CN109449186A - Oled display substrate motherboard and preparation method thereof and OLED display - Google Patents
Oled display substrate motherboard and preparation method thereof and OLED display Download PDFInfo
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- CN109449186A CN109449186A CN201811303031.9A CN201811303031A CN109449186A CN 109449186 A CN109449186 A CN 109449186A CN 201811303031 A CN201811303031 A CN 201811303031A CN 109449186 A CN109449186 A CN 109449186A
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- barrier structure
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
Abstract
The present invention provides a kind of oled display substrate motherboard and preparation method thereof and OLED display, the oled display substrate motherboard includes the display area of multiple array arrangements, the described method includes: being formed before anode within the display area, barrier structure is formed between the domain of adjacent display areas.Oled display substrate motherboard provided by the invention and preparation method thereof and OLED display are able to solve the problem of Argent grain causes adverse effect, reduce OLED display production yield to other display base plates.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of oled display substrate motherboard and preparation method thereof and
OLED display.
Background technique
Due to Organic Light Emitting Diode (Organic Light-emitting Diode, abbreviation OLED) have self-luminous,
Wide viewing angle, high contrast, compared with low power consumption, high reaction speed the advantages that so that OLED technology is gradually aobvious in mobile phone screen, TV
The display fields such as display screen curtain, medical monitoring instrument are popularized, and have harvested extensive concern.
In the prior art, Argent grain can be generated in the anode etching process of production flexible circuit board, these Argent grains hold
It is easily rinsed to adjacent oled display substrate, causes the bad of the liquid crystal cell (cell) in other oled display substrates, drop
The production yield of low OLED display.
Summary of the invention
The embodiment of the present invention provides a kind of oled display substrate motherboard and preparation method thereof and OLED display, with solution
Certainly the Argent grain in anode etching process rinses asking for the production yield that OLED display is reduced to other oled display substrates
Topic.
It is as follows that in order to solve the above technical problem, the present invention provides technical solutions:
In a first aspect, the embodiment of the present invention provides a kind of production method of oled display substrate motherboard, the OLED is shown
Substrate motherboard includes the display area of multiple array arrangements, is formed before anode within the display area, in adjacent display areas
Barrier structure is formed between domain.
It is further, described to form barrier structure between the domain of adjacent display areas, comprising:
A wherein layer function film layer for the oled display substrate motherboard is formed by a patterning processes and is located at adjacent
Barrier structure between display area.
It is further, described to form barrier structure between the domain of adjacent display areas, comprising:
By a patterning processes formed the oled display substrate motherboard flatness layer and be located at adjacent display areas domain it
Between barrier structure.
Further, it is described pass through a patterning processes formed the oled display substrate motherboard flatness layer and be located at phase
Barrier structure between adjacent display area, comprising:
Flat material layer is formed, coats photoresist on the flat material layer；
The photoresist is exposed using mask plate, the photoresist for forming corresponding display area and barrier zones retains
The photoresist in region and other corresponding regions removes region, wherein the barrier zones are between the domain of adjacent display areas；
After development, the photoresist in photoresist removal region is removed；
Etch away the flat material layer in photoresist removal region；
Flatness layer is formed in the display area, forms barrier structure in the barrier zones.
Further, the flatness layer for passing through a patterning processes and forming the oled display substrate motherboard, and in phase
Barrier structure is formed between adjacent display area, comprising:
Flat material layer is formed, coats photoresist on the flat material layer；
The photoresist is exposed using mask plate, photoresist retention area is formed, corresponds to the first of barrier zones
Photoresist removes region and second photoresist in other corresponding regions removes region, and the photoresist retention area includes pair
Answer the first area of display area and the second area of corresponding elongated area, the elongated area from the display area to
Other display areas extend and surround the barrier zones；
After development, the photoresist in the first photoresist removal region and second photoresist removal region is removed；
Etch away the flat material layer in the first photoresist removal region and second photoresist removal region；
Flatness layer is formed in the display area, forms barrier structure in the barrier zones.
Further, after forming anode layer, further includes:
The organic layer for covering the display area and the barrier structure is formed, so that the organic layer upper surface is smooth
Surface.
Second aspect, the embodiment of the present invention also provide a kind of oled display substrate motherboard, the oled display substrate motherboard
Display area including multiple array arrangements, including flatness layer, the Yi Jiwei on underlay substrate and positioned at the display area
Barrier structure between the domain of adjacent display areas.
