CN109474818A - A kind of imaging sensor and imaging modules - Google Patents
A kind of imaging sensor and imaging modules Download PDFInfo
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- CN109474818A CN109474818A CN201910005682.8A CN201910005682A CN109474818A CN 109474818 A CN109474818 A CN 109474818A CN 201910005682 A CN201910005682 A CN 201910005682A CN 109474818 A CN109474818 A CN 109474818A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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Abstract
This application involves technical field of image processing, providing a kind of imaging sensor and imaging modules, imaging sensor includes diffraction grid component and photosensory assembly;Diffraction grid component includes at least one diffraction grating;Photosensory assembly includes multiple photosensitive pixels, and photosensitive pixel is set to the light emission side of diffraction grating, for obtaining the light wave through diffraction grating diffraction;Diffraction grating includes grating substrate and multiple the first annulus and the second annulus being arranged concentrically, and the first annulus and the second annulus are set on grating substrate;First annulus is made of first medium, and the second annulus is made of second medium, and one second annulus, the refractive index difference of the first annulus and the second annulus are equipped between adjacent two first annulus;It realizes and 3D imaging is realized by an imaging sensor, reduce the manufacture difficulty and cost of manufacture of diffraction grating, can effectively control production precision, improve diffraction grating quality.
Description
Technical field
This application involves technical field of image processing, are to be related to a kind of imaging sensor and imaging mould more specifically
Group.
Background technique
With the development of science and technology, 3D imaging technique comes into consumer electronics field, brings for people and preferably take pictures
Experience.3D imaging technique not only has the ability that 2D imaging is carried out to target object, but also can obtain the depth of target object
Information can further realize the functions such as 3D scanning, scene modeling, gesture interaction according to depth information.At present the 3D of mainstream at
As technical solution includes depth camera scheme and multi-cam scheme.
Depth camera scheme mainly includes structure light scheme and flight time scheme (TOF), wherein the core of structure light
Component includes infrared light emission mould group and imaging modules, and infrared light emission mould group projects the structure light figure by coding to space
Case light beam, the pattern beam are received after target object reflects by imaging modules, can be obtained object according to corresponding algorithm
The depth information of body.The core component of depth camera based on time flight method principle (ToF) also projective module group and imaging modules,
For emitting the light beam through ovennodulation, which is received after target object reflects by imaging modules projective module group at this time, imaging
Mould group can obtain the flight time of light beam in space by demodulation, and then calculate the distance of corresponding target object.It is more
Camera scheme is to increase the quantity of camera in camera module, obtains image by way of multiple cameras
Depth information.
However, being required to just be able to achieve by the way of multiple cameras to object in above-mentioned 3D imaging technique scheme
The acquisition of body depth information, such as in depth camera scheme, it is seen that light image and infrared light image are using two camera lens difference
It obtains, will lead to the collected visible images of depth camera and infrared light image with parallax, to influence to obtain object
The accuracy of body depth information.Meanwhile the volume and weight of camera module can be dramatically increased using multiple cameras, it is unfavorable for
The miniaturization of camera module.
Summary of the invention
The application's is designed to provide a kind of imaging sensor, is needed with solving existing 3D imaging using multiple cameras
The technical issues of.
To achieve the above object, the application the technical solution adopted is that: a kind of imaging sensor, including diffraction grating are provided
Component and photosensory assembly;
The diffraction grid component includes at least one diffraction grating;
The diffraction grating includes grating substrate and multiple the first annulus and the second annulus being arranged concentrically, and described first
Annulus and second annulus are set on the grating substrate;
First annulus is made of first medium, and second annulus is made of second medium, and adjacent two described first
Second annulus is equipped between annulus, first annulus is different with the refractive index of second annulus;
The photosensory assembly includes multiple photosensitive pixels, and the photosensitive pixel is set to the light emission side of the diffraction grating, is used
In light wave of the acquisition through the diffraction grating diffraction.
In one embodiment, the diffraction grating be transmission grating, the photosensory assembly be set to the grating substrate with
The opposite side of first annulus.
In one embodiment, the width ratio of the width of first annulus and second annulus is 2/3~3/2.
In one embodiment, the sum of width of the width of first annulus and second annulus is 1 micron~20
Micron;
The sum of width of the width of first annulus and second annulus is not less than the two adjacent photosensitive pixels
Spacing between center.
In one embodiment, the height of grating substrate described in the distance from top of second annulus is 0.2 micron~1 micro-
Rice.
In one embodiment, the first medium is air or silica or glass or organic material.
In one embodiment, described image sensor further includes filtering assembly;
The filtering assembly includes optical filter, and the optical filter is set between the diffraction grating and the photosensitive pixel.
