CN109445041B - Processing technology of 25G optical module - Google Patents

Processing technology of 25G optical module Download PDF

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Publication number
CN109445041B
CN109445041B CN201811258201.6A CN201811258201A CN109445041B CN 109445041 B CN109445041 B CN 109445041B CN 201811258201 A CN201811258201 A CN 201811258201A CN 109445041 B CN109445041 B CN 109445041B
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optical module
shell
heat dissipation
parts
movable block
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CN109445041A (en
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汪洋
朱汝俊
吴海峰
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Huangshan Guangrui Communication Co ltd
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Huangshan Guangrui Communication Co ltd
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4269Cooling with heat sinks or radiation fins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/70Additives characterised by shape, e.g. fibres, flakes or microspheres
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20427Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2248Oxides; Hydroxides of metals of copper
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2262Oxides; Hydroxides of metals of manganese
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2265Oxides; Hydroxides of metals of iron
    • C08K2003/2268Ferrous oxide (FeO)

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The invention belongs to the field of electronic communication equipment, and particularly relates to a processing technology of a 25G optical module. The specific technical scheme is as follows: a processing technology of a 25G optical module comprises the following specific steps: preparing an optical module main body and a shell, wherein one end of the shell is provided with an opening, and a cavity is processed inwards along the opening; the side wall of at least one side of the shell and the corresponding top are provided with an installation channel, the bottom of the installation channel is provided with an elastic part, the other end of the elastic part is fixedly connected with a movable block, and when the elastic part is in a natural state, the outer end of the movable block extends out of the installation channel to enter the cavity; a stretching rope is fixedly connected at the inner end of the movable block, the stretching rope passes through a through hole preset in the top of the shell and is fixedly connected with the surface of a first movable rod, a fin is fixedly connected to the first movable rod and hinged to the top of the shell, and a fin groove is formed in the top of the shell; the included angle between the tangent of the fixed joint of the stretching rope on the cross-section circular surface of the first movable rod and the fin is 90-180 degrees. The processing technology provided by the invention is simple and reasonable, and can effectively meet the daily processing requirement of the optical module.

Description

Processing technology of 25G optical module
Technical Field
The invention belongs to the field of electronic communication equipment, and particularly relates to a processing technology of a 25G optical module.
Background
With the continuous speed increase of the bandwidth in the field of optical communication, the bandwidth of an optical module is also upgraded. In response to the market demand for high bandwidth and high rate data transmission, the module design is increasingly developed in the direction of miniaturization and high density. The improvement of the speed of the optical module generally accompanies with the improvement of power, and as the power of the optical module increases, the volume heat density also increases, so that the working temperature of the optical module increases, the performance of an electro-optical/photoelectric conversion component and a chip which are sensitive to temperature in the optical module can be greatly reduced, and even the whole module cannot work normally or fails. In addition, the 25G optical module with the efficient heat dissipation structure often has the problems of complex processing, unreasonable processing technology setting and the like. Therefore, it is desirable to provide a more efficient heat dissipation structure and an optimized process to solve this problem.
Disclosure of Invention
The invention aims to provide a processing technology of a 25G optical module with excellent heat dissipation performance.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows: a processing technology of a 25G optical module comprises the following specific processing technology steps:
(1) preparing an optical module main body and a shell, wherein one end of the shell is provided with an opening, and a cavity for the optical module main body to enter and exit is processed inwards along the opening;
(2) the side wall of at least one side of the shell is provided with an installation channel, and the top of the shell is provided with a through hole communicated with the installation channel;
(3) an elastic part is arranged at the bottom of the installation channel, a movable block is fixedly connected to the other end of the elastic part, and when the elastic part is in a natural state, the outer end of the movable block extends out of the installation channel and enters the cavity;
(4) a stretching rope is put into the through hole at the top of the shell and extends into the mounting channel, and the stretching rope is fixedly connected with the inner end of the movable block; the stretching rope is left on the surface part of the top of the shell and fixedly connected with the face near the end face of a first movable rod, the first movable rod is fixedly connected with a fin, the first movable rod is hinged to the top of the shell, and the top of the shell is correspondingly provided with a fin groove;
the specific connection processing mode of the stretching rope and the first movable rod is as follows: an included angle between a tangent line of a fixed connection point of the stretching rope on the cross-section circular surface of the first movable rod and the fin is 90-180 degrees;
and after the setting is finished, the 25G optical module is processed.
