CN109461376B - Backlight module, manufacturing method thereof and display device - Google Patents

Backlight module, manufacturing method thereof and display device Download PDF

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Publication number
CN109461376B
CN109461376B CN201811405657.0A CN201811405657A CN109461376B CN 109461376 B CN109461376 B CN 109461376B CN 201811405657 A CN201811405657 A CN 201811405657A CN 109461376 B CN109461376 B CN 109461376B
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light
film layer
reflective
substrate
reflection
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CN109461376A (en
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张冰
高亮
韩波
耿霄霖
禹璐
贾丽丽
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133605Direct backlight including specially adapted reflectors
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133611Direct backlight including means for improving the brightness uniformity

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The invention provides a backlight module, a manufacturing method thereof and a display device, wherein the backlight module comprises: the light-emitting plate comprises a first substrate, a plurality of light-emitting units and a first reflection film layer, wherein the light-emitting units and the first reflection film layer are arranged on the first substrate; the transparent and reflective film layer is arranged on the light-emitting plate and comprises a transmission film layer and a plurality of second reflection patterns, the transmission film layer is provided with a plurality of second hollow areas which are arranged in an array mode, the second reflection patterns correspond to the second hollow areas and are arranged in the corresponding second hollow areas, and a preset gap is formed between the transparent and reflective film layer and the light-emitting plate; the light-emitting units correspond to the second reflection patterns one to one, and the orthographic projection of the light-emitting units on the first substrate is positioned in the orthographic projection area of the second reflection patterns on the first substrate. The whole luminous luminance of backlight unit reduces the light efficiency loss, reduces backlight unit's consumption and thickness.

Description

Backlight module, manufacturing method thereof and display device
Technical Field
The invention relates to the technical field of display, in particular to a backlight module, a manufacturing method of the backlight module and a display device.
Background
The existing backlight module, especially a surface Light source formed by Mini Light emitting diodes (Mini LEDs), is provided with a direct type backlight module (BLU) structure, which facilitates realization of positioning single point adjustment (Local Dimming) to realize High Dynamic Range imaging (HDR) display, so that the backlight module has High contrast rendering characteristics.
Therefore, the existing backlight module has the technical problems of low lighting effect and large power consumption.
Disclosure of Invention
The embodiment of the invention provides a backlight module, a manufacturing method thereof and a display device, and aims to solve the technical problems of low light efficiency and high power consumption of the conventional backlight module.
In order to achieve the above purpose, the embodiments of the present invention provide the following specific schemes:
in a first aspect, an embodiment of the present invention provides a backlight module, including: :
the luminous plate comprises a first substrate, a plurality of luminous units and a first reflection film layer, wherein the luminous units and the first reflection film layer are arranged on the first substrate, the first reflection film layer is provided with a plurality of first hollow areas which are arranged in an array mode, and the luminous units correspond to the first hollow areas one to one and are arranged in the corresponding first hollow areas;
the transparent and reflective film layer is arranged on the light-emitting plate and comprises a transmission film layer and a plurality of second reflection patterns, the transmission film layer is provided with a plurality of second hollowed-out areas which are arranged in an array mode, the second reflection patterns correspond to the second hollowed-out areas one by one and are arranged in the corresponding second hollowed-out areas, and a preset gap is formed between the transparent and reflective film layer and the light-emitting plate;
the light-emitting units correspond to the second reflection patterns one to one, and the orthographic projection of the light-emitting units on the first substrate is located in the orthographic projection area of the second reflection patterns on the first substrate.
Optionally, the transflective film layer further comprises a second substrate, the second substrate is arranged on the light-emitting plate, the transmissive film layer and the reflective patterns are arranged on the second substrate, and the second substrate is used for forming the transflective film layer and the preset gap between the light-emitting plates.
Optionally, the first reflective film layer and/or the second reflective pattern at least include a reflective metal layer.
Optionally, the first reflective film layer includes a first insulating medium layer, a first reflective metal layer, and a second insulating medium layer sequentially formed on the first substrate;
the first insulating medium layer surrounds the lower surface of the first light-reflecting metal layer, and the second insulating medium layer surrounds the upper surface and the side surface of the first light-reflecting metal layer.
