CN109468642A - A kind of chemical polishing solution and its application method for brass red copper welding material - Google Patents
A kind of chemical polishing solution and its application method for brass red copper welding material Download PDFInfo
- Publication number
- CN109468642A CN109468642A CN201910010137.8A CN201910010137A CN109468642A CN 109468642 A CN109468642 A CN 109468642A CN 201910010137 A CN201910010137 A CN 201910010137A CN 109468642 A CN109468642 A CN 109468642A
- Authority
- CN
- China
- Prior art keywords
- welding material
- brass
- red copper
- chemical polishing
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of chemical polishing solutions and its application method for brass red copper welding material, the chemical polishing solution is made of polishing fluid A and light-emitting solution B, application method is will first the material polished to be needed to be placed in polishing fluid A to polish, then the workpiece after polishing is carried out to move back film, out light.The present invention does not use the chemical substance such as chromic acid harmful to environment, does not use nitric acid yet, will not generate tobacco, polishing process more safety and environmental protection during the polishing process;The acid that low concentration is used in polishing fluid, can reduce the rate of reaction, reduce the heat that system generates, avoid the fast decoupled of hydrogen peroxide, extend the service life of polishing fluid;Phenomena such as addition sulfuric acid amount is no more than 1% in polishing fluid, and the metal ion that can prevent different copper alloys from reflecting reacts on material surface, prevents the spot corrosion of material surface.
Description
Technical field
The present invention relates to field of metal surface treatment technology, and in particular to a kind of chemical polishing of brass red copper welding material
Liquid and its application method.
Background technique
Polishing is generally divided into mechanical polishing, electrochemical polish and chemical polishing three classes, can not only remove table by polishing
Surface oxidized skin can also make workpiece surface more smooth, even up to mirror effect.
Mechanical polishing is to obtain glossy surface, shape of this method to workpiece by the phase mutual friction between abrasive material and substrate
Shape requires, and commonly used in the material of flat surface, if material shape is complicated, especially there is the material of corner angle, is difficult to use
This method.Electrochemical polish is so that material surface is reached smooth by point discharge principle, and the use needs of this method disappear
Consume a large amount of electric energy, higher cost, and if material has corner angle, it is likely to result in the state that corner angle flatten.Chemical polishing then may be used
To overcome these problems, power supply is not needed, surfacing processing can be carried out to complex-shaped material, polishing uniformity is good, behaviour
Make method simplicity, high production efficiency.
Traditional chemical polishing is using chromic acid, but since chromic acid is larger to environmental hazard, China's most places are
It is forbidden to use.The polishing method of substitution chromic acid is using " three acid " polishing, i.e. sulfuric acid, phosphoric acid, nitric acid, the technique polishing effect
Good, brightness is high, and still, in process of production, nitric acid can generate a large amount of tobacco, cause serious environmental pollution, while to operation
The health of personnel generates harm.Therefore the more and more chemical polishings that copper alloy is carried out using hydrogen peroxide-sulfuric acid system of people, are led to
Brightener is overregulated to reach brightness effect.However, it is necessary to which the workpiece of polishing treatment is not often single copper alloy merely, more
More may be the combination of a variety of alloys, existing since the condition of welding material and different-alloy during the polishing process is different
Technology can not make the welding materials such as red copper, brass alloys or even stainless steel while polishing reaches brightness effect.
Summary of the invention
In view of the above problems, the present invention provides a kind of chemical polishing solution for brass red copper welding material, mainly solve
The chemical polishing of the two or more different-alloy materials such as brass-red copper welding material, brass-red copper-stainless steel welding material.
In order to achieve the above objectives, the technical scheme is that
It is a kind of for brass-red copper welding material chemical polishing solution, the chemical polishing solution is by polishing fluid A and light-emitting solution
B composition;
The polishing fluid A is composed of the following components:
The light-emitting solution B is composed of the following components:
Preferably, the polishing fluid A is composed of the following components: 35% hydrogen peroxide 48wt%~52wt%;98% sulfuric acid
0.6%~0.8%;Brightener 6%~8%;Deionized water surplus;The light-emitting solution B is composed of the following components: 98% sulfuric acid
3%~5%;Imidazoles corrosion inhibiter 0.05%~0.1%;Organic amine corrosion inhibiter 0.05%~0.1%;Deionized water surplus.
