CN109486346A - A kind of high temperature resistant sealer and the preparation method and application thereof - Google Patents
A kind of high temperature resistant sealer and the preparation method and application thereof Download PDFInfo
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- CN109486346A CN109486346A CN201811271765.3A CN201811271765A CN109486346A CN 109486346 A CN109486346 A CN 109486346A CN 201811271765 A CN201811271765 A CN 201811271765A CN 109486346 A CN109486346 A CN 109486346A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/47—Levelling agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/329—Phosphorus containing acids
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Abstract
The invention discloses a kind of high temperature resistant sealers and the preparation method and application thereof, belong to thermal protection coating field.The high temperature resistant sealer, raw material include following mass parts component: 100 parts of epoxy organosilicon varnish and 90-110 parts of amido silicon oil curing agent.The sealer is applied to aluminium packet aluminum oxide coating layer surface, can be obviously improved its salt spray corrosion resistance, and experience 192h alternation salt fog examination substrate does not corrode;In addition the sealer is applied to zirconia coating surface, its antioxygenic property can be improved, and after undergoing -1000 DEG C of thermal shocks three times of room temperature, zirconia coating is not fallen off still.
Description
Technical field
The present invention relates to a kind of epoxy organosilicon high temperature resistant sealer preparation method and applications, can be applied to ceramic base painting
Layer surface improves its anti-oxidant and anti-corrosion ability, belongs to thermal protection coating field.
Background technique
Ceramic base coating has the advantages such as high temperature resistant, binding force be strong, can be used as thermal barrier coating applied to metallic substrate surface,
Realize the thermal protection to substrate.However, ceramic base coating often has porous structure, under the environment such as salt fog, damp and hot, steam,
The small molecules such as inorganic salts are easy to infiltrate into substrate through the hole of ceramic base coating, make metal base that spot corrosion occur, to make
Decline at ceramic base coating and substrate part binding force.In addition, oxygen molecule can be applied through ceramic base under high temperature aerobic environment
The hole of layer, infiltrates into metallic substrate surface, so that substrate be made to aoxidize.
Organic capping agent has preferable levelability and permeability, can close the micropore of ceramic base coating surface, improves
Its Corrosion Protection.Traditional sealer uses epoxy resin or acrylic resin, although can achieve good sealing effect,
But epoxy resin is environment resistant poor, and marine environment is applied to when long can occur serious xanthochromia and dusting, seriously affects its closing
Effect.Although acrylic resin has preferable weatherability, temperature tolerance is poor, can not be applied to temperature and be higher than 500 DEG C
Hot environment.Currently, epoxy organosilicon should be difficult to apply to sealer field due to being difficult to solidify in 15 DEG C or less constructions.
Summary of the invention
Aiming at the problems existing in the prior art, the present invention provides a kind of high temperature resistant sealer and preparation method thereof with answer
With the sealer is applied to aluminium packet aluminum oxide coating layer surface, can be obviously improved its salt spray corrosion resistance, undergoes 192h alternation
Salt fog examination substrate does not corrode;In addition the sealer is applied to zirconia coating surface, its antioxygenic property can be improved, and undergoes room
After warm -1000 DEG C of thermal shocks three times, zirconia coating is not fallen off still.
For achieving the above object, the invention provides the following technical scheme:
A kind of high temperature resistant sealer, raw material include following mass parts component:
100 parts of epoxy organosilicon varnish and 90-110 parts of amido silicon oil curing agent.
In an alternative embodiment, the epoxy organosilicon varnish includes following mass parts component:
100 parts of epoxy silicone resin, 1.5-2.5 parts of polyphosphoric acid levelling agent, 1.5-2.5 parts of modified organic silicon levelling agent,
1.5-2.5 parts of UV light stabilizing agent, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent.
In an alternative embodiment, the preparation method of the epoxy silicone resin, comprising:
100 mass parts epoxy resin and 90-110 mass parts dimethylbenzene are mixed, dissolve 2-3h at 80-100 DEG C, then plus
Enter 35-45 mass parts silicone intermediate and 1-3 parts of isopropyl titanates, is warming up to 130-140 DEG C, reaction 4-5h to solution is clarified
It is transparent.