Further, the oled display substrate motherboard further includes the cutting region between the domain of adjacent display areas, institute
It states barrier structure and is located at the cutting region.
The third aspect, the embodiment of the present invention also provide a kind of oled display substrate, and the oled display substrate is institute as above
The oled display substrate motherboard stated is cut.
Fourth aspect, the embodiment of the present invention also provide a kind of OLED display, including OLED as described above shows base
Plate.
It, can be in anode by forming barrier structure between the domain of adjacent display areas in technical solution provided by the invention
The Argent grain being rinsed is stopped to enter the display area of other display base plates in etching process, so as to solve Argent grain to it
The problem of his display base plate causes adverse effect, reduces OLED display production yield.Therefore, technical side provided by the invention
Case can be avoided Argent grain and cause adverse effect to other display base plates, it is ensured that the production yield of OLED display.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without any creative labor, it can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the schematic diagram of oled display substrate motherboard in the prior art；
Fig. 2 is a kind of schematic diagram of oled display substrate motherboard provided in an embodiment of the present invention；
Fig. 3 is the schematic diagram of another oled display substrate motherboard provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Oled display substrate motherboard in the prior art, as shown in Figure 1, comparing between the display area of multiple array arrangements
It is flat, therefore the Argent grain that generates in anode etching process is unimpeded is able to enter in other oled display substrates, it is right
Other oled display substrates cause adverse effect, lead to the problem of reducing OLED display yield.
The embodiment of the present invention in view of the above-mentioned problems, provide a kind of oled display substrate motherboard and preparation method thereof and
OLED display can stop the Argent grain being rinsed to enter the viewing area of other display base plates in anode etching process
Domain causes adverse effect so as to solve Argent grain to other display base plates, reduces asking for OLED display production yield
Topic.
The embodiment of the present invention provides a kind of production method of oled display substrate motherboard, the oled display substrate motherboard packet
Include the display area of multiple array arrangements, which comprises
It is formed before anode within the display area, forms barrier structure between the domain of adjacent display areas.
In the present embodiment, by forming barrier structure between the domain of adjacent display areas, it can be hindered in anode etching process
The display area that the Argent grain being rinsed enters other display base plates is kept off, is made so as to solve Argent grain to other display base plates
At adverse effect, the problem of reducing OLED display production yield.Therefore, technical solution provided by the invention can be avoided silver
Particle causes adverse effect to other display base plates, it is ensured that the production yield of OLED display.
Above-mentioned oled display substrate motherboard can be flexible display substrates motherboard, be also possible to rigid display base plate motherboard.
When display base plate motherboard is flexible display substrates motherboard, underlay substrate uses flexible substrate substrate, such as Kapton；
When display base plate motherboard is rigid display base plate motherboard, underlay substrate uses rigid substrate substrate, such as quartz base plate or glass
Glass substrate.
Above-mentioned display area will form anode in the manufacturing process of subsequent oled display substrate motherboard.
Wherein, before anode formation, oled display substrate motherboard includes underlay substrate and is located on the underlay substrate
At least one layer of structure, the barrier structure can be set in any layer structure at least one layer of structure, and
Play the effect for stopping Argent grain to enter other oled display substrates.The barrier structure can be the block of protrusion (such as Fig. 2 institute
Show), so that Argent grain be stopped to enter other oled display substrates, reaches and Argent grain is avoided to cause not other oled display substrates
The effect of good influence；The barrier structure is also possible to groove (as shown in Figure 3, wherein the invisible part that is recessed is represented by dotted lines),
To accommodate the Argent grain that can enter other oled display substrates originally, it equally can achieve and avoid Argent grain aobvious to other OLED
Show that substrate causes dysgenic effect.
It when above-mentioned barrier structure is block, can be on underlay substrate after forming layer structure, pass through the modes such as deposition
Block is additionally formed in layer structure；It is also possible to by forming block with a patterning processes while forming layer structure,
It is not limited thereto.
Likewise, can be when above-mentioned barrier structure is groove and after forming layer structure, pass through etching on underlay substrate
Etc. modes be additionally formed groove in layer structure；It is also possible to while forming layer structure by being formed with a patterning processes
Groove is not limited thereto.
It is in some alternative embodiments, described to form barrier structure between the domain of adjacent display areas, comprising:
A wherein layer function film layer for the oled display substrate motherboard is formed by a patterning processes and is located at adjacent
Barrier structure between display area.