In one embodiment, the filtering assembly includes Red lightscreening plate, green color filter and blue color filter;
Alternatively, the filtering assembly includes Red lightscreening plate, white filter and blue color filter;
Alternatively, the filtering assembly includes Red lightscreening plate, green color filter, blue color filter and white filter;
Alternatively, the filtering assembly includes Red lightscreening plate, green color filter, blue color filter and infrared fileter;
Alternatively, the filtering assembly includes infrared fileter.
In one embodiment, described image sensor further includes lenticule component;
The lenticule component includes lenticule, the lenticule be set to the diffraction grating and the photosensitive pixel it
Between.
The purpose of the application, which also resides in, provides a kind of imaging modules, including above-mentioned imaging sensor and lens subassembly;
The lens subassembly enters on light path set on the diffraction grid component, described for focusing to incident light wave
Diffraction grid component.
A kind of beneficial effect of imaging sensor provided by the present application is:
(1) by the way that diffraction grating is arranged on light path in entering for photosensory assembly, incident light wave shape after diffraction grating diffraction
At diffraction light wave, diffraction light wave is re-shoot to photosensitive pixel, thus photosensitive pixel obtain image information for the later period into
When row image procossing, 2D image and depth information can be obtained simultaneously, realize and 3D imaging is realized by an imaging sensor.
On the one hand, it since 2D image and depth information are realized by an imaging sensor, effectively prevents using two mirrors
The problem of parallax experienced that head is imaged respectively effectively increases the accuracy for obtaining depth information, improves 3D image quality.On the other hand,
2D image is obtained simultaneously using an imaging sensor and the volume and again of camera module can be effectively reduced in depth information
Amount, is conducive to the miniaturization and lightweight of camera module, has boundless application prospect.
(2) conventional diffractive grating is mostly the strip form at array arrangement, and striped arrangement can be transverse direction, longitudinal direction or transverse and longitudinal
Staggeredly, the complex manufacturing technology of diffraction grating when being arranged using aforesaid way, cost of manufacture is high, is unfavorable for being given birth on a large scale
It produces.And the first medium of diffraction grating and second medium are arranged by way of concentric loop in the present embodiment, it can be very big
The manufacture difficulty and cost of manufacture of diffraction grating are reduced, while can also effectively control production precision in production, helps to mention
The quality of high diffraction grating.Meanwhile when diffraction grating multiple in diffraction grid component are arranged into array of diffraction gratings, due to
The symmetry of diffraction grating is high, therefore more convenient in arrangement.
Detailed description of the invention
It in order to more clearly explain the technical solutions in the embodiments of the present application, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only some of the application
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is a kind of overlooking structure diagram of imaging sensor provided by the embodiments of the present application;
Fig. 2 is a kind of overlooking structure diagram of diffraction grating in imaging sensor provided by the embodiments of the present application;
Fig. 3 is the configuration schematic diagram in the first section of imaging sensor provided by the embodiments of the present application;
Fig. 4 is another overlooking structure diagram of imaging sensor provided by the embodiments of the present application;
Fig. 5 is the overlooking structure diagram of another diffraction grating in imaging sensor provided by the embodiments of the present application;
Fig. 6 is second of cross section structure schematic diagram of imaging sensor provided by the embodiments of the present application;
Fig. 7 is the configuration schematic diagram in second of section of imaging sensor provided by the embodiments of the present application;
Fig. 8 is the third cross section structure schematic diagram of imaging sensor provided by the embodiments of the present application;
Fig. 9 is a kind of structural schematic diagram of filtering assembly in imaging sensor provided by the embodiments of the present application;
Figure 10 is another structural schematic diagram of filtering assembly in imaging sensor provided by the embodiments of the present application;
Figure 11 is the 4th kind of cross section structure schematic diagram of imaging sensor provided by the embodiments of the present application;
Figure 12 is the 5th kind of cross section structure schematic diagram of imaging sensor provided by the embodiments of the present application;
Figure 13 is the 6th kind of cross section structure schematic diagram of imaging sensor provided by the embodiments of the present application;
Figure 14 is the structural schematic diagram one of imaging modules provided by the embodiments of the present application;
Figure 15 is the structural schematic diagram two of imaging modules provided by the embodiments of the present application.
Wherein, each appended drawing reference in figure:
11- incident light wave;12- diffraction light wave;
20- imaging sensor;21- diffraction grid component;
210- diffraction grating;211- grating substrate;
The first annulus of 212-;The second annulus of 213-;
22- photosensory assembly;220- photosensitive pixel;
23- filtering assembly;230- optical filter;
24- lenticule component;240- lenticule;
30- lens subassembly;40- filter coating.
