CN109457283A - Flat parts electro-plating method - Google Patents

Flat parts electro-plating method Download PDF

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Publication number
CN109457283A
CN109457283A CN201811466134.7A CN201811466134A CN109457283A CN 109457283 A CN109457283 A CN 109457283A CN 201811466134 A CN201811466134 A CN 201811466134A CN 109457283 A CN109457283 A CN 109457283A
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CN
China
Prior art keywords
flat parts
plating method
electro
mixing container
spice
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811466134.7A
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Chinese (zh)
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CN109457283B (en
Inventor
范安平
金妤
黄瑜
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SHANGHAI RADIALL ELECTRONIC CO Ltd
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SHANGHAI RADIALL ELECTRONIC CO Ltd
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Priority to CN201811466134.7A priority Critical patent/CN109457283B/en
Publication of CN109457283A publication Critical patent/CN109457283A/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention provides a kind of flat parts electro-plating method, the following steps are included: S1, flat parts to be electroplated and the spice part for being used for isolating plate-like part are poured into mixing container together, the cathode of mixing container and DC power supply is electrically connected, spice part is connected in series by two rings being located in Different Plane, and the size of the ring and the size of flat parts match;Mixing container is put into electroplate liquid so that flat parts are immersed in electroplate liquid by S2, and in the plating process, mixing container mixes flat parts and spice part, and spice part is mixed in flat parts so that two flat parts being bonded to each other are separated from each other.The phenomenon that be bonded to each other two flat parts can be separated from each other, avoid flat parts plating leakage by the present invention, is greatly improved the electroplating quality of flat parts.

