CN109445043B - Packaging structure of cable - Google Patents
Packaging structure of cable Download PDFInfo
- Publication number
- CN109445043B CN109445043B CN201811597640.XA CN201811597640A CN109445043B CN 109445043 B CN109445043 B CN 109445043B CN 201811597640 A CN201811597640 A CN 201811597640A CN 109445043 B CN109445043 B CN 109445043B
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- cable
- module
- system board
- splicing
- plate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Abstract
The invention discloses a packaging structure of a cable, which comprises: a system board module comprising one or more first pin holes; and one or more cable modules including one or more second tiles, wherein the system board module is aligned with the one or more cable modules through the first and second tiles such that each cable in the cable module is electrically or optically coupled with an input and/or output port of the system board.
Description
Technical Field
The invention relates to the technical field of integrated packaging. In particular, the invention relates to a packaging structure of a large-scale high-frequency cable.
Background
With the rapid development of the computer industry, the speed and capacity of information processing have become the standard for evaluating the quality in this field, especially the improvement of transmission speed, and the chip in the computer host can cooperate with the peripheral device to continuously expand its function.
The peak calculation speed, the continuous calculation speed and the comprehensive technical level for the super calculation are in the international leading position, for example, the super computer "Tianhe II" is a great progress made by the super calculation technology development in China. In addition to increasing the upper limit of the single channel transmission rate, increasing the number of channels also becomes another solution to solve such problems. However, from the packaging and integration point of view, whether optical or electrical interconnection, the more the number of channels makes the packaging more difficult, sometimes even exponentially. At present, for the requirement of simultaneously realizing a plurality of hundreds of channels and a large array of multi-cables, no mature solution is available in the industry, the difficulty is high, and the assembly cost is high.
Disclosure of Invention
The invention aims to solve the problem of large-capacity high-frequency signal transmission, and the core assembly disclosed by the invention is used for assembling and welding a large-array high-frequency cable to a circuit board to complete interconnection of large-array high-frequency signals and facilitate assembly.
To solve the problems in the prior art, according to an aspect of the present invention, there is provided a cable encapsulation structure, including:
a system board module comprising one or more first pin holes; and
one or more cable modules comprising one or more second eyelets,
wherein the system board module is aligned with the one or more cable modules through the first and second tiles such that each cable in the cable module is electrically or optically coupled to an input and/or output port of the system board.
In one embodiment of the invention, the system board module comprises:
the bottom plate comprises a system plate base, a system plate and a pressing block, wherein the system plate is superposed on the system plate base, the system plate base is provided with one or more third splicing holes, the system plate is provided with one or more fourth splicing holes, and the pressing block is superposed on the system plate and is provided with one or more fifth splicing holes;
wherein the system board base, the system board and the pressing block are aligned through the third splicing hole, the fourth splicing hole and the fifth splicing hole and are fixed through the system board splicing pins.
In one embodiment of the invention, one or more magnetic strips or adhesive strips are disposed on the top surface of the base plate.
In one embodiment of the invention, one or more magnetic strips or adhesive strips are disposed on the top surface of the system board base.
In one embodiment of the invention, the cable module comprises:
a cable cover plate;
a cable mount having a cable slot; and
a cable disposed in the cable groove, a top surface of the cable being flush with a top surface of the cable base,
wherein the one or more second pin holes extend through the cable cover and the cable base.
In one embodiment of the invention, the cable is an optical cable or an electrical cable.
In one embodiment of the invention, one or more magnetic strips or adhesive strips are disposed on the bottom surface of the cable base.
In one embodiment of the invention, the system board module and the cable module are secured by cable module pins.
In another embodiment of the present invention, a system board module and cable module installation method is provided, including:
coating solder paste on the surface of the circuit board;
the circuit board is placed on the bottom plate, position adjustment is carried out through the first splicing hole, and positioning is carried out through the pressing block and the system board splicing needle;
arranging the cables in cable troughs;
the position of the adjusting cable is fixed through a cable cover plate;
aligning the system board module and the cable module through the splicing holes through one or more second splicing holes on the system board and one or more third splicing holes on the cable module, and fixing the system board module and the cable module through splicing pins of the cable module;
and reflowing the fixed system board and the cable module.
In another embodiment of the present invention, a system board module and cable module installation method is provided, including:
dispensing glue on a surface of a system board, the system board having light input and output ports;
the system board is placed on the bottom board, position adjustment is carried out through the first splicing hole, and positioning is carried out through the pressing block and the system board splicing needle;
arranging the optical cables in cable troughs;
the position of the cable is adjusted and fixed through a cable cover plate;
aligning the system board module and the cable module through the splicing holes through one or more second splicing holes on the system board and one or more third splicing holes on the cable module, and fixing the system board module and the cable module through splicing pins of the cable module;
and performing heat curing on the fixed system board and the cable module.