In an alternative embodiment, the molecular structure of the silicone intermediate is shown below:
Wherein, n=10-15.
In an alternative embodiment, the polyphosphoric acid levelling agent is the BYK358 of BYK company, Germany.
In an alternative embodiment, the modified organic silicon levelling agent is the BYK320 of BYK company, Germany.
In an alternative embodiment, the UV light stabilizing agent is the 220 of BYK company, Germany.
In an alternative embodiment, the visible light stabilizer is the 9061 of BYK company, Germany.
In an alternative embodiment, the solvent is in dimethylbenzene, butyl acetate, toluene, acetone or ethyl acetate
It is at least one.
In an alternative embodiment, the curing agent molecular structure such as following formula:
Wherein, n=9-14.
A kind of preparation method of high temperature resistant sealer, comprising the following steps:
(1) raw material is weighed according to the following ratio:
100 parts of epoxy organosilicon varnish and 90-110 parts of amido silicon oil curing agent;
(2) weighed raw material is mixed to get high temperature resistant sealer.
In an alternative embodiment, the epoxy organosilicon varnish, raw material includes following mass parts component:
100 parts of epoxy silicone resin, 1.5-2.5 parts of polyphosphoric acid levelling agent, 1.5-2.5 parts of modified organic silicon levelling agent,
1.5-2.5 parts of UV light stabilizing agent, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent.
In an alternative embodiment, varnish raw material is stirred 30 minutes in 400 turns/min or more revolving speed or more, obtain epoxy
Silicone varnish.
In an alternative embodiment, the preparation method of the epoxy silicone resin, comprising:
100 mass parts epoxy resin and 90-110 mass parts dimethylbenzene are mixed, dissolve 2-3h at 80-100 DEG C, then plus
Enter 35-45 mass parts silicone intermediate and 1-3 parts of isopropyl titanates, be warming up to 130-140 DEG C, 4-5h is reacted, until solution is clear
It is clear bright.
In an alternative embodiment, the molecular structure of the silicone intermediate is shown below:
Wherein, n=10-15.
In an alternative embodiment, in the solvent xylene, butyl acetate, toluene, acetone or ethyl acetate extremely
Few one kind.
In an alternative embodiment, the curing agent molecular structure such as following formula:
Wherein, n=9-14.
Application of the high temperature resistant sealer in ceramic base thermal barrier coating.
Compared with prior art, the present invention has the following advantages:
(1) high temperature resistant sealer provided in an embodiment of the present invention, using epoxy silicone resin as film forming agent, using ammonia
The rapid curing of 15 DEG C of following temperature is realized in base silicon oil solidifying agent;
(1) epoxy silicone resin and conventional epoxy organic siliconresin phase of method preparation provided in an embodiment of the present invention
Than under the premise of other basic performances are immovable, thermal weight loss is reduced to 60% at 600 DEG C, and toughness is improved to 52%, is avoided
Commercial epoxy organic siliconresin no longer has the problem of antiseptic property after 600 DEG C or more flame ablations;(2) novel resistance to height
Warm sealer is applied to aluminium packet aluminum oxide coating layer, after 1800 DEG C of ablation 5s, still has good salt spray corrosion resistance, experience
192h alternation salt fog examination substrate does not corrode.
(3) novel fire resistant sealer is applied to zirconia coating surface, its antioxygenic property can be improved, and undergoes room temperature-
After 1100 DEG C of thermal shocks three times, zirconia coating is not fallen off still.
Detailed description of the invention
Fig. 1 is the epoxy silicone resin sealer and epoxy resin sealing agent thermogravimetric curve figure that embodiment 1 provides;
Fig. 2 is aluminium oxide-epoxy organosilicon sealer coating system (left side) and aluminium oxide-tradition sealer in embodiment 1
After 1800 DEG C of 5s ablations of coating system (right side), experience 192h alternation salt fog examines post-etching situation map;
Fig. 3 is that zirconium oxide-epoxy organosilicon sealer system (left side) and single zirconia coating (right side) are undergone in embodiment 1
- 1100 DEG C of thermal shock test rear surface state diagrams of room temperature three times.
Specific embodiment
A specific embodiment of the invention is described in further details below with reference to the drawings and specific embodiments.
