CN109428990A - The assemble method of photographing module and photographing module - Google Patents
The assemble method of photographing module and photographing module Download PDFInfo
- Publication number
- CN109428990A CN109428990A CN201710790849.7A CN201710790849A CN109428990A CN 109428990 A CN109428990 A CN 109428990A CN 201710790849 A CN201710790849 A CN 201710790849A CN 109428990 A CN109428990 A CN 109428990A
- Authority
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- China
- Prior art keywords
- substrate
- photographing module
- bottom plate
- fixed frame
- lens assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 116
- 230000006698 induction Effects 0.000 claims abstract description 56
- 238000010586 diagram Methods 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of photographing module and the assemble method of photographing module, photographing module includes substrate, induction chip, electronic component, bottom plate and lens assembly.Induction chip is set on the first surface of substrate, and electronic component is set on the second surface of substrate.Bottom plate is covered in the second surface of substrate, and bottom plate has bottom plate aperture, is contained electronic component in bottom plate by bottom plate aperture.Lens assembly is covered in the first surface of substrate, since electronic component is set to the second surface of substrate, therefore lens assembly not overlay electronic element.Therefore, the substrate of small size can be selected, to reduce the volume of photographing module.
Description
Technical field
The present invention relates to a kind of photographing modules, more particularly to applied to the photographing module of portable electronic devices.
Background technique
Mobile communication device and personal digital assistant device (Personal Digital with shooting function
Assistant, PDA) etc. portable electronic devices become increasingly popular, and in response to the portable characteristic of portable electronic devices, clap
Camera shooting function has become the basic function in portable electronic devices, that is, photographing module can be provided in portable electronic devices.
The structure of photographing module will be illustrated next.Please refer to Fig. 1 and Fig. 2, Fig. 1 is the appearance of existing photographing module
Structural schematic diagram, and Fig. 2 is the structural profile illustration of existing photographing module.Photographing module 1 includes shell 10, sensing element
11, lens assembly 12 and multiple electronic components 13, the function of sensing element 11 are the outside received except photographing module 1
Light beam L and form image.Sensing element 11 includes induction chip 111 and circuit board 112, and induction chip 111 is fixed on circuit
On plate 112, function is to receive external beam L and form image, and induction chip 111 has induction region 1111.And circuit
Plate 112 is connected to induction chip 111 and lens assembly 12, and function is to carry induction chip 111 thereon.
In Fig. 1 and Fig. 2, lens module 12 covers sensing element 11 so that external beam L can by lens module 12 and
It is projected on the induction region 1111 of sensing element 11, and lens assembly 12 includes lens module 121 and fixed frame 122.Mirror
Head module 121 is located at the top of induction chip 111 and in alignment with induction chip 111, and the function of fixed frame 122 is carrying camera lens mould
Block 121 and covering board 112 and connect with circuit board 112.Wherein, multiple electronic components 13 be set on circuit board 112 and
It is fixed the inside that frame 122 is covered in lens assembly 12.Shell 10 coats lens module 12 to avoid impaired.According to above-mentioned camera shooting
The structure of module 1 is it is found that when external beam L is projected to the induction region 1111 of induction chip 111 by lens module 121
When, induction chip 111 can produce corresponding image.
With the evolution in epoch, user while also requiring the shooting function pay attention to day by day of portable electronic devices
The volume of portable electronic devices is lightening.The volume of portable electronic devices is lightening to be indicated inside portable electronic devices
Space will reduce so that photographing module will be difficult to be arranged in portable electronic devices.And in requiring photographing module
Under the premise of high performance, the volumes of portable electronic devices also non-easy thing is reduced.Illustrate by taking the photographing module 1 of Fig. 2 as an example, is intended to contract
The volume of small photographing module 1 can realize it by reducing the volume of circuit board 112.However, being provided on circuit board 112 more
A electronic component 13, therefore the body machine of circuit board 112 can not reduce.
Therefore, it is necessary to a kind of photographing modules that achievable volume is lightening.
Summary of the invention
The purpose of the present invention is to provide a kind of photographing modules that achievable volume is lightening.
Another object of the present invention is to provide a kind of assemble methods of photographing module that volume is lightening.
In a preferred embodiment, the present invention provides a kind of photographing module, including a substrate, an induction chip, an electronics
Element, a bottom plate and a lens assembly.The induction chip is set on a first surface of the substrate, and is electrically connected at this
Substrate.The electronic component is set on a second surface of the substrate.The bottom plate is covered in the second surface of the substrate, and should
Bottom plate has a bottom plate aperture, is contained the electronic component in the bottom plate by the bottom plate aperture.Lens assembly covering
In the first surface of the substrate；Wherein, which does not cover the electronic component.
