CN109486432A - The two-sided cured film of flexible conductive film - Google Patents
The two-sided cured film of flexible conductive film Download PDFInfo
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- CN109486432A CN109486432A CN201811159675.5A CN201811159675A CN109486432A CN 109486432 A CN109486432 A CN 109486432A CN 201811159675 A CN201811159675 A CN 201811159675A CN 109486432 A CN109486432 A CN 109486432A
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
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Abstract
The present invention provides a kind of two-sided cured films of flexible conductive film, it is characterized in that, including COP substrate layer and it is coated on the hardened layer of the COP substrate layer bilateral, the material of the hardened layer includes first coating composition, and the first coating composition includes following components based on mass fraction: silicon oxidation nanometer particle 5-40%；Compound 5-20%, the compound 20-80% containing multiple polymerizable unsaturated groups, the photoinitiator 0.1-10%, solvent 10-30% of the group containing active polymerisable.The present invention constructs the complex of COP two-sided hardening and PET protection film, makes it have easy processing application.The bending resistance of improvement cop can be gone with first coating composition, second coating composition or third coating composition can be added simultaneously, to obtain the two-sided cured film of high transmittance, low haze, the transmitance of this final two-sided cured film reaches 93% or more, mist degree is lower than 0.1%, to be applied to the processing of flexible conductive film.
Description
Technical field
The present invention relates to optics technical field of membrane, in particular to a kind of two-sided cured film of flexible conductive film.
Background technique
A kind of basis film photoelectric material of the transparent conductive film as low resistance and high transparency.It is widely used in band
Electric protecting film, antistatic coating, solar battery, display etc..For these solid materials, light transmittance and conduction
Rate is the attribute of conflict, and usual electric conductivity improves the decline that will lead to light transmittance, thus the transparent conductive film that can be commercialized
It is fewer.Transparent conductive film is with a wide range of applications and important research significance in fields such as the energy, information, national defence.?
Before the present invention occurs, such as capacitive touch screen, the substrate body of nano silver class conducting screen is main in the market for transparent conductive film
It is the cured film of PET, most exist in use can not be resistant to bending, and COP substrate is not during subsequent production
Pipe is that have fracture in coating waste water or ITO plated film process, is not able to satisfy the demand of high-end flexible touch screen equipment, only
In capable of being confined to, the application of low side touch panel device.
Summary of the invention
The main purpose of the present invention is to provide a kind of resistant to bending, the flexible conductive film of flexility can be improved with two-sided
Cured film.
Technical solution of the present invention:
The two-sided cured film of a kind of flexible conductive film, which is characterized in that including COP substrate layer and be coated on the COP
The hardened layer of substrate layer bilateral, the material of at least hardened layer of side include first coating composition, the first coating combination
Object includes following components based on mass fraction: silicon oxidation nanometer particle 5-40%；The compound 5- of the group containing active polymerisable
20%, the compound 20-80% containing multiple polymerizable unsaturated groups, photoinitiator 0.1-10%, solvent 10-30%.
Silicon oxidation nanometer particle is selected from zirconium oxide and Nano particles of silicon dioxide；The compound of the group containing active polymerisable selects
From hydroxyethyl methacrylate, the compound containing multiple polymerizable unsaturated groups be selected from three (methyl) acrylic acid trihydroxy methyls third
Ester, photoinitiator are selected from dimethyl benzil ketals, solvent is selected from toluene and methylisobutylketone.
The compound containing 1-3 active group is mainly used when selecting active unsaturated compound, and is selected and be free of benzene
Ring etc. hard sections compound, while by the dry thick range at 0.5-3.0 μm of the coating of regulation first coating composition, thus
This hardened layer is set to improve the bending resistance of COP substrate.
Preferably, the COP substrate layer is that transmitance is greater than 92%, cyclic olefin polymer film of the mist degree less than 0.1%,
With a thickness of 10-100 μm, preferably 20-60 μm.COP base material thickness, which thickens, will lead to cost and seriously increases.Preferred thickness is 20 μm
< thickness < 60 μm are the made zone of reasonableness fixed after having fully considered existing production status and production cost.
