CN109466152A - A kind of production method of high thermal conductivity iron substrate - Google Patents

A kind of production method of high thermal conductivity iron substrate Download PDF

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Publication number
CN109466152A
CN109466152A CN201811023894.0A CN201811023894A CN109466152A CN 109466152 A CN109466152 A CN 109466152A CN 201811023894 A CN201811023894 A CN 201811023894A CN 109466152 A CN109466152 A CN 109466152A
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iron
thermal conductivity
iron substrate
production method
thermally conductive
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CN109466152B (en
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楼红卫
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Zhejiang Rochtek Technology Co Ltd
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Zhejiang Rochtek Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Abstract

The present invention provides a kind of production method of thermally conductive iron substrate for electromechanical equipment, mainly includes 6 steps: the 1, production of iron-based bottom plate；2, thermally conductive glue is prepared with epoxy resin and modified Nano inorganic heat filling；3, thermally conductive glue is rolled on release film by gap, Drying and cooling obtains conductive adhesive film；4, it is stacked that copper foil, conductive adhesive film and iron substrate are carried out to plate combination in certain sequence；5, temperature-pressure compression moulding under vacuum conditions plate is combined；6, satisfactory thermally conductive iron substrate is cut and is put in storage.Thermally conductive iron substrate prepared by the present invention makes it form good interface cohesion between epoxy resin, to reduce two-phase interface thermal resistance, improves the thermal conductivity and toughness of material by being modified to nano inorganic filler.

Description

A kind of production method of high thermal conductivity iron substrate
Technical field
The invention belongs to wiring board manufacturing technology fields, and in particular to be a kind of high thermal conductivity iron substrate production method.
Background technique
Iron substrate is a kind of heat dissipation metal substrate applied on high-end motor, high-end product facility and motor, mesh It is preceding to be widely used in the market.Iron substrate hardness can much larger, general factory in manufacturing process and difficulty compared to other metal substrates Family is difficult the technology of grasp.Being primarily present technical barrier is: 1) ferrous material easily oxidation and rusting in process can be led It causes and the binding force difference of thermal insulation layer generates layering exception；2) surface hardness is insufficient, in production and client's use process It easily scratches, the processability and applicability of quality cost and product to product are all bottlenecks；3) at high cost, to solve knot Resultant force and processability and applicability, need to put into higher equipment and scrap cost.Therefore the application range in market by This limitation cannot effectively meet the problem of high-cooling property of electromechanical equipment needs in addition, there is also substrate heating conduction is bad.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of production method of high thermal conductivity iron substrate, the present invention is made Thermally conductive iron substrate have the characteristics that be not easy that oxidation and rusting, surface hardness are high, binding force is strong, are not easy to be layered, are at low cost.This hair Technical solution used by bright its technical problem of solution is:
A kind of production method of high thermal conductivity iron substrate, specifically comprises the following steps:
The production of S1, iron-based bottom plate:
1) iron plate is put into lye oil removing 2-3 minutes；
2) the polish-brush wheel of the 180-800 mesh of the iron plate after oil removing is subjected to single side polish-brush roughening；
3) iron plate after polish-brush is washed with high pressure water；
4) antirust treatment is carried out to iron plate with the antirust agent of prepared 5-15%；
5) drying and processing is carried out to iron-based after antirust treatment with 120-140 DEG C of hot wind, obtains iron substrate.
Preferably, the iron plate with a thickness of 0.2-2.0mm.
Preferably, the lye is concentration 10-20%, the sodium hydroxide solution that temperature is 50-60 DEG C.
Preferably, the antirust agent is water-based antirust agent.
S2, thermally conductive glue is prepared:
1) by mass ratio be 10-15% epoxy resin and 70-80% modified Nano inorganic non-metallic heat filling into Row is sufficiently mixed, and is stirred in the case where revolving speed is 1200~2000r/min and is obtained at least 3 hours mixing adhesive solution；2) nanoscale is used Ceramic grinder grinds mixing adhesive solution obtained above 1-2 times；
3) adhesive solution after grinding is stirred at least 4 hours in the case where revolving speed is 1200~2000r/min, and is put into magnet Magnetic pole absorption is carried out, final thermally conductive glue is obtained.