Specific embodiment
In order to which technical problems to be solved in this application, technical solution and beneficial effect is more clearly understood, tie below
Accompanying drawings and embodiments are closed, the application is further elaborated.It should be appreciated that specific embodiment described herein is only used
To explain the application, it is not used to limit the application.Term " first ", " second " are used merely to facilitate description purpose, and cannot manage
Solution is indication or suggestion relative importance or the quantity for implicitly indicating technical characteristic.When a component referred to as " is connected to " separately
One component, it, which can be, is directly or indirectly connected on another component.When component is referred to as " being fixed on " or " setting
In " another component, it can directly or indirectly be located on another component.Term " on ", "lower", "left", "right",
The orientation or position of the instructions such as "front", "rear" are orientation based on the figure or position, are merely for convenience of describing, Bu Nengli
Solution is the limitation to the technical program.
It please refers to Fig.1 to Fig.3, a kind of imaging sensor 20, including diffraction grid component 21 and photosensory assembly 22;Diffraction light
Grid component 21 includes at least one diffraction grating 210, and diffraction grating 210 is used to carry out diffraction to incident light wave 11;Photosensory assembly
22 include multiple photosensitive pixels 220, and photosensitive pixel 220 is set to the light emission side of diffraction grating 210, for obtaining through diffraction grating
The light wave of 210 diffraction.Wherein, diffraction grating 210 includes grating substrate 211 and multiple 212 Hes of the first annulus being arranged concentrically
Second annulus 213, the first annulus 212 and the second annulus 213 are set on grating substrate 211.First annulus 212 is by first medium
It is made, the second annulus 213 is made of second medium, and one second annulus 213, the first circle are equipped between adjacent two first annulus 212
Ring 212 is different with the refractive index of the second annulus 213.
Referring to Fig. 2, in one embodiment, the quantity of diffraction grating 210 is one, and each diffraction grating 210 is corresponding
Equipped with multiple photosensitive pixels 220.Since diffraction grating 210 is rounded, the diametrical direction along diffraction grating 210 is diffraction
The grating axis of grating 210.The first adjacent annulus 212 and the second annulus 213 constitute a screen periods in diffraction grating 210
L0, incident light wave 11 are incident to diffraction grating 210, and diffraction light wave 12, diffraction light wave 12 are obtained after 210 diffraction of diffraction grating
It is emitted to from photosensitive pixel 220 from diffraction grating 210, photosensitive pixel 220 obtains the diffraction light wave 12.
Referring to Fig. 1, in one embodiment, diffraction grid component 21 includes into the diffraction grating 210 of array arrangement, together
When photosensory assembly 22 in multiple photosensitive pixels 220 at array arrangement, at the photosensitive pixel 220 and diffraction grating 210 of array arrangement
Array arrangement be adapted, so as to effectively receive the diffraction light wave 12 being emitted through diffraction grating 210.
It, can cut-through when light wave encounters opaque or transparent barrier or aperture (narrow slit) in propagation path
Object generates and deviates straightline propagation, and this phenomenon is referred to as the diffraction of light.It can be generated in barrier or aperture rear light and dark
Striped or the ring of light, as diffraction pattern.When having the object of periodical transmittance function with plane wave illumination one, meeting exists
The image of the periodic function is reappeared after the object on certain specific ranges, this phenomenon is exactly Talbot effect (Talbot
Effect)。
For example, at 210 rear of diffraction grating and diffraction grating 210 at a distance of Z=nZTThe distance of (n is the integer not less than 0)
Place, it can be observed that image identical with diffraction grating 210;At 210 rear of diffraction grating and diffraction grating 210 at a distance of Z=
[(2n+1)/4]ZTAt the distance of (n is the integer not less than 0), it can be observed that (that observes spreads out frequency multiplication grating image herein
The screen periods of grating 210 are penetrated as former screen periods L0Half);At 210 rear of diffraction grating and diffraction grating 210 at a distance of Z
=[(2n+1)/2] ZTAt the distance of (n is the integer not less than 0), it can be observed that the grating image (grating reappeared of reverse phase
As being staggered half of fringe period with former diffraction grating 210);In the other positions at 210 rear of diffraction grating, observed figure
As being fresnel diffraction picture.
According to the incident intensity of incident light wave 11 and the difference of incidence angle, talbot of the diffraction grating 210 in selection
Depth Z=nZTBe formed by also can be different from imaging for position.Therefore by diffraction grating 210 in talbot's depth Z=
nZTPosition be formed by from imaging analysis, so as to the anti-incidence angle and incident intensity for releasing incident light wave 11, Jin Erke
To be positioned according to Talbot effect to incident light wave 11, the optical component additional without other.
In the present embodiment, after the image information of the acquisition of photosensitive pixel 220 diffraction light wave 12, subsequent processing can be carried out.
For example, the image information that photosensitive pixel 220 obtains diffraction light wave 12 is original signal;Original signal carries out high through initial filter
Frequency filtering and middle low frequency filtering, the part signal of High frequency filter can be used for obtaining depth information, the part letter of middle low frequency filtering
It number can be used for carrying out two-dimensional imaging, finally again merge depth information with the image of two-dimensional imaging, obtaining has depth
The image of information.Therefore, imaging sensor 20 provided in this embodiment provides raw image data for subsequent image procossing,
It helps to realize and 3D imaging can be realized using an imaging modules.