In a preferred embodiment, the present invention also provides a kind of photographing module, including a substrate, an induction chip, a mirror
Head assembly and a sticker.The induction chip is set on a first surface of the substrate, and including a bonding wire portion, to electricity
Property is connected to the substrate.The lens assembly is covered in the first surface of the substrate, and the lens assembly includes a recessed portion, is used
To accommodate the bonding wire portion in wherein.The sticker is set between the recessed portion and the substrate, and part coats the bonding wire portion, is used
To seal the lens assembly and the substrate.
In a preferred embodiment, the present invention also provides a kind of assemble method of photographing module, comprising the following steps: step
(A): setting one electronic component on a second surface of a substrate, step (B): covering one bottom plate in second table of the substrate
Face, and appear the electronic component except the bottom plate, step (C): one induction chip of setting on a first surface of the substrate,
And step (D): one lens assembly of covering is in the first surface of the substrate, to form the photographing module.
In summary, multiple electronic components are set on the second surface of substrate by the assemble method of photographing module of the present invention,
Compared with the practice of first surface that electronic component is set to substrate in the prior art, what the method for the present invention was completed is taken the photograph
As the substrate of smaller size smaller can be used in module, therefore photographing module can have lesser volume, to realize the lightening of volume.Separately
Outside, the method for the present invention more in fixed frame and and substrate between gap setting sticker, to seal fixed frame and substrate.Together
When, sticker can partially coat the bonding wire portion of induction chip, to consolidate the electric connection between substrate and induction chip.
Detailed description of the invention
Fig. 1 is the surface structure schematic diagram of existing photographing module.
Fig. 2 is the structural profile illustration of existing photographing module.
Fig. 3 is surface structure schematic diagram of the photographing module of the present invention in a preferred embodiment.
Fig. 4 is the surface structure schematic diagram at photographing module of the present invention another visual angle in a preferred embodiment.
Fig. 5 is structural profile illustration of the photographing module of the present invention in a preferred embodiment.
Fig. 6 is flow diagram of the assemble method of photographing module of the present invention in a preferred embodiment.
Fig. 7 A~Fig. 7 D is the structural schematic diagram that photographing module of the present invention is assembled in a preferred embodiment.
Fig. 8 is flow diagram of the assemble method of photographing module of the present invention in another preferred embodiment.
[symbol description]
1,2 photographing module, 10 shell
11 sensing elements 12,25 lens assemblies
13 adhering element, 21 substrate
22,111 induction chip, 23 electronic component
24 bottom plate, 26 first sticker
27 second sticker, 28 third sticker
112 circuit boards 121,252 lens modules
122, the first surface of 251 fixed frame, 211 substrate
First side of 213 substrate of second surface of 212 substrates
The 221 bonding wire portion of third side of 214 substrates
222,1111 induction region, 241 bottom plate aperture
2511 gaps recessed portion g
A, B, C, D, D*, D1~D6 step L external beam
Specific embodiment
In view of problem of the prior art, the present invention provides the assemble method of a kind of photographing module and photographing module, with solution
The certainly defect of the prior art.The structure for illustrating photographing module of the present invention first, please refer to Fig. 3, Fig. 4 and Fig. 5, Fig. 3 is
Surface structure schematic diagram of the photographing module of the present invention in a preferred embodiment, Fig. 4 are that photographing module of the present invention is preferably real in one
The surface structure schematic diagram at another visual angle in example is applied, and Fig. 5 is that structure of the photographing module of the present invention in a preferred embodiment is cutd open
Face schematic diagram.Photographing module 2 includes substrate 21, induction chip 22, multiple electronic components 23, bottom plate 24 and lens assembly 25.
