CN109435140A - Injection moulding process - Google Patents
Injection moulding process Download PDFInfo
- Publication number
- CN109435140A CN109435140A CN201811108782.5A CN201811108782A CN109435140A CN 109435140 A CN109435140 A CN 109435140A CN 201811108782 A CN201811108782 A CN 201811108782A CN 109435140 A CN109435140 A CN 109435140A
- Authority
- CN
- China
- Prior art keywords
- moulding
- mold
- line
- protection
- injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The embodiment of the invention discloses a kind of injection moulding process; this method comprises: composite protection layer is arranged in the bond pad surface in the first moulding; it is formed to moulding; wherein, the composite protection layer includes the shape memory alloy layer positioned at surface layer and the protection glue-line between the pad and the shape memory alloy layer；It is placed in described in mold to moulding, the plastic grains of the second moulding of injection in Xiang Suoshu mold, and the mold is heated, thickend so that the shape memory alloy layer is heated, the gas vent discharge then gasified by the mold；The mold is removed, the protection glue-line of the bond pad surface is washed, second moulding is formed with the surface in first moulding.Injection moulding process disclosed by the embodiments of the present invention, can butt welding fold double protection, promote the quality of protection to pad, while glue-line being protected to be readily cleaned, the reliability of moulding pad can be promoted.
Description
Technical field
The invention belongs to injection molding technology field more particularly to a kind of injection moulding process.
Background technique
In electronic component injection moulding process, the pad of moulding will be electrically connected with other electronic components, therefore,
Evacuation protection processing is done, to position where pad to avoid it is covered with plastic and influences subsequent welding.
At this stage, evacuation protection is carried out to these key positions, is mainly realized by following two mode:
First, it is coated in bond pad surface using high temperature resistant protective glue before injection molding, is then molded, but it is resistance to after being molded
High temperature protection glue is difficult to clean, and is easy residual, is caused failure welding；
Second, make evacuation on mold, but when die size not at that time, easily cause pad scald.
In short, electronic component injection moulding process at this stage has the technical problem poor to the quality of protection of pad.
Summary of the invention
In view of this, the embodiment of the invention provides a kind of injection moulding process, for solving electronic component note at this stage
Molding process has the technical problem poor to the quality of protection of pad.
The embodiment of the invention provides a kind of injection moulding process, this method comprises:
Composite protection layer is set in the bond pad surface of the first moulding, is formed to moulding, wherein the composite protection layer
Shape memory alloy layer including being located at surface layer and the protective glue between the pad and the shape memory alloy layer
Layer；
It is placed in described in mold to moulding, the plastic grains of the second moulding of injection in Xiang Suoshu mold, and to institute
It states mold to be heated, thicken so that the shape memory alloy layer is heated, the row of exhausting-gas hole then to be gasified by the mold
Out；
The mold is removed, the protection glue-line of the bond pad surface is washed, in the table of first moulding
Face forms second moulding.
Further, in the method for the bond pad surface setting composite protection layer of the first moulding, comprising:
The protection glue-line is coated in the bond pad surface of the first moulding；
The shape memory alloy layer is covered on the surface of the protection glue-line.
Further, the mold includes bed die and backform；
It is placed in described in mold to moulding, the plastic grains of the second moulding of injection in Xiang Suoshu mold, and to institute
State the method that mold is heated, comprising:
It is placed in described in the bed die to moulding, the bed die is heated, so that the marmem
Layer is heated to thicken；
The backform is fastened on to the opening portion of the bed die, the backform is heated, so that the shape memory
Alloy-layer is gasified and is discharged by the gas vent of the backform；
The plastic grains of the second moulding are injected by the inlet on the backform.
Further, before removing the mold, further includes:
The mold is placed in cooling equipment and carries out cooling treatment.
Further, the method for the protection glue-line of the bond pad surface is washed, comprising:
It is cleaned using the protection glue-line of the plasma washing equipment to the bond pad surface.
Further, the method for the protection glue-line of the bond pad surface is washed, comprising:
It is put into cleaning solvent and the protection glue-line of the bond pad surface is cleaned.
