CN109435418A - A kind of processing method of organic material - Google Patents

A kind of processing method of organic material Download PDF

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Publication number
CN109435418A
CN109435418A CN201811377525.1A CN201811377525A CN109435418A CN 109435418 A CN109435418 A CN 109435418A CN 201811377525 A CN201811377525 A CN 201811377525A CN 109435418 A CN109435418 A CN 109435418A
Authority
CN
China
Prior art keywords
organic material
aluminium base
metal aluminium
processing method
material according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811377525.1A
Other languages
Chinese (zh)
Inventor
吴华军
邵勇
蔡志浩
梁高
朱占植
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN WUZHU TECHNOLOGY Co Ltd
Original Assignee
SHENZHEN WUZHU TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN WUZHU TECHNOLOGY Co Ltd filed Critical SHENZHEN WUZHU TECHNOLOGY Co Ltd
Priority to CN201811377525.1A priority Critical patent/CN109435418A/en
Publication of CN109435418A publication Critical patent/CN109435418A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/12Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0012Mechanical treatment, e.g. roughening, deforming, stretching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0012Mechanical treatment, e.g. roughening, deforming, stretching
    • B32B2038/002Sandblasting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

The invention discloses a kind of processing method of organic material, the processing method is the following steps are included: provide a metal aluminium base, being roughened to the surface of metal aluminium base makes its surface at honeycomb;Remove the greasy dirt on the surface of metal aluminium base;The surface that organic material is fitted in metal aluminium base closes organic material and metallic aluminium base junction by bonding processes.The present invention is roughened and degreases to the surface of metal aluminium base, organic material and metal aluminium base can be made to be securely joined with by bonding processes again, solve it is organic it is high lead between material and metal aluminium base binding force difference caused by bad retirement, manufacture cost to save.