Induction chip 22 is set on the first surface 211 of substrate 21, and is electrically connected at substrate 21, wherein induction chip 22 includes
Multiple bonding wire portions 221 and induction region 222, multiple bonding wire portions 221 are formed in a manner of bonding wire (Wire Bonding), and can
Substrate 21 is electrically connected at by multiple bonding wire portions 221.Multiple electronic components 23 are then set to the second surface 212 of substrate 21
Above and it is electrically connected at substrate 21.Bottom plate 24 is covered in the second surface 212 of substrate 21, and bottom plate 24 has multiple bottom plate apertures
241, so that multiple electronic components 23 can be incorporated in bottom plate 24 by multiple bottom plate apertures 241.In this preferred embodiment
In, soft-hard composite board, copper clad laminate (FR4substrate) or ceramic substrate (Ceramic can be used in substrate 21
Substrate)。
Lens assembly 25 is covered in the first surface 211 of substrate 21, with seal induction chip 22 in lens assembly 25 and
Between substrate 21.Wherein, since multiple electronic components 23 are set on the second surface 212 of substrate 21, therefore lens assembly 25 is not
Cover multiple electronic components 23.Lens assembly 25 includes fixed frame 251 and lens module 252, and fixed frame 251 is covered in substrate
21 first surface 211, and lens module 252 is set on fixed frame 251.Wherein, fixed frame 251 includes multiple recessed portions
2511, it is set on the lower surface of fixed frame 252, recessed portion 2511 can accommodate corresponding bonding wire portion 221 in wherein.Yu Ben
In preferred embodiment, lens module 252 is made of multiple lens.
Specifically, photographing module 2 of the present invention further includes the first sticker 26, the second sticker 27 and third
Sticker 28.First sticker 26 be set to the induction region 222 of induction chip 22 periphery place, in conjunction with induction chip 22 with
And fixed frame 251.Second sticker 27 is set between multiple recessed portions 2511 and substrate 21, and can partially be coated corresponding
Therefore bonding wire portion 221 by the second sticker 27 can consolidate bonding wire portion 221 and salable fixed frame 251 and substrate 21.The
Three stickers 28 are then set between fixed frame 251 and lens module 252, to combine fixed frame 251 and lens module 252.
The detailed step of the assemble method of photographing module of the present invention will be illustrated next.Referring to Fig. 6, it is present invention camera shooting
Flow diagram of the assemble method of module in a preferred embodiment.The assemble method of photographing module of the present invention includes following step
It is rapid:
Step A: setting electronic component is on the second surface of substrate.
Step B: covering bottom plate is in the second surface of substrate.
Step C: setting induction chip is on the first surface of substrate.
Step D: covering lens assembly is in the first surface of substrate, to form photographing module.
Wherein, step D includes:
Step D1: the first sticker of setting is at the periphery of the induction region of induction chip.
Step D2: first surface of the fixed frame in substrate of lens assembly is covered.
Step D3: gap of the second sticker of setting between substrate and fixed frame.
Step D4: the lens module of lens assembly is set on fixed frame.
The operation situation of the assemble method of photographing module of the present invention will be illustrated next.Please refer to Fig. 6 and Fig. 7 A~
Fig. 7 D, Fig. 7 A~Fig. 7 D is the structural schematic diagram that photographing module of the present invention is assembled in a preferred embodiment.When being imaged
When the assembly working of module 2 starts, multiple electronic components 23 progress step A first: are set in the second surface 212 of substrate 21
On, wherein multiple electronic components 23 are set on the second surface 212 of substrate 21 with surface adhering technical (SMT), and multiple
Electronic component 23 is electrically connected in substrate 21.Next, carrying out step B: covering bottom plate 24 is in the second surface of substrate 21
212, and multiple electronic components 23 is made to pass through corresponding bottom plate aperture 241, to store multiple electronic components 23 in bottom plate 24.
Wherein, bottom plate 24 is also set on the second surface 212 of substrate 21 with surface adhering technical.Substrate 21, bottom plate 24 and more
The combination situation of a electronic component 23 is as shown in Figure 7 A.
After bottom plate 24 is combined with substrate 21, carry out step C: setting induction chip 22 is in the first surface of substrate 21
On 211, and substrate 21 is electrically connected at using multiple bonding wire portions 221 of induction chip 22.The knot of induction chip 22 and substrate 21
It is as shown in Figure 7 B to close situation, and Fig. 7 B shows that multiple bonding wire portions 221 are respectively arranged at the first side 213 and the substrate of substrate 21
On 21 third side 214.Followed by step D1: first sticker 26 of setting is in the induction region 222 of induction chip 22
At periphery, also as shown in Figure 7 B.
After first sticker 26 is provided with, the fixed frame 251 of lens assembly 25 is covered in the first surface of substrate 21
211, that is, carry out step D2.Wherein, fixed frame 251 is binded by 26 part of the first sticker with induction chip 22.Fig. 7 C
Show the combination situation of fixed frame 251 and substrate 21, and the first side of multiple recessed portions 2511 of fixed frame 251 and substrate 21
213 and the third side 214 of substrate 21 be respectively formed multiple gap g.Followed by step D3: setting the second sticker 27 in
Gap g between substrate 21 and fixed frame 251, as illustrated in fig. 7d.Second sticker 27 can partially coat multiple bonding wire portions 221,
To promote the stability in bonding wire portion 221, on the other hand, also fixed frame 251 and substrate can be sealed by the second sticker 27
21, to avoid dust enters the inside of photographing module 2 and contacts with induction chip 22.
