CN109435418A - A kind of processing method of organic material - Google Patents
A kind of processing method of organic material Download PDFInfo
- Publication number
- CN109435418A CN109435418A CN201811377525.1A CN201811377525A CN109435418A CN 109435418 A CN109435418 A CN 109435418A CN 201811377525 A CN201811377525 A CN 201811377525A CN 109435418 A CN109435418 A CN 109435418A
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- CN
- China
- Prior art keywords
- organic material
- aluminium base
- metal aluminium
- processing method
- material according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011368 organic material Substances 0.000 title claims abstract description 50
- 238000003672 processing method Methods 0.000 title claims abstract description 21
- 239000004411 aluminium Substances 0.000 claims abstract description 57
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 57
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims description 16
- 238000012360 testing method Methods 0.000 claims description 12
- 238000007788 roughening Methods 0.000 claims description 7
- 239000003814 drug Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000005422 blasting Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 241000208340 Araliaceae Species 0.000 claims 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims 1
- 235000003140 Panax quinquefolius Nutrition 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 235000008434 ginseng Nutrition 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 238000005488 sandblasting Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000002585 base Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
- B32B2038/002—Sandblasting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The invention discloses a kind of processing method of organic material, the processing method is the following steps are included: provide a metal aluminium base, being roughened to the surface of metal aluminium base makes its surface at honeycomb;Remove the greasy dirt on the surface of metal aluminium base;The surface that organic material is fitted in metal aluminium base closes organic material and metallic aluminium base junction by bonding processes.The present invention is roughened and degreases to the surface of metal aluminium base, organic material and metal aluminium base can be made to be securely joined with by bonding processes again, solve it is organic it is high lead between material and metal aluminium base binding force difference caused by bad retirement, manufacture cost to save.
Description
Technical field
The present invention relates to field of material processing more particularly to a kind of processing methods of organic material.
Background technique
The excellent metal material of mechanical property and the organic material formation metal joined integrally of high insulation characterisitic is organic multiple
Synthesis type body is widely used in various industrial circles, such as the substrate in the field PCB.Wherein, the good aluminium of exothermicity
Or aluminium alloy is selection the most commonly used in metal material.But metal aluminium base and the associativity difference of organic material are this kind of
The technological difficulties of sheet fabrication.
Summary of the invention
The purpose of the present invention is to provide a kind of processing method of organic material, to solve metal aluminium base and organic material
The problem of associativity difference.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of processing method of organic material, the processing method the following steps are included:
A metal aluminium base is provided, being roughened to the surface of metal aluminium base makes its surface at honeycomb;
Remove the greasy dirt on the surface of metal aluminium base;
The surface that organic material is fitted in metal aluminium base closes organic material and metallic aluminium base junction by bonding processes.
Optionally, it is 1.5-2.5 degrees celsius/minute, fender that the pressing parameter of the bonding processes, which includes: heating rate,
Expect brown paper according to 6 new 8 old 6 new arrangements.
Optionally, the roughening treatment selects one or both of chemical attack processing, blasting treatment;It is described coarse
The surface roughness RZ for changing treated metal aluminium base is greater than 7 microns.
Optionally, the roughening treatment is blasting treatment.
Optionally, the step: the greasy dirt on the surface of removal metal aluminium base specifically includes:
It provides one to degrease liquid medicine, uses the greasy dirt for the liquid medicine removal metallic aluminium primary surface that degreases.
Optionally, the organic material is the compound of organic Heat Conduction Material and ceramic powders;
Optionally, organic Heat Conduction Material is Halogen heat conductive insulating resin.
Optionally, in the bonding processes, organic material is first melted, and then solidifies the surface for being bonded in metal aluminium base.
Optionally, the step: so that organic material is attached to the surface of metal aluminium base by bonding processes, further include before
One step:
The temperature-viscosity curve for testing organic material carries out pressing formula according to the test result of temperature-viscosity curve and sets
Fixed, the pressing combination for carrying out multiple groups organic material and metal aluminium base is tested;Pressure is determined according to the test result of pressing combination test
Close parameter.
Optionally, the surface of the metal aluminium base is the opposite two sides of metal aluminium base.
Compared with prior art, the invention has the following advantages:
The present invention is roughened and degreases to the surface of metal aluminium base, then by bonding processes can make it is organic
Material and metal aluminium base are securely joined with, solve it is organic it is high lead between material and metal aluminium base binding force difference caused by not
It is good to scrap, cost is manufactured to save.
Specific embodiment
It in order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below will be to of the invention real
The technical solution applied in example is clearly and completely described, it is clear that the embodiments described below are only present invention a part
Embodiment, and not all embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creation
Property labour under the premise of all other embodiment obtained, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a kind of processing method of organic material, the processing method the following steps are included:
A metal aluminium base is provided, being roughened to the surface of metal aluminium base makes its surface at honeycomb;
Remove the greasy dirt on the surface of metal aluminium base;
The surface that organic material is fitted in metal aluminium base closes organic material and metallic aluminium base junction by bonding processes.
Wherein, the pressing parameter of bonding processes is chosen according to the characteristic of organic material.Then abovementioned steps: pass through bonding processes
So that organic material is attached to the surface of metal aluminium base, before further include a step:
The temperature-viscosity curve for testing organic material carries out pressing formula according to the test result of temperature-viscosity curve and sets
Fixed, the pressing combination for carrying out multiple groups organic material and metal aluminium base is tested;Pressure is determined according to the test result of pressing combination test
Close parameter.