Description

Flat parts electro-plating method
Technical field
The invention belongs to electroplating technologies, more particularly to a kind of flat parts electro-plating method.
Background technique
When a large amount of or multiple flat parts are electroplated, two adjacent flat parts are easy to fit together mutually, thus Leading to certain surfaces of flat parts does not have coating.
Existing electro-plating method: winding copper wire on flat parts, to prevent flat parts to be bonded to each other.However, in electricity After the completion of plating, the surface of flat parts can leave the winding trace of copper wire.In addition, needing to twine each flat parts before plating It after copper wire, plating, and needs to remove on the copper wire on each flat parts, entire electroplating process is time-consuming and laborious.
Summary of the invention
In view of the foregoing deficiencies of prior art, the technical problem to be solved in the present invention is that providing a kind of flat parts Electro-plating method is greatly improved the phenomenon that capable of being separated from each other by be bonded to each other two flat parts, avoid flat parts plating leakage The electroplating quality of flat parts.
In order to solve the above technical problem, the present invention provides a kind of flat parts electro-plating methods, comprising the following steps:
S1 pours into flat parts to be electroplated and the spice part for being used for isolating plate-like part in mixing container together, The cathode of mixing container and DC power supply is electrically connected, and spice part is connected in series by two rings being located in Different Plane, institute The size of the size and flat parts of stating ring matches;
S2, is put into electroplate liquid for mixing container so that flat parts are immersed in electroplate liquid, in the plating process, mixing container Flat parts and spice part are mixed, spice part is mixed in flat parts two sheets zero so as to be bonded to each other Part is separated from each other.
Preferably, the spherical shape in two surfaces of the flat parts.
Preferably, the flat parts and ring are rounded, and the diameter of flat parts and the diameter of ring match.
Preferably, the spice part is bent by wire.
Preferably, the spice part is made of an electrically conducting material.
Preferably, the spice part is integrally formed by hard material.
Preferably, the ring is rounded, one of rectangular, triangle.
Preferably, the plane where a ring is mutually perpendicular to the plane where ring described in another.
Preferably, the mixing container is made of roller, and the rotation axis of roller is horizontally disposed, and the inner cavity of roller, which is constituted, to be used for Accommodate the accommodation space of flat parts.
Preferably, the side wall of the mixing container is equipped with the multiple through-holes for allowing electroplate liquid to circulate.
As described above, flat parts electro-plating method of the invention, has the advantages that in flat parts of the invention In electro-plating method, mixing container mixes flat parts and spice part, and spice part is by being located in Different Plane Two rings are connected in series, so that be bonded to each other two flat parts can be separated from each other when being mixed in flat parts, The electroplating quality of flat parts is greatly improved in the phenomenon that avoiding flat parts plating leakage.
Detailed description of the invention
Fig. 1 is shown as the schematic diagram of flat parts of the invention;
Fig. 2 is shown as the schematic diagram of spice part of the invention;
Fig. 3 is shown as the schematic diagram of spice part isolating plate-like part;
Fig. 4 is shown as the plating schematic diagram of flat parts.
Component label instructions
1 flat parts
2 spice parts
21 rings
3 mixing containers
4 DC power supplies
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation Content disclosed by book is understood other advantages and efficacy of the present invention easily.
It should be clear that structure, ratio, size etc. depicted in this specification institute attached drawing, only to cooperate specification to be taken off The content shown is not intended to limit the invention enforceable qualifications so that those skilled in the art understands and reads, therefore Do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the present invention Under the effect of can be generated and the purpose that can reach, the model that disclosed technology contents can be covered should all be still fallen in In enclosing.Meanwhile cited such as "upper" in this specification, "lower", "left", "right", " centre " and " one " term, be also only Convenient for being illustrated for narration, rather than to limit the scope of the invention, relativeness is altered or modified, in no essence It changes under technology contents, when being also considered as the enforceable scope of the present invention.
As shown in Figure 1, Figure 2, shown in Fig. 3 and Fig. 4, the present invention provides a kind of flat parts electro-plating method, comprising the following steps:
Flat parts 1 to be electroplated and the spice part 2 for being used for isolating plate-like part 1 are poured into mixing container 3 by S1 together Interior, the cathode of mixing container 3 and DC power supply 4 is electrically connected, and spice part 2 is connected by two rings 21 being located in Different Plane It forms, the size of above-mentioned ring 21 and the size of flat parts 1 match;
Mixing container 3 is put into electroplate liquid so that flat parts 1 are immersed in electroplate liquid by S2, and in the plating process, mixing holds Device 3 mixes flat parts 1 and spice part 2, and spice part 2 is mixed in flat parts 1 so that two be bonded to each other A flat parts 1 are separated from each other.
Since flat parts 1 of the invention are easy to fit together in plating, the part of the surface of flat parts 1 is not plated Upper metal layer, it may appear that the phenomenon that plating leakage.In flat parts electro-plating method of the invention, mixing container 3 is by 1 He of flat parts Spice part 2 mixes, and spice part 2 is connected in series by two rings 21 being located in Different Plane, so that being mixed in When in flat parts 1, the phenomenon that capable of being separated from each other by be bonded to each other two flat parts 1, avoid 1 plating leakage of flat parts, The electroplating quality of flat parts 1 is greatly improved.
Two surfaces of above-mentioned flat parts 1 can be in planar, and two surfaces of flat parts 1 can also be spherical Shape.
When above-mentioned flat parts 1 and rounded ring 21, the diameter of the diameter and ring 21 of flat parts 1 matches, this Sample is more easier two flat parts 1 that separation is bonded to each other.
Above-mentioned ring 21 is rounded, one of rectangular, triangle.When ring 21 is rounded, the electroplating quality of flat parts 1 Most preferably.The size of two rings 21 of above-mentioned spice part 2 may be the same or different, when the size of two rings 21 is big When small identical, it is more easier two flat parts 1 that separation is bonded to each other.
For the ease of making above-mentioned spice part 2, above-mentioned spice part 2 is integrally formed by hard material, specifically, spice Part 2 can be bent by wire.
In order to further increase the electroplating quality of above-mentioned flat parts 1, above-mentioned spice part 2 is made of an electrically conducting material.
In order to easily facilitate two flat parts 1 being bonded to each other of separation, plane where an above-mentioned ring 21 with it is another Plane where a above-mentioned ring 21 is mutually perpendicular to.
Above-mentioned mixing container 3 can be made of vibration plate;Above-mentioned mixing container 3 can also be made of roller, which turns Moving axis is horizontally disposed, and the inner cavity of roller constitutes the accommodation space for accommodating flat parts 1.When mixing container 3 is made of roller When, the electroplating quality of flat parts 1 is more preferably.
For the ease of immersing above-mentioned flat parts 1 into electroplate liquid, the side wall of above-mentioned mixing container 3, which is equipped with, allows electricity Multiple through-holes of plating solution circulation.
In conclusion two flat parts that flat parts electro-plating method of the invention can will be bonded to each other mutually divide From the phenomenon that avoiding flat parts plating leakage, the electroplating quality of flat parts being greatly improved.So the present invention effectively overcomes now There is the various shortcoming in technology and has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as At all equivalent modifications or change, should be covered by the claims of the present invention.