Preferably, the movable block, the elastic component and the tensile rope are specifically processed and connected in the following manner:
(1) processing the installation channel along the inclined direction, and fixedly connecting the inner end of the movable block with a movable block stretching rod in the installation channel;
(2) then fixedly connecting the stretching rod of the movable block with the outer end of a connecting rod, wherein the connecting rod is arranged in the depth direction parallel to the side wall;
(3) then fixedly connecting the elastic part in the middle of the connecting rod in the direction opposite to the direction of the stretching rod of the movable block;
(4) and finally, fixedly connecting the inner end of the connecting rod with the stretching rope, and finishing the processing of the part of structure.
Preferably, the part of the movable block extending into the cavity is processed into an arc surface extending along the in-and-out direction of the optical module body.
Preferably, the first movable rod is in linkage connection with at least one second movable rod, and the second movable rod is hinged to the upper surface of the heat dissipation part and fixedly connected with the fins; the second movable bar is parallel to the first movable bar.
Preferably, a heat dissipation coating is arranged on the outer surface of the heat dissipation part and/or the fins.
Preferably, the formula of the heat dissipation coating is as follows: 20-25 parts of FeO powder and MnO in parts by weight220-25 parts of powder, 8-10 parts of CuO powder, 50-60 parts of hollow glass beads, 100-160 parts of bisphenol A epoxy resin and 2000 parts of deionized water; the particle size of the powder of each metal oxide is less than or equal to 0.5 mu m, and the particle size of the hollow glass bead is less than or equal to 5 mu m.
Preferably, the formula of the heat dissipation coating is as follows: 25 parts by weight of FeO powder and MnO 220 parts of powder, 8 parts of CuO powder, 55 parts of hollow glass beads, 135 parts of bisphenol A type epoxy resin and 2000 parts of deionized water.
Preferably, the preparation method of the heat dissipation coating comprises the following steps:
(1) MnO of2Uniformly mixing the powder, CuO powder and hollow glass beads, adding the mixture into bisphenol A type epoxy resin, uniformly mixing, adding FeO powder and deionized water, and ultrasonically mixing uniformly to obtain a heat-dissipation coating;
(2) uniformly coating the heat dissipation coating on the outer surface of a heat dissipation part and/or the surface of the fin, and then placing the heat dissipation coating in an electric field for processing for 5 minutes at 120-130V/cm;
in the whole electrifying process, a uniform external magnetic field is applied at the same time; the direction of the external magnetic field is vertical to the coating direction of the coating; the magnetic field intensity is 0.5T, and the magnetic field interval is 20-25 mm;
(3) then, keeping the temperature for 2 hours at 165-175 ℃ in an argon environment; naturally cooling, and then cleaning for 2-3 times;
(4) then preserving the heat for 2 hours at 450-550 ℃ under an argon environment; then preserving the heat for 0.5h at the temperature of 750-800 ℃; and naturally cooling to form the heat dissipation coating.
Preferably, the optical module is inserted into the upper and lower surfaces of the other end of the housing and is provided with a first heat dissipation plate and a second heat dissipation plate respectively, and the first heat dissipation plate and the second heat dissipation plate are connected to the housing through fastening bolts.
Preferably, the first heat dissipation plate is further provided with a plurality of heat dissipation holes.
The invention has the following beneficial effects:
1. when the optical module main part gets into the casing, the heat production is many and the heat dissipation is difficult. Through the arrangement of the invention, after the optical module main body enters, the radiating fins on the upper wall of the shell are automatically opened, so that the radiating area is increased, meanwhile, the shell is thinned due to the opening of the fins, the distance between the optical module main body and the outside is shortened, and the radiating efficiency is further improved. In addition, in the working process, channels are formed among the fins, and air flowing from the outside can form flow channels among the fins to help take away heat.
After the optical module main body leaves the shell, the fins on the shell are automatically closed, and the fins are prevented from being damaged by collision or injuring workers when in a standing state.
2. The heat dissipation part of the shell is also correspondingly provided with a heat dissipation coating to further help heat dissipation. The shell is made of metal, and during electrodeposition and after the bisphenol A type epoxy resin is contacted with the shell, gas can be generated to generate grooves on the surface of the coating. In addition, FeO floats on the surface of the coating under the action of a magnetic field, and part of FeO is washed away, so that a groove is further formed on the surface of the coating, the heat dissipation area of the coating is increased, and the heat dissipation capacity of the heat dissipation coating is effectively improved.