The beneficial effect of imaging sensor 20 provided in this embodiment at least that:
(1) by entering setting diffraction grating 210 on light path in photosensory assembly 22, incident light wave 11 is through diffraction grating 21
Diffraction light wave 12 is formed after diffraction, diffraction light wave 12, which reenters, to be incident upon at photosensitive pixel 220, thus the figure that photosensitive pixel 220 obtains
Picture information can obtain 2D image and depth information when carrying out image procossing for the later period simultaneously, realize and schemed by one
As sensor 20 realizes 3D imaging.On the one hand, since 2D image and depth information are realized by an imaging sensor 20
, the problem of parallax experienced being imaged respectively using two camera lenses is effectively prevented, the accuracy for obtaining depth information is effectively increased, changes
Kind 3D image quality.On the other hand, 2D image is obtained simultaneously using an imaging sensor 20 and depth information can be effective
The volume and weight for reducing camera module, is conducive to the miniaturization and lightweight of camera module, has boundless answer
Use prospect.
(2) conventional diffractive grating is mostly the strip form at array arrangement, and striped arrangement can be transverse direction, longitudinal direction or transverse and longitudinal
Staggeredly, the complex manufacturing technology of diffraction grating 210 when being arranged using aforesaid way, cost of manufacture is high, is unfavorable for being advised greatly
Mould production.And the first medium of diffraction grating 210 and second medium are arranged by way of concentric loop in the present embodiment,
The manufacture difficulty and cost of manufacture of diffraction grating 210 can be greatly reduced, while can also effectively control production precision in production,
Help to improve the quality of diffraction grating 210.Meanwhile spreading out being arranged into diffraction grating 210 multiple in diffraction grid component 22
It is more convenient in arrangement since the symmetry of diffraction grating 210 is high when penetrating grating array.
Fig. 3 and Fig. 6 are please referred to, in one embodiment, diffraction grating 210 is transmission grating, and photosensory assembly 22 is set to light
The side opposite with the first annulus 212 of grid base bottom 211.Incident light wave 11 forms diffraction light wave after being incident to diffraction grating 210
12, diffraction light wave 12 is emitted from grating substrate 211, is connect so as to be located at the photosensitive pixel 220 of 211 side of grating substrate
It receives.Diffraction grating 210 is made of the material for allowing incident light wave 11 to transmit at this time, such as can be silica (SiO2)、
Glass, organic material (such as ethylene terephthalate, polypropylene, polyvinyl chloride) etc..Certainly, according to diffraction grating 210
Application scenarios are different, and the wave-length coverage for the light wave that diffraction grating 210 allows to penetrate can be different.For example, for ultraviolet light and
Speech, diffraction grating 210 allow the optical wavelength passed through can be for less than 400nm;For visible light, diffraction grating 210
Allow by optical wavelength range can be 400nm~800nm;For infrared light, diffraction grating 210 allows to pass through
Optical wavelength range can be 800nm~1500m.It therefore, can be by diffraction for the imaging of visible-range
The selection of 210 material of grating, at least so that the light wave of wave-length coverage 400nm~800nm can penetrate diffraction grating 210.
Fig. 3 and Fig. 6 are please referred to, in one embodiment, diffraction grating 210 is phase grating, by using different Jie
Material makes the first annulus 212 and the second annulus 213, so as to forming two phase gratings.Optionally, first is made
The first medium of annulus 212 is air, and the material of the second annulus 213 is identical as the material of grating substrate 210, the second annulus 213
It is integrally formed with grating substrate 211, at this time the cross sectional shape of diffraction grating 210 are as follows: periodic arrangement is equipped on grating substrate 211
Protrusion, be groove between adjacent protrusion, adjacent protrusion and groove constitute a screen periods L0.And diffraction grating 210
The shape of top view is then are as follows: multiple second annulus 213 are arranged concentrically, spaced apart between adjacent two second annulus 213.When
So, the first annulus 212 can also be made of other materials, be equivalent in the groove between adjacent protrusion and filled by difference at this time
First annulus 212 made of the material of the second annulus 213.
Referring to Fig. 7, in one embodiment, the width of the first annulus 211 is L1, and the width of the second annulus is L2, spread out
The screen periods L0 for penetrating grating 210 is then L1+L2.The width ratio L1:L2 of first annulus 212 and the second annulus 213 be 2/3~
3/2.The medium for considering the first annulus 212 is air, and the duty ratio of diffraction grating 210 is 40%~60% at this time, such as diffraction
The duty ratio of grating 210 can be 50%, and the width L1 of the first annulus 212 is identical as the width L2 of the second annulus 213 at this time.When
So, the duty ratio of diffraction grating 210 can also be the 40% (width of the width L1 of the first annulus 212 and the second annulus 213 at this time
L2 ratio L1:L2=3:2), 60% (the width L2 ratio L1:L2 of the width L1 of the first annulus 212 and the second annulus 213 at this time
=2:3) etc. other values, herein with no restrictions.