Wherein, above-mentioned functional film layer is to form the anode established functional film layer on underlay substrate before.It is formed simultaneously
Functional film layer can be the film layer directly contacted with anode, then at this time barrier structure can be used directly to stop Argent grain it is (recessed
Slot is used to accommodate Argent grain/block and is used to stop Argent grain).In addition, the functional film layer being formed simultaneously be also possible to not with anode
The film layer directly contacted, then the other function film layer being now between anode and the functional film layer are corresponding because of barrier structure
(covering groove is simultaneously formed using other function film layer as the groove of slot bottom/covering block and is formed with other function for recurring structure variation
Energy film layer is the block on surface), and can equally play the effect for stopping Argent grain to enter other oled display substrates.
It is formed simultaneously a layer function film layer and barrier structure by a patterning processes, additional production resistance can be saved every time
The Production Time of structure is kept off, the producing efficiency of oled display substrate motherboard is improved.
It is further, described to form barrier structure between the domain of adjacent display areas, comprising:
By a patterning processes formed the oled display substrate motherboard flatness layer and be located at adjacent display areas domain it
Between barrier structure.
The functional film layer being formed simultaneously in an i.e. above-mentioned patterning processes with barrier structure is flatness layer.
It is described to pass through a patterning processes shape in an optional specific embodiment by taking barrier structure is block as an example
Flatness layer at the oled display substrate motherboard and the barrier structure between the domain of adjacent display areas, comprising:
Flat material layer is formed, coats photoresist on the flat material layer；
The photoresist is exposed using mask plate, the photoresist for forming corresponding display area and barrier zones retains
The photoresist in region and other corresponding regions removes region, wherein the barrier zones are between the domain of adjacent display areas；
After development, the photoresist in photoresist removal region is removed；
Etch away the flat material layer in photoresist removal region；
Flatness layer is formed in the display area, forms barrier structure in the barrier zones.
The photoresist and flat material layer in region are removed in photoresist by removing, is retained in the light of photoresist retention area
Photoresist and flat material layer, to form the barrier structure of protrusion, the protrusion between the adjacent display areas domain of otherwise flat
Barrier structure the Argent grain of generation can be stopped in subsequent anode etching process, protect other oled display substrates from
The adverse effect of Argent grain, it is ensured that the production yield of OLED display.
It is described to pass through a patterning processes and formed in another optional embodiment by taking barrier structure is groove as an example
The flatness layer of the oled display substrate motherboard, and barrier structure is formed between the domain of adjacent display areas, comprising:
Flat material layer is formed, coats photoresist on the flat material layer；
The photoresist is exposed using mask plate, photoresist retention area is formed, corresponds to the first of barrier zones
Photoresist removes region and second photoresist in other corresponding regions removes region, and the photoresist retention area includes pair
Answer the first area of display area and the second area of corresponding elongated area, the elongated area from the display area to
Other display areas extend and surround the barrier zones；
After development, the photoresist in the first photoresist removal region and second photoresist removal region is removed；
Etch away the flat material layer in the first photoresist removal region and second photoresist removal region；
Flatness layer is formed in the display area, forms barrier structure in the barrier zones.
Region is removed by the first photoresist of removal and the second photoresist removes the photoresist and flat material layer in region, is protected
The photoresist and flat material layer of photoresist retention area are stayed in, to form recess on the elongated area of otherwise flat
Barrier structure, the barrier structure of the recess can accommodate can be from flat extension by the script of generation in subsequent anode etching process
Region enters the Argent grain of other oled display substrates, protects other oled display substrates from the adverse effect of Argent grain, really
Protect the production yield of OLED display.
In other optional embodiments, after forming anode layer, further includes:
The organic layer for covering the display area and the barrier structure is formed, so that the organic layer upper surface is smooth
Surface.
Specifically, photoresist (PR glue) can be filled and led up before covering organic layer the case where barrier structure is groove
Groove covers organic layer on display area and barrier structure again later, so that the upper surface of organic layer is even curface.
In the case where barrier structure is block, block can be removed in a manner of etching, cutting etc. by first passing through in advance, Zhi Houzai
Organic layer is covered on display area and barrier structure, so that the upper surface of organic layer is even curface.
The smooth organic layer in formation upper surface can be avoided subsequent to OLED display base on display area and barrier structure
The influence of plate motherboard production, it is ensured that the production yield of oled display substrate motherboard.
The embodiment of the present invention also provides a kind of oled display substrate motherboard, and the display area including multiple array arrangements is gone back
Including on underlay substrate and be located at the display area flatness layer and the blocking junction between the domain of adjacent display areas
Structure.