Preferably, the brightener in the polishing fluid A is TX-10, NP-10, OP-10, TX-100, TO-10, diethylene glycol
Two or more mixtures in butyl ether, diethylene glycol ether.
Preferably, the imidazoles corrosion inhibiter in the light-emitting solution B is imidazoles, benzimidazole, 2- amyl benzimidazole, 2- mercapto
One or more of base benzimidazole mixture.
Preferably, the organic amine corrosion inhibiter in the light-emitting solution B is oleyl propylene diamine sulfate, cocoyl propane diamine
Sulfate, soya-bean oil base propane diamine sulfate, tallow alkyl propane diamine sulfate, tallow alkyl two sub- third triamine sulfate, butter
One or more of the sub- third triamine sulfate of alkyl Sanya the third tetramine sulfate, dodecyl two mixture.
The present invention also provides the above-mentioned application method for brass-red copper welding material chemical polishing solution, the uses
Method the following steps are included:
A, brass-red copper welding material is immersed in polishing fluid A and carries out chemical polishing;
B, the brass after polishing-red copper welding material is placed in light-emitting solution B and carries out out light processing.
Preferably, the application method further includes that welding material is carried out oil removing cleaning before step A.
Preferably, the application method further includes that will go out the welding material after light to be passivated processing after stepb.
Preferably, described to be used for brass-red copper welding material, Huang for brass-red copper welding material chemical polishing solution
The chemical polishing of the two or more different-alloy materials such as copper-red copper-stainless steel welding material.
The present invention provides a kind of chemical polishing solution and polishing method for brass red copper welding material, and this method first need to
The workpiece to be polished, which is placed in polishing fluid, to be polished, then the workpiece after polishing is carried out to move back film, light processing out.
The sulfuric acid less than 1% is used only as acidizing reagent in polishing fluid A of the invention, is corroded in copper alloy surface,
The unstable of system after metal dissolving is prevented between different-alloy, or is reacted to each other.The use for reducing sulfuric acid simultaneously, can drop
Reaction in low polishing trough reduces the release of heat, reduces the decomposition of hydrogen peroxide, reduces application risk, while extending throwing
The service life of light liquid.
Compared with existing chromic acid, three acid polishing system, this method does not use the chemical substance such as chromic acid harmful to environment,
Nitric acid is not used, tobacco, polishing process more safety and environmental protection will not be generated during the polishing process yet;Using lower dense in polishing fluid
The acid of degree can reduce the rate of reaction, reduce the heat that system generates, avoid the fast decoupled of hydrogen peroxide, extend throwing
The service life of light liquid;In polishing fluid A be added sulfuric acid amount be no more than 1%, the metal that can prevent different copper alloys from reflecting from
Phenomena such as son reacts on material surface, prevents the spot corrosion of material surface.
The present invention breaches the polishing method that classical acid adds hydrogen peroxide in use process, the dosage of acid is reduced to certain
Degree, can achieve the part of corrosion out-of-flatness, and can prevent the metal ion after different corrosion of copper alloy from mutually polluting,
Corrosion will not be generated to welding portion, influence weld strength, the environmentally friendly polishing method of different Cu alloy welding material may be implemented,
Brass portions after polishing are bright, and red copper part is bright, and welding position will not corrode, other welding materials are unaffected, reach
Good using effect.
Specific embodiment
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the contents of the present invention, those skilled in the art can
To make various changes or modifications to the present invention, such equivalent forms equally fall within limited range of the present invention.
It is a kind of for brass-red copper welding material chemical polishing solution, the chemical polishing solution is by polishing fluid A and light-emitting solution
B composition;
The polishing fluid A is composed of the following components:
The light-emitting solution B is composed of the following components:
The application method of chemical polishing solution of the present invention is generally divided into four steps (wherein, second and third step is necessary step):
Step 1: oil removing is cleaned
Alkaline degreasing-washing-acidity descale one is washed
Step 2: chemical polishing
The welding material handled well is immersed in polishing fluid A, the soak at room temperature time is 2 minutes, takes out welding material.
Step 3: light processing out
The welding material of taking-up is directly placed into light-emitting solution B, is all dissolved to black film within soak at room temperature 1 minute.
4th: Passivation Treatment
Wash one passivation-washing-drying
Embodiment 1
Experimental material: brass tube and copper tube welding material.