Optionally, the second reflective pattern includes a second light-reflecting metal layer and a third insulating medium layer.
Optionally, the first light-reflecting metal layer and/or the second light-reflecting metal layer are made of aluminum or silver; and/or the presence of a gas in the gas,
the first insulating medium layer and/or the third insulating medium layer are/is made of aluminum oxide; and/or the presence of a gas in the gas,
the second insulating medium layer is made of titanium oxide and silicon oxide.
Optionally, the backlight module further includes a diffusion film layer and a composite prism sequentially formed on the transflective film layer.
Optionally, the backlight module further includes a quantum dot film layer disposed between the transflective film layer and the diffusion film layer.
In a second aspect, an embodiment of the present invention provides a display device, including the backlight module according to any one of the first aspects.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a backlight module, which is used to manufacture the backlight module according to any one of the first aspect, and the method includes:
forming a first reflection film layer and a light emitting unit on a first substrate, wherein the first reflection film layer is provided with a plurality of first hollow areas arranged in an array manner, and the light emitting unit and the first hollow areas are in one-to-one correspondence and are arranged in the corresponding first hollow areas;
forming a transmission film layer and a second reflection pattern on the first reflection film layer, wherein a preset gap exists between the transmission film layer and the second reflection pattern, the transmission film layer is provided with a plurality of second hollowed-out areas which are arranged in an array manner, and the second reflection patterns and the second hollowed-out areas are in one-to-one correspondence and are arranged in the corresponding second hollowed-out areas;
the light emitting units correspond to the second reflection patterns one to one, and the orthographic projection of the light emitting units on the first substrate is located in the orthographic projection area of the second reflection patterns on the first substrate.
In this embodiment, the backlight module includes a light-emitting plate and a transflective film layer, a plurality of light-emitting units and a first reflective film layer are disposed on a first substrate of the light-emitting plate, the transflective film layer includes a transmissive film layer and a plurality of second reflective patterns, and the light-emitting units correspond to the second reflective patterns one to one, and an orthographic projection of the light-emitting units on the first substrate is located in an orthographic projection area of the second reflective patterns on the first substrate. Therefore, the emergent light of the light-emitting unit is projected to the corresponding second reflection pattern and is reflected to the first reflection film layer through the second reflection pattern, and the light-emitting brightness right above the light-emitting unit is reduced. The light reflected to the first reflection film layer is reflected to the transmission film layer again and is emitted through the transmission film layer, and the light emitting brightness of the area outside the light emitting unit is improved. From this, can the holistic luminance of backlight unit, even light effect is better, has reduced the light efficiency loss, has reduced module consumption and thickness under the condition that improves whole luminance.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a backlight module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another backlight module according to an embodiment of the invention;
fig. 3 is a schematic structural diagram of a first reflective film layer of a backlight module according to an embodiment of the invention;
fig. 4 to 8 are schematic views illustrating a manufacturing process of a light-emitting panel according to an embodiment of the invention;
fig. 9 is a graph showing a reflectivity result of the first reflective film layer of the backlight module according to the embodiment of the invention;
FIG. 10 is a schematic diagram of a sample comparison of a prior art ink light emitting panel with a light emitting panel of an embodiment of the present invention;
FIG. 11 is a graph illustrating the measured reflectance of a prior art ink light panel compared to a light panel of an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a second reflective pattern of the backlight module according to the embodiment of the invention;
FIG. 13 is a graph showing a reflectivity result of a second reflective pattern of the backlight module according to the embodiment of the present invention;
FIG. 14 is a graph showing the distribution of the light emission angle and the light ray of a Lambertian chip;
fig. 15 is a schematic structural diagram of a second reflective pattern of the backlight module according to the embodiment of the invention;
FIG. 16 is a schematic distribution diagram of a second reflective pattern of the backlight module according to the embodiment of the invention;
fig. 17 to 19 are schematic structural diagrams of a second reflective pattern of the backlight module according to the embodiment of the invention;
fig. 20 is a comparison graph of the front and rear effects of the light-emitting panel and the transflective film layer provided in the embodiment of the present invention;
fig. 21 is a schematic structural diagram of another backlight module according to an embodiment of the invention;
fig. 22 is a schematic flow chart illustrating a method for manufacturing a backlight module according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a backlight module according to an embodiment of the present invention. As shown in fig. 1, the backlight module 100 includes:
the light-emitting panel 110 comprises a first substrate 111, a plurality of light-emitting units 112 arranged on the first substrate 111, and a first reflection film layer 113, wherein the first reflection film layer 113 is provided with a plurality of first hollow-out areas arranged in an array manner, and the light-emitting units 112 correspond to the first hollow-out areas one to one and are arranged in the corresponding first hollow-out areas;
the transflective film layer 120 disposed on the light emitting panel 110 includes a transmissive film layer 122 and a plurality of second reflective patterns 121, the transmissive film layer 122 has a plurality of second hollow areas arranged in an array, the second reflective patterns 121 and the second hollow areas are in one-to-one correspondence, and are disposed in the corresponding second hollow areas, and a preset gap 123 exists between the transflective film layer 120 and the light emitting panel 110;
the light emitting units 112 correspond to the second reflective patterns 121 one to one, and the orthographic projection of the light emitting units 112 on the first substrate 111 is located in the orthographic projection area of the second reflective patterns 121 on the first substrate 111.