3. The invention also provides a processing technology of the 25G optical module, which optimizes processing steps and saves processing cost.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention in a non-operating state;
FIG. 2 is a sectional view taken along line A-A of the housing of FIG. 1 in a non-operative state;
FIG. 3 is a schematic view of the internal structure of the installation channel and the position relationship of the fins in FIG. 2;
FIG. 4 is a sectional view taken along line A-A of the housing of FIG. 1 in an operational state;
FIG. 5 is a schematic view of the internal structure of the installation channel and the position relationship of the fins in FIG. 4;
FIG. 6 is an enlarged view of one embodiment of section A of FIG. 2 in a non-operational state;
FIG. 7 is an enlarged view of one embodiment of section A of FIG. 4 in an operational state;
FIG. 8 is an enlarged view of the alternate embodiment of section A of FIG. 2 in a non-operational state;
FIG. 9 is an enlarged view of portion A of FIG. 4 in an alternative operational configuration;
FIG. 10 is a schematic view of one embodiment of the linkage connection of FIG. 2 in an operational state;
FIG. 11 is a schematic view of another embodiment of the linkage connection of FIG. 2 in an operational state;
fig. 12 is a schematic structural diagram of another embodiment of the present invention in an operating state.
Detailed Description
In each drawing, the optical module body 10 is in an operating state when inserted into the housing 20, and the optical module body 10 is in an inoperative state when not inserted into the housing 20.
As shown in fig. 1, a 25G optical module includes an optical module body 10 and a housing 20 with an opening at one end for inserting the optical module body 10, where the optical module body 10 may be sleeved inside the housing 20, or may be placed alone without being sleeved.
As shown in fig. 2 to 5, the housing 20 includes a base 21 having a cavity therein, and the cavity is used for the optical module body 10 to enter and exit. A heat dissipation portion 22 is provided above the base portion 21. The base 21 is actually integral with the heat sink 22 and is separated into two parts for convenience of description.
The base 21 is provided with a mounting channel on at least one side wall near the opening. The movable block 31 is arranged in the installation channel, the installation channel is preferably symmetrically arranged on two side walls, and the internal structure of the installation channel is correspondingly symmetrically arranged (only one side wall structure is shown in the figures).
An elastic part 34 is arranged between the outer end of the movable block 31 as a free end and the inner end of the movable block and the bottom of the installation channel, and the elastic part 34 is preferably a spring with strong elastic recovery capability. When the optical module body 10 is separated from the housing 20, the free end of the movable block 31 extends into the cavity. The inner end of the movable block 31 is connected with a tensile rope 35.
The movable block 31, the elastic member 34 and the tensile cord 35 are preferably connected as follows: the installation passageway slope is arranged, movable block 31 one end is the free end, the tensile pole 32 rigid coupling of movable block in the other end and the installation passageway, the tensile pole 32 of movable block and the outer end rigid coupling of connecting rod 33 that is on a parallel with the lateral wall depth direction, the middle part of connecting rod 33, with the tensile pole 32 opposite direction rigid coupling of movable block elastomeric element 34, connecting rod 33 inner with tensile rope 35 rigid coupling, tensile rope 35 is preferred to be wire rope.
Preferably, when the optical module body 10 does not enter, a surface of the movable block 31 connected to the connecting rod 33 is just located at an opening of the cavity formed in the sidewall, and the surface is parallel to the opening of the cavity; after the optical module body 10 completely enters the housing 20, the movable block 31 completely enters the cavity.
The other end of the tensile rope 35 extends into the heat dissipation part 22 and is fixedly connected with the face near the end face of the first movable rod 361, the first movable rod 361 is hinged to the upper surface of the heat dissipation part 22, and the first movable rod 361 is fixedly connected with the fin 37; the heat dissipation portion 22 is correspondingly provided with fin grooves 38, so that the fins 37 are just positioned in the fin grooves 38 when in a closed state.