Chemical polishing: the welding material handled well is immersed in polishing fluid A, and the group of polishing fluid A becomes 35% concentration
Hydrogen peroxide 48wt%;The sulfuric acid 0.8% of 98% concentration;TX-10 is 1%;Butyl 7%;Water surplus.Welding material is normal
Warm soaking time is 2 minutes, takes out welding material.
Light processing out: the welding material of taking-up is directly placed into light-emitting solution B, and the group of light-emitting solution B becomes 98% concentration
Sulfuric acid 3%;2- amyl benzimidazole 0.05%;Oleyl propylene diamine sulfate 0.05%;Water surplus.Soak at room temperature 1 minute is extremely
Black film all dissolves.
Treated welding material, brass portions are bright, and red copper part is bright.
Embodiment 2
Experimental material: brass tube, copper tube, stainless steel welding material.
Chemical polishing: the welding material handled well is immersed in polishing fluid A, and the group of polishing fluid A becomes 35% dioxygen
Water 52wt%;98% sulfuric acid 0.6%;TX-100 is 2%;Butyl 4%;Water surplus.The soak at room temperature time is 2 points
Clock takes out welding material.
Light processing out: the welding material of taking-up is directly placed into light-emitting solution B, and the group of light-emitting solution B becomes 98% sulfuric acid
5%;2-mercaptobenzimidazole 0.1%;The sub- third triamine sulfate 0.1% of dodecyl two;Water surplus.Soak at room temperature 1 minute is extremely
Black film all dissolves.
Treated welding material, brass portions are bright, and red copper part is bright, and stainless steel parts are unaffected.
Embodiment 3
Experimental material: brass part, red copper part, steel welding material.
Chemical polishing: the welding material handled well is immersed in polishing fluid A, and the group of polishing fluid A becomes 35% dioxygen
Water 50wt%;98% sulfuric acid 0.7%;TO-10 is 3%;Diethylene glycol ether 4%;Water surplus.The soak at room temperature time is 2 minutes,
Take out welding material.
Light processing out: the welding material of taking-up is directly placed into light-emitting solution B, and the group of light-emitting solution B becomes 98% sulfuric acid
4%;Benzimidazole 0.07%;The sub- third triamine sulfate 0.08% of tallow alkyl two;Water surplus.Soak at room temperature 1 minute is to black
Film all dissolves.
Treated welding material, brass portions are bright, and red copper part is bright, and steel part is unaffected.
The present invention breaches the polishing method that classical acid adds hydrogen peroxide in use process, and the dosage of acid is reduced to certain journey
Degree, can achieve the part of corrosion out-of-flatness, and can prevent the metal ion after different corrosion of copper alloy from mutually polluting, also not
Corrosion can be generated to welding portion, influence weld strength, the environmentally friendly polishing method of different Cu alloy welding material may be implemented, throw
Brass portions after light are bright, and red copper part is bright, and welding position will not corrode, other welding materials are unaffected, reach
Good using effect.In use, if encountered, corrosion does not work or acidity is already below this range, is properly added sulphur
Acid does not work if there is light out, can be properly added brightener.Hydrogen peroxide can also be substantially reduced using the present invention and method
Decompose, will not vigorous reaction generate heat operate more convenient without condensing water conservation.
Than the above described, the present invention can also have other modes realization, in the premise for not departing from the content of present invention
Under, it is any obviously replace it is within the scope of the present invention.
Claims (9)
1. a kind of for brass-red copper welding material chemical polishing solution, which is characterized in that the chemical polishing solution is by polishing fluid
A and light-emitting solution B composition;
The polishing fluid A is composed of the following components:
35% hydrogen peroxide: 45-55wt%
98% sulfuric acid: 0.5-1wt%
Brightener: 4-10wt%
Surplus is deionized water:
The light-emitting solution B is composed of the following components:
98% sulfuric acid: 1-10wt%
Imidazoles corrosion inhibiter: 0.01-0.5wt%
Organic amine corrosion inhibiter: 0.01-0.5wt%
Surplus is deionized water.
2. being used for brass-red copper welding material chemical polishing solution as described in claim 1, which is characterized in that the polishing
Liquid A is composed of the following components: 35% hydrogen peroxide 48wt%~52wt%;98% sulfuric acid 0.6%~0.8%;Brightener 6%~
8%;Deionized water surplus;
The light-emitting solution B is composed of the following components: 98% sulfuric acid 3%~5%;Imidazoles corrosion inhibiter 0.05%~0.1%;Have
Machine amine inhibitor 0.05%~0.1%;Deionized water surplus.