Preferably, the hardened layer with a thickness of 0.3-10 μm, preferably 0.5-3.0 μm.Thickness is lower than 0.3 μm, can lead
Cause HC layer it is excessively thin, the brittle purpose of improvement is not achieved, and thickness is more than 10 μm, then will lead to that production cost is excessively high and film is more crisp.
Preferably, the hardened layer further includes second coating composition, and the second coating composition is based on mass fraction
Include following components: 4-methyl-2 pentanone 45-55%, acrylate polymer 45-55%, 2,6- di-t-butyl are to methylbenzene
Phenol 0.2-1.0%, methylmethacrylate 0.2-1.0%.
Preferably, the hardened layer further includes third coating composition, and the third coating composition is based on mass fraction
Include following components: acrylic acid synthetic resin 45-55%, n-butyl acetate 30-40%, bis- uncle of ethyl acetate 5-15%, 2,6-
Butyl p-methyl phenol 0.2-1.0%, methylmethacrylate 0.2-1.0%.
Preferably, the mass ratio of the first coating composition and second coating composition is 100:n, 0 n≤100 <.
Preferably, the mass ratio of the first coating composition and third coating composition is 100:n, 0 n≤100 <.
Second coating composition or third coating composition is added, it can be with because the two does not contain any particle, after mixing
The particle content of mixture glue is reduced, so as to effectively improve transmitance, reduces mist degree.
Preferably, further include the supporting layer that the hardened layer side is set, the shrinking percentage of the supporting layer (TD MD to,
150 DEG C) less than 0.1%, to guarantee the positive and negative warpage of collocation post-production within 10mm.With a thickness of 10-500 μm, preferably
It is 20-200 μm.It is excessively thin that thickness lower than 10 μm will lead to substrate, and existing production technology is difficult to realize, and thickness is more than 500 μm
It can then cause winding difficult, meanwhile, because thickness, which thickens, will lead to material price rise.
Preferably, the material of the supporting layer is selected from PET or TAC or PC or PE or PP.
Preferably, the supporting layer is that tack supporting layer or the supporting layer are pasted by a glue-line and the hardened layer
It closes.The glue-line is parting compound adhesive.
The utility model has the advantages that
The present invention constructs the complex of COP two-sided hardening and PET protection film, makes it have easy processing application.It can be with
The bending resistance for removing to improve cop with first coating composition, can be effectively solved COP substrate rear road processing procedure regardless of
Be the technical issues of all fracture in coating waste water or ITO plated film process, at the same can be added improve cop transmitance,
The second coating composition or third coating composition of mist degree are reduced, respectively Reasonable Regulation And Control first coating composition and second coating
The ratio of composition or third coating composition obtains the two-sided cured film of high transmittance, low haze, this final two-sided hardening
The transmitance of film reaches 93% or more, and mist degree is lower than 0.1%, to be applied to the processing of flexible conductive film.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present invention, and of the invention shows
Examples and descriptions thereof are used to explain the present invention for meaning property, does not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 shows the structural schematic diagram of two-sided cured film of flexible conductive film described in the embodiment of the present invention 1；
Fig. 2 shows the structural schematic diagrams of two-sided cured film of flexible conductive film described in the embodiment of the present invention 2.
Wherein, 1, COP substrate layer, 2, hardened layer, 3, supporting layer, 4, glue-line
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
Embodiment 1
As shown in Figure 1, use high transmittance (>=92%), low haze (≤0.04%) 40 μ m-thicks COP as substrate
Layer 1 regulates and controls flexible improvement glue first coating composition using solvent PM (propylene glycol monomethyl ether), and concrete component is zirconium oxide and two
The nanoparticle 6% of siliconoxide mass ratio 3/1；The hydroxyethyl methacrylate 18% of the group containing active polymerisable, containing multiple
Compound three (methyl) the acrylic acid trihydroxy methyl propyl ester 64% of polymerizable unsaturated group, the contracting of photoinitiator dimethyl benzil
Ketone 0.5%, solvent toluene, methylisobutylketone mass ratio 1/1 mixed solvent 11.5%, Gu containing to 25%, to COP substrate layer
The one face hardened layer 2 of dry thick formation of 1.5 μm of coating, and it is bonded 125 μm of easily peelable PET supporting layers 3 online simultaneously, it is finally right
The dry thick 1.5 μm of formation another side hardened layers 2 of the same coating of 1 another side of COP substrate layer coating, it is final to obtain with supporting base material
Two-sided cured film.