In this embodiment, the backlight module 100 includes a light-emitting plate 110 and a transflective film layer 120, the transflective film layer 120 is disposed on a side of a light-emitting surface of the light-emitting plate 110, and a predetermined gap 123 exists between the transflective film layer 120 and the light-emitting plate 110, so as to ensure a transmission process of light emitted from the light-emitting plate 110 between the light-emitting plate 110 and the transflective film layer 120. Specifically, the light emitting panel 110 includes a first substrate 111, a first reflective film 113 and a plurality of light emitting units 112, and the first reflective film 113 and the plurality of light emitting units 112 are disposed on the first substrate 111. The light emitting units 112 are arranged on the first substrate 111 in an array, and the first reflective film 113 is disposed on the first substrate 111 except for the light emitting units 112.
The first substrate 111 may be a Printed Circuit Board (PCB), a Flexible Circuit Board (FPC), or a Glass (Glass) substrate, and ensures the required flatness and strength of the light emitting panel 110, so as to perform the subsequent operations of fixing the light emitting unit 112 and forming the first reflective film 113. The light emitting unit 112 may be a light emitting chip, such as a Mini light emitting diode (Mini LED), and the backlight module 100 formed is a Mini LED backlight module 100.
The transflective film layer 120 of the backlight module 100 includes a transmissive film layer 122 and a plurality of second reflective patterns 121, the transmissive film layer 122 has a plurality of second hollow areas arranged in an array, and the second reflective patterns 121 correspond to the second hollow areas one to one. In addition, the light emitting units 112 on the light emitting panel 110 correspond to the second reflective patterns 121 of the transflective film layer 120 one by one, an orthographic projection of the light emitting units 112 on the first substrate 111 is located in an orthographic projection area of the second reflective patterns 121 on the first substrate 111, and a reflective surface of the second reflective patterns 121 faces the light emitting units 112. The light-emitting panel 110 is further provided with a first reflective film 113 for reflecting light. The transparent and reflective film layer 120 is used to replace the diffusion plate, so as to effectively reduce the thickness of the module.
Thus, when the light emitting unit 112 is turned on, the emergent light is projected onto the reflective surface of the second reflective pattern 121 of the corresponding area. The emergent light projected onto the second reflection image is partially transmitted, and partially reflected onto the first reflection film 113 of the light emitting panel 110 via the second reflection pattern 121, so that the luminance of the corresponding region of the light emitting unit 112 is reduced. The light reflected to the first reflective film 113 is reflected to the transmissive film 122 by the emitting surface of the first reflective film 113, and is emitted by the transmissive film 122, so that the light emitting brightness of other regions except the light emitting unit 112 is improved. Thus, the overall brightness of the backlight module 100 is relatively uniform.
Optionally, the first reflective film layer 113 and the second reflective film layer may at least include a reflective metal layer, and the reflective metal layer may be made of reflective metal, such as silver, copper, or aluminum.