Finally, carrying out step D4: the lens module 252 of setting lens assembly 25 is on fixed frame 251, to form camera shooting mould
Block 2, as shown in Figure 5.Fig. 5 shows that third sticker 28 is set between fixed frame 251 and lens module 252, solid to combine
Determine frame 251 and lens module 252.Wherein, lens module 252 is square with active alignment (Active Alignment) in step D4
Formula is set on fixed frame 251.
Specifically, the lens assembly of photographing module of the present invention also can be used fixed frame and be integrated with lens module
Molding structure, in this way, which the operation situation of the assemble method of photographing module of the present invention can be slightly different.Referring to Fig. 8, its
For flow diagram of the assemble method in another preferred embodiment of photographing module of the present invention.The assembling of photographing module of the present invention
Method the following steps are included:
Step A: setting electronic component is on the second surface of substrate.
Step B: covering bottom plate is in the second surface of substrate.
Step C: setting induction chip is on the first surface of substrate.
Step D*: covering lens assembly is in the first surface of substrate, to form photographing module.
Wherein, step D* includes:
Step D1: the first sticker of setting is at the periphery of the induction region of induction chip.
Step D5: covering lens assembly is in the first surface of substrate.
Step D6: gap of the second sticker of setting between substrate and lens assembly.
The assemble method of the photographing module of this preferred embodiment is substantially the same with aforementioned preferred embodiment, between the rwo
The difference is that only, in response to integrally formed lens assembly, step D* only needs to carry out step D1, step D5 and step D6
The assembling that photographing module can be completed, without carrying out the assembling between lens module and fixed frame.
As described above, multiple electronic components are set to the second table of substrate by the assemble method of photographing module of the present invention
On face, compared with the practice of first surface that electronic component is set to substrate in the prior art, the method for the present invention institute group is installed
At photographing module the substrate of smaller size smaller can be used, therefore photographing module can have lesser volume, to realize the frivolous of volume
Change.In addition, the method for the present invention more in fixed frame and and substrate between gap setting sticker, to seal fixed frame and base
Plate.Meanwhile sticker can partially coat the bonding wire portion of induction chip, to consolidate the electric connection between substrate and induction chip.
The foregoing is merely presently preferred embodiments of the present invention, the claim being not intended to limit the invention, thus it is all its
It is intended to be limited solely by the claim of this case without departing from the lower equivalent change or modification completed of spirit disclosed in this invention
It is interior.
Claims (14)
1. a kind of photographing module characterized by comprising
One substrate；
One induction chip is set on a first surface of the substrate, and is electrically connected at the substrate；
One electronic component is set on a second surface of the substrate；
One bottom plate is covered in the second surface of the substrate, and the bottom plate has a bottom plate aperture, makes the electronic component by being somebody's turn to do
Bottom plate aperture and be incorporated in the bottom plate；And
One lens assembly is covered in the first surface of the substrate；Wherein, which does not cover the electronic component.
2. photographing module as described in claim 1, wherein the induction chip includes a bonding wire portion, to pass through bonding wire mode
It is electrically connected at the substrate.
3. photographing module as claimed in claim 2, wherein the lens assembly includes:
One fixed frame is covered in the first surface of the substrate；And
One lens module is set on the fixed frame；Wherein, which includes a recessed portion, is set to the one of the fixed frame
On lower surface, to accommodate the bonding wire portion in wherein.
4. photographing module as claimed in claim 3 further includes a sticker, is set between the recessed portion and the substrate, and
Part coats the bonding wire portion, to seal the fixed frame and the substrate.
5. photographing module as described in claim 1, wherein the electronic component and the bottom plate are arranged with surface adhering technical
In on the second surface of the substrate.
6. a kind of photographing module characterized by comprising
One substrate；
One induction chip is set on a first surface of the substrate, and including a bonding wire portion, is used for being electrically connected to the base
Plate；
One lens assembly is covered in the first surface of the substrate, and the lens assembly includes a recessed portion, to accommodate the weldering
Line portion is in wherein；And
One sticker is set between the recessed portion and the substrate, and part coats the bonding wire portion, to seal the lens assembly
And the substrate.