Embodiment 2
As shown in Fig. 2, use high transmittance (>=92%), low haze (≤0.04%) 40 μ m-thicks COP as substrate
Layer 1；Controlling glue first coating composition/second coating composition quality ratio is 80/20 formation mixture glue, wherein first applies
Layer composition component is as follows: the nanoparticle 8% of zirconium oxide and zinc oxide mass ratio 3/1；The first of the group containing active polymerisable
Base hydroxy-ethyl acrylate 10%, compound three (methyl) acrylic acid trihydroxy methyl propyl ester containing multiple polymerizable unsaturated groups
70%, photoinitiator dimethyl benzil ketals 0.5%, solvent toluene, methylisobutylketone mass ratio 1/1 mixed solvent
11.5%；Second coating composition component is as follows: 4-methyl-2 pentanone 53%, acrylate polymer 46%, the tertiary fourth of 2,6- bis-
Base p-methyl phenol 0.5%, methylmethacrylate 0.5%.It is solid using solvent MIBK (methyl iso-butyl ketone (MIBK)) dilution mixture glue
Containing to 25%, 1.5 μm of one face hardened layer 2 of dry thick formation is coated with to COP substrate layer 1 using this mixture glue, and online simultaneously
125 μm of easily peelable PET supporting layers 3 are bonded, support layer 3 is bonded by glue-line 4 with hardened layer 2, finally another to COP substrate layer 1
Coated on one side is equally coated with dry thick 1.5 μm or so of mixture glue and forms another side hardened layer 2, and final obtain has supporting base material
Two-sided cured film.
Embodiment 3
As shown in Figure 1, use high transmittance (>=92%), low haze (≤0.04%) 40 μm of COP as substrate layer
1；Controlling glue first coating composition/third coating composition mass ratio is 80/20 formation mixture glue, wherein first coating
Composition component is as follows: the nanoparticle 6% of zirconium oxide and silica quality ratio 3/1；The first of the group containing active polymerisable
Base hydroxy-ethyl acrylate 18%, compound three (methyl) acrylic acid trihydroxy methyl propyl ester containing multiple polymerizable unsaturated groups
64%, photoinitiator dimethyl benzil ketals 0.5%, solvent toluene, methylisobutylketone mass ratio 1/1 mixed solvent
11.5%；Third coating composition component is as follows: acrylic acid synthetic resin 55%, n-butyl acetate 34%, ethyl acetate 10%,
2,6- di-tert-butyl methyl phenol 0.5%, methylmethacrylate 0.5%.Contained admittedly using solvent MIBK dilution mixture glue
25%, 1.5 μm of one face hardened layer 2 of dry thick formation is coated with to COP substrate layer using this mixture glue, and online fitting is easy simultaneously
125 μm of PET supporting layers 3 of removing, finally, being coated with dry thick 1.5 μm or so of the mixing of same coating to 1 another side of COP substrate layer
Glue forms another side hardened layer 2, final to obtain the two-sided cured film for having supporting base material.
The related property result such as following table of above three embodiments and commercially available general PET cured film, COP of the present invention are bis-
Face cured film has high transmission, the characteristic of low haze, and bending resistance is excellent, while AB performance also can be according to customer requirement tune
Control.It is such to be also convenient for later period client with support structure and be prepared into conductive film to the reprocessing of this cured film to provide just
Benefit.