In the present embodiment, barrier structure between the domain of adjacent display areas can stop quilt in anode etching process
The Argent grain of flushing enters the display area of other display base plates, causes not so as to solve Argent grain to other display base plates
The problem of good influence, reduction OLED display production yield.Therefore, technical solution provided by the invention can be avoided Argent grain
Adverse effect is caused to other display base plates, it is ensured that the production yield of OLED display.
Above-mentioned oled display substrate motherboard can be flexible display substrates motherboard, be also possible to rigid display base plate motherboard.
When display base plate motherboard is flexible display substrates motherboard, underlay substrate uses flexible substrate substrate, such as Kapton；
When display base plate motherboard is rigid display base plate motherboard, underlay substrate uses rigid substrate substrate, such as quartz base plate or glass
Glass substrate.
Above-mentioned display area will form anode in the manufacturing process of subsequent oled display substrate motherboard.
Wherein, before anode formation, oled display substrate motherboard includes underlay substrate and is located on the underlay substrate
At least one layer of structure, the barrier structure can be set in any layer structure at least one layer of structure, and
Play the effect for stopping Argent grain to enter other oled display substrates.The barrier structure can be the block of protrusion (such as Fig. 2 institute
Show), so that Argent grain be stopped to enter other oled display substrates, reaches and Argent grain is avoided to cause not other oled display substrates
The effect of good influence；The barrier structure is also possible to groove (as shown in Figure 3, wherein the invisible part that is recessed is represented by dotted lines),
To accommodate the Argent grain that can enter other oled display substrates originally, it equally can achieve and avoid Argent grain aobvious to other OLED
Show that substrate causes dysgenic effect.
It when above-mentioned barrier structure is block, can be on underlay substrate after forming layer structure, pass through the modes such as deposition
Block is additionally formed in layer structure；It is also possible to form block by a patterning processes while forming layer structure,
This is not construed as limiting.
Likewise, can be when above-mentioned barrier structure is groove and after forming layer structure, pass through etching on underlay substrate
Etc. modes be additionally formed groove in layer structure；It is also possible to be formed while forming layer structure by a patterning processes recessed
Slot is not limited thereto.
In addition, can be and oled display substrate motherboard in the case where forming barrier structure by a patterning processes
A wherein layer function film layer be formed simultaneously, above-mentioned functional film layer is to form before anode the established function on underlay substrate
Film layer.
The functional film layer being formed simultaneously can be the film layer directly contacted with anode, then barrier structure can be used directly at this time
To stop Argent grain (groove is used to accommodate Argent grain/block and is used to stop Argent grain).In addition, the functional film layer being formed simultaneously
It can be the film layer not contacted directly with anode, be then now in the other function film layer between anode and the functional film layer because of resistance
Keep off structure and the variation of corresponding recurring structure (covering groove is simultaneously formed using other function film layer as the groove of slot bottom/covering block
And formed using other function film layer as the block on surface), and can equally play and Argent grain is stopped to enter other OLED display base
The effect of plate.
Further, the oled display substrate motherboard further includes the cutting region between the domain of adjacent display areas, institute
It states barrier structure and is located at the cutting region.
Oled display substrate is obtained after the cutting region cutting of oled display substrate motherboard by laser, by by blocking junction
Structure is designed at cutting region, without the influence in order to avoid barrier structure to oled display substrate in oled display substrate motherboard
Increase the planarization process to barrier structure in the production process, the subsequent cutting region that is directly cut by laser can remove resistance
Structure is kept off, the Production Time of oled display substrate motherboard is saved.
The embodiment of the present invention also provides a kind of oled display substrate, for shape after above-mentioned oled display substrate motherboard cutting
At.
The embodiment of the invention also provides a kind of OLED displays, including oled display substrate as described above.It is described
OLED display can be with are as follows: TV, display, Digital Frame, mobile phone, tablet computer, navigator etc. are any to have display function
The products or components of energy, wherein the display device further includes flexible circuit board, printed circuit board and backboard.
Unless otherwise defined, the technical term or scientific term that the disclosure uses should be tool in fields of the present invention
The ordinary meaning for thering is the personage of general technical ability to be understood." first ", " second " used in the disclosure and similar word are simultaneously
Any sequence, quantity or importance are not indicated, and are used only to distinguish different component parts." comprising " or "comprising" etc.