The modified Nano inorganic non-metallic heat filling is the preparation method is as follows: first by inorganic heat filling at 100 DEG C Dry 1h in baking oven；Oxidized activating Dextran 60-140g is taken, pH value is adjusted to 6-8 with sodium hydroxide, 40-80g is then added It is inorganic to lead filler, it flows back at 40-80 DEG C, stirs 1-12h, then 0.5-1.5h is stirred at room temperature, then filter, and use second Alcohol washing, obtains that modified Nano is inorganic to lead filler.
The oxidized activating glucan is made by following methods: 5-10ml deionization is added in the glucan of 0.5-1.8g In water, it is heated with stirring to 55-85 DEG C and makes it completely dissolved, obtain dextran solution；By 0.2-0.5g NaIO4Solid powder is molten In 5-10ml deionized water, to NaIO4It is poured into after being completely dissolved in prepared dextran solution, solution maintains 50-100 It is stirred 30-60min at DEG C, obtains the glucan of oxidized activating.
Since common inorganic heat filling surface polarity is big, dispersibility in the polymer is poor, between filler particles easily Assemble, or even separated in interface with organic phase, so that circulation of the heat between two phase structure is obstructed.The present invention Nano inorganic heat filling particle surface cladding oxidized activating glucan, glucan after oxidation generates a large amount of carboxyls, carboxylic Base and nanoparticles stable key connect, and improve the two-phase interface bonding state of inorganic filler and epoxy resin to a certain extent, The good combination of interface can reduce phonon in the scattering of interface, to reduce two-phase interface thermal resistance, improve the heat of material Conductance.Secondly, glucan has porosity three-dimensional space reticular structure, micropore can suck a large amount of inorganic heat filling, rise To the effect of increase-volume.In addition, the cation group of glucan is more, epoxy resin contains hydroxyl isoreactivity group, cation Connect with hydroxyl bond, enhances the binding force of glucan and epoxy resin, the glucan of grafted inorganic heat filling is in resin matrix In in spatial network shape be distributed, be more conducive to the formation in space effective channel, improve heat transfer efficiency.
Preferably, the nano inorganic nonmetallic heat conductive filler is nano-metal-oxide Al2O3、MgO、ZnO、 NiO, metal nitride AiN, SiN4, one or more of BN and SiC, nano inorganic nonmetallic heat conductive filler is averaged Partial size is 5-120nm.
Preferably, the epoxy resin is bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol S type epoxy Resin, bisphenol-A epoxy resin, multiple functional radical glycidyl ether resin, multiple functional radical epihydric alcohol amine resin, alicyclic ring One or more of race's epoxy resin and heterocyclic epoxy resin.
S3, production conductive adhesive film:
The thermally conductive glue prepared is passed through on the gap 80-150um roller coating to 25-35um release film, then in baking oven Thickness 80-150um, fugitive constituent 0.6-1.2% were obtained using cooling by high-temperature baking 3-6 minutes of 80-180 DEG C Conductive adhesive film.
S4, plate combination:
Copper foil is cut into corresponding size as needed, then according to copper foil, conductive adhesive film, iron-based bottom plate or iron substrate, Conductive adhesive film, copper foil sequence be combined it is stacked.
Preferably, the copper foil with a thickness of 12-140um.
It is S5, hot-forming:
The plate combination for needing the number of plies will be stacked in the step S4 to be put into vacuum press, in 50-230 DEG C, 10- It is heated under the conditions of 30Kgf, simultaneously compression moulding of pressurizeing, during compression moulding, vacuum time holding at least 40 minutes, 230 It is kept at DEG C at least 30 minutes, take out the thermally conductive iron substrate of compression moulding and is cooled to 50 DEG C or less.
S6, storage is cut:
By the satisfactory thermally conductive iron substrate storage of compression moulding, and size is cut as needed, described thermally conductive Thermal conductivity >=15W/ (m.k) of iron substrate, proof voltage >=2.0KV, peel strength >=1.5N/mm.
The beneficial effects of the present invention are:
1, there is stronger specific surface area and interface interaction by the modified nano inorganic filler in surface in the present invention, one Aspect can adsorb more inorganic nano-fillers, on the other hand can make to be formed between epoxy resin and inorganic nano-filler Good interface cohesion improves the thermal conductivity of material to reduce two-phase interface thermal resistance；
2, can make the rigidity of inorganic matter after nano inorganic filler and epoxy resin are compound in the present invention, dimensional stability and The toughness of thermal stability and epoxy resin, processability are blended together, and show stronger toughness and processing characteristics；
3, degree of roughening improves iron-based plate surface after treatment in the present invention, and bonding interface is bigger than traditional handicraft very It is more, form the active bonding interface with stronger secondary or physical bond performance；Make inorganic heat filling chaining using externally-applied magnetic field induction Shape distribution, heat filling are arranged of preferred orient in the same direction under high-intensity magnetic field induction, and a small amount of filler forms effective thermally conductive Network chain improves the thermal conductivity of whole system；
4, conductive adhesive film produced by the present invention, thermal coefficient is high, and flexible, product molding is good.
