CN109448552B - Method for attaching support film on flexible display device - Google Patents
Method for attaching support film on flexible display device Download PDFInfo
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- CN109448552B CN109448552B CN201811393839.0A CN201811393839A CN109448552B CN 109448552 B CN109448552 B CN 109448552B CN 201811393839 A CN201811393839 A CN 201811393839A CN 109448552 B CN109448552 B CN 109448552B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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Abstract
The invention provides a method for attaching a support film on a flexible display device, which comprises the following steps: providing a hard platform, wherein the hard platform comprises a first supporting part, a second supporting part and a third supporting part, the second supporting part is arranged between the first supporting part and the third supporting part, the second supporting part comprises an extensible flexible layer, and the flexible layer is made of a daub material with a shear thickening effect; the flexible display device comprises a display area and a non-display area, the non-display area comprises an integrated circuit chip area and a peripheral area, the flexible display device is moved towards the hard platform, so that the first supporting part is contacted with the front surface of the display area, the flexible layer of the second supporting part extends and covers the integrated circuit chip of the integrated circuit chip area, and the third supporting part is contacted with the front surface of the peripheral area; knocking the second supporting part along the vertical direction by a set force, and hardening the flexible layer; a support film is bonded to the back surface of the flexible display device.
Description
Technical Field
The invention relates to the field of display devices, in particular to a method for attaching a support film to a flexible display device.
Background
Currently, the mainstream technologies in the flat panel display industry are LCD and OLED. In recent years, OLEDs are gradually emerging due to their self-luminescence, extremely high contrast, and the like. Meanwhile, the development trend of ultra-narrow frames and full-face screens enables the market of flexible OLEDs to be wider.
The flexible OLED display panel not only can be lighter and thinner in size, but also can reduce power consumption, so that the cruising ability of corresponding products can be improved. Meanwhile, due to the flexibility and the flexibility of the flexible OLED display panel, the durability of the flexible OLED display panel is higher than that of a common hard display panel. The flexible OLED display panel can be widely applied to various products with display functions, such as tablet computers, televisions, mobile terminals and various wearable devices.
The flexible OLED display is a flexible display device made of a flexible substrate (PI), and a flexible substrate such as a Polyimide (PI) is first prepared or adsorbed on a surface of the rigid substrate, then a Thin Film Transistor (TFT) and an OLED device are prepared on the flexible substrate, and finally the flexible substrate is peeled off from the rigid substrate in a Laser Lift Off (LLO) manner or other manners, and then a support Film (support Film) is attached below the flexible substrate to improve the strength of the flexible substrate.
Fig. 1A is a top view and fig. 1B is a side view of a conventional flexible OLED display device. Referring to fig. 1A and 1B, the flexible OLED display device includes a display area 100 and a non-display area 110 disposed at one side of the display area 100. In order to improve the strength of the flexible substrate 120 after the flexible substrate 120 is peeled from the rigid substrate by Laser Lift Off (LLO) or other methods, a support film (support film) is attached below the flexible substrate 120. FIG. 2 is a schematic view of a conformable support film. Referring to fig. 1A, 1B and 2, the support film is divided into a first support film 130 attached to the display region 100 and a second support film 140 attached to the non-display region 110. In the bonding process, a rigid Stage (Stage)150 may be used to support the display region 100 and the non-display region 110, a roller 160 contacts the surface of the support film and applies pressure, and the roller 160 rolls along the extension direction of the panel to attach the support film to the flexible substrate 120.
The integrated circuit chip 170 located in the non-display region 110 is usually made of Si, GaAs, SiC, InP, etc., and has a small pressure, and when the integrated circuit chip is locally stressed and exceeds the pressure, the integrated circuit chip is easily broken (Crack) and damaged, which may affect the circuit and further affect the normal display function of the flexible display device. Therefore, in the non-display area 110, the area corresponding to the area having the integrated circuit chip 170 cannot be supported by the hard platform, and the area is floating. The disadvantage is that after the bonding process, the region corresponding to the ic chip 170 is not supported, and bubbles are generated at the bottom of the region, which results in high risk; there is no support corresponding to the area with the ic chip 170, which is deformed upwards by the force when the roller 160 applies a certain pressure to the area, and fig. 3 is a schematic diagram of the roller 160 rolling on the area with the ic chip 170, which is deformed by the force as can be seen from fig. 3.