Similar word means that the element or object before the word occur covers the element or object for appearing in the word presented hereinafter
And its it is equivalent, and it is not excluded for other elements or object.The similar word such as " connection " or " connected " is not limited to physics
Or mechanical connection, but may include electrical connection, it is either direct or indirectly."upper", "lower",
"left", "right" etc. is only used for indicating relative positional relationship, and after the absolute position for being described object changes, then the relative position is closed
System may also correspondingly change.
It is appreciated that ought such as layer, film, region or substrate etc element be referred to as be located at another element "above" or "below"
When, which " direct " can be located at "above" or "below" another element, or may exist intermediary element.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within protection of the invention.
Claims (10)
1. a kind of production method of oled display substrate motherboard, the oled display substrate motherboard includes the aobvious of multiple array arrangements
Show region, which is characterized in that the described method includes:
It is formed before anode within the display area, forms barrier structure between the domain of adjacent display areas.
2. the method according to claim 1, wherein described form barrier structure between the domain of adjacent display areas,
Include:
A wherein layer function film layer for the oled display substrate motherboard is formed by a patterning processes and is located at adjacent display
Barrier structure between region.
3. according to the method described in claim 2, it is characterized in that, described form barrier structure between the domain of adjacent display areas,
Include:
The flatness layer of the oled display substrate motherboard is formed by a patterning processes and between the domain of adjacent display areas
Barrier structure.
4. according to the method described in claim 3, it is characterized in that, it is described pass through a patterning processes and form the OLED show
The flatness layer of substrate motherboard and the barrier structure between the domain of adjacent display areas, comprising:
Flat material layer is formed, coats photoresist on the flat material layer；
The photoresist is exposed using mask plate, forms the photoresist reserved area of corresponding display area and barrier zones
The photoresist in domain and other corresponding regions removes region, wherein the barrier zones are between the domain of adjacent display areas；
After development, the photoresist in photoresist removal region is removed；
Etch away the flat material layer in photoresist removal region；
Flatness layer is formed in the display area, forms barrier structure in the barrier zones.
5. according to the method described in claim 3, it is characterized in that, it is described pass through a patterning processes and form the OLED show
The flatness layer of substrate motherboard, and barrier structure is formed between the domain of adjacent display areas, comprising:
Flat material layer is formed, coats photoresist on the flat material layer；
The photoresist is exposed using mask plate, forms the first photoetching of photoresist retention area, corresponding barrier zones
Glue removes region and second photoresist in other corresponding regions removes region, and the photoresist retention area includes corresponding aobvious
Show the first area in region and the second area of corresponding elongated area, the elongated area from the display area to other
Display area extends and surrounds the barrier zones；
After development, the photoresist in the first photoresist removal region and second photoresist removal region is removed；
Etch away the flat material layer in the first photoresist removal region and second photoresist removal region；
Flatness layer is formed in the display area, forms barrier structure in the barrier zones.
6. method according to any one of claims 1-5, which is characterized in that after forming anode layer, further includes:
The organic layer for covering the display area and the barrier structure is formed, so that the organic layer upper surface is smooth table
Face.
7. a kind of oled display substrate motherboard, the oled display substrate motherboard includes the display area of multiple array arrangements,
It is characterized in that, including the flatness layer on underlay substrate and positioned at the display area and between the domain of adjacent display areas
Barrier structure.
8. oled display substrate motherboard according to claim 7, which is characterized in that the oled display substrate motherboard also wraps
The cutting region between the domain of adjacent display areas is included, the barrier structure is located at the cutting region.
9. a kind of oled display substrate, which is characterized in that the oled display substrate is OLED as claimed in claim 7 or 8
Display base plate motherboard is cut.
10. a kind of OLED display, which is characterized in that including oled display substrate as claimed in claim 9.
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| CN201811303031.9A CN109449186B (en) | 2018-11-02 | 2018-11-02 | OLED display substrate mother board, manufacturing method thereof and OLED display device |
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| CN201811303031.9A CN109449186B (en) | 2018-11-02 | 2018-11-02 | OLED display substrate mother board, manufacturing method thereof and OLED display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110164953A (en) * | 2019-07-04 | 2019-08-23 | 京东方科技集团股份有限公司 | Display base plate motherboard and preparation method, display panel motherboard, base plate preparation method |
| CN110796949A (en) * | 2019-11-08 | 2020-02-14 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof, mother board, display panel and display device |
| CN112466918A (en) * | 2020-11-24 | 2021-03-09 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
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