The connection mode of the tensile rope 35 and the first movable rod 361 is as follows: the included angle between the tangent of the fixed joint 350 of the tensile rope 35 on the cross section circular surface of the first movable rod 361 and the fin 37 is 90-180 degrees. When the included angle is 180 degrees, the specific connection mode in the non-working state is shown in fig. 6, and the specific connection mode in the working state is shown in fig. 7. When the included angle is 90 °, the specific connection manner in the non-operating state is as shown in fig. 8, and the specific connection manner in the operating state is as shown in fig. 9 (the linkage connection manner shown in fig. 6 to 9 corresponds to the connection manner in fig. 10).
The part of the movable block 31 extending into the cavity is preferably an arc surface extending along the direction of the optical module body 10. In order to facilitate the insertion of the optical module body 10 into the housing 20, the movable block 31 can be easily pressed into the sidewall without damaging the optical module body 10. One end of the movable block 31 is a free end, and when no optical module main body 10 enters, the protruding side wall enters the cavity.
It should be noted that the position relationship illustrated in the drawings is merely for convenience of observation and explanation, and there is a certain displacement difference between the movable block 31 and the fin 37 in the depth direction of the housing 20. The movable block 31 is located at the open entrance of the housing 20. The fin 37 is located on the end surface of the other end of the opening end of the housing 20, preferably located at a position corresponding to the upper surface of the housing 20 at the deepest position of the optical module body 10 after insertion; that is, after the optical module body 10 is inserted, the fins 37 are provided above the insertion end thereof at a position corresponding to the housing 20.
The more preferable scheme is as follows: the first movable rod 361 and the at least one second movable rod 362 are connected in a linkage manner, and the second movable rod 362 is hinged to the upper surface of the heat dissipation part 22 and fixedly connected with the fins 37. The second movable bar 362 is parallel to the first movable bar 361.
The linkage connection may be as shown in fig. 10, extending the tensile cord 35 to form a linkage cord 351. The link rope 351 is formed in a stable connection with the first movable bar 361 after being wound around the first movable bar 361 at least one turn, and then extended and wound around the second movable bar 362 in the same manner. In order to form a stable connection between the linking rope 351 and each movable rod, a groove may be formed in each movable rod, and the linking rope 351 may be fixed in the groove. The stretching rope 35 moves up and down, and pulls the linkage rope 351 to move left and right, thereby driving the fins 37 to open and close in a linkage manner.
The linkage connection may also be, as shown in fig. 11, a linkage bar 352 is hinged to the outer side of each fin 37. The upper surface of the heat dissipation part 22 is correspondingly provided with a groove for placing the linkage rod 352. The stretching rope 35 moves up and down to drive the fins 37 on the first movable rod 361 to open and close, and then the fins 37 are used for linkage opening and closing under the action of the linkage rod 352. The fin grooves 38 are not shown in both fig. 10 and 11.
The working principle of the invention is as follows: when the optical module body 10 is not inserted, the elastic member 34 is in a natural state, the movable block 31 protrudes from the side wall and is located inside the housing 20, and the fins 37 are in a closed state. The optical module body 10 enters from the opening of the housing 20, and pushes the movable block 31 to move to the inside and deep inside the sidewall of the housing 20, so that the elastic component 34 is pressed down to drive the tensile rope 35 to move downward, thereby driving the first movable rod 361 to rotate, and driving the fins 37 to open under the linkage structure. After the optical module body 10 exits the housing 20, the elastic member 34 returns to the natural state, pushes the movable block 31 to move outward, and at the same time, the tensile cord 35 moves upward, and the fins 37 are closed.
The more preferable scheme is as follows: the outer surface of the heat dissipation portion 22 and/or the fins 37 are provided with a heat dissipation coating (not shown).
The preparation method of the heat dissipation coating comprises the following steps:
1. the formula is as follows: 20-25 parts of FeO powder and MnO in parts by weight220-25 parts of powder, 8-10 parts of CuO powder, 50-60 parts of hollow glass beads, 100-160 parts of bisphenol A epoxy resin and 2000 parts of deionized water. The particle size of the powder of each metal oxide is less than or equal to 0.5 mu m, and the particle size of the hollow glass bead is less than or equal to 5 mu m.
2. The preparation method comprises the following steps:
(1) MnO of2And uniformly mixing the powder, the CuO powder and the hollow glass beads, adding the mixture into bisphenol A type epoxy resin, uniformly mixing, adding FeO powder and deionized water, and ultrasonically and uniformly mixing to obtain the heat-dissipating coating.