The embodiment of the invention provides a kind of high temperature resistant sealer, raw material includes following mass parts component:
100 parts of epoxy organosilicon varnish and 90-110 parts of amido silicon oil curing agent.
Specifically, in the embodiment of the present invention, epoxy organosilicon varnish is the transparent painting using epoxy silicone resin as matrix
Material;
High temperature resistant sealer provided in an embodiment of the present invention, using epoxy silicone resin as film forming agent, using amino
The rapid curing of 15 DEG C of following temperature is realized in silicon oil solidifying agent.
Wherein, the curing agent molecular structure is preferably as shown in formula (1):
Wherein, n=9-14.
In an alternative embodiment, the epoxy organosilicon varnish includes following mass parts component:
100 parts of epoxy silicone resin, 1.5-2.5 parts of polyphosphoric acid levelling agent, 1.5-2.5 parts of modified organic silicon levelling agent,
1.5-2.5 parts of UV light stabilizing agent, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent.
Wherein, the preparation method of the epoxy silicone resin, comprising:
100 mass parts epoxy resin and 90-110 mass parts dimethylbenzene are mixed, dissolve 2-3h at 80-100 DEG C, then plus
Enter 35-45 mass parts silicone intermediate and 1-3 parts of isopropyl titanates, be warming up to 130-140 DEG C, 4-5h is reacted, until solution is clear
It is clear bright.Shown in the molecular structure of the silicone intermediate such as formula (2):
Wherein, n=10-15.
The epoxy silicone resin of method preparation provided in an embodiment of the present invention has up to 600 DEG C or more of heat resistance
And the resistance to ultraviolet irradiation energy of up to 500h or more.
The BYK358 of the polyphosphoric acid levelling agent preferably BYK company, Germany;The modified organic silicon levelling agent is preferably German
The BYK320 of BYK company;The 220 of the UV light stabilizing agent preferably BYK company, Germany;The visible light stabilizer is preferably German
The 9061 of BYK company;At least one of the preferred dimethylbenzene of the solvent, butyl acetate, toluene, acetone or ethyl acetate.
The embodiment of the invention also provides a kind of preparation methods of high temperature resistant sealer, comprising the following steps:
(1) raw material is weighed according to the following ratio:
100 parts of epoxy organosilicon varnish and 90-110 parts of amido silicon oil curing agent;
(2) weighed raw material is mixed to get high temperature resistant sealer.
Specifically, the epoxy organosilicon varnish, raw material include following mass parts component:
100 parts of epoxy silicone resin, 1.5-2.5 parts of polyphosphoric acid levelling agent, 1.5-2.5 parts of modified organic silicon levelling agent,
1.5-2.5 parts of UV light stabilizing agent, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent.By varnish raw material 400 turns/
The stirring of min or more revolving speed 30 minutes or more, obtain epoxy organosilicon varnish.
The embodiment of the present invention is raw materials used the offer of above-mentioned raw materials embodiment, specifically describes and effect is referring to above-mentioned implementation
Example, details are not described herein.
The embodiment of the invention also provides application of the above-mentioned high temperature resistant sealer in ceramic base thermal barrier coating.
Capping reagent layer is formed in coating surface by processes such as spraying, brushing or roller coating, so that thermal barrier coating is passing through
After going through 1800 DEG C or more high temperature, still there is anti salt spray corrosion ability, alternation salt fog 192h can be resisted.
The following are specific embodiments of the present invention, raw materials are commercial product in each embodiment.
Embodiment 1
The embodiment of the invention provides a kind of high temperature resistant sealer, preparation method includes the following steps:
(1) 100g parts of Ba Ling petrochemical industry CYD011 epoxy resin are added into reaction kettle, 100g dimethylbenzene dissolves at 90 DEG C
3h, adding 40g silicone intermediate as shown in formula (2), (n=9-14 is bought from DOW CORNING DC6030), 2g metatitanic acid isopropyl
Ester is warming up to 130 DEG C, 4h is reacted, until solution clear, obtains epoxy silicone resin.
(2) by 100g epoxy silicone resin, 2gBYK358,2gBYK320,2g light stabilizer 9061,2g light stabilizer
Stirred tank is added in 220,100g dimethylbenzene, stirs 30min under 400 turns/min revolving speed, obtains epoxy organosilicon varnish.