Drawings
To further clarify the above and other advantages and features of embodiments of the present invention, a more particular description of embodiments of the invention will be rendered by reference to the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. In the drawings, the same or corresponding parts will be denoted by the same or similar reference numerals for clarity.
Fig. 1 shows a perspective view of a package structure 100 of a large-scale high-frequency cable according to an embodiment of the invention.
Fig. 2 illustrates a perspective view of a system board module 110 according to one embodiment of the invention.
Fig. 3 shows a perspective view of the base plate 111 according to an embodiment of the invention.
Fig. 4 illustrates an exploded perspective view of the system board module 110 according to one embodiment of the invention.
Fig. 5 shows a perspective view of a cable module 120 according to an embodiment of the invention.
Fig. 6 illustrates a schematic bottom perspective view of the cable mount 122 according to one embodiment of the invention.
Fig. 7 illustrates a top perspective view of the cable mount 122 according to one embodiment of the present invention.
Fig. 8 further illustrates a perspective view of a cable trough according to an embodiment of the present invention.
Fig. 9 shows a right side view of the cable mount 122 according to one embodiment of the invention.
Fig. 10 shows a flow diagram of an installation process of a system board module and a cable module according to one embodiment of the invention.
Fig. 11 shows a flow diagram of an installation process of a system board module and a cable module according to one embodiment of the invention.
Detailed Description
In the following description, the invention is described with reference to various embodiments. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details, or with other alternative and/or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of embodiments of the invention. Similarly, for purposes of explanation, specific numbers, materials and configurations are set forth in order to provide a thorough understanding of the embodiments of the invention. However, the invention may be practiced without specific details. Further, it should be understood that the embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.
Reference in the specification to "one embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the purpose of convenience and simplicity of description, and are not intended to imply that the devices or elements so referred to must be in a particular orientation, constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The invention provides a large-scale high-frequency cable packaging structure. Through the packaging structure, the assembly of large-scale multi-cable can be completed simultaneously, hundreds of channels are assembled and formed at one time, the batch assembly can be realized, and the process repeatability is high. The optical/electrical transceiver module is more suitable for optical/electrical transceiver modules with higher density, and can provide application requirements of higher bandwidth and longer distance for large-scale data centers, super-computation centers and the like.
Fig. 1 shows a perspective view of a package structure 100 of a large-scale high-frequency cable according to an embodiment of the invention. As shown in fig. 1, the packaging structure 100 of the high frequency cable includes a system board module 110 and one or more cable modules 120. The system board module 110 is aligned with one or more cable modules 120 via a splice so that each cable in the cable module is electrically or optically coupled to an input and/or output port of the system board.
Fig. 2 illustrates a perspective view of a system board module 110 according to one embodiment of the invention. As shown in fig. 2, the system board module 110 includes a backplane 111. Fig. 3 shows a perspective view of the base plate 111 according to an embodiment of the invention. The floor 111 includes areas for placement of system boards and areas for placement of cable modules.
In the embodiment shown in fig. 1 to 3, the area for placing the system board is in the middle of the bottom plate 111, and the system board base 116 is provided in the area for placing the system board. The area for placing the cable modules is around the area for placing the system board. However, it will be appreciated by those skilled in the art that in other embodiments of the invention, the area for placing the system board may be located anywhere on the base plate, for example, on one side of the base plate, depending on the actual requirements.
The base plate 111 may have a plurality of spigots 112. Cable module 120 is aligned with backplane 111 through one or more of split holes 112 and secured by cable module split pins 113. The system board is aligned with the base plate 111 through one or more of the system board tiles 112 and secured by the system board tiles 114.
Magnetic strips or adhesive tape 115 may also be included on the surface of base 111 to further enhance the connection with cable modules 120.
The system board base 116 may also include magnetic strips or adhesive tape 117 on its surface to further enhance the connection to the system board 120.
Fig. 4 illustrates an exploded perspective view of the system board module 110 according to one embodiment of the invention. The system board 118 and the press block 119 are stacked in this order on the system board base 116. The system board 118 and the pressing block 119 are provided with splicing holes at corresponding positions, in the installation process, the splicing holes in the system board 118 and the pressing block 119 are aligned with the corresponding splicing holes in the bottom plate 111, so that the system board 118 and the pressing block 119 are positioned on the bottom plate 111, and then the system board splicing pins 114 are inserted into the pressing block 119, the system board 118 and the bottom plate 111, so that the fixation of the system board 118 and the pressing block 119 is realized.
Fig. 5 shows a perspective view of a cable module 120 according to an embodiment of the invention. As shown in fig. 5, the cable module 120 includes a cable cover 121 and a cable base 122. The cable cover 121 and the cable base 122 have substantially the same shape. The cable cover 121 has one or more split holes 123.