Disclosure of Invention
The invention aims to provide a method for attaching a support film on a flexible display device, which can provide good support for an integrated circuit chip, is beneficial to attaching the support film, reduces the risk of bubbles and avoids the deformation of a flexible display panel.
In order to solve the above problems, the present invention provides a method for attaching a support film to a flexible display device, the flexible display device including a display region and a non-display region, the non-display region including an integrated circuit chip region and a peripheral region, the method comprising the steps of: providing a hard platform, wherein the hard platform comprises a first supporting part, a second supporting part and a third supporting part, and the second supporting part is arranged between the first supporting part and the third supporting part; (ii) a The second support part comprises a flexible layer which can be extended and is made of a material with shear thickening effect in a daub state; the method further comprises the steps of: moving the flexible display device towards the hard platform to enable the first supporting part to be in contact with the front face of the display area, the flexible layer of the second supporting part extends and covers the integrated circuit chip of the integrated circuit chip area, and the third supporting part is in contact with the front face of the peripheral area; knocking the second supporting part along the vertical direction with a set force, and hardening the flexible layer; and attaching a support film to the back surface of the flexible display device.
In one embodiment, the first support portion and the third support portion clamp the second support portion, and the second support portion is capable of moving in a vertical direction.
In one embodiment, the second support portion further comprises a base layer, the flexible layer being disposed on the base layer, and in the step of striking the second support portion, the base layer is struck to harden the flexible layer.
In one embodiment, the base layer is made of rubber.
In one embodiment, the flexible layer is made of a gel material formed by in situ compounding of a shear thickening fluid with a polymer gel matrix.
In one embodiment, the flexible layer is made of polyborodimethylsiloxane.
In an embodiment, the moving speed of the flexible display device to the hard platform is less than or equal to 30 mm/S.
In one embodiment, the speed of striking the second support is greater than or equal to 100 mm/S.
In one embodiment, the non-display area further includes a coating area disposed between the display area and the ic chip area, and the flexible layer of the second support covers the coating area in the step of covering the ic chip of the ic chip area with the flexible layer of the second support.
In one embodiment, the method for attaching the support film to the back surface of the flexible display device includes: the flexible display device is supported by the first support part, the second support part and the third support part, and the surface of the support film placed on the back surface of the flexible display device is rolled by a roller so as to attach the support film to the back surface of the flexible display device.
The invention has the advantages that the flexible layer made of the daub-state material with the shear thickening effect is hardened after being knocked by external force, so that the integrated circuit chip can be well supported under the condition of not damaging the integrated circuit chip, the attachment of a support film is facilitated, the risk of bubbles is reduced, and the deformation of the flexible display panel is avoided.
Drawings
FIG. 1A is a top view of a prior art flexible OLED display device;
fig. 1B is a side view of a conventional flexible OLED display device;
FIG. 2 is a schematic view of a conformable support film;
FIG. 3 is a schematic diagram of a roller rolling over an area having integrated circuit chips;
fig. 4 to 8 are schematic diagrams illustrating steps of a method for attaching a support film to a flexible display device according to the present invention.
Detailed Description
The following describes in detail a specific embodiment of a method for attaching a support film to a flexible display device according to the present invention with reference to the accompanying drawings.
Fig. 4 to 8 are schematic diagrams illustrating steps of a method for attaching a support film to a flexible display device according to the present invention.
Referring to fig. 4, a rigid platen 400 is provided. The hard stage 400 includes a first support 401, a second support 402, and a third support 403.
The first supporting portion 401 and the third supporting portion 403 are made of hard material to provide a supporting function. In this embodiment, the material of the first support portion 401 and the third support portion 403 is the same as the material of the conventional hard stage used when a support film is attached to a flexible display device, but the present invention is not limited thereto, and any material that can satisfy the supporting function may be used to manufacture the first support portion 401 and the second support portion 403 of the present invention.