Detailed description of the invention
Fig. 1 is the production technology figure of high thermal conductivity iron substrate of the present invention.
Specific implementation method
Below against attached drawing, the present invention is further illustrated in conjunction with the embodiments:
Embodiment 1
A kind of production method of high thermal conductivity iron substrate, step include:
S1, iron substrate production: 1) iron plate of 1.50mm thickness is put into concentration is 10%, in the lye that temperature is 55 DEG C Oil removing 3 minutes；The polish-brush wheel of 500 mesh of iron plate after oil removing is carried out single side polish-brush roughening by 2；3 with high pressure water to iron after polish-brush Plate is washed；4) antirust treatment is carried out to iron plate with configured 10% antirust agent；5) at 130 DEG C of hot winds to antirust Iron plate after reason carries out drying and processing, obtains iron-based bottom plate.
S2, it prepares thermally conductive glue: epoxy resin and modified Nano inorganic filler is filled according to mass ratio for 15:80 Divide mixing, is stirred at 1500r/min and obtain within 4 hours mixing adhesive solution, then with nanometer scale ceramics grinder to epoxy glue Viscous solution is ground 2 times, is finally that 1500r/min is stirred 5 hours in revolving speed to adhesive solution after grinding, is put into magnet and carries out magnetic Pole absorption obtains final thermally conductive glue.
The modified Nano inorganic filler the preparation method is as follows: first that inorganic filler is dry in 100 DEG C of baking oven 1h, the glucan 100g after taking oxidized activating adjust pH value to 7 with sodium hydroxide, 60g inorganic filler are then added, at 60 DEG C Lower reflux stirs 5h, then 1h is stirred at room temperature, then filters, and with ethanol washing, obtains modified Nano inorganic filler.
The glucan of oxidized activating is made by following methods: the glucan of 1.1g being added in 8ml deionized water, stirring It is heated to 70 DEG C to make it completely dissolved, obtains dextran solution；By 0.3g NaIO4Solid powder is dissolved in 7ml deionized water, To NaIO4It is poured into after being completely dissolved in prepared dextran solution, solution maintains to be stirred 50min at 75 DEG C, obtains oxygen Change the glucan of activation.
S3, conductive adhesive film production: 1) the thermally conductive glue for preparing is passed through 90um gap roller coating to 30um release film on； 2) pass through high-temperature baking 5 minutes of 130 DEG C in baking oven, using cooling, obtain 90um thickness conductive adhesive film；3) according to life It is stand-by that production requirement cuts corresponding size.
S4, plate combination: 1) as needed the copper foil of 50um thickness is cut into corresponding size；2) with copper foil, heat-conducting glue Film, iron-based bottom plate sequence stack together.
It is S5, hot-forming: 1) plate for being stacked to demand number of plies combination to be put into vacuum press；And 50-230 DEG C, It is heated under conditions of 10-30Kgf, compression moulding of pressurizeing；2) 30 minutes are at least kept in pressing process, at 230 DEG C, very The empty time at least keeps 40 minutes；3) the good iron substrate of temperature-pressure is taken out, is cooled to 50 DEG C or less.
S6, storage is cut:
By the satisfactory thermally conductive iron substrate storage of compression moulding, and size is sheared as needed.
Embodiment 2
A kind of production method of high thermal conductivity iron substrate, step include:
S1, iron substrate production: 1) iron plate of 1.0mm thickness is put into concentration is 20%, is removed in the lye that temperature is 50 DEG C Oil 3 minutes；2) the polish-brush wheel of 600 mesh of the iron plate after oil removing is subjected to single side polish-brush roughening；3) with high pressure water to iron after polish-brush Plate is washed；4) antirust treatment is carried out to iron plate with configured 13% water-based antirust agent；5) with 140 DEG C of hot winds to anti- Rust treated iron plate carries out drying and processing, obtains iron-based bottom plate.