Specifically, when the backlight module 100 is manufactured, the first reflective film 113 is formed on the first substrate 111, and the formed first reflective film 113 has a plurality of first hollow areas arranged in an array. Each first hollow-out region corresponds to one light-emitting unit 112, and the light-emitting units 112 are disposed in the corresponding first hollow-out regions. A plurality of light emitting units 112 may be disposed on the first substrate 111, and then a first reflective film 113 having a plurality of first hollow areas may be formed on other areas of the first substrate 111. Of course, the first reflective film layer 113 having a plurality of first hollow-out areas may be formed on the first substrate 111, and then the plurality of light emitting units 112 may be disposed corresponding to the plurality of first hollow-out areas.
When the transflective module is manufactured, the transmission film layer 122 may be formed first, the formed transmission film layer 122 includes a plurality of second hollow-out areas arranged in an array, and a second reflection pattern 121 is correspondingly formed in each second hollow-out area. Or a plurality of second reflective patterns 121 arranged in an array may be formed first, and then the transflective film layer 120 is formed, and a plurality of second hollow-out regions of the transflective film layer 120 correspond to the second reflective patterns 121 one by one. The first reflecting film layer 113 and the transflective film layer 120 are manufactured by adopting a vacuum coating process, and the graphic window is manufactured by adopting a photoetching process, so that the process is simple and easy to industrialize.
In the backlight module provided by the embodiment of the invention, the light emitted by the light-emitting unit is projected onto the corresponding second reflection pattern and is reflected onto the first reflection film layer through the second reflection pattern, so that the light-emitting brightness right above the light-emitting unit is reduced. The light reflected to the first reflection film layer is reflected to the transmission film layer again and is emitted through the transmission film layer, and the light emitting brightness of the area outside the light emitting unit is improved. From this, can the holistic luminance of backlight unit, even light effect is better, has reduced the light efficiency loss, has reduced backlight unit's consumption and thickness when improving whole luminance.
On the basis of the above embodiment, as shown in fig. 2, the transflective film layer 120 may further include a second substrate 124, the second substrate 124 is disposed on the light emitting panel 110, the transmissive film layer 122 and the plurality of second reflective patterns 121 are disposed on the second substrate 124, and the second substrate 124 is used for forming a predetermined gap 123 between the transflective film layer 120 and the light emitting panel 110.
In this embodiment, the transflective film layer 120 is additionally provided with a second substrate 124 for forming a predetermined gap 123 between the transflective film layer 120 and the light-emitting panel 110, so as to provide a transmission path for the light emitted from the light-emitting unit 112, thereby completing the light reflection and transmission processes. The second substrate 124 may be made of transparent plates such as glass and acrylic plates, which not only ensures normal transmission of light, but also ensures flatness and strength of the substrate. The reflectivity of the second reflective pattern 121 is 90 ± 1%, the second substrate 124 has 5% to 6% absorption loss of light efficiency, and there is 4% to 5% light transmittance right above the light emitting unit 112. The second reflective patterns 121 are disposed on the second substrate 124 and directly face the light emitting units 112, so that absorption loss of the second substrate 124 to light effects can be reduced.
In a specific implementation, the second substrate 124 may be disposed on the light emitting panel 110, and then the second reflective pattern 121 and the transmissive film layer 122 are formed on the second substrate 124, i.e., the transflective film layer 120 is formed. Thus, the transflective film layer 120 has a simple processing process, and the backlight module 100 has high overall stability and a small thickness.
In one embodiment, as shown in fig. 3, the first reflective film layer 113 may include a first insulating dielectric layer 114, a first reflective metal layer 115, and a second insulating dielectric layer 116 sequentially formed on the first substrate 111;
the first insulating dielectric layer 114 surrounds the lower surface of the first light-reflecting metal layer 115, and the second insulating dielectric layer 116 surrounds the upper surface and the side surface of the first light-reflecting metal layer 115.
Optionally, the first insulating dielectric layer 114 is made of aluminum oxide; and/or the presence of a gas in the gas,
the second insulating dielectric layer 116 is made of titanium oxide and silicon oxide.