Further, the injection moulding process further include:
Using drying unit to after cleaning first moulding and second moulding be dried.
Injection moulding process provided in an embodiment of the present invention includes marmem in the bond pad surface setting of the first moulding
The composite protection layer of layer and protection glue-line, is molded, and inject plastic grains in mold, is heated to mold,
So that shape memory alloy layer gasify, remove mold the protection glue-line of bond pad surface is cleared up, shape memory alloy layer and
Protection glue-line can butt welding fold double protection, promote the quality of protection to pad, while glue-line being protected to be readily cleaned, can
Promote the reliability of moulding pad.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a method flow diagram of injection moulding process provided in an embodiment of the present invention；
Fig. 2 is the another method flow diagram of injection moulding process provided in an embodiment of the present invention；
Fig. 3 is the another method flow diagram of injection moulding process provided in an embodiment of the present invention；
Fig. 4 is the another method flow diagram of injection moulding process provided in an embodiment of the present invention；
Structural schematic diagram when Fig. 5 is injection moulding process practical application provided in an embodiment of the present invention.
Another structural schematic diagram when Fig. 6 is injection moulding process practical application provided in an embodiment of the present invention.
Another structural schematic diagram when Fig. 7 is injection moulding process practical application provided in an embodiment of the present invention.
Another structural schematic diagram when Fig. 8 is injection moulding process practical application provided in an embodiment of the present invention.
Specific embodiment
Carry out the embodiment that the present invention will be described in detail below in conjunction with accompanying drawings and embodiments, how the present invention is applied whereby
Technological means solves technical problem and reaches the realization process of technical effect to fully understand and implement.
As used some vocabulary to censure specific components in the specification and claims.Those skilled in the art answer
It is understood that hardware manufacturer may call the same component with different nouns.This specification and claims are not with name
The difference of title is as the mode for distinguishing component, but with the difference of component functionally as the criterion of differentiation.Such as logical
The "comprising" of piece specification and claim mentioned in is an open language, therefore should be construed to " include but do not limit
In "." substantially " refer within the acceptable error range, those skilled in the art can solve technology within a certain error range
Problem basically reaches technical effect.In addition, " coupling " or " electric connection " word includes any directly and indirectly electrical herein
Coupling means.Therefore, if it is described herein that a first device is coupled to a second device, then representing first device can directly electrical coupling
It is connected to second device, or is electrically coupled to second device indirectly by other devices or coupling means.Specification subsequent descriptions
To implement better embodiment of the invention, so description is being not limited to for the purpose of illustrating rule of the invention
The scope of the present invention.Protection scope of the present invention is as defined by the appended claims.
It should also be noted that, the terms "include", "comprise" or its any other variant are intended to nonexcludability
It include so that the process, method, commodity or the system that include a series of elements not only include those elements, but also to wrap
Include the other elements being not explicitly listed, or further include for this process, method, commodity or system intrinsic want
Element.In the absence of more restrictions, the element limited by sentence "including a ...", not being discharged is including element
There is also other identical elements in process, method, commodity or system.
Specific embodiment
Referring to FIG. 1, being a method flow diagram of injection moulding process provided in an embodiment of the present invention, which comprises
Step S100 is arranged composite protection layer in the bond pad surface of the first moulding, is formed to moulding, wherein described
Composite protection layer include positioned at surface layer shape memory alloy layer and be located at the pad and the shape memory alloy layer it
Between protection glue-line；
Step S300 is placed in described in mold to moulding, the plastic cement of the second moulding of injection in Xiang Suoshu mold
Grain, and the mold is heated, it thickens so that the shape memory alloy layer is heated, is then gasified by the mold
Gas vent discharge；
Step S500 removes the mold, the protection glue-line of the bond pad surface is washed, in first note
The surface of plastic forms second moulding.