The second support 402 includes a flexible layer 4021. The flexible layer 4021 is made of a material having a shear thickening effect in a mastic state. Materials with shear thickening effect normally assume a natural state of softness, lightness, stretchability and crush-deformation, but, when subjected to an external force, harden rapidly, thereby achieving a high protection against an external force receptor. Shear thickening refers to the phenomenon that the viscosity of a system is rapidly, violently and nonlinearly increased when the system is subjected to shear force. The main principle is that when a certain material is not subjected to shearing or impact force, the dispersed phase particles and the dispersion medium form a net structure due to the action of hydrogen bonds, the dispersed phase particles are not interfered with each other, when the material is subjected to shearing or impact force, the originally formed net structure is gradually disintegrated, the dispersed phase particles form particle clusters due to mutual collision, the fluidity of the material is reduced, the viscosity of the material is sharply increased, and the phenomenon of thickening is shown. Materials for making the flexible layer 4021 include, but are not limited to, gel materials formed by in situ compounding of a shear thickening fluid (STF fluid) with a polymer gel matrix. In this embodiment, the flexible layer 4021 is made of polyborodimethylsiloxane (polyborodimethylsiloxane) which in its conventional state, such as soft marshmallow, is stretchable, squeezable, and hardens immediately upon impact, thereby protecting the object it covers from the forces.
In this embodiment, the second supporting portion 402 further includes a base layer 4022, and the flexible layer 4021 is disposed on the surface of the base layer 4022. The material of the base layer 4022 includes, but is not limited to, rubber. The flexible layer 4021 is adhered to a surface of the base layer 4022, and the base layer 4022 supports the flexible layer 4021.
The second support portion 402 is disposed between the first support portion 401 and the third support portion 403. Further, in an embodiment, the first supporting portion 401 and the third supporting portion 403 clamp the second supporting portion 402 to fix the second supporting portion 402. The first support portion 401 and the third support portion 403 do not completely fix the second support portion 402, and when a certain force is applied to push the second support portion 402, the second support portion 402 may move in a vertical direction.
Referring to fig. 5, the flexible display device to be attached with the supporting film includes a display area a and a non-display area B. The display area a and the non-display area B use the same flexible substrate 500. The display area a refers to an area where an image can be displayed, the non-display area B refers to an area where an image cannot be displayed other than the display area a, and the division method of the display area a and the non-display area B is well known to those skilled in the art. The non-display area B includes an integrated circuit chip area B1 and a peripheral area B2. Wherein, the integrated circuit chip 501 is arranged in the integrated circuit chip region B1, and the peripheral region B2 includes but is not limited to the flexible circuit board 502. In the present embodiment, the non-display area B further includes a coating area B3 disposed between the display area a and the integrated circuit chip area B1. The dividing method of the integrated circuit chip region B1, the peripheral region B2 and the coating region B3 is well known to those skilled in the art.
Referring to fig. 5, the flexible display device is moved toward the rigid platform 400, as indicated by the arrow in fig. 5. In this embodiment, the supporting film needs to be attached to the back surface of the flexible display device, and therefore, the hard platform 400 needs to be disposed on the front surface of the flexible display device.
Referring to fig. 6, after the moving motion is finished, the first supporting portion 401 contacts with the front surface of the display area a, in this embodiment, the first supporting portion 401 contacts with the display surface of the flexible display device.
Referring to fig. 6, after the moving motion is finished, the flexible layer 4021 of the second supporting portion 402 covers the integrated circuit chip 501 in the integrated circuit chip area B1, and because the flexible layer 4021 has malleability, the flexible layer 4021 gradually covers the integrated circuit chip 501 along with the movement of the flexible display device to the rigid platform 400 until the flexible layer 4021 completely covers the integrated circuit chip 501. The flexible layer 4021 can fully cover the integrated circuit chip 501, no gap exists between the integrated circuit chip 501 and the flexible layer, and meanwhile, the integrated circuit chip 501 is balanced in stress and does not exceed the bearing pressure and damage risks. Preferably, in an embodiment, the moving speed of the flexible display device to the rigid platform 400 is less than or equal to 30mm/S, so that the flexible layer 4021 can sufficiently cover the integrated circuit chip 501. Wherein, in an embodiment, the flexible layer 4021 of the second support part also covers the coating region B3. In one embodiment, the second supporting portion 402 can move along the vertical direction, and when the flexible layer 4021 covers the ic chip region B1 and the coating region B3, the second supporting portion 402 can move, so that the flexible layer 4021 can cover the ic chip region B1 and the coating region B3 without gaps.
Referring to fig. 6, after the moving movement is finished, the third supporting portion 403 contacts with the front surface of the peripheral region B2, in this embodiment, the third supporting portion 403 contacts with the flexible circuit board 502 of the peripheral region B2.