S2, it prepares thermally conductive glue: epoxy resin and modified Nano inorganic filler is filled according to mass ratio for 10:70 Divide mixing, is stirred at 1200r/min and obtain within 4 hours mixing adhesive solution, then with nanometer scale ceramics grinder to epoxy glue Viscous solution is ground 2 times, is finally that 1200r/min is stirred 5 hours in revolving speed to adhesive solution after grinding, is put into magnet and carries out magnetic Pole absorption obtains final thermally conductive glue.
The modified Nano inorganic filler the preparation method is as follows: first that inorganic filler is dry in 100 DEG C of baking oven 1h, the Dextran 60 g after taking oxidized activating adjust pH value to 7 with sodium hydroxide, 80g inorganic filler are then added, at 80 DEG C Lower reflux stirs 10h, then 0.5h is stirred at room temperature, then filters, and with ethanol washing, obtains that modified Nano is inorganic to be filled out Material.
The glucan of oxidized activating is made by following methods: the glucan of 0.8g being added in 10ml deionized water, stirring It is heated to 85 DEG C to make it completely dissolved, obtains dextran solution；By 0.5g NaIO4Solid powder is dissolved in 10ml deionized water In, to NaIO4It is poured into after being completely dissolved in prepared dextran solution, solution maintains to be stirred 60min at 100 DEG C, obtains To the glucan of oxidized activating.
S3, conductive adhesive film production: 1) the thermally conductive glue for preparing is passed through 100um gap roller coating to 35um release film on； 2) pass through high-temperature baking 3 minutes of 80 DEG C in baking oven, using cooling, obtain 100um thickness conductive adhesive film；3) according to life It is stand-by that production requirement cuts corresponding size.
S4, plate combination: 1) as needed the copper foil of 50um thickness is cut into corresponding size；2) with copper foil, heat-conducting glue Film, iron-based bottom plate sequence stack together.
It is S5, hot-forming: 1) by the plate for being stacked to demand number of plies combination be put into vacuum press and 50-230 DEG C, It is heated under conditions of 10-30Kgf, compression moulding of pressurizeing；2) 30 minutes are at least kept in pressing process, at 230 DEG C, very The empty time at least keeps 40 minutes；3) the good iron substrate of temperature-pressure is taken out, is cooled to 50 DEG C or less.
S6, storage is cut:
By the satisfactory thermally conductive iron substrate storage of compression moulding, and size is sheared as needed.
Embodiment 3
A kind of production method of high thermal conductivity iron substrate, step include:
S1, iron substrate production: 1) iron plate of 1.0mm thickness is put into concentration is 10%, is removed in the lye that temperature is 50 DEG C Oil 2 minutes；2) the polish-brush wheel of 400 mesh of the iron plate after oil removing is subjected to single side polish-brush roughening；3) with high pressure water to iron after polish-brush Plate is washed；4) antirust treatment is carried out to iron plate with configured 10% water-based antirust agent；5) with 120 DEG C of hot winds to anti- Rust treated iron plate carries out drying and processing, obtains iron-based bottom plate.
S2, it prepares thermally conductive glue: epoxy resin and modified Nano inorganic filler is filled according to mass ratio for 15:75 Divide mixing, is stirred at 2200r/min and obtain within 6 hours mixing adhesive solution, then with nanometer scale ceramics grinder to epoxy glue Viscous solution is ground 2 times, is finally that 1800r/min is stirred 8 hours in revolving speed to adhesive solution after grinding, is put into magnet and carries out magnetic Pole absorption obtains final thermally conductive glue.
The modified Nano inorganic filler the preparation method is as follows: first that inorganic filler is dry in 100 DEG C of baking oven 1h, the glucan 120g after taking oxidized activating adjust pH value to 7 with sodium hydroxide, 80g inorganic filler are then added, at 60 DEG C Lower reflux stirs 12h, then 1h is stirred at room temperature, then filters, and with ethanol washing, obtains modified Nano inorganic filler.
The glucan of oxidized activating is made by following methods: the glucan of 1.8g being added in 10ml deionized water, stirring It is heated to 85 DEG C to make it completely dissolved, obtains dextran solution；By 0.5g NaIO4Solid powder is dissolved in 10ml deionized water In, to NaIO4It is poured into after being completely dissolved in prepared dextran solution, solution maintains to be stirred 60min at 80 DEG C, obtains To the glucan of oxidized activating.
S3, conductive adhesive film production: 1) the thermally conductive glue for preparing is passed through 90um gap roller coating to 30um release film on； 2) pass through high-temperature baking 5 minutes of 130 DEG C in baking oven, using cooling, obtain 90um thickness conductive adhesive film；3) according to life It is stand-by that production requirement cuts corresponding size.