(2) And uniformly coating the heat dissipation coating on the clean surface to be plated. The area of the coating to be plated, which can be coated by 1g of the heat dissipation coating, is 100-200 cm2. And (3) placing the coating to be plated after coating in an electric field, providing a direct current power supply by using a JY 600 type electrophoresis apparatus, applying a constant electric field of 120-130V/cm between electrodes, and electrifying for 5 minutes.
In the whole electrifying process, a uniform external magnetic field is applied to the to-be-plated layer at the same time. The direction of the external magnetic field is vertical to the coating direction of the coating on the layer to be coated; the magnetic field intensity is 0.5T, and the magnetic field interval is 20-25 mm.
(3) And (3) placing the layer to be plated after the treatment in the step (2) in an argon environment at the temperature of 165-175 ℃, and preserving heat for 2 hours. And after natural cooling, ultrasonically cleaning the to-be-plated layer for 2-3 times by using deionized water, and washing off metal oxides on the surface of the plated layer to form the plated layer with uniform pores.
(4) Then preserving the heat for 2 hours at 450-550 ℃ under an argon environment; and then preserving the heat for 0.5h at the temperature of 750-800 ℃, and removing the bisphenol A type epoxy resin. And naturally cooling to form the heat dissipation coating.
The preparation of the heat-dissipating coating is further described below with reference to specific experiments.
10 groups of heat dissipation coatings were prepared according to the above method, wherein the specific parameters of each group are shown in table 1, and the components in the table are in parts by weight. FeO was not added as a control 1, and an applied magnetic field was not added as a control 2.
TABLE 1 specific parameter tables
Figure BDA0001843249010000081
The emissivity is a basic parameter of thermophysical property, the emissivity of each heat dissipation coating is measured by using an infrared thermal emissivity tester, and the apparent characteristics of the heat dissipation coatings are observed by using an electron microscope, and the result is shown in table 2.
Table 2 Each group of effect display table
Group of Emissivity Apparent characteristics
Group 1 0.88 Structure with a large number of grooves
Group 2 0.93 Structure with a large number of grooves
Group 3 0.87 Structure with a large number of grooves
Group 4 0.87 Structure with a large number of grooves
Group 5 0.82 Structure with a large number of grooves
Group 6 0.85 Structure with a large number of grooves
Group 7 0.83 Structure with a large number of grooves
Group 8 0.85 Structure with a large number of grooves
Group 9 0.82 Structure with a large number of grooves
Group
10 0.76 Structure with a large number of grooves
Control group 1 0.70 Partial groove structure
Control group 2 0.76 Small number of groove structures
The more preferable scheme is as follows: the optical module body 10 is further provided with a first heat sink 41 and a second heat sink 42 on the upper and lower surfaces of the other end inserted into the housing 20, and the first heat sink 41 is further provided with a plurality of heat dissipating holes 411. The heat dissipation plates are made of metal materials with good heat dissipation performance, such as metal aluminum. The first heat sink 41 and the second heat sink 42 are connected to the case 20 by fastening bolts 50. In order to ensure that the first heat sink 41 and the second heat sink 42 are tightly attached to the optical module body 10, a clamping spring 51 is further provided between the fastening bolt 50 and the second heat sink 42.

Claims (10)

1. A processing technology of a 25G optical module is characterized by comprising the following steps: the specific processing technology comprises the following steps:
(1) preparing an optical module main body (10) and a shell (20), opening one end of the shell (20), and processing a cavity for the optical module main body (10) to enter and exit inwards along the opening;
(2) a mounting channel is arranged on at least one side wall of the shell (20), and a through hole communicated with the mounting channel is arranged at the top of the shell (20);
(3) an elastic component (34) is arranged at the bottom of the installation channel, a movable block (31) is fixedly connected to the other end of the elastic component (34), and when the elastic component (34) is in a natural state, the outer end of the movable block (31) extends out of the installation channel and enters the cavity;
(4) a stretching rope (35) is put into the through hole at the top of the shell (20) and stretches into the mounting channel, and the stretching rope (35) is fixedly connected with the inner end of the movable block (31); the stretching rope (35) is remained on the surface part of the top of the shell (20) and fixedly connected with the face near the end surface of a first movable rod (361), a fin (37) is fixedly connected on the first movable rod (361), the first movable rod is hinged to the top of the shell (20), and a fin groove (38) is correspondingly arranged on the top of the shell (20);
the specific connection processing mode of the stretching rope (35) and the first movable rod (361) is as follows: an included angle between a tangent of a fixed connection point of the stretching rope (35) on the cross section circular surface of the first movable rod (361) and the fin (37) is 90-180 degrees;
and after the setting is finished, the 25G optical module is processed.