Referring to fig. 7, the second supporting portion 402 is vertically knocked by a set force F. The flexible layer 4021 is hardened by the force F so that it is no longer malleable but rather rigid. In this embodiment, taking the force F as 100N as an example, the speed of knocking the second supporting portion 402 is greater than or equal to 100mm/S, the second flexible layer 4021 is hardened and does not damage the integrated circuit chip 501. For example, in other embodiments, the force F may range from 80N to 120N. In this embodiment, the base layer 4022 is tapped to harden the flexible layer 4021. Since the flexible layer 4021 covers the integrated circuit region B1 and the coating region B3, after the flexible layer 4021 is hardened, the second supporting part 402 can support the integrated circuit region B1 and the coating region B3 well.
Referring to fig. 8, a support film is attached to the back surface of the flexible display device. In this step, the front surface of the flexible display device is supported by the hard platform 400, so that the problems of deformation of the flexible display device and bubbles in the bonding area are solved during the bonding process.
In this embodiment, the method for attaching the support film to the back surface of the flexible display device includes the following steps: a first supporting film 800 and a second supporting film 801 are placed on the back of the flexible display device; the flexible display device is supported by a first support 401, a second support 402 and a third support 403; the first support film 800 and the second support film 801 are rolled by a roller 802 in a direction parallel to the flexible display device panel to attach the first support film 800 and the second support film 801 to the back surface of the flexible display device. In the integrated circuit area and the coating area, because the hardened flexible layer 4021 of the second support part 402 provides stable and good support, no air bubbles are generated at the joint of the area, and no bending deformation occurs, so that the risk is reduced, and the product quality is improved.
After the laminating process is finished, the flexible display device is separated from the hard platform, the flexible layer is not adhered to an area covered by the flexible layer, the flexible layer and the area can be smoothly separated, and then the flexible display device with the support film is formed.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A method for attaching a support film to a flexible display device, the flexible display device comprising a display area and a non-display area, the non-display area comprising an integrated circuit chip area and a peripheral area, the method comprising the steps of: providing a hard platform, wherein the hard platform comprises a first supporting part, a second supporting part and a third supporting part, and the second supporting part is arranged between the first supporting part and the third supporting part; it is characterized in that the preparation method is characterized in that,
the second support part comprises a flexible layer which can be extended and is made of a material with shear thickening effect in a daub state;
and, the method further comprises the steps of:
moving the flexible display device towards the hard platform to enable the first supporting part to be in contact with the front face of the display area, the flexible layer of the second supporting part extends and covers the integrated circuit chip of the integrated circuit chip area, and the third supporting part is in contact with the front face of the peripheral area;
knocking the second supporting part along the vertical direction with a set force, and hardening the flexible layer;
and attaching a support film to the back surface of the flexible display device.
2. The method of claim 1, wherein the first support and the third support sandwich the second support, and the second support is movable in a vertical direction.
3. A method of attaching a support film to a flexible display device according to claim 2, wherein the second support portion further comprises a base layer, the flexible layer is provided on the base layer, and in the step of striking the second support portion, the base layer is struck to harden the flexible layer.
4. The method of claim 3, wherein the base layer is made of rubber.
5. A method of conforming a support film on a flexible display device according to claim 1 wherein the flexible layer is made from a gel material formed by in situ compounding of a shear thickening fluid and a polymer gel matrix.
6. A method of attaching a support film to a flexible display device according to claim 1, wherein the flexible layer is made of polyborodimethylsiloxane.
7. The method of claim 1, wherein the flexible display device is moved toward the rigid platform at a speed of less than or equal to 30 mm/S.
8. The method of claim 1, wherein a speed of striking the second support is greater than or equal to 100 mm/S.
9. A method as claimed in claim 1, wherein the non-display area further comprises a coating area disposed between the display area and the ic chip area, and the flexible layer of the second support portion covers the coating area during the step of covering the ic chip of the ic chip area with the flexible layer of the second support portion.
10. The method of claim 1, wherein the method of attaching the support film to the back surface of the flexible display device comprises:
the flexible display device is supported by the first support part, the second support part and the third support part, and the surface of the support film placed on the back surface of the flexible display device is rolled by a roller so as to attach the support film to the back surface of the flexible display device.
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| CN201811393839.0A CN109448552B (en) | 2018-11-21 | 2018-11-21 | Method for attaching support film on flexible display device |
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| CN111508364A (en) * | 2020-04-30 | 2020-08-07 | 合肥维信诺科技有限公司 | Flexible display device |
| CN113835546B (en) | 2020-06-24 | 2023-08-29 | 京东方科技集团股份有限公司 | Bonding device and bonding method |
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