Setting by pressing parameter controls organic material and closes in low viscosity with metallic aluminium base junction.The viscosity of organic material
It is related to temperature, according to the temperature-viscosity curve of organic material, the viscosity of organic material can be reacted by temperature.
In bonding processes, organic material is first melted, and then solidifies the surface for being bonded in metal aluminium base.
In the present embodiment, it is 1.5-2.5 degrees celsius/minute, buffering that the pressing parameter of bonding processes, which includes: heating rate,
Material brown paper is according to 6 new 8 old 6 new arrangements.
One or both of chemical attack processing, blasting treatment can be selected in roughening treatment.In the present embodiment, coarse
Changing processing is blasting treatment, and the surface roughness RZ of the metal aluminium base after roughening treatment is greater than 7 microns.
In the present embodiment, abovementioned steps: the greasy dirt on the surface of removal metal aluminium base specifically includes:
It provides one to degrease liquid medicine, uses the greasy dirt for the liquid medicine removal metallic aluminium primary surface that degreases.
Specifically, organic material is the compound of organic Heat Conduction Material and ceramic powders, wherein organic Heat Conduction Material is nothing
Halogen heat conductive insulating resin.The surface of metal aluminium base is the opposite two sides of metal aluminium base.
The embodiment of the present invention is roughened and degreases to the surface of metal aluminium base, then by being arranged suitable
Pressing parameter carry out bonding processes be securely joined with organic material and metal aluminium base, solve it is organic it is high lead material and gold
Bad retirement caused by binding force difference between category aluminium base, manufactures cost to save.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations;Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features;And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of processing method of organic material, which is characterized in that the processing method the following steps are included:
A metal aluminium base is provided, being roughened to the surface of metal aluminium base makes its surface at honeycomb;
Remove the greasy dirt on the surface of metal aluminium base;
The surface that organic material is fitted in metal aluminium base closes organic material and metallic aluminium base junction by bonding processes.
2. the processing method of organic material according to claim 1, which is characterized in that the pressing parameter of the bonding processes
It include: heating rate for 1.5-2.5 degrees celsius/minute, padded coaming brown paper is newly arranged according to 6 new 8 old 6.
3. the processing method of organic material according to claim 1, which is characterized in that the roughening treatment selects chemistry
One or both of corrosion treatment, blasting treatment;The surface roughness RZ of metal aluminium base after the roughening treatment is greater than 7
Micron.
4. the processing method of organic material according to claim 3, which is characterized in that the roughening treatment is at sandblasting
Reason.
5. the processing method of organic material according to claim 1, which is characterized in that the step: removal metal aluminium base
Surface greasy dirt, specifically include:
It provides one to degrease liquid medicine, uses the greasy dirt for the liquid medicine removal metallic aluminium primary surface that degreases.
6. the processing method of organic material according to claim 1, which is characterized in that the organic material is organic thermally conductive
The compound of material and ceramic powders.
7. the processing method of organic material according to claim 6, which is characterized in that organic Heat Conduction Material is Halogen
Heat conductive insulating resin.
8. the processing method of organic material according to claim 1, which is characterized in that in the bonding processes, You Jicai
Material first melts, and then solidifies the surface for being bonded in metal aluminium base.
9. the processing method of organic material according to claim 1, which is characterized in that the step: pass through bonding processes
So that organic material is attached to the surface of metal aluminium base, before further include a step:
The temperature-viscosity curve for testing organic material carries out pressing formula setting according to the test result of temperature-viscosity curve,
The pressing combination for carrying out multiple groups organic material and metal aluminium base is tested;Pressing ginseng is determined according to the test result of pressing combination test
Number.
10. the processing method of organic material according to claim 1, which is characterized in that the surface of the metal aluminium base is
The opposite two sides of metal aluminium base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811377525.1A CN109435418A (en) | 2018-11-19 | 2018-11-19 | A kind of processing method of organic material |
Applications Claiming Priority (1)
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CN201811377525.1A CN109435418A (en) | 2018-11-19 | 2018-11-19 | A kind of processing method of organic material |
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CN109435418A true CN109435418A (en) | 2019-03-08 |
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CN201811377525.1A Pending CN109435418A (en) | 2018-11-19 | 2018-11-19 | A kind of processing method of organic material |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102149252A (en) * | 2010-02-04 | 2011-08-10 | 景旺电子(深圳)有限公司 | Preparation method for aluminum-base copper-clad plate |
CN102181866A (en) * | 2011-04-14 | 2011-09-14 | 惠州中京电子科技股份有限公司 | Method for roughening surface of aluminum substrate |
CN102505134A (en) * | 2011-12-21 | 2012-06-20 | 广东生益科技股份有限公司 | Aluminum plate for radiating substrate and treatment method thereof |
CN102602117A (en) * | 2012-03-21 | 2012-07-25 | 苏州东亚欣业节能照明有限公司 | Method for preparing copper-clad plate |
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CN104113979A (en) * | 2014-02-13 | 2014-10-22 | 美的集团股份有限公司 | Aluminum-based circuit board and preparation method thereof, and full packaging electronic component |
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-
2018
- 2018-11-19 CN CN201811377525.1A patent/CN109435418A/en active Pending
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Application publication date: 20190308 |
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