In this embodiment, the first reflective film 113 is formed by combining a reflective metal and a dielectric film to achieve high reflectivity. The area of the first substrate 111 where the light emitting unit 112 is disposed is fixed, and as shown in fig. 4, a first insulating medium layer 114 is first formed on the entire surface of the first substrate 111, and the first insulating medium layer 114 is formed of oxygenMade of aluminium, e.g. Al 2 O 3 . As shown in fig. 5, a first reflective metal layer 115 is then plated on the first insulating medium layer 114, and aluminum oxide is used as a transition between the first reflective metal layer 115 and the first substrate 111, so as to effectively improve the adhesion of the first reflective metal layer 115. As shown in fig. 6, the light emitting unit 112 is then obtained by coating photoresist, exposing, developing and etching. As shown in fig. 7, next, a second insulating dielectric layer 116 is formed on the first reflective metal layer 115, and 1 to 10 dielectric layers may be formed, where the number of the dielectric layers may be adjusted according to the reflectivity and the production efficiency. As shown in fig. 8, a new light emitting unit 112 region is obtained by coating photoresist, exposing, developing and etching again. The thickness of each film layer of the luminous plate can be as follows
Table 1 shows:
Figure GDF0000013870080000071
Figure GDF0000013870080000081
TABLE 1
A first spacing (L1 shown in fig. 6) between adjacent light emitting cell 112 regions in the first light reflecting metal layer 115 is smaller than a second spacing (L2 shown in fig. 8) between adjacent light emitting cell 112 regions in the second insulating dielectric layer 116. Thus, the insulating medium layer protects the first reflective metal layer 115 and simultaneously improves the reflectivity of the whole film layer of the light-emitting panel 110, and the insulating medium layer isolates the first reflective metal layer 115 from the light-emitting unit 112 by increasing the distance between the light-emitting unit 112 areas, thereby effectively insulating the periphery of the light-emitting unit 112 and reducing the risk of short circuit of the light-emitting unit 112.
The result of the reflectivity test of the first reflective film 113 of the light-emitting panel 110 is shown in fig. 9, and the reflectivity reaches over 96% in the visible light band. The first insulating medium layer 114 surrounds the lower surface of the first light-reflecting metal layer 115, so that the adhesion force of the first light-reflecting metal layer 115 can be improved, and the first light-reflecting metal layer 115 and the bottom traces of the light-emitting units 112 can be further isolated. The second insulating medium layer 116 may be formed by stacking 1 to 10 insulating medium film layers, and the second insulating medium layer 116 surrounds the upper surface and the side surface of the first reflective metal layer 115, so that the risk of scratching the first reflective metal layer 115 can be reduced, and the reflectivity of the first reflective metal layer 115 in the wavelength band of visible light of 400nm to 500nm can be improved.
As shown in fig. 10, comparing the results of the conventional ink light emitting panel 110 (shown as a in fig. 10) and the high-reflectivity light emitting panel 110 (shown as b in fig. 10) of the backlight module 100 of the present embodiment, it can be seen that the light emitting panel 110 of the backlight module 100 of the present embodiment has a significant surface specular reflection effect, and the flatness and reflectivity thereof are greatly improved. As shown in fig. 11, comparing the reflectivity test results of the conventional ink light emitting panel (S1 shown in fig. 11) and the light emitting panel 110 (S2 shown in fig. 11) of the backlight module 100 provided in this embodiment, it can be seen that the reflectivity is greatly improved in the entire visible light band.
In another embodiment, as shown in fig. 12, the second reflective pattern 121 may include a second light reflecting metal layer 125 and a third insulating medium layer 126. Optionally, the third insulating dielectric layer 126 is made of aluminum oxide.
In this embodiment, the second reflective pattern 121 of the transflective film layer 120 includes a second reflective metal layer 125 and a third insulating medium layer 126, the second reflective metal layer 125 may be made of aluminum, and the third insulating medium layer 126 may be made of Al 2 O 3 As a protective layer for the second reflective metal, and may also serve as the transmissive film 122. The film thickness of the second reflective pattern is shown in table 2, and the reflectivity thereof is shown in fig. 13.