It please refers to Fig. 4 to Fig. 7 in one embodiment, considers that the medium of the first annulus 212 is air.Second annulus 213
Distance from top grating substrate 211 height be 0.2 micron~1 micron, at this time between 210 protrusions of diffraction grating and groove
Optical path difference is the height value of the second annulus 213, so that being incident to the incident light wave of diffraction grating 210 in protrusion and groove
Place has above-mentioned preset optical path difference.Different according to the wavelength of incident light wave, the height of the second annulus 213 can also be different, can
Selection of land, the height of the second annulus 213 can be the half-wavelength of incident light wave.For example, when the wavelength of incident light wave is 500nm, the
The height of two annulus 213 can be 250nm (i.e. 0.25 micron).Certainly, the height of the second annulus 213 may be other values,
It is not limited in above-mentioned situation, herein with no restrictions.
Referring to Fig. 7, in one embodiment, the screen periods L0 of diffraction grating 210 can be 1 micron~20 microns, from
And ensure incident light wave 11 by that can transmit from diffraction grating 210 when diffraction grating 210.The feelings for being 50% for duty ratio
For condition, when the screen periods L0 of diffraction grating 210 is 1 micron, the width L1 of the first annulus 212 and the second annulus 213
Width L2 is then 500nm.Certainly, screen periods L0, which can according to need, is configured, herein with no restrictions.
Referring to Fig. 7, in one embodiment, the distance between neighboring photosensitive pixel 220 L3 is little in photosensory assembly 22
In the screen periods L0 of diffraction grating 210, according to the difference of the distance between neighboring photosensitive pixel 220 L3, a screen periods
The quantity of the corresponding photosensitive pixel 220 of L0 also can be different.For example, when the distance between neighboring photosensitive pixel 220 L3 is equal to grating
When period L 0, a screen periods L0 can completely correspond to a photosensitive pixel 220 in the direction of the width, can also be two neighboring
The half of each photosensitive pixel 220 corresponds to a screen periods L0 in photosensitive pixel 220, is also possible to pair of other forms
It answers.When the distance between neighboring photosensitive pixel 220 L3 is the half of screen periods L0, screen periods in the direction of the width
L0 then corresponds to two photosensitive pixels 220.
In one embodiment, photosensory assembly 22 can be CMOS (Complementary Metal Oxide
Semiconductor, complementary metal oxide semiconductor) imaging sensor or CCD (Charge-coupled Device, charge
Coupling element) imaging sensor, photosensitive pixel 220 can be into the optical sensor of array arrangement at this time, spread out so as to receive
Light wave 12 is penetrated, and diffraction light wave 12 generates corresponding signal based on the received.The size of photosensitive pixel 220 also can according to need
It is selected, herein with no restrictions.Certainly, photosensory assembly 22 is also possible to other kinds of photosensor array, and not only limits
In above-mentioned situation.
In one embodiment, incident light wave 11 be monochromatic wave, i.e., incident light wave 11 only include a kind of wavelength light beam, this
When eventually arrive at each photosensitive pixel 220 in photosensory assembly 22 diffraction light wave 12 only have a kind of wavelength.
Referring to Fig. 8, in one embodiment, incident light wave 11 is nonmonochromatic wave, that is, it include the light wave of multi-wavelength, this
When the diffraction light wave 12 that is formed after diffraction grating 210 of incident light wave 11 also include multi-wavelength, in order to ensure reaching each sense
The diffraction light wave 12 of light pixel 220 only has a kind of wavelength, needs that filtering assembly 23 is arranged in imaging sensor 20.Filtering assembly
23 include multiple optical filters 230, and optical filter 230 is set between diffraction grating 210 and photosensitive pixel 220, to play optical filtering
Effect.
The type of optical filter 230, which can according to need, to be configured.
In one embodiment, multiple optical filters 230 can be same optical filter in filtering assembly 23, can pass through
Optical wavelength range it is identical, such as optical filter 23 (can allow for Red lightscreening plate (allow feux rouges pass through), green color filter
Optical filtering passes through) or blue color filter (blue light is allowed to pass through), optical filter 230, which can play, at this time selects a kind of light wave
The effect selected.
In one embodiment, the type of multiple optical filters 230 may include a variety of, and a variety of optical filterings in filtering assembly 23
Piece 230 is arranged according to default pattern.Referring to Fig. 9, such as filtering assembly 23 includes Red lightscreening plate (R), green filter
Piece (G) and blue color filter (B), three kinds of optical filters can carry out periodic arrangement according to the requirement of Bayer array.To filter
For component 23 is according to square arrangement, it is successively arranged the green color filter (G) and red filter of period arrangement in one direction
Piece (R) is successively arranged the green color filter (G) and blue color filter (B) of period arrangement, to realize that optical filtering is wanted in another direction
It asks.