2. The process for manufacturing the 25G optical module according to claim 1, wherein: the movable block (31), the elastic part (34) and the stretching rope (35) are specifically processed and connected in the following way:
(1) processing the installation channel along the inclined direction, and fixedly connecting the inner end of the movable block (31) with a movable block stretching rod (32) in the installation channel;
(2) then fixedly connecting the movable block stretching rod (32) with the outer end of a connecting rod (33), wherein the connecting rod (33) is arranged along the depth direction parallel to the side wall;
(3) then fixedly connecting the middle part of the connecting rod (33) with the elastic part (34) in the direction opposite to the direction of the movable block stretching rod (32);
(4) and finally, fixedly connecting the inner end of the connecting rod (33) with the stretching rope (35), and finishing the processing of the part of structure.
3. The process for manufacturing the 25G optical module according to claim 1, wherein: and processing the part of the movable block (31) extending into the cavity into a cambered surface extending along the in-and-out direction of the optical module main body (10).
4. The process for manufacturing the 25G optical module according to claim 1, wherein: the first movable rod (361) is connected with at least one second movable rod (362) in a linkage manner, and the second movable rod (362) is hinged to the upper surface of the heat dissipation part (22) and fixedly connected with a fin (37); and the second movable bar (362) is disposed in parallel with the first movable bar (361).
5. The process for manufacturing the 25G optical module according to claim 1, wherein: a heat-dissipating coating is provided on the fins (37).
6. The process for manufacturing the 25G optical module according to claim 5, wherein: the formula of the heat dissipation coating is as follows: 20-25 parts of FeO powder and MnO in parts by weight220-25 parts of powder, 8-10 parts of CuO powder, 50-60 parts of hollow glass beads, 100-160 parts of bisphenol A epoxy resin and 2000 parts of deionized water; FeO powder, MnO2The grain diameter of the powder and the CuO powder is less than or equal to 0.5 mu m, and the grain diameter of the hollow glass micro-bead is less than or equal to 5 mu m.
7. The process for manufacturing the 25G optical module according to claim 6, wherein: the formula of the heat dissipation coating is as follows: 25 parts by weight of FeO powder and MnO220 parts of powder, 8 parts of CuO powder, 55 parts of hollow glass beads, 135 parts of bisphenol A type epoxy resin and 2000 parts of deionized water.
8. The process for manufacturing a 25G optical module according to claim 6 or 7, wherein: the preparation method of the heat dissipation coating comprises the following steps:
(1) MnO of2Uniformly mixing the powder, CuO powder and hollow glass beads, adding the mixture into bisphenol A type epoxy resin, uniformly mixing, adding FeO powder and deionized water, and ultrasonically mixing uniformly to obtain a heat-dissipation coating;
(2) uniformly coating the heat dissipation coating on the surface of the fin (37), and then placing the fin in an electric field for processing for 5 minutes at 120-130V/cm;
in the whole electrifying process, a uniform external magnetic field is applied at the same time; the direction of the external magnetic field is vertical to the coating direction of the coating; the magnetic field intensity is 0.5T, and the magnetic field interval is 20-25 mm;
(3) then, keeping the temperature for 2 hours at 165-175 ℃ in an argon environment; naturally cooling, and then cleaning for 2-3 times;
(4) then preserving the heat for 2 hours at 450-550 ℃ under an argon environment; then preserving the heat for 0.5h at the temperature of 750-800 ℃; and naturally cooling to form the heat dissipation coating.
9. The process for manufacturing the 25G optical module according to claim 1, wherein: a first heat dissipation plate (41) and a second heat dissipation plate (42) are respectively installed on the upper surface and the lower surface of the other end of the optical module main body (10) inserted into the shell (20), and the first heat dissipation plate (41) and the second heat dissipation plate (42) are connected to the shell (20) through fastening bolts (50).
10. The process for manufacturing a 25G optical module according to claim 9, wherein: a plurality of heat dissipation holes (411) are formed in the first heat dissipation plate (41).
CN201811258201.6A 2018-10-26 2018-10-26 Processing technology of 25G optical module Active CN109445041B (en)

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