Number of layers Material and thickness
Second reflecting metal layer Al:150nm
A third insulating dielectric layer Al2O3:20nm
TABLE 2
On the basis of the above embodiment, the light emitting unit 112 may be a lambertian chip, and the light emitting angle distribution thereof is as shown in fig. 14. As can be seen from fig. 14, 75% of the light is between ± 45 °, and 25% of the light is distributed between 45 ° and 60 °. That is, most of the light is within ± 45 ° of the space directly above the light emitting unit 112. Therefore, the area of the second reflective pattern 121 needs to cover most of the light emitted directly above the light emitting unit 112, and the size of the second reflective pattern 121 may be varied according to the shape of the second reflective pattern.
When the second reflective pattern is circular, as shown in fig. 15 and 16, the size of the second reflective pattern 121 is D = L +2 × D × tan α, where L is the size of the light emitting unit 112, D is the width of the predetermined gap 123 between the second reflective pattern 121 and the light emitting unit 112, and α is the angle of the emitted light. In order to ensure that most of the outgoing light of the light-emitting unit 112 is blocked, the angular range of α may be set to 45 ° < α < 60 °. Alpha is larger than 45 degrees, which can ensure that 75 percent of emergent light of the light-emitting unit 112 is shielded to reduce the brightness of the center point of the light-emitting unit 112. A is less than 60 deg., it is ensured that the surface of the second reflective pattern 121 is not too large.
The width d of the predetermined gap 123 between the second reflective pattern 121 and the light emitting unit 112 is an important factor affecting the light path, and is directly related to the size of the second reflective pattern 121. If the second substrate 124 is used as the predetermined gap 123, the width of the predetermined gap 123 is the thickness of the second substrate 124. In addition, because the top of the light-emitting unit 112 is provided with the protective glue, the top of the light-emitting unit 112 can be directly attached to the film material without additionally reserving a gap.
For example, D =0.5 mm, the size L =0.53 mm of the light emitting unit 112, and the size D of the second reflective pattern 121 has a range: 0.53+2 + 0.5 + tan45 ° < D < 0.53+2 + 0.5 + tan 60, i.e. 1.53 mm < D < 2.26 mm.
As shown in fig. 16, the second reflective patterns 121 correspond to the light emitting units 112 one to one. If 1021Mini LED chips are used as the light emitting units 112, the size of the light emitting units is about 0.25 × 0.53, the interval between adjacent light emitting units 112 is 4.2 × 4.75 mm, the second reflective patterns 121 are circular dotted line regions, and the interval between the second reflective patterns 121 is the same as the interval between the light emitting units 112, which is 4.2 × 4.75 mm.
The second substrate 124 of the transflective film layer 120 may be a glass substrate with a thickness of 0.3 mm to 0.5 mm, a second reflective pattern 121 with a reflectivity of 90 ± 1% is formed directly above the light emitting unit 112, and the region outside the second reflective pattern 121 is the transmissive film layer 122. As shown in fig. 17, the second reflective pattern 121 may have a rectangular shape, and the intersection of the diagonal lines of the rectangular shape needs to be aligned with the geometric center of the light emitting unit 112. As shown in fig. 18, the second reflective pattern 121 may have an elliptical shape, and the intersection of the major and minor axes of the elliptical shape needs to be aligned with the center of the set of light emitting cells 112. As shown in fig. 19, the second reflective pattern 121 is a circle, and the center of the circle needs to be aligned with the center of the set of light emitting units 112.
The brightness uniformity of the backlight module 100 with the transflective film 120 can be seen to be more than 88% in any shape. Compared with the existing high-haze diffusion plate, the uniformity is improved by more than 15%. As shown in fig. 20, the actual effect diagram of the Mini LED lighting board 110 before (a shown in fig. 20) and after (b shown in fig. 20) the transflective film layer 120 is shown, and it can be seen that the shading effect of the Mini LED lighting board on the lamp shadow is very obvious. As shown in table 3, the brightness of the luminescent panel provided by the present invention is improved by about 24.8, and the uniformity is improved by 15%, as compared with the reflection brightness of the existing ink.
Figure GDF0000013870080000101
Figure GDF0000013870080000111
TABLE 3
In addition, as shown in fig. 21, the backlight module 100 may further include a diffusion film layer 130 and a composite prism 140 sequentially formed on the transflective film layer 120.