Description

A kind of processing method of organic material
Technical field
The present invention relates to field of material processing more particularly to a kind of processing methods of organic material.
Background technique
The excellent metal material of mechanical property and the organic material formation metal joined integrally of high insulation characterisitic is organic multiple Synthesis type body is widely used in various industrial circles, such as the substrate in the field PCB.Wherein, the good aluminium of exothermicity Or aluminium alloy is selection the most commonly used in metal material.But metal aluminium base and the associativity difference of organic material are this kind of The technological difficulties of sheet fabrication.
Summary of the invention
The purpose of the present invention is to provide a kind of processing method of organic material, to solve metal aluminium base and organic material The problem of associativity difference.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of processing method of organic material, the processing method the following steps are included:
A metal aluminium base is provided, being roughened to the surface of metal aluminium base makes its surface at honeycomb;
Remove the greasy dirt on the surface of metal aluminium base;
The surface that organic material is fitted in metal aluminium base closes organic material and metallic aluminium base junction by bonding processes.
Optionally, it is 1.5-2.5 degrees celsius/minute, fender that the pressing parameter of the bonding processes, which includes: heating rate, Expect brown paper according to 6 new 8 old 6 new arrangements.
Optionally, the roughening treatment selects one or both of chemical attack processing, blasting treatment;It is described coarse The surface roughness RZ for changing treated metal aluminium base is greater than 7 microns.
Optionally, the roughening treatment is blasting treatment.
Optionally, the step: the greasy dirt on the surface of removal metal aluminium base specifically includes:
It provides one to degrease liquid medicine, uses the greasy dirt for the liquid medicine removal metallic aluminium primary surface that degreases.
Optionally, the organic material is the compound of organic Heat Conduction Material and ceramic powders;
Optionally, organic Heat Conduction Material is Halogen heat conductive insulating resin.
Optionally, in the bonding processes, organic material is first melted, and then solidifies the surface for being bonded in metal aluminium base.
Optionally, the step: so that organic material is attached to the surface of metal aluminium base by bonding processes, further include before One step:
The temperature-viscosity curve for testing organic material carries out pressing formula according to the test result of temperature-viscosity curve and sets Fixed, the pressing combination for carrying out multiple groups organic material and metal aluminium base is tested;Pressure is determined according to the test result of pressing combination test Close parameter.
Optionally, the surface of the metal aluminium base is the opposite two sides of metal aluminium base.
Compared with prior art, the invention has the following advantages:
The present invention is roughened and degreases to the surface of metal aluminium base, then by bonding processes can make it is organic Material and metal aluminium base are securely joined with, solve it is organic it is high lead between material and metal aluminium base binding force difference caused by not It is good to scrap, cost is manufactured to save.
Specific embodiment
It in order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below will be to of the invention real The technical solution applied in example is clearly and completely described, it is clear that the embodiments described below are only present invention a part Embodiment, and not all embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creation Property labour under the premise of all other embodiment obtained, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a kind of processing method of organic material, the processing method the following steps are included:
A metal aluminium base is provided, being roughened to the surface of metal aluminium base makes its surface at honeycomb;
Remove the greasy dirt on the surface of metal aluminium base;
The surface that organic material is fitted in metal aluminium base closes organic material and metallic aluminium base junction by bonding processes.
Wherein, the pressing parameter of bonding processes is chosen according to the characteristic of organic material.Then abovementioned steps: pass through bonding processes So that organic material is attached to the surface of metal aluminium base, before further include a step:
The temperature-viscosity curve for testing organic material carries out pressing formula according to the test result of temperature-viscosity curve and sets Fixed, the pressing combination for carrying out multiple groups organic material and metal aluminium base is tested;Pressure is determined according to the test result of pressing combination test Close parameter.
Setting by pressing parameter controls organic material and closes in low viscosity with metallic aluminium base junction.The viscosity of organic material It is related to temperature, according to the temperature-viscosity curve of organic material, the viscosity of organic material can be reacted by temperature.
In bonding processes, organic material is first melted, and then solidifies the surface for being bonded in metal aluminium base.
In the present embodiment, it is 1.5-2.5 degrees celsius/minute, buffering that the pressing parameter of bonding processes, which includes: heating rate, Material brown paper is according to 6 new 8 old 6 new arrangements.
One or both of chemical attack processing, blasting treatment can be selected in roughening treatment.In the present embodiment, coarse Changing processing is blasting treatment, and the surface roughness RZ of the metal aluminium base after roughening treatment is greater than 7 microns.
In the present embodiment, abovementioned steps: the greasy dirt on the surface of removal metal aluminium base specifically includes:
It provides one to degrease liquid medicine, uses the greasy dirt for the liquid medicine removal metallic aluminium primary surface that degreases.
Specifically, organic material is the compound of organic Heat Conduction Material and ceramic powders, wherein organic Heat Conduction Material is nothing Halogen heat conductive insulating resin.The surface of metal aluminium base is the opposite two sides of metal aluminium base.
The embodiment of the present invention is roughened and degreases to the surface of metal aluminium base, then by being arranged suitable Pressing parameter carry out bonding processes be securely joined with organic material and metal aluminium base, solve it is organic it is high lead material and gold Bad retirement caused by binding force difference between category aluminium base, manufactures cost to save.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations;Although referring to before Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features;And these It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.

Claims (10)