(3) by epoxy organosilicon varnish 100g and structural formula, (n=9-14 is bought from road health the curing agent as shown in formula (1)
Peaceful 6040) 100g is uniformly mixed, and obtains sealer.
It is constructed more than aluminium packet aluminum oxide coating layer and zirconia coating surface, room temperature curing for 24 hours using brushing mode.
Attached drawing 1 is that the heat of epoxy organosilicon sealer provided in this embodiment and conventional epoxies sealer is lost after solidifying
Weight curve, after 600 DEG C, conventional epoxies are decomposed completely, and epoxy organosilicon sealer still has 40% quality retention rate.
After attached drawing 2 is the 1800 DEG C of 5s ablation of epoxy organosilicon sealer provided in this embodiment and traditional sealer experience,
Undergo the 192h alternation salt fog result of appraisal again, sealer provided in this embodiment still has an antiseptic property, and traditional sealer table
It has corroded in face.Attached drawing 3 is zirconium oxide-epoxy organosilicon sealer coating system and single zirconia coating experience room temperature-three times
1100 DEG C of thermal shock tests are as a result, single zirconia coating zirconia surface has disengaged from, zirconium oxide-epoxy organosilicon sealer coating
The zirconia coating of system is still intact.
Embodiment 2
The embodiment of the invention provides a kind of high temperature resistant sealer, preparation method includes the following steps:
It is added 100gg Ba Ling petrochemical industry CYD011 epoxy resin into reaction kettle, 90g dimethylbenzene dissolves 3h at 90 DEG C, then plus
Entering 35g silicone intermediate as shown in formula (2), (n=9-14, purchase heat up from DOW CORNING DC6030), 1g isopropyl titanate
To 130 DEG C, 4h is reacted, until solution clear, obtains epoxy silicone resin.
By 100g epoxy silicone resin, 1.5gBYK358,1.5gBYK320,1.5g light stabilizer 9061,1.5g light is steady
Determine agent 220,90g toluene is added stirred tank, stirs 30min under 400 turns/min revolving speed, prepare epoxy organosilicon varnish.
By epoxy organosilicon varnish 100g and structural formula, the curing agent as shown in formula (1) (buys from DOW CORNING 6040) 90g
It is uniformly mixed, obtains sealer.
It is constructed more than aluminium packet aluminum oxide coating layer and zirconia coating surface, room temperature curing for 24 hours using brushing mode.
After 600 DEG C, conventional epoxies are decomposed completely, and sealer prepared by embodiment 2 still has 38% quality to retain
Rate.
Embodiment 3
The embodiment of the invention provides a kind of high temperature resistant sealer, preparation method includes the following steps:
100gg Ba Ling petrochemical industry CYD011 epoxy resin is added into reaction kettle, 110g dimethylbenzene dissolves 3h at 90 DEG C, then
45g silicone intermediate is added, and (purchase is warming up to 130 DEG C from DOW CORNING DC6030), 3g isopropyl titanate, 4h is reacted, until molten
Liquid clear.
By 100g epoxy silicone resin, 2.5gBYK358,2.5gBYK320,2.5g light stabilizer 9061,2.5g light is steady
Determine agent 220,110g ethyl acetate is added stirred tank, stirs 30min under 400 turns/min revolving speed, prepare epoxy organosilicon varnish.
The curing agent 110g as shown in formula (1) (the buying from DOW CORNING 6040) by epoxy organosilicon varnish 100g and structural formula
It is uniformly mixed, is constructed more than aluminium packet aluminum oxide coating layer and zirconia coating surface, room temperature curing for 24 hours using brushing mode.
After 600 DEG C, conventional epoxies are decomposed completely, sealer prepared by embodiment 3, still have 42% quality to retain
Rate.The above, a specific embodiment only of the invention, but scope of protection of the present invention is not limited thereto, and it is any ripe
Know those skilled in the art in the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of, should all contain
Lid is within protection scope of the present invention.
Unspecified part of the present invention belongs to common sense well known to those skilled in the art.
Claims (18)
1. a kind of high temperature resistant sealer, which is characterized in that its raw material includes following mass parts component:
100 parts of epoxy organosilicon varnish and 90-110 parts of amido silicon oil curing agent.