Fig. 6 illustrates a schematic bottom perspective view of the cable mount 122 according to one embodiment of the invention. Fig. 7 illustrates a top perspective view of the cable mount 122 according to one embodiment of the present invention. As shown in fig. 6 and 7, the cable mount 122 has one or more split holes 124, a magnetic strip or adhesive tape 125, and a cable slot 126. One or more split holes 124 extend through the top and bottom surfaces of the cable mount 122. The magnetic strip or adhesive tape 125 is disposed on the bottom surface of the cable base 122, and after mounting the cable base to the base plate 111, the magnetic strip or adhesive tape 125 contacts a corresponding surface of the base plate 111 for reinforcement. During installation, the holes 123 in the cable cover 121, the corresponding holes 124 in the cable base, and the corresponding holes in the base plate 111 are aligned and secured by the cable module pins 113.
The cable slot 126 is used to accommodate a cable 127. Fig. 8 further illustrates a perspective view of a cable trough according to an embodiment of the present invention. The bottom of the cable trough 126 may have one or more raised structures 128 for confining the cable to prevent it from rolling within the trough.
The cable 127 may be an electrical cable or an optical cable. After the cables 127 are secured within the cable slots 126, the top ends of the cables 127 are substantially flush with the top surface of the cable mount 122. Fig. 9 shows a right side view of the cable mount 122 according to one embodiment of the invention. Therefore, after the cable cover plate is covered on the cable base, the plurality of cables are limited at specific positions and do not move up and down or roll left and right.
One specific example of a system board module and a cable module is described above in connection with fig. 1-9. Those skilled in the art will appreciate that the specific shape and arrangement of the system board modules and cable modules may be adapted.
The following is a description of the system board module and cable module installation process in conjunction with fig. 10 and 11.
Fig. 10 shows a flow diagram of an installation process of a system board module and a cable module according to one embodiment of the invention. In the embodiment shown in fig. 10, the cable is a cable and the system board is a PCB circuit board.
First, the system board module and the cable module are assembled separately.
Specifically, the assembly of the system board module includes: step 101, printing solder paste on the surface of a PCB; then, in step 102, the PCB is placed on the bottom plate and is adjusted in position by the pin holes, and is positioned by the pressing blocks and the system board pins. Printing solder paste may include surface solder paste printing and underlying solder paste application.
The assembly of the cable module may include: arranging the cable in a cable trough in step 103; the adjusted cable position is secured by the cable cover plate at step 104.
Next, the system board modules are aligned with the cable modules by splicing and secured by splicing pins at step 105. The upper and lower combination and the position fine adjustment of the cable module can be realized through the hole matching alignment of the system board. Whereby the connection ends of the cables are aligned with the connection ports on the PCB board.
In step 106, after the assembly is completed, cable tail fixation is performed.
In step 107, the assembly is reflowed to complete the soldering of the cable to PCB board connection.
Fig. 11 shows a flow diagram of an installation process of a system board module and a cable module according to one embodiment of the invention. In the embodiment shown in fig. 11, the cable is an optical cable and the system board has optical input and output ports. After installation, the optical cable is in optical communication with the optical input and output ports on the system board.
First, the system board module and the cable module are assembled separately.
Specifically, the assembly of the system board module includes: step 111, dispensing at the optical input and output ports on the system board; the system board is then placed on the base plate and adjusted and positioned at step 112. Dispensing at the optical input and output ports on the system board may include surface uv dispensing and an underlying glue coating.
The assembly of the cable module may include: arranging the optical cables in cable troughs in step 113; the adjusted cable position is secured by the cable cover plate at step 114.
Next, the system board modules are aligned with the cable modules by splicing and secured by splicing pins at step 115. The upper and lower combination and the position fine adjustment of the cable module can be realized through the hole matching alignment of the system board. Whereby the connection ends of the cables are aligned with the optical input and output ports on the system board.
At step 116, cable tail fixation is performed after assembly of the assembly is complete.
In step 117, the assembly is uv irradiated to complete the pre-cure and complete the soldering of the connection of the cable to the PCB.
At step 118, the assembly is thermally cured.
While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various combinations, modifications, and changes can be made thereto without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention disclosed herein should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.
Claims (9)
1. An encapsulation structure of a cable, comprising:
a system board module comprising one or more first dowels, the system board module comprising: the bottom plate comprises a system plate base, a system plate and a pressing block, wherein the system plate is stacked on the system plate base, the pressing block is stacked on the system plate, the system plate base is provided with one or more third splicing holes, the system plate is provided with one or more fourth splicing holes, the pressing block is provided with one or more fifth splicing holes, and the system plate base, the system plate and the pressing block are aligned through the third splicing holes, the fourth splicing holes and the fifth splicing holes and are fixed through system plate splicing pins; and
one or more cable modules comprising one or more second eyelets,
wherein the system board module is aligned with the one or more cable modules through the first and second tiles such that each cable in the cable module is electrically or optically coupled to an input and/or output port of the system board,
the area for placing the cable modules is around the area for placing the system board.