Referring to Fig. 10, for another example, filtering assembly 23 includes Red lightscreening plate (R), white filter (W) and blue filter
Piece (B), the requirement that three kinds of optical filters are referred to Bayer array carries out periodic arrangement, with filtering assembly 23 according to square arrangement
For, be successively arranged in one direction the period arrangement white filter (W) and Red lightscreening plate (R), in another direction according to
Secondary white filter (W) and blue color filter (B) equipped with period arrangement, realizes the requirement that filters, effectively improves brightness of image, from
And improve the quality of image procossing under half-light scene.
For another example, filtering assembly 23 may include Red lightscreening plate (R), green color filter (G), blue color filter (B) and
White filter (W), four kinds of optical filters can carry out periodic arrangement according to the requirement of Bayer array.With filtering assembly 23 according to
For square arrangement, it is successively arranged the green color filter (G) and Red lightscreening plate (R) of period arrangement in one direction, along another
One direction is successively arranged the white filter (W) and blue color filter (B) of period arrangement, to realize that optical filtering requires, improves picture
Face brightness, picture are more fully apparent from.
For another example, filtering assembly 23 may include Red lightscreening plate (R), green color filter (G), blue color filter (B) and
Infrared fileter (IR), photosensitive pixel 220 corresponding with infrared fileter corresponds to infrared photosensitive pixel at this time, so as to structure
At RGB-IR imaging sensor, infrared light is obtained while obtaining visible light, there are wider application scenarios.
For another example, filtering assembly 23 can only include infrared fileter (IR), and photosensitive pixel 220 is infrared light-sensitive image at this time
Element, imaging sensor can be infrared image sensor.
Certainly, in other embodiments, the type of optical filter 230 and arrangement mode may be it in filtering assembly 23
His form, is not limited in above-mentioned situation.
In one embodiment, the size of optical filter 230 is corresponding with the size of photosensitive pixel 220 in filtering assembly 23,
That is the corresponding photosensitive pixel 220 of an optical filter 230, so that it is guaranteed that the optical wavelength for reaching each photosensitive pixel 220 is pair
Answer optical filter 230 allow by optical wavelength.Certainly, in other embodiments, optical filter 230 and photosensitive pixel 220
Size may be other situations, such as optical filter 230 and photosensitive pixel 220 are rectangle, and optical filter 230 mutually hangs down two
Histogram to size be 220 corresponding direction size of photosensitive pixel integral multiple (such as 2 times, 3 times, 4 times etc.), optical filter at this time
230 corresponding multiple photosensitive pixels 220.
Figure 11 is please referred to, in one embodiment, imaging sensor 20 further includes lenticule component 24, lenticule component 24
Including multiple lenticules 240, lenticule 240 is set between diffraction grating 210 and photosensitive pixel 220.Multiple lenticules 240 are at battle array
Column arrangement, and its arrangement form is corresponding with the arrangement form of photosensitive pixel 220, it is ensured that each photosensitive pixel 220 is correspondingly provided with
One lenticule 240, the lenticule 240 can focus to diffraction light wave 12 on corresponding photosensitive pixel 220, improve imaging effect
Fruit.
Figure 12 and Figure 13 are please referred to, in one embodiment, imaging sensor 20 includes diffraction grid component 21, optical filtering group
Part 23, lenticule component 24 and photosensory assembly 22.Wherein diffraction grid component 21 includes multiple diffraction lights being arranged in array
Grid 210;Photosensory assembly 22 includes multiple photosensitive pixels 220 being arranged in array;Filtering assembly 23 includes multiple is arranged in array
Optical filter 230, and the corresponding photosensitive pixel 220 of each optical filter 230;Lenticule component 24 includes multiple lenticules 240,
The corresponding photosensitive pixel 220 of each lenticule 240.Optical filter 230 can be set to the surface (please referring to Fig. 7) of lenticule 240,
It can be set to and (please refer to Fig. 8) between lenticule 240 and photosensitive pixel 220.
Figure 14 is please referred to, the purpose of the present embodiment, which also resides in, provides a kind of imaging modules, including above-mentioned imaging sensor
20 and lens subassembly 30, lens subassembly 30 is set to the entering on light path of diffraction grid component 21, for gathering incident light wave 11
Coke is to diffraction grid component 21.Lens subassembly 30 may include a collector lens, also may include multiple collector lenses, herein
With no restrictions, as long as focusing light effect can be played to incident light wave 11, herein with no restrictions.
In one embodiment, imaging modules can be camera module, which can apply mobile whole
In end, so that 2D image and depth information can be obtained by a camera module simultaneously by realizing, 3D imaging is realized.Certainly,
Imaging modules have a wide range of applications field, such as can be used for background blurring, three-dimensional reconstruction, visual token, gesture identification etc.,
Herein with no restrictions.