So-called AB refers to the smoothness of glue application rear film, and coating rear film friction easily sliding is then to have AB,
Otherwise thin-film friction is puckery difficult to slide, there is no AB performance.The first coating composition itself is to have particle so there is AB
Property, but the introducing of second coating composition and third coating composition both resins, since ionic difference leads to AB
Property is also different, and second coating composition belongs to anionic type resin, causes particle in resin lower layer so do not have AB, third
Coating composition is the resin of cation type, and particle is enable to float on resin surface to have AB, so as to meet
The requirement of different clients.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of two-sided cured film of flexible conductive film, which is characterized in that including COP substrate layer and be coated on the COP base
The hardened layer of material layer bilateral, the material of at least hardened layer of side include first coating composition, the first coating composition
It based on mass fraction include following components: silicon oxidation nanometer particle 5-40%；The compound 5-20% of the group containing active polymerisable,
Compound 20-80%, photoinitiator 0.1-10%, solvent 10-30% containing multiple polymerizable unsaturated groups.
2. the two-sided cured film of flexible conductive film according to claim 1, which is characterized in that the COP substrate layer is
Rate is crossed greater than 92%, cyclic olefin polymer film of the mist degree less than 0.1%, with a thickness of 10-100 μm, preferably 20-60 μm.
3. the two-sided cured film of flexible conductive film according to claim 1, which is characterized in that the hardened layer with a thickness of
0.3-10 μm, preferably 0.5-3.0 μm.
4. the two-sided cured film of flexible conductive film according to claim 1, which is characterized in that the hardened layer further includes
Two coating compositions, the second coating composition includes following components based on mass fraction: 4-methyl-2 pentanone 45-55%,
Acrylate polymer 45-55%, 2,6- di-tert-butyl methyl phenol 0.2-1.0%, methylmethacrylate 0.2-1.0%.
5. the two-sided cured film of flexible conductive film according to claim 1, which is characterized in that the hardened layer further includes
Three coating composition, the third coating composition includes following components based on mass fraction: acrylic acid synthetic resin 45-
55%, n-butyl acetate 30-40%, ethyl acetate 5-15%, 2,6- di-tert-butyl methyl phenol 0.2-1.0%, isobutene
Sour methyl esters 0.2-1.0%.
6. the two-sided cured film of flexible conductive film according to claim 4, which is characterized in that the first coating composition
Mass ratio with second coating composition is 100:n, 0 n≤100 <.
7. the two-sided cured film of flexible conductive film according to claim 5, which is characterized in that the first coating composition
Mass ratio with third coating composition is 100:n, 0 n≤100 <.
8. the two-sided cured film of flexible conductive film according to claim 1, which is characterized in that further include being disposed therein one
A supporting layer of the hardened layer far from COP substrate layer side, the shrinking percentage of the supporting layer less than 0.1%, with a thickness of
10-500 μm, preferably 20-200 μm.
9. the two-sided cured film of flexible conductive film according to claim 1, which is characterized in that the material of the supporting layer selects
From PET or TAC or PC or PE or PP.
10. the two-sided cured film of flexible conductive film according to claim 8, which is characterized in that the supporting layer is self-adhesion
Property supporting layer or the supporting layer be bonded with the hardened layer by a glue-line.
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| CN201811159675.5A CN109486432A (en) | 2018-09-30 | 2018-09-30 | The two-sided cured film of flexible conductive film |
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Cited By (3)
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|---|---|---|---|---|
| CN111009338A (en) * | 2019-12-12 | 2020-04-14 | 湖南中天碧水膜科技有限公司 | Conducting film |
| CN111063480A (en) * | 2020-01-03 | 2020-04-24 | 湖南中天碧水膜科技有限公司 | Flexible low-resistance conductive film and preparation method thereof |
| TWI744985B (en) * | 2019-07-22 | 2021-11-01 | 日商柯尼卡美能達股份有限公司 | Laminated film and its manufacturing method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI744985B (en) * | 2019-07-22 | 2021-11-01 | 日商柯尼卡美能達股份有限公司 | Laminated film and its manufacturing method |
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| CN111063480A (en) * | 2020-01-03 | 2020-04-24 | 湖南中天碧水膜科技有限公司 | Flexible low-resistance conductive film and preparation method thereof |
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