2. The cable package of claim 1, wherein one or more magnetic strips or adhesive strips are disposed on the top surface of the base plate.
3. The cable package arrangement of claim 1, wherein one or more magnetic strips or adhesive strips are disposed on a top surface of the system board base.
4. The cable encapsulation structure of claim 1, wherein the cable module comprises:
a cable cover plate;
a cable mount having a cable slot; and
a cable disposed in the cable groove, a top surface of the cable being flush with a top surface of the cable base,
wherein the one or more second pin holes extend through the cable cover and the cable base.
5. The packaging structure for cables according to claim 4, wherein the cable is an optical cable or an electric cable.
6. The packaging structure of the cable according to claim 4, wherein one or more magnetic strips or adhesive tapes are disposed on the bottom surface of the cable base.
7. The cable package of claim 1, wherein the system board module and the cable module are secured by a cable module pin.
8. A method of installing a system board module and a cable module, wherein the system board module includes one or more first tiles, the system board module comprising: a bottom plate comprising a system plate base, a system plate and a pressing block, wherein the system plate base is provided with one or more third splicing holes, the system plate is provided with one or more fourth splicing holes, and the pressing block is provided with one or more fifth splicing holes; the cable module includes one or more second eyelets, the method comprising:
coating solder paste on the surface of the system board;
the system board is placed on a system board base, position adjustment is carried out through a third splicing hole, a fourth splicing hole and a fifth splicing hole, and positioning is carried out through a pressing block and a system board splicing needle;
arranging cables in cable troughs of the cable modules;
the position of the adjusting cable is fixed through a cable cover plate;
aligning the system board module and the cable module through one or more first splicing holes on the system board and one or more second splicing holes on the cable module, and fixing the system board module and the cable module through splicing pins of the cable module, wherein the area for placing the cable module is arranged around the area for placing the system board;
and reflowing the fixed system board and the cable module.
9. A method of installing a system board module and a cable module, wherein the system board module includes one or more first tiles, the system board module comprising: a bottom plate comprising a system plate base, a system plate and a pressing block, wherein the system plate base is provided with one or more third splicing holes, the system plate is provided with one or more fourth splicing holes, and the pressing block is provided with one or more fifth splicing holes; the cable module includes one or more second eyelets, the method comprising:
dispensing glue on a surface of a system board, the system board having light input and output ports;
the system board is placed on a system board base, position adjustment is carried out through a third splicing hole, a fourth splicing hole and a fifth splicing hole, and positioning is carried out through a pressing block and a system board splicing needle;
arranging an optical cable in a cable trough of the cable module;
the position of the optical cable is adjusted and fixed through a cable cover plate;
aligning the system board module and the cable module through one or more first splicing holes on the system board and one or more second splicing holes on the cable module, and fixing the system board module and the cable module through splicing pins of the cable module, wherein the area for placing the cable module is arranged around the area for placing the system board;
and performing heat curing on the fixed system board and the cable module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811597640.XA CN109445043B (en) | 2018-12-26 | 2018-12-26 | Packaging structure of cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811597640.XA CN109445043B (en) | 2018-12-26 | 2018-12-26 | Packaging structure of cable |
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| Publication Number | Publication Date |
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| CN109445043A CN109445043A (en) | 2019-03-08 |
| CN109445043B true CN109445043B (en) | 2020-09-15 |
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| CN201811597640.XA Active CN109445043B (en) | 2018-12-26 | 2018-12-26 | Packaging structure of cable |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6741778B1 (en) * | 2000-05-23 | 2004-05-25 | International Business Machines Corporation | Optical device with chip level precision alignment |
| CN103698864B (en) * | 2012-09-27 | 2016-12-07 | 鸿富锦精密工业（深圳）有限公司 | The joints of optical fibre |
| JP5625138B1 (en) * | 2013-07-05 | 2014-11-12 | 古河電気工業株式会社 | Optical module, optical module mounting method, optical module mounting circuit board, optical module evaluation kit system, circuit board, and communication system |
| CN205509967U (en) * | 2016-03-23 | 2016-08-24 | 常熟市冠日新材料有限公司 | Junction box of solar photovoltaic module |
| CN207037186U (en) * | 2017-08-21 | 2018-02-23 | 中航海信光电技术有限公司 | A kind of optical module using LCC encapsulating structures |
| CN108508549B (en) * | 2018-03-30 | 2020-04-21 | 翔光光通讯器材（昆山）有限公司 | High-density optical transceiver module |
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