Figure 15 is please referred to, in one embodiment, filter coating 40 is additionally provided between lens subassembly 30 and imaging sensor 20,
The filter coating 40 can be used for filtering unwanted veiling glare in incident light wave 11, avoid its reach imaging sensor 20 and to diffraction light
Grid 210 have an impact, and facilitate the diffracting effect for improving diffraction grating 210.Such as filter coating 40 can be visible light filter coating,
It can permit visible light and passes through, and filter out the light wave of other wave-length coverages.Certainly, filter coating 40 can be also used for filtering it
The light wave of all band is not limited in above-mentioned situation.
The beneficial effects of imaging modules provided in this embodiment at least that:
(1) diffraction grating 210 is arranged in entering for photosensory assembly 22 in imaging sensor 20 on light path, and incident light wave 11 is through spreading out
Diffraction light wave 12 is formed after penetrating 21 diffraction of grating, diffraction light wave 12, which reenters, to be incident upon at photosensitive pixel 220, thus photosensitive pixel 220
The image information of acquisition can obtain 2D image and depth information simultaneously, realize logical when carrying out image procossing for the later period
It crosses an imaging sensor 20 and realizes 3D imaging.On the one hand, since 2D image and depth information are by an imaging sensor
20 come what is realized, effectively prevents the problem of parallax experienced being imaged respectively using two camera lenses, effectively increases and obtains depth information
Accuracy improves 3D image quality.On the other hand, 2D image and depth information are obtained using an imaging sensor 20 simultaneously
The volume and weight that imaging modules can be effectively reduced is conducive to the miniaturization and lightweight of imaging modules, has very extensive
Application prospect.
(2) conventional diffractive grating is mostly the strip form at array arrangement, and striped arrangement can be transverse direction, longitudinal direction or transverse and longitudinal
Staggeredly, the complex manufacturing technology of diffraction grating 210 when being arranged using aforesaid way, cost of manufacture is high, is unfavorable for being advised greatly
Mould production.And the first medium of diffraction grating 210 and second medium are arranged by way of concentric loop in the present embodiment,
The manufacture difficulty and cost of manufacture of diffraction grating 210 can be greatly reduced, while can also effectively control production precision in production,
The quality of diffraction grating 210 is helped to improve, and then the cost of manufacture of imaging modules can be reduced and improve imaging modules matter
Amount.
The purpose of the present embodiment, which also resides in, provides a kind of mobile terminal, including above-mentioned imaging modules, to help to mention
The image quality of high acquisition for mobile terminal 3D rendering reduces whole volume and weight, while can greatly expand mobile terminal
Usage scenario, improve user experience.
The foregoing is merely the preferred embodiments of the application, not to limit the application, all essences in the application
Made any modifications, equivalent replacements, and improvements etc., should be included within the scope of protection of this application within mind and principle.
Claims (10)
1. a kind of imaging sensor, it is characterised in that: including diffraction grid component and photosensory assembly;
The diffraction grid component includes at least one diffraction grating;
The diffraction grating includes grating substrate and multiple the first annulus and the second annulus being arranged concentrically, first annulus
It is set on the grating substrate with second annulus;
First annulus is made of first medium, and second annulus is made of second medium, adjacent two first annulus
Between be equipped with second annulus, the refractive index of first annulus and second annulus is different;
The photosensory assembly includes multiple photosensitive pixels, and the photosensitive pixel is set to the light emission side of the diffraction grating, for obtaining
It learns from else's experience the light wave of the diffraction grating diffraction.
2. imaging sensor as described in claim 1, it is characterised in that:
The diffraction grating is transmission grating, and the photosensory assembly is set to one opposite with first annulus of the grating substrate
Side.
3. imaging sensor as described in claim 1, it is characterised in that: the width of first annulus and second annulus
Width ratio be 2/3~3/2.
4. imaging sensor as described in claim 1, it is characterised in that: the width of first annulus and second annulus
The sum of width be 1 micron~20 microns;
The sum of width of the width of first annulus and second annulus is not less than the center of the two adjacent photosensitive pixels
Between spacing.
5. imaging sensor as claimed in claim 4, it is characterised in that: grating base described in the distance from top of second annulus
The height at bottom is 0.2 micron~1 micron.
6. imaging sensor as described in claim 1, it is characterised in that: the first medium be air or silica or
Person's glass or organic material.
7. imaging sensor as described in claim 1, it is characterised in that: described image sensor further includes filtering assembly;
The filtering assembly includes optical filter, and the optical filter is set between the diffraction grating and the photosensitive pixel.