3. being used for brass-red copper welding material chemical polishing solution as claimed in claim 1 or 2, which is characterized in that the throwing
Brightener in light liquid A is TX-10, NP-10, in OP-10, TX-100, TO-10, butyl, diethylene glycol ether
Two or more mixtures.
4. as claimed in claim 1 or 2 be used for brass-red copper welding material chemical polishing solution, which is characterized in that it is described go out
Imidazoles corrosion inhibiter in light liquid B be one of imidazoles, benzimidazole, 2- amyl benzimidazole, 2-mercaptobenzimidazole or
Several mixtures.
5. as claimed in claim 1 or 2 be used for brass-red copper welding material chemical polishing solution, which is characterized in that it is described go out
Organic amine corrosion inhibiter in light liquid B is oleyl propylene diamine sulfate, cocoyl propane diamine sulfate, soya-bean oil base propane diamine sulphur
The sub- third triamine sulfate of hydrochlorate, tallow alkyl propane diamine sulfate, tallow alkyl two, tallow alkyl Sanya the third tetramine sulfate,
One or more of the sub- third triamine sulfate of dodecyl two mixture.
6. being used for the application method of brass-red copper welding material chemical polishing solution as described in claim 1, feature exists
In, the application method the following steps are included:
A. brass-red copper welding material is immersed in polishing fluid A and is polished;
B. the brass after polishing-red copper welding material is placed in light-emitting solution B and carries out out light processing.
7. being used for the application method of brass-red copper welding material chemical polishing solution as claimed in claim 6, feature exists
In the application method further includes that welding material is carried out oil removing cleaning before step A.
8. being used for the application method of brass-red copper welding material chemical polishing solution as claimed in claim 6, feature exists
It after stepb further include that will go out the welding material after light to be passivated processing in, the application method.
9. being used for the application method of brass-red copper welding material chemical polishing solution as claimed in claim 6, feature exists
In described stainless for brass-red copper welding material, brass-red copper-for brass-red copper welding material chemical polishing solution
The chemical polishing of the two or more different-alloy materials such as steel welding material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910010137.8A CN109468642A (en) | 2019-01-04 | 2019-01-04 | A kind of chemical polishing solution and its application method for brass red copper welding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910010137.8A CN109468642A (en) | 2019-01-04 | 2019-01-04 | A kind of chemical polishing solution and its application method for brass red copper welding material |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109468642A true CN109468642A (en) | 2019-03-15 |
Family
ID=65678487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910010137.8A Pending CN109468642A (en) | 2019-01-04 | 2019-01-04 | A kind of chemical polishing solution and its application method for brass red copper welding material |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109468642A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111155095A (en) * | 2020-01-14 | 2020-05-15 | 东莞市美贝仕铜材处理剂开发有限公司 | Method for activating copper material polishing waste liquid |
CN116288362A (en) * | 2023-02-17 | 2023-06-23 | 厦门金波贵金属制品有限公司 | Pure copper chemical polishing pickling solution and manufacturing process thereof, and pure copper surface polishing treatment process |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1659311A (en) * | 2002-04-04 | 2005-08-24 | 坎梅陶尔股份有限公司 | Method for copper-plating or bronze-plating an object and liquid mixtures therefor |
CN101851470A (en) * | 2009-04-03 | 2010-10-06 | 比亚迪股份有限公司 | Chemical polishing liquid and polishing method |
CN102383132A (en) * | 2010-11-24 | 2012-03-21 | 温州奥洋金属表面处理有限公司 | Polishing solution for processing surfaces of copper and copper alloy by replacing copper pickling process |
CN103849876A (en) * | 2012-12-03 | 2014-06-11 | 浙江伟星实业发展股份有限公司 | Chemical polishing method |
CN104651842A (en) * | 2014-04-28 | 2015-05-27 | 严振 | Chemical polishing method for copper and alloys thereof |
CN105369311A (en) * | 2015-11-17 | 2016-03-02 | 扬州市佳佳镀锌有限公司 | Bright dipping method for galvanized workpiece |