The light emitting unit 112 is emitted through the transmission film layer 122 by the reflection action of the second reflection pattern 121 and the first reflection film layer 113, and the light emitting brightness of the light emitting unit 112 is relatively uniform with that of other areas. The diffusion film further homogenizes the light emitted through the transflective film layer 120, and can effectively shield a boundary between the transmissive film layer 122 of the transflective film layer 120 and the second reflective pattern 121.
Further, as shown in fig. 21, the backlight module 100 further includes a quantum dot film layer 150 disposed between the transflective film layer 120 and the diffusion film layer 130.
The Quantum Dot film 150 (Quantum Dot, that is, QD film) can convert blue light emitted by the light-emitting unit 112 into white light, and the Quantum Dot particles also have high haze, so that an area with low luminance directly above the light-emitting unit 112 can be shielded, and the light-uniformizing effect is further optimized. The QD film is further homogenized in combination with the high haze diffusion film layer 130, so that a dark area right above the light emitting unit 112 is effectively shielded, and a good light homogenizing effect can be achieved without a diffusion plate. The compound prism 140 effectively condenses light, further improving the overall brightness of the backlight module 100.
Referring to fig. 22, fig. 22 is a schematic flow chart of a method for manufacturing a backlight module according to an embodiment of the present invention, where the backlight module is used to manufacture the backlight module according to the embodiment shown in fig. 1 and related embodiments. As shown in fig. 22, the method includes:
step 221, forming a first reflection film layer and light-emitting units on a first substrate, wherein the first reflection film layer is provided with a plurality of first hollow-out areas arranged in an array manner, and the light-emitting units are in one-to-one correspondence with the first hollow-out areas and are arranged in the corresponding first hollow-out areas;
step 222, forming a transmission film layer and a second reflection pattern on the first reflection film layer, wherein a preset gap exists between the transmission film layer and the second reflection pattern, the transmission film layer is provided with a plurality of second hollowed-out areas arranged in an array, and the second reflection patterns and the second hollowed-out areas are in one-to-one correspondence and are arranged in the corresponding second hollowed-out areas; the light emitting units correspond to the second reflection patterns one to one, and the orthographic projection of the light emitting units on the first substrate is located in the orthographic projection area of the second reflection patterns on the first substrate.
In the method for manufacturing a backlight module according to the embodiment of the present invention, the manufactured backlight module includes a light-emitting plate and a transparent reflective film layer, a first substrate of the light-emitting plate is provided with a plurality of light-emitting units and a second reflective film layer, the transparent reflective film layer includes a transparent film layer and a plurality of second reflective patterns, the light-emitting units correspond to the second reflective patterns one to one, and an orthographic projection of the light-emitting units on the first substrate is located in an orthographic projection area of the second reflective patterns on the first substrate. Therefore, the light emitted by the light-emitting unit is projected to the corresponding second reflection pattern and is reflected to the first reflection film layer through the second reflection pattern, and the light-emitting brightness right above the light-emitting unit is reduced. The light reflected to the first reflection film layer is reflected to the transmission film layer again and is emitted through the transmission film layer, and the light emitting brightness of the area outside the light emitting unit is improved. From this, can the holistic luminance of backlight unit, even light effect is better, has reduced the light efficiency loss, has reduced module consumption and thickness under the condition that improves whole luminance. For a specific implementation process of the method for manufacturing the backlight module according to the embodiment of the present invention, reference may be made to the specific implementation process of the backlight module provided in the foregoing embodiment, and details are not repeated here.
In addition, an embodiment of the present invention further provides a display device, including the backlight module according to the embodiment shown in fig. 1 and related embodiments.