S4, plate combination: 1) as needed the copper foil of 50um thickness is cut into corresponding size；2) with copper foil, heat-conducting glue Film, iron-based bottom plate sequence stack together.
It is S5, hot-forming: 1) plate for being stacked to demand number of plies combination to be put into vacuum press；And 50-230 DEG C, It is heated under conditions of 10-30Kgf, compression moulding of pressurizeing；2) 30 minutes are at least kept in pressing process, at 230 DEG C, very The empty time at least keeps 40 minutes；
3) the good iron substrate of temperature-pressure is taken out, is cooled to 50 DEG C or less.
S6, storage is cut:
By the satisfactory thermally conductive iron substrate storage of compression moulding, and size is sheared as needed.
Comparative example
A kind of thermally conductive iron substrate, including copper foil, conductive adhesive film, iron-based bottom plate, the conductive adhesive film is by epoxy resin and nothing The mixing of machine heat filling is sufficiently mixed and carries out the thermally conductive glue of magnetic absorption and is made through step S3.By step S5 in hot pressing It forms to obtain the final product.
Thermal conductivity and breakdown voltage resistant performance are carried out to copper-clad plate prepared in embodiment 1 to 5 and comparative example below Test, the test method of heating conduction are as follows: ASTM-D5470；Breakdown voltage resistant test method are as follows: IPC-TM-6502.5.6； Test result see the table below:
Thermal conductivity, breakdown voltage resistant is carried out to thermally conductive iron substrate prepared in embodiment 1 to 3 and comparative example below Performance test and peel strength test, the test method of heating conduction are as follows: ASTM-D5470；Breakdown voltage resistant test method Are as follows: IPC-TM-6502.5.6；The test method of peel strength is ASTM-D882.Test result see the table below:
The above list is only specific embodiments of the present invention, it is clear that present invention is not limited to the above embodiments, this field The those of ordinary skill's all deformations that directly can export or associate from present disclosure, should belong to the present invention Protection scope.

Claims (10)

1. a kind of production method of high thermal conductivity iron substrate, which comprises the following steps:
The production of S1, iron-based bottom plate:
S2, thermally conductive glue is prepared:
1) by epoxy resin and modified Nano inorganic heat filling be sufficiently mixed and revolving speed be 1200-2000r/min under Stirring obtains mixing adhesive solution at least 3 hours；
2) mixing adhesive solution is ground 1-2 times with nanometer scale ceramics grinder；
3) solution after grinding is stirred at least 4 hours in the case where revolving speed is 1200-2000r/min, and is put into magnet and carries out magnetic pole suction It is attached, obtain thermally conductive glue；
S3, production conductive adhesive film: prepared thermally conductive glue is passed through on the gap 80-150um roller coating to 25-35um release film, Then pass through high-temperature baking 3-6 minutes of 80-180 DEG C in baking oven, cooling obtains conductive adhesive film；
S4, plate combination: according to copper foil, conductive adhesive film, iron-based bottom plate or iron-based bottom plate, conductive adhesive film, copper foil sequence by plate Material is combined stacked；
It is S5, hot-forming: the plate combination for needing the number of plies will be stacked in the step S4 and be put into vacuum press, in 50- 230 DEG C, heated under the conditions of 10-30Kgf, compression moulding of pressurizeing, take out the thermally conductive iron substrate of compression moulding and be cooled to 50 DEG C or less；
S6, it cuts storage: the satisfactory thermally conductive iron substrate of compression moulding being put in storage, and size is cut as needed；
In step S2, the modified Nano inorganic heat filling is the preparation method is as follows: first by nano inorganic heat filling at 100 DEG C Baking oven in dry 1h, the Dextran 60-140g after taking oxidized activating, adjust pH value to 6-8 with sodium hydroxide, be then added The nano inorganic heat filling of 40-80g after drying, the two is uniformly mixed to flow back at 40-80 DEG C, stirs 1-12h, then in room Temperature is lower to stir 0.5-1.5h, then filters, and with ethanol washing, obtains modified Nano inorganic heat filling；
The glucan of the oxidized activating is made by following methods: 5-10ml deionized water is added in the glucan of 0.5-1.8g In, it is heated with stirring to 55-85 DEG C and makes it completely dissolved, obtain dextran solution；By 0.2-0.5g NaIO4Solid powder is dissolved in In 5-10ml deionized water, to NaIO4It is poured into after being completely dissolved in prepared dextran solution, solution maintains at 50-100 DEG C It is stirred 30-60min, obtains the glucan of oxidized activating.