7. photographing module as claimed in claim 6, further includes:
One electronic component is set on a second surface of the substrate；And
One bottom plate is covered in the second surface of the substrate, and the bottom plate has a bottom plate aperture, makes the electronic component by being somebody's turn to do
Bottom plate aperture and be incorporated in the bottom plate；Wherein, which does not cover the electronic component.
8. photographing module as claimed in claim 6, wherein the lens assembly includes:
One fixed frame is covered in the first surface of the substrate；And
One lens module is set on the fixed frame；Wherein, which is set on a lower surface of the fixed frame.
9. a kind of assemble method of photographing module, comprising the following steps:
(A) one electronic component of setting is on a second surface of a substrate；
(B) one bottom plate of covering is in the second surface of the substrate；
(C) one induction chip of setting is on a first surface of the substrate；And
(D) one lens assembly of covering is in the first surface of the substrate, to form the photographing module.
10. the assemble method of photographing module as claimed in claim 9, wherein in the step (A), the electronic component is with table
Face adhering technical and be set on the second surface of the substrate.
11. the assemble method of photographing module as claimed in claim 9, wherein the bottom plate has a bottom plate aperture, in the step
(B) in, which is set on the second surface of the substrate with surface adhering technical, and the electronic component passes through the bottom plate
Aperture and be incorporated in the bottom plate.
12. the assemble method of photographing module as claimed in claim 9, wherein the induction chip has a bonding wire portion, in the step
Suddenly in (C), the bonding wire portion of the induction chip is electrically connected at the substrate by bonding wire mode.
13. the assemble method of photographing module as claimed in claim 12, wherein include: in the step (D)
(D1) one first sticker of setting is at the periphery of an induction region of the induction chip；
(D2) first surface of a fixed frame in the substrate of the lens assembly is covered；
(D3) gap of one second sticker of setting between the substrate and the fixed frame, coats the second sticker part
The bonding wire portion, and seal the fixed frame and the substrate；And
(D4) lens module of the lens assembly is set on the fixed frame.
14. the assemble method of photographing module as claimed in claim 12, wherein include: in the step (D)
(D1) one first sticker of setting is at the periphery of an induction region of the induction chip；
(D5) lens assembly is covered in the first surface of the substrate；And
(D6) gap of one second sticker of setting between the substrate and the lens assembly, wraps the second sticker part
The bonding wire portion is covered, and seals the photographing module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710790849.7A CN109428990A (en) | 2017-09-05 | 2017-09-05 | The assemble method of photographing module and photographing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710790849.7A CN109428990A (en) | 2017-09-05 | 2017-09-05 | The assemble method of photographing module and photographing module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109428990A true CN109428990A (en) | 2019-03-05 |
Family
ID=65513455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710790849.7A Pending CN109428990A (en) | 2017-09-05 | 2017-09-05 | The assemble method of photographing module and photographing module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109428990A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6414779B1 (en) * | 2000-11-30 | 2002-07-02 | Opeical Biopsy Technologies, Inc. | Integrated angled-dual-axis confocal scanning endoscopes |
| CN2664202Y (en) * | 2003-10-16 | 2004-12-15 | 胜开科技股份有限公司 | Multi-chip image sensor module |
| US20060097129A1 (en) * | 2004-11-10 | 2006-05-11 | Kuo-Yang Sun | Lens module structure |
| CN102214588A (en) * | 2010-04-09 | 2011-10-12 | 致伸科技股份有限公司 | Assembling method of camera module |
| US20120044414A1 (en) * | 2010-08-23 | 2012-02-23 | Shu-Tze Chen | Thin Image Capturing Apparatus |
-
2017
- 2017-09-05 CN CN201710790849.7A patent/CN109428990A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6414779B1 (en) * | 2000-11-30 | 2002-07-02 | Opeical Biopsy Technologies, Inc. | Integrated angled-dual-axis confocal scanning endoscopes |
| CN2664202Y (en) * | 2003-10-16 | 2004-12-15 | 胜开科技股份有限公司 | Multi-chip image sensor module |
| US20060097129A1 (en) * | 2004-11-10 | 2006-05-11 | Kuo-Yang Sun | Lens module structure |
| CN102214588A (en) * | 2010-04-09 | 2011-10-12 | 致伸科技股份有限公司 | Assembling method of camera module |
| US20120044414A1 (en) * | 2010-08-23 | 2012-02-23 | Shu-Tze Chen | Thin Image Capturing Apparatus |
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