In the display device provided by the embodiment of the present invention, the backlight module includes a light-emitting plate and a transflective film layer, a first substrate of the light-emitting plate is provided with a plurality of light-emitting units and a second reflective film layer, the transflective film layer includes a transmissive film layer and a plurality of second reflective patterns, the light-emitting units correspond to the second reflective patterns one by one, and an orthographic projection of the light-emitting units on the first substrate is located in an orthographic projection area of the second reflective patterns on the first substrate. Therefore, light rays emitted by the light-emitting unit are projected to the corresponding second reflection pattern and are reflected to the first reflection film layer through the second reflection pattern, and the light-emitting brightness right above the light-emitting unit is reduced. The light reflected to the first reflection film layer is reflected to the transmission film layer again and is absorbed and emitted through the transmission film layer, and therefore the light-emitting brightness of the area outside the light-emitting unit is improved. From this, can the holistic luminance of backlight unit, even light effect is better, has reduced the light efficiency loss, has reduced module consumption and thickness under the condition that improves whole luminance. For a specific implementation process of the display device provided in the embodiment of the present invention, reference may be made to the specific implementation process of the backlight module provided in the above embodiment, which is not described in detail herein.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (7)

1. A backlight module, comprising:
the luminous plate comprises a first substrate, a plurality of luminous units and a first reflection film layer, wherein the luminous units and the first reflection film layer are arranged on the first substrate, the first reflection film layer is provided with a plurality of first hollowed-out areas which are arranged in an array mode, the luminous units correspond to the first hollowed-out areas one to one and are arranged in the corresponding first hollowed-out areas, the first reflection film layer comprises a first insulating medium layer, a first light-reflecting metal layer and a second insulating medium layer which are sequentially formed on the first substrate, the first insulating medium layer surrounds the lower surface of the first light-reflecting metal layer, the second insulating medium layer surrounds the upper surface and the side surface of the first light-reflecting metal layer, and the second insulating medium layer also covers the bottom surface of the first hollowed-out area;
the transflective film layer is arranged on the light-emitting plate and comprises a transmissive film layer and a plurality of second reflective patterns, the transmissive film layer is provided with a plurality of second hollowed-out areas which are arranged in an array mode, the second reflective patterns correspond to the second hollowed-out areas one by one and are arranged in the corresponding second hollowed-out areas, a preset gap exists between the transflective film layer and the light-emitting plate, emergent light projected to the second reflective patterns is transmitted by a first part, and the second part is reflected to the first reflective film layer of the light-emitting plate through the second reflective patterns;
the light-emitting units correspond to the second reflection patterns one by one, and the orthographic projection of the light-emitting units on the first substrate is positioned in the orthographic projection area of the second reflection patterns on the first substrate;
the transflective film layer further comprises a second substrate, the second substrate is arranged on the light-emitting plate, the transmissive film layer and the plurality of second reflective patterns are arranged on the second substrate, and the second substrate is used for forming a preset gap between the transflective film layer and the light-emitting unit;
the backlight module further comprises: the quantum dot film comprises a quantum dot film layer arranged on the transparent and reflective film layer and a diffusion film layer arranged on the quantum dot film layer, wherein quantum dot particles contained in the quantum dot film layer have high haze.
2. The backlight module according to claim 1, wherein the first reflective film layer and/or the second reflective pattern at least comprises a reflective metal layer.
3. The backlight module as claimed in claim 2, wherein the second reflective pattern comprises a second reflective metal layer and a third insulating medium layer.
4. The backlight module according to claim 3, wherein the first and/or second reflective metal layers are made of aluminum or silver; and/or the presence of a gas in the gas,
the first insulating medium layer and/or the third insulating medium layer are/is made of aluminum oxide; and/or the presence of a gas in the gas,
the second insulating medium layer is made of titanium oxide and silicon oxide.
5. The backlight module of claim 1, further comprising a compound prism formed on the diffuser film layer.
6. A display device comprising the backlight module according to any one of claims 1 to 5.
7. A method for manufacturing a backlight module according to any one of claims 1 to 5, the method comprising:
forming a first reflection film layer and light-emitting units on a first substrate, wherein the first reflection film layer is provided with a plurality of first hollow-out areas which are arranged in an array, and the light-emitting units and the first hollow-out areas are in one-to-one correspondence and are arranged in the corresponding first hollow-out areas;
forming a transmission film layer and a second reflection pattern on the first reflection film layer, wherein a preset gap exists between the transmission film layer and the second reflection pattern, the transmission film layer is provided with a plurality of second hollowed-out areas which are arranged in an array manner, and the second reflection patterns and the second hollowed-out areas are in one-to-one correspondence and are arranged in the corresponding second hollowed-out areas;
the light emitting units correspond to the second reflection patterns one to one, and the orthographic projection of the light emitting units on the first substrate is located in the orthographic projection area of the second reflection patterns on the first substrate.
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