Wherein, incorporated by reference to Fig. 5, in the step s 100, the pad 2 is located at the surface of first moulding 1, can be with
It is as shown in figure 5, being depressed in the surface of first moulding 1, or be mutually flat with the surface of first moulding 1
The neat surface for either protruding from first moulding 1, above latter two situation the present embodiment is not shown, but not structure
The exclusion of these pairs of situations, the embodiment of the present invention are only to be with the surface that the pad 2 is depressed in first moulding 1
Example is described；Specifically, composite protection layer is arranged in 2 surface of pad, is formed and covers the weldering by the composite protection layer
Disk to moulding, wherein the composite protection layer include positioned at surface layer shape memory alloy layer 4 and be located at the pad
Protection glue-line 3 between 2 and the shape memory alloy layer 4, it can be understood as the pad 2, the protection glue-line 3 and institute
The gesture that shape memory alloy layer forms stacking is stated, to play double protection to the pad 2 in injection molding.
Referring to FIG. 2, composite protection layer is arranged in the bond pad surface of the first moulding in the step S100, formed wait be molded
The specific method of part includes:
Step S110 coats the protection glue-line in the bond pad surface of the first moulding；
Step S120 covers the shape memory alloy layer on the surface of the protection glue-line.
And Fig. 5 is combined, in step s 110, the protection glue-line is coated on 2 surface of pad of the first moulding 1, here
The protection glue-line 3 be common protection glue-line, the surface of the pad 2 can be coated in by forms such as sprayings, is wanted here
The surface of the pad 2 is completely covered.
In the step s 120, it is coating the protection glue-line 3 and then is covering the marmem on its surface
Layer 4, to obtain the composite protection layer.
In step S300, incorporated by reference to Fig. 6, obtain it is described to moulding after, be placed in mold to moulding for described
In, i.e. molding is handled, and template here generally has two pieces, is mutually fastened and is formed enclosure space, it is described be placed in moulding it is described
In enclosure space, the plastic grains of the second moulding 6 are then injected into the mold 5, and heat to the mold 5,
Herein, the plastic grains are added in Xiang Suoshu mold 5 and mold heating can be carried out simultaneously, to the mould
When 5 heating of tool, the shape memory alloy layer 4 is heated to thicken, can to below the protection glue-line 3 and pad 2 play
Protective effect persistently heats the mold 5, while in the mold 5 under the action of high pressure, the shape memory alloy layer
4 are gasified, and are discharged via the gas vent 53 on the mold 5.
Specifically, referring to FIG. 3, the mold 5 here includes bed die 51 and backform 52；
It is placed in described in mold 5 to moulding, the plastic grains of the second moulding 6 of injection in Xiang Suoshu mold 5, and right
The method that the mold 5 is heated, comprising:
Step S310 is placed in the bed die to moulding by described, heats to the bed die, so that the shape
Memory alloy layer is heated to thicken；
The backform is fastened on the opening portion of the bed die by step S320, is heated to the backform, so that described
Shape memory alloy layer is gasified and is discharged by the gas vent of the backform；
Step S330 injects the plastic grains of the second moulding by the inlet on the backform.
Wherein, in step s310, it is put into described in the bed die 51 to moulding, the bed die 51 here is general
For groove-like structure, be put into it is described to moulding after the bed die 51 is heated so that the shape is remembered
Recall that alloy-layer 4 is heated to thicken, at this time to below the protection glue-line 3 and the pad 2 play a protective role.
In step 320, the opening portion of the bed die 51 is fastened on using the backform 52, so that in the mold 5
Enclosure space is formed, while also the backform 52 is heated, the backform 52 can be closed with the shape memory at this time
Layer gold 4 is close to each other and then contacts with each other, when the backform 52 is fastened on the opening portion of the bed die 51 completely, and along with
The raising of 5 internal temperature of mold, internal pressure also constantly increase, and the shape memory alloy layer 4 can be gasified, by solid
Body directly becomes gas, and the gas vent 53 as described in the gas vent on the backform 52 is discharged, as shown in Figure 7.
In step S330, while step S320 is carried out, when the backform 52 is fastened on the opening of the bed die 51
When portion, begins through the inlet 54 being located on the backform 52 and injected into the mold 5 and form second moulding 6
In plastic grains, the plastic grains melted by heat and the gap being full of between first moulding 1 and the mold 5, i.e.,
The region that package is not covered with 1 periphery of the first moulding by the protection glue-line 2, that is, form second moulding 6.
