CN109423670A - The preparation method and its electroplate liquid of track copper bar plating nickel on surface tungsten phosphorus alloy - Google Patents
The preparation method and its electroplate liquid of track copper bar plating nickel on surface tungsten phosphorus alloy Download PDFInfo
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- CN109423670A CN109423670A CN201710719186.XA CN201710719186A CN109423670A CN 109423670 A CN109423670 A CN 109423670A CN 201710719186 A CN201710719186 A CN 201710719186A CN 109423670 A CN109423670 A CN 109423670A
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- copper bar
- tungsten phosphorus
- electroplate liquid
- plating
- nickel tungsten
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Abstract
The invention discloses the preparation methods and its electroplate liquid of track copper bar plating nickel on surface tungsten phosphorus alloy, belong to tramway technical field of anticorrosion, the present invention is using ultrasonic electroless deposition technique in track copper bar coating surface ni-w-p alloy, the composite deposite of ni-w-p alloy is prepared on track copper bar surface, while further increasing the corrosion resistance of track copper bar, the wearability of track copper bar is also improved, binding force of cladding material obtained is stronger；In addition, by the way of ultrasonic electroless deposition technique, making to plate layer porosity is reduced, and thickness of coating is uniformly and the quality of coating is more stable；Pollution in electroplating process to environment is reduced using environment protection brilliant agent.
Description
Technical field
The invention belongs to tramway technical field of anticorrosion, and in particular to the preparation of track copper bar plating nickel on surface tungsten phosphorus alloy
Method and its electroplate liquid.
Background technique
Modern tram track structure form is more, in general, is broadly divided into flush type and non-embedded type track.It buries
Enter formula track and need long-term embedment underground, surrounding soil humidity is larger, directly results in the track copper bar web of the rail and is generated with lower portion
Chemical corrosion；The stray electrical current on streetcar track can also cause the electrochemical corrosion of track copper bar simultaneously, acceleration orbit
Damage.The corrosion of flush type track copper bar will directly reduce its service life, especially southern rainy regions, precipitation and soil
PH value is mostly acidity, accelerates the tarnishing processes of rail.
In the prior art, the anti-corrosion that electroplated coating carries out track copper bar, such as plating tungsten and nickel plating are generallyd use, it is still, single
Wearability, binding force and the corrosion resistance of one coating are well below composite deposite；It is electroplated using traditional coating bath, the coating hole of acquisition
Gap rate is larger, and anti-corrosion effect is poor, and has the shortcomings that thickness of coating is uneven and quality of coating is unstable；In addition, traditional
Brightener contain there are many poisonous metal.
Summary of the invention
For overcome the deficiencies in the prior art, the purpose of the present invention is intended to provide track copper bar plating nickel on surface tungsten phosphorus alloy
Preparation method and its electroplate liquid.
A kind of preparation method of track copper bar plating nickel on surface tungsten phosphorus alloy provided by the invention, is realized by following steps:
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Step 3, by the copper bar to be plated after pre-treatment be placed in the nickel tungsten phosphorus electroplate liquid carry out nickel tungsten phosphorus it is sonicating
Plating is learned, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains plating ni-w-p alloy
Copper bar.
Preferably, the pH value of nickel tungsten phosphorus electroplate liquid described in the step 1 is adjusted to 4.5-5.
Preferably, oil removal treatment described in the step 2 specifically: it is 40~60 DEG C of concentration that copper bar to be plated, which is placed in temperature,
For 99% H2SO4Middle immersion 2min；The pickling goes out light processing specifically: the copper bar to be plated after oil removing, which is placed in concentration, is
30s is impregnated in 30% nitric acid；The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%,
The technological parameter of the polishing treatment is room temperature 30s；The activation processing specifically: the copper bar to be plated after polishing is placed in concentration
3min is impregnated under room temperature in 5% HCl.
Preferably, the technological parameter of the chemical plating of excusing from death described in the step 3 are as follows: frequency 18-60kHz, power 50-
500w, operating temperature are 85-90 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 18-22 μm/h.
Preferably, the dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of three second
Hydramine, 10 parts of oleic acid and 80 parts of water composition, the drying temperature of the drying and processing are 60-120 DEG C, drying time 10min.
Preferably, oil removing described in the step 2, the pickling go out in light and the polishing treatment and the step 3
Washing process, the washing process are carried out after dehydration Anti- tarnishing processing specifically: product is first carried out to 4 water in tap water
It washes, then 2 washings is carried out using pure water.
The present invention also provides a kind of for preparing the electroplate liquid of ni-w-p alloy on track copper bar surface, the nickel tungsten phosphorus electricity
Plating solution composition is as follows:
Preferably, the component of the brightener are as follows:