CN107287582A (en) * | 2017-05-19 | 2017-10-24 | 浙江帝恒实业有限公司 | A kind of chemical plating stannum copper cash and preparation method thereof |
CN107299367A (en) * | 2017-08-24 | 2017-10-27 | 重庆立道表面技术有限公司 | Non-cyanide bright plate silver plating solution |
-
2019
- 2019-01-04 CN CN201910010137.8A patent/CN109468642A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1659311A (en) * | 2002-04-04 | 2005-08-24 | 坎梅陶尔股份有限公司 | Method for copper-plating or bronze-plating an object and liquid mixtures therefor |
CN101851470A (en) * | 2009-04-03 | 2010-10-06 | 比亚迪股份有限公司 | Chemical polishing liquid and polishing method |
CN102383132A (en) * | 2010-11-24 | 2012-03-21 | 温州奥洋金属表面处理有限公司 | Polishing solution for processing surfaces of copper and copper alloy by replacing copper pickling process |
CN103849876A (en) * | 2012-12-03 | 2014-06-11 | 浙江伟星实业发展股份有限公司 | Chemical polishing method |
CN104651842A (en) * | 2014-04-28 | 2015-05-27 | 严振 | Chemical polishing method for copper and alloys thereof |
CN105369311A (en) * | 2015-11-17 | 2016-03-02 | 扬州市佳佳镀锌有限公司 | Bright dipping method for galvanized workpiece |
CN107287582A (en) * | 2017-05-19 | 2017-10-24 | 浙江帝恒实业有限公司 | A kind of chemical plating stannum copper cash and preparation method thereof |
CN107299367A (en) * | 2017-08-24 | 2017-10-27 | 重庆立道表面技术有限公司 | Non-cyanide bright plate silver plating solution |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111155095A (en) * | 2020-01-14 | 2020-05-15 | 东莞市美贝仕铜材处理剂开发有限公司 | Method for activating copper material polishing waste liquid |
CN116288362A (en) * | 2023-02-17 | 2023-06-23 | 厦门金波贵金属制品有限公司 | Pure copper chemical polishing pickling solution and manufacturing process thereof, and pure copper surface polishing treatment process |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101851470B (en) | Chemical polishing liquid and polishing method | |
CN107254683B (en) | A kind of the strength rust remover and its application method of steelwork | |
CN109468642A (en) | A kind of chemical polishing solution and its application method for brass red copper welding material | |
CN109825822A (en) | A kind of diamond/copper semiconductor sealing material method of surface finish | |
CN106400036B (en) | A kind of environment-protective process replacing hydrochloride derusting | |
CN104762622A (en) | A treatment method for brightening surfaces of copper nickel alloy tubes | |
CN108950643B (en) | Alkaline aluminum anodic oxide film remover and preparation method and use method thereof | |
CN106086908A (en) | A kind of copper material pickling polishing fluid and preparation method thereof and using method | |
CN106283056A (en) | A kind of it is applicable to taking off plating solution and taking off electroplating method of the surface of the work coat of metal | |
CN105525298B (en) | A method of removal titanium and its alloy surface oxide skin | |
CN106637339A (en) | Preparation process of aluminum alloy having high bonding strength anode oxide film | |
KR20150003871A (en) | Cleaning agent for alloy material, and method for producing alloy material | |
CN107287582A (en) | A kind of chemical plating stannum copper cash and preparation method thereof | |
CN103422051B (en) | Remove the method for copper nickel/aluminium graphite compound sealing coating material | |
CN103849876B (en) | A kind of chemically polishing method | |
CN104513999B (en) | Corrosion inhibiter is with composition and its application and method that pickling is carried out to equipment | |
CN109252200A (en) | A kind of aluminum alloy die casting surface treatment method | |
CN101368126A (en) | Liquid coolant for cutting wire-electrode | |
CN116536116A (en) | Microbubble cleaning solution and method for using same | |
CN107630223A (en) | A kind of environmentally-friendly water-based metal cleaner of high efficiency microbubble | |
CN111041494A (en) | Vertical aluminum oxidation system and production method thereof | |
CN105925984B (en) | Deburring liquid for machining and preparation method thereof | |
CN104230073B (en) | The treatment process of ammonia-containing water | |
CN220491842U (en) | Microbubble cleaning device, silicon material cleaning equipment, silicon wafer processing equipment and electroplating equipment | |
CN106190649A (en) | Cleaning solution and method for cleaning PCB tin removing groove by using same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190315 |