In step S500, the mold 5 is removed after the completion of injection molding, at this time first moulding 1 and the second note
Plastic 6 links together, and second moulding 6 is wrapped in the periphery of first moulding 1 in addition to the pad 2,
The surface of the pad 2 is covered with the protection glue-line 3；Then the protection glue-line 3 is cleaned, cleaning here
Method includes any one of following methods:
1, it is cleaned using the protection glue-line 3 of the plasma washing equipment to 2 surface of pad；Specifically
The composite members of first moulding 1 and the second moulding 6 that injection molding is completed are put into togerther in plasma washing equipment, to institute
The protection glue-line 3 for stating 2 surface of pad carries out plasma cleaning, to get rid of the protection glue-line on 2 surface of pad
3。
2, it is put into cleaning solvent and the protection glue-line 3 on 2 surface of pad is cleaned；Herein, described clear
Wash solvent be cleaning it is described protection glue-line 3 dedicated solvent, and will not to first moulding 1, second moulding 6 with
And the pad 2 generates destruction.
After cleaning, the protection glue-line 3 on 2 surface of pad is removed, and first moulding 1 is only left
It is equipped with the pad 2 with the surface of second moulding 6, first moulding 1, as shown in figure 8, being so far entirely molded
Journey is completed.
Referring to FIG. 4, in other preferred embodiments of the invention, in order to promote injection molding efficiency, described in dismounting
Before mold 5, i.e., before the described step S500, the injection moulding process further include:
The mold 5 is placed in cooling equipment and carries out cooling treatment by step S400.Specifically, described second will be molded
After discharge that plastic grains needed for moulding 6 inject in the mold 5 and the shape memory alloy layer 4 is gasified completely, really
It protects after the plastic grains are melted completely and wrap up the periphery of first moulding 1, the mold 5 is placed in cooling equipment
Middle carry out cooling treatment, can accelerate the solidification of second moulding 6, connect it quickly with first moulding 1,
Composite injection molding part is formed, injection molding efficiency can be promoted.
In addition, in other preferred embodiments of the invention, in order to promote the composite injection molding part (first moulding
1 and second moulding 6) forming quality to be used after the protection glue-line 3 for washing 2 surface of pad
Drying unit to after cleaning first moulding 1 and second moulding 6 be dried, to obtain clean institute
Composite members are stated, the condition for allowing to have next manufacturing process at once shortens the time of flowing water manufacture, reduces the manufacture of product
Period promotes manufacture efficiency.
Through the above description of the embodiments, those skilled in the art can be understood that each embodiment can
It realizes by means of software and necessary general hardware platform, naturally it is also possible to pass through hardware.Based on this understanding, on
Stating technical solution, substantially the part that contributes to existing technology can be embodied in the form of software products in other words, should
Computer software product may be stored in a computer readable storage medium, such as ROM/RAM, magnetic disk, CD, including several fingers
It enables and using so that a computer equipment (can be personal computer, server or the network equipment etc.) executes each implementation
The method of certain parts of example or embodiment.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (7)
1. a kind of injection moulding process characterized by comprising
Composite protection layer is set in the bond pad surface of the first moulding, is formed to moulding, wherein the composite protection layer includes
Protection glue-line positioned at the shape memory alloy layer on surface layer and between the pad and the shape memory alloy layer；
It is placed in described in mold to moulding, the plastic grains of the second moulding of injection in Xiang Suoshu mold, and to the mould
Tool is heated, and is thickend so that the shape memory alloy layer is heated, the gas vent discharge then gasified by the mold；
The mold is removed, the protection glue-line of the bond pad surface is washed, in the surface shape of first moulding
At second moulding.
2. injection moulding process according to claim 1, which is characterized in that compound guarantor is arranged in the bond pad surface of the first moulding
The method of sheath, comprising:
The protection glue-line is coated in the bond pad surface of the first moulding；
The shape memory alloy layer is covered on the surface of the protection glue-line.