Claims (10)

1. a kind of flat parts electro-plating method, which comprises the following steps:
Flat parts (1) to be electroplated and the spice part (2) for isolating plate-like part (1) are poured into mixing together and held by S1 In device (3), the cathode of mixing container (3) and DC power supply (4) is electrically connected, and spice part (2) is by being located in Different Plane Two rings (21) are connected in series, and the size of the ring (21) and the size of flat parts (1) match;
Mixing container (3) is put into electroplate liquid so that flat parts (1) are immersed in electroplate liquid by S2, and in the plating process, mixing holds Device (3) mixes flat parts (1) and spice part (2), and spice part (2) is mixed in flat parts (1) so that phase Two flat parts (1) being mutually bonded are separated from each other.
2. flat parts electro-plating method according to claim 1, it is characterised in that: two surfaces of the flat parts (1) Spherical shape.
3. flat parts electro-plating method according to claim 1, it is characterised in that: the flat parts (1) and ring (21) Rounded, the diameter of the diameter and ring (21) of flat parts (1) matches.
4. flat parts electro-plating method according to claim 1, it is characterised in that: the spice part (2) is by wire It bends.
5. flat parts electro-plating method according to claim 1, it is characterised in that: the spice part (2) is by conduction material Material is made.
6. flat parts electro-plating method according to claim 1, it is characterised in that: the spice part (2) is by hard material Material is integrally formed.
7. flat parts electro-plating method according to claim 1, it is characterised in that: the ring (21) is rounded, it is rectangular, three It is one of angular.
8. flat parts electro-plating method according to claim 1, it is characterised in that: the plane where a ring (21) It is mutually perpendicular to the plane where ring described in another (21).
9. flat parts electro-plating method according to claim 1, it is characterised in that: the mixing container (3) is by roller structure At the rotation axis of roller is horizontally disposed, and the inner cavity of roller constitutes the accommodation space for accommodating flat parts (1).
10. flat parts electro-plating method according to claim 1, it is characterised in that: on the side wall of the mixing container (3) Equipped with the multiple through-holes for allowing electroplate liquid to circulate.
CN201811466134.7A 2018-12-03 2018-12-03 Electroplating method for sheet-shaped parts Active CN109457283B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811466134.7A CN109457283B (en) 2018-12-03 2018-12-03 Electroplating method for sheet-shaped parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811466134.7A CN109457283B (en) 2018-12-03 2018-12-03 Electroplating method for sheet-shaped parts

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CN109457283A true CN109457283A (en) 2019-03-12
CN109457283B CN109457283B (en) 2021-04-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112281202A (en) * 2020-10-21 2021-01-29 广州九岳天装饰工程有限公司 Hardware electroplating machine

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842799A (en) * 1981-09-04 1983-03-12 Fujitsu Ltd Barrel plating method
CN1357648A (en) * 2000-12-11 2002-07-10 Aem公司 Electroplating equipment
CN2890094Y (en) * 2005-06-07 2007-04-18 武汉材料保护研究所 Sheet type magnetic-parts vibration device for electroplating aluminium
CN101139732A (en) * 2006-07-06 2008-03-12 上村工业株式会社 Surface treatment apparatus for small object
CN103122474A (en) * 2013-02-06 2013-05-29 铜陵市晶顺电子有限责任公司 Electroplating roller for sheet parts
CN103484922A (en) * 2013-09-09 2014-01-01 浙江英洛华磁业有限公司 End cover for electroplating barrel
CN105088323A (en) * 2015-08-12 2015-11-25 深圳市环翔精饰工业有限公司 Plate type electroplating hanger
CN207537587U (en) * 2017-12-01 2018-06-26 无锡乐普金属科技有限公司 Electroplating flower basket

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842799A (en) * 1981-09-04 1983-03-12 Fujitsu Ltd Barrel plating method
CN1357648A (en) * 2000-12-11 2002-07-10 Aem公司 Electroplating equipment
CN2890094Y (en) * 2005-06-07 2007-04-18 武汉材料保护研究所 Sheet type magnetic-parts vibration device for electroplating aluminium
CN101139732A (en) * 2006-07-06 2008-03-12 上村工业株式会社 Surface treatment apparatus for small object
CN103122474A (en) * 2013-02-06 2013-05-29 铜陵市晶顺电子有限责任公司 Electroplating roller for sheet parts
CN103484922A (en) * 2013-09-09 2014-01-01 浙江英洛华磁业有限公司 End cover for electroplating barrel
CN105088323A (en) * 2015-08-12 2015-11-25 深圳市环翔精饰工业有限公司 Plate type electroplating hanger
CN207537587U (en) * 2017-12-01 2018-06-26 无锡乐普金属科技有限公司 Electroplating flower basket

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
沈涪: "《接插件电镀》", 31 May 2007, 国防工业出版社 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112281202A (en) * 2020-10-21 2021-01-29 广州九岳天装饰工程有限公司 Hardware electroplating machine

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