2. a kind of high temperature resistant sealer according to claim 1, which is characterized in that the epoxy organosilicon varnish includes following
Mass parts component:
It is 100 parts of epoxy silicone resin, 1.5-2.5 parts of polyphosphoric acid levelling agent, 1.5-2.5 parts of modified organic silicon levelling agent, ultraviolet
1.5-2.5 parts of light stabilizer, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent.
3. a kind of high temperature resistant sealer according to claim 2, which is characterized in that the preparation side of the epoxy silicone resin
Method, comprising:
100 mass parts epoxy resin and 90-110 mass parts dimethylbenzene are mixed, 2-3h is dissolved at 80-100 DEG C, adds
35-45 mass parts silicone intermediate and 1-3 parts of isopropyl titanates are warming up to 130-140 DEG C, and reaction 4-5h is saturating to solution clarification
It is bright.
4. a kind of high temperature resistant sealer according to claim 3, which is characterized in that the molecular structure of the silicone intermediate
It is shown below:
Wherein, n=10-15.
5. a kind of high temperature resistant sealer according to claim 2, which is characterized in that the polyphosphoric acid levelling agent is Germany BYK
The BYK358 of company.
6. a kind of high temperature resistant sealer according to claim 2, which is characterized in that the modified organic silicon levelling agent is Germany
The BYK320 of BYK company.
7. a kind of high temperature resistant sealer according to claim 2, which is characterized in that the UV light stabilizing agent is Germany BYK
The 220 of company.
8. a kind of high temperature resistant sealer according to claim 2, which is characterized in that the visible light stabilizer is Germany BYK
The 9061 of company.
9. a kind of high temperature resistant sealer according to claim 2, which is characterized in that the solvent is dimethylbenzene, acetic acid fourth
At least one of ester, toluene, acetone or ethyl acetate.
10. a kind of high temperature resistant sealer according to claim 1, which is characterized in that the curing agent molecular structure such as following formula:
Wherein, n=9-14.
11. a kind of preparation method of high temperature resistant sealer, which comprises the following steps:
(1) raw material is weighed according to the following ratio:
100 parts of epoxy organosilicon varnish and 90-110 parts of amido silicon oil curing agent;
(2) weighed raw material is mixed to get high temperature resistant sealer.
12. a kind of preparation method of high temperature resistant sealer according to claim 11, which is characterized in that the epoxy organosilicon
Varnish, raw material include following mass parts component:
It is 100 parts of epoxy silicone resin, 1.5-2.5 parts of polyphosphoric acid levelling agent, 1.5-2.5 parts of modified organic silicon levelling agent, ultraviolet
1.5-2.5 parts of light stabilizer, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent.
13. a kind of preparation method of high temperature resistant sealer according to claim 12, which is characterized in that varnish raw material exists
The stirring of 400 turns/min or more revolving speed 30 minutes or more, obtain epoxy organosilicon varnish.
14. a kind of preparation method of high temperature resistant sealer according to claim 12, which is characterized in that the epoxy organosilicon
The preparation method of resin, comprising:
100 mass parts epoxy resin and 90-110 mass parts dimethylbenzene are mixed, 2-3h is dissolved at 80-100 DEG C, adds
35-45 mass parts silicone intermediate and 1-3 parts of isopropyl titanates are warming up to 130-140 DEG C, react 4-5h, until solution is clarified
It is transparent.
15. 4 a kind of preparation method of high temperature resistant sealer according to claim 1, which is characterized in that among the organosilicon
The molecular structure of body is shown below:
Wherein, n=10-15.
16. a kind of preparation method of high temperature resistant sealer according to claim 12, which is characterized in that the solvent diformazan
At least one of benzene, butyl acetate, toluene, acetone or ethyl acetate.
17. a kind of preparation method of high temperature resistant sealer according to claim 11, which is characterized in that the solidification agent molecule
Structure such as following formula:
Wherein, n=9-14.
18. application of the described in any item high temperature resistant sealers of claim 1-10 in ceramic base thermal barrier coating.
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CN114892158A (en) * | 2022-03-25 | 2022-08-12 | 温州安能科技有限公司 | Method for plating corrosion-resistant low-resistance nano film on surface of aluminum alloy |
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