1. a kind of processing method of organic material, which is characterized in that the processing method the following steps are included:
A metal aluminium base is provided, being roughened to the surface of metal aluminium base makes its surface at honeycomb;
Remove the greasy dirt on the surface of metal aluminium base;
The surface that organic material is fitted in metal aluminium base closes organic material and metallic aluminium base junction by bonding processes.
2. the processing method of organic material according to claim 1, which is characterized in that the pressing parameter of the bonding processes It include: heating rate for 1.5-2.5 degrees celsius/minute, padded coaming brown paper is newly arranged according to 6 new 8 old 6.
3. the processing method of organic material according to claim 1, which is characterized in that the roughening treatment selects chemistry One or both of corrosion treatment, blasting treatment;The surface roughness RZ of metal aluminium base after the roughening treatment is greater than 7 Micron.
4. the processing method of organic material according to claim 3, which is characterized in that the roughening treatment is at sandblasting Reason.
5. the processing method of organic material according to claim 1, which is characterized in that the step: removal metal aluminium base Surface greasy dirt, specifically include:
It provides one to degrease liquid medicine, uses the greasy dirt for the liquid medicine removal metallic aluminium primary surface that degreases.
6. the processing method of organic material according to claim 1, which is characterized in that the organic material is organic thermally conductive The compound of material and ceramic powders.
7. the processing method of organic material according to claim 6, which is characterized in that organic Heat Conduction Material is Halogen Heat conductive insulating resin.
8. the processing method of organic material according to claim 1, which is characterized in that in the bonding processes, You Jicai Material first melts, and then solidifies the surface for being bonded in metal aluminium base.
9. the processing method of organic material according to claim 1, which is characterized in that the step: pass through bonding processes So that organic material is attached to the surface of metal aluminium base, before further include a step:
The temperature-viscosity curve for testing organic material carries out pressing formula setting according to the test result of temperature-viscosity curve, The pressing combination for carrying out multiple groups organic material and metal aluminium base is tested;Pressing ginseng is determined according to the test result of pressing combination test Number.
10. the processing method of organic material according to claim 1, which is characterized in that the surface of the metal aluminium base is The opposite two sides of metal aluminium base.
CN201811377525.1A 2018-11-19 2018-11-19 A kind of processing method of organic material Pending CN109435418A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811377525.1A CN109435418A (en) 2018-11-19 2018-11-19 A kind of processing method of organic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811377525.1A CN109435418A (en) 2018-11-19 2018-11-19 A kind of processing method of organic material

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CN109435418A true CN109435418A (en) 2019-03-08

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102149252A (en) * 2010-02-04 2011-08-10 景旺电子(深圳)有限公司 Preparation method for aluminum-base copper-clad plate
CN102181866A (en) * 2011-04-14 2011-09-14 惠州中京电子科技股份有限公司 Method for roughening surface of aluminum substrate
CN102505134A (en) * 2011-12-21 2012-06-20 广东生益科技股份有限公司 Aluminum plate for radiating substrate and treatment method thereof
CN102602117A (en) * 2012-03-21 2012-07-25 苏州东亚欣业节能照明有限公司 Method for preparing copper-clad plate
CN102673048A (en) * 2012-05-31 2012-09-19 咸阳众鑫电子材料有限公司 Method for manufacturing high-thermal-conductivity aluminum-based copper clad plate
CN103419460A (en) * 2012-05-24 2013-12-04 甄伟浪 Processing method of high-heat-conduction aluminum base copper clad board
CN104113979A (en) * 2014-02-13 2014-10-22 美的集团股份有限公司 Aluminum-based circuit board and preparation method thereof, and full packaging electronic component
CN106626700A (en) * 2016-12-27 2017-05-10 江西省航宇新材料股份有限公司 Manufacturing technique for aluminum metal base copper foil coating laminated board
CN107839365A (en) * 2017-10-13 2018-03-27 乾乐欣展新材料技术(上海)有限公司 A kind of method of aluminium base screen printing brush coating

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102149252A (en) * 2010-02-04 2011-08-10 景旺电子(深圳)有限公司 Preparation method for aluminum-base copper-clad plate
CN102181866A (en) * 2011-04-14 2011-09-14 惠州中京电子科技股份有限公司 Method for roughening surface of aluminum substrate
CN102505134A (en) * 2011-12-21 2012-06-20 广东生益科技股份有限公司 Aluminum plate for radiating substrate and treatment method thereof
CN102602117A (en) * 2012-03-21 2012-07-25 苏州东亚欣业节能照明有限公司 Method for preparing copper-clad plate
CN103419460A (en) * 2012-05-24 2013-12-04 甄伟浪 Processing method of high-heat-conduction aluminum base copper clad board
CN102673048A (en) * 2012-05-31 2012-09-19 咸阳众鑫电子材料有限公司 Method for manufacturing high-thermal-conductivity aluminum-based copper clad plate
CN104113979A (en) * 2014-02-13 2014-10-22 美的集团股份有限公司 Aluminum-based circuit board and preparation method thereof, and full packaging electronic component
CN106626700A (en) * 2016-12-27 2017-05-10 江西省航宇新材料股份有限公司 Manufacturing technique for aluminum metal base copper foil coating laminated board
CN107839365A (en) * 2017-10-13 2018-03-27 乾乐欣展新材料技术(上海)有限公司 A kind of method of aluminium base screen printing brush coating

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Application publication date: 20190308

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