8. imaging sensor as claimed in claim 7, it is characterised in that: the filtering assembly includes Red lightscreening plate, green
Optical filter and blue color filter;
Alternatively, the filtering assembly includes Red lightscreening plate, white filter and blue color filter;
Alternatively, the filtering assembly includes Red lightscreening plate, green color filter, blue color filter and white filter;
Alternatively, the filtering assembly includes Red lightscreening plate, green color filter, blue color filter and infrared fileter;
Alternatively, the filtering assembly includes infrared fileter.
9. imaging sensor as described in any one of claims 1 to 8, it is characterised in that: described image sensor further includes micro-
Lens subassembly;
The lenticule component includes lenticule, and the lenticule is set between the diffraction grating and the photosensitive pixel.
10. a kind of imaging modules, it is characterised in that: including imaging sensor according to any one of claims 1 to 9 and lens group
Part;
The lens subassembly enters on light path set on the diffraction grid component, for incident light wave to be focused to the diffraction
Grating assembly.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109884742A (en) * | 2019-04-03 | 2019-06-14 | 深圳市灵明光子科技有限公司 | Optical field imaging device and optical field imaging method |
CN118412362A (en) * | 2024-07-04 | 2024-07-30 | 深圳比特微电子科技有限公司 | Image sensor and method of manufacturing the same |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090115011A1 (en) * | 2005-10-12 | 2009-05-07 | Sumitomo Electric Industries, Ltd. | Solid-state imaging device and production method thereof |
US20090250594A1 (en) * | 2008-04-04 | 2009-10-08 | Panasonic Corporation | Solid-state image sensor and manufacturing method thereof |
JP2012252168A (en) * | 2011-06-03 | 2012-12-20 | Canon Inc | Diffraction optical element and imaging optical system using the same |
US20140111620A1 (en) * | 2012-10-22 | 2014-04-24 | Samsung Electronics Co., Ltd. | Imaging optical system for 3d image acquisition apparatus, and 3d image acquisition apparatus including the imaging optical system |
KR20140051030A (en) * | 2012-10-22 | 2014-04-30 | 삼성전자주식회사 | Imaging optical system for 3d image acquisition apparatus, and 3d image acquisition apparatus including the imaging optical system |
WO2018055831A1 (en) * | 2016-09-26 | 2018-03-29 | 株式会社日立製作所 | Imaging device |
US20180136480A1 (en) * | 2015-06-17 | 2018-05-17 | Maxell, Ltd. | Imaging apparatus |
WO2018221019A1 (en) * | 2017-06-01 | 2018-12-06 | 富士フイルム株式会社 | Image processing device, imaging system, image processing method, and recording medium |
WO2018221025A1 (en) * | 2017-06-01 | 2018-12-06 | 富士フイルム株式会社 | Imaging device, image processing device, imaging system, image processing method, and recording medium |
CN209105345U (en) * | 2019-01-03 | 2019-07-12 | Oppo广东移动通信有限公司 | A kind of imaging sensor and imaging modules |
-
2019
- 2019-01-03 CN CN201910005682.8A patent/CN109474818B/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090115011A1 (en) * | 2005-10-12 | 2009-05-07 | Sumitomo Electric Industries, Ltd. | Solid-state imaging device and production method thereof |
US20090250594A1 (en) * | 2008-04-04 | 2009-10-08 | Panasonic Corporation | Solid-state image sensor and manufacturing method thereof |
JP2012252168A (en) * | 2011-06-03 | 2012-12-20 | Canon Inc | Diffraction optical element and imaging optical system using the same |
US20140111620A1 (en) * | 2012-10-22 | 2014-04-24 | Samsung Electronics Co., Ltd. | Imaging optical system for 3d image acquisition apparatus, and 3d image acquisition apparatus including the imaging optical system |
KR20140051030A (en) * | 2012-10-22 | 2014-04-30 | 삼성전자주식회사 | Imaging optical system for 3d image acquisition apparatus, and 3d image acquisition apparatus including the imaging optical system |
US20180136480A1 (en) * | 2015-06-17 | 2018-05-17 | Maxell, Ltd. | Imaging apparatus |
WO2018055831A1 (en) * | 2016-09-26 | 2018-03-29 | 株式会社日立製作所 | Imaging device |
WO2018221019A1 (en) * | 2017-06-01 | 2018-12-06 | 富士フイルム株式会社 | Image processing device, imaging system, image processing method, and recording medium |
WO2018221025A1 (en) * | 2017-06-01 | 2018-12-06 | 富士フイルム株式会社 | Imaging device, image processing device, imaging system, image processing method, and recording medium |
CN209105345U (en) * | 2019-01-03 | 2019-07-12 | Oppo广东移动通信有限公司 | A kind of imaging sensor and imaging modules |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109884742A (en) * | 2019-04-03 | 2019-06-14 | 深圳市灵明光子科技有限公司 | Optical field imaging device and optical field imaging method |
CN118412362A (en) * | 2024-07-04 | 2024-07-30 | 深圳比特微电子科技有限公司 | Image sensor and method of manufacturing the same |
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