2. a kind of production method of high thermal conductivity iron substrate according to claim 1, which is characterized in that the nano inorganic is led Hot filler is metal oxide Al2O3, MgO, ZnO, NiO, metal nitride AiN, SiN4, one of BN and SiC or several Kind, the average grain diameter of the nano inorganic heat filling is 5-120nm；The epoxy resin is bisphenol A type epoxy resin, bis-phenol It is F type epoxy resin, bisphenol-s epoxy resin, bisphenol-A epoxy resin, multiple functional radical glycidyl ether resin, multifunctional One or more of base epihydric alcohol amine resin, cycloaliphatic epoxy resin and heterocyclic epoxy resin.
3. a kind of production method of high thermal conductivity iron substrate according to claim 1, which is characterized in that in the step S1, Iron-based bottom plate production method particularly includes: a, be put into iron plate in lye oil removing 2-3 minutes；B, the iron plate after oil removing is used into 180- The polish-brush wheel of 800 mesh carries out the roughening of single side polish-brush；C, iron plate after polish-brush is washed with high pressure water；It d, is 5-15% with concentration Antirust agent to iron plate carry out antirust treatment；E, drying and processing is carried out to the iron plate after antirust treatment with 120-140 DEG C of hot wind, obtained To iron-based bottom plate.
4. a kind of production method of high thermal conductivity iron substrate according to claim 3, which is characterized in that the thickness of the iron plate For 0.2-2.0mm.
5. a kind of production method of high thermal conductivity iron substrate according to claim 3, which is characterized in that the lye is concentration 10-20%, the sodium hydroxide solution that temperature is 50-60 DEG C, the antirust agent are water-based antirust agent.
6. a kind of production method of high thermal conductivity iron substrate according to claim 1, which is characterized in that described in step S2 Epoxy resin and the mass ratio of modified Nano inorganic heat filling are 10-15:70-80.
7. a kind of production method of high thermal conductivity iron substrate according to claim 1, which is characterized in that described in step S3 Conductive adhesive film with a thickness of 80-160um, fugitive constituent 0.6-1.2%.
8. a kind of production method of high thermal conductivity iron substrate according to claim 1, which is characterized in that described in step S4 Copper foil with a thickness of 12-140um.
9. a kind of production method of high thermal conductivity iron substrate according to claim 1, which is characterized in that described in step S5 During compression moulding, vacuum time is kept at least 30 minutes at being kept at least 40 minutes, 230 DEG C.
10. a kind of production method of high thermal conductivity iron substrate according to claim 1, which is characterized in that described in step S6 Thermal conductivity >=15.0W/m.k of thermally conductive iron substrate, proof voltage >=2.0KV, peel strength >=1.5N/mm.
CN201811023894.0A 2018-09-04 2018-09-04 Manufacturing method of high-thermal-conductivity iron substrate Active CN109466152B (en)

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CN101792573A (en) * 2010-02-09 2010-08-04 广东生益科技股份有限公司 Halogen-free high heat-conducting resin composition and resin coated copper foil
CN103958578A (en) * 2011-10-19 2014-07-30 日东电工株式会社 Thermal-conductive sheet, led mounting substrate, and led module
CN104559183A (en) * 2014-12-09 2015-04-29 江苏大学 Preparation method of magnetic micro/nano composite filler/silicon rubber heat-conducting composite material
CN105001450A (en) * 2015-07-09 2015-10-28 天津大学 High-directional-thermal-conductivity carbon/polymer composite material and preparation method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101212957A (en) * 2005-06-29 2008-07-02 万能药生物有限公司 Novel pharmaceutical sustained release compositions and processes thereof
CN101792573A (en) * 2010-02-09 2010-08-04 广东生益科技股份有限公司 Halogen-free high heat-conducting resin composition and resin coated copper foil
CN103958578A (en) * 2011-10-19 2014-07-30 日东电工株式会社 Thermal-conductive sheet, led mounting substrate, and led module
CN104559183A (en) * 2014-12-09 2015-04-29 江苏大学 Preparation method of magnetic micro/nano composite filler/silicon rubber heat-conducting composite material
CN105001450A (en) * 2015-07-09 2015-10-28 天津大学 High-directional-thermal-conductivity carbon/polymer composite material and preparation method

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