.
21. display module as claimed in claim 20, which is characterized in that the core material is less than the absorptivity of visible light
20%.
22. display module as claimed in claim 20, which is characterized in that the cortical material is greater than the absorptivity of visible light
50%.
23. display module as claimed in claim 20, which is characterized in that the depth-width ratio of the sandwich layer is greater than 10.
24. display module as claimed in claim 20, which is characterized in that the distance between adjacent sandwich layer is less than 30 μm.
25. display module as claimed in claim 19, which is characterized in that light collimation panel and the optical sensor it
Between, further includes:
Adhesion layer is located on the optical sensor；
Filter layer is located on the adhesion layer.
26. display module as claimed in claim 19, which is characterized in that light collimation panel and the optical sensor it
Between, further includes:
Filter layer is located on the optical sensor；
Adhesion layer is located on the filter layer.
27. the display module as described in claim 25 or 26, which is characterized in that the material of the adhesion layer is transparent optical
Glue.
28. the display module as described in claim 25 or 26, which is characterized in that absorptivity of the filter layer near infrared light
Greater than 50%.
29. the display module as described in claim 25 or 26, which is characterized in that the filter layer is big to the transmitance of visible light
In 50%.
30. display module as claimed in claim 15, which is characterized in that the light-emitting display panel is OLED display surface
Plate.
31. display module as claimed in claim 15, which is characterized in that the self-emission panel includes multiple luminescence units,
The luminescence unit includes transparent area, and the transparent area area accounts for 5% to the 20% of the luminescence unit area.
32. display module as claimed in claim 15, which is characterized in that the optical sensor includes photosensitive pixel, each
Sensor devices in the photosensitive pixel are amorphous silicon PIN photodiodes.
Priority Applications (1)
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|---|---|---|---|
| CN201710829844.0A CN109508578A (en) | 2017-09-14 | 2017-09-14 | Display module and forming method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710829844.0A CN109508578A (en) | 2017-09-14 | 2017-09-14 | Display module and forming method thereof |
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| CN109508578A true CN109508578A (en) | 2019-03-22 |
Family
ID=65744692
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Application publication date: 20190322 |