3. injection moulding process according to claim 1, which is characterized in that the mold includes bed die and backform；
It is placed in described in mold to moulding, the plastic grains of the second moulding of injection in Xiang Suoshu mold, and to the mould
Have the method heated, comprising:
Be placed in described in the bed die to moulding, the bed die heated so that the shape memory alloy layer by
Thermal change is thick；
The backform is fastened on to the opening portion of the bed die, the backform is heated, so that the marmem
Layer is gasified and is discharged by the gas vent of the backform；
The plastic grains of the second moulding are injected by the inlet on the backform.
4. injection moulding process according to claim 1, which is characterized in that before removing the mold, further includes:
The mold is placed in cooling equipment and carries out cooling treatment.
5. injection moulding process according to claim 1, which is characterized in that wash the protection glue-line of the bond pad surface
Method, comprising:
It is cleaned using the protection glue-line of the plasma washing equipment to the bond pad surface.
6. injection moulding process according to claim 1, which is characterized in that wash the protection glue-line of the bond pad surface
Method, comprising:
It is put into cleaning solvent and the protection glue-line of the bond pad surface is cleaned.
7. injection moulding process according to claim 1, which is characterized in that further include:
Using drying unit to after cleaning first moulding and second moulding be dried.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811108782.5A CN109435140A (en) | 2018-09-21 | 2018-09-21 | Injection moulding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811108782.5A CN109435140A (en) | 2018-09-21 | 2018-09-21 | Injection moulding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109435140A true CN109435140A (en) | 2019-03-08 |
Family
ID=65531009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811108782.5A Pending CN109435140A (en) | 2018-09-21 | 2018-09-21 | Injection moulding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109435140A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0768630A (en) * | 1993-09-07 | 1995-03-14 | Mitsubishi Motors Corp | Resin foamed layer protector integral type resin tank and manufacture thereof |
-
2018
- 2018-09-21 CN CN201811108782.5A patent/CN109435140A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0768630A (en) * | 1993-09-07 | 1995-03-14 | Mitsubishi Motors Corp | Resin foamed layer protector integral type resin tank and manufacture thereof |
Non-Patent Citations (1)
| Title |
|---|
| 殷景华等: "《功能材料概论》", 31 August 2017 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106891006B (en) | A kind of selective laser fusing TC4 in-situ annealing goes residual stress method | |
| CN109016496A (en) | Photocuring 3D printing aftertreatment technology | |
| CN109435140A (en) | Injection moulding process | |
| EP2174765B1 (en) | Method of in-mold decoration | |
| JPS5942167A (en) | Combined multi-stage type forming die | |
| JP2007245595A (en) | Mold | |
| CN108748857B (en) | Method for processing micro loudspeaker assembly | |
| US11235502B2 (en) | Mold carrier for injection molding | |
| CN114799218B (en) | Powder cleaning and cleaning method for 3D printing exhaust insert | |
| CN111283968A (en) | Injection mold for collecting mold scale, mold scale collecting system and method | |
| JP2644074B2 (en) | Split spray method for release agent | |
| JP2010205929A (en) | Method of forming circuit on plastic member | |
| JP4854358B2 (en) | Mold design method, mold design apparatus and mold design program | |
| CN110767630A (en) | SiP module electromagnetic shielding method | |
| JP2016010950A (en) | Production system for optical element, production method of optical element and program | |
| JP3709388B2 (en) | Disk manufacturing system | |
| JP2007083657A (en) | Method for molding silicone rubber | |
| JPH04341812A (en) | Injection molding method | |
| JPH0349729B2 (en) | ||
| Reich et al. | Efficient Production of Individualized High-volume Parts | |
| CN206840600U (en) | High-precision silica gel injection mold | |
| JP2821112B2 (en) | Cleaning method for thermosetting resin injection mold | |
| CN106313422A (en) | Injection molding method for plastic encapsulated type IPM and plastic encapsulated type IPM | |
| CN105984075B (en) | A kind of In-mold decoration method and a kind of in-molded equipment | |
| JPH04287954A (en) | Mold of cace for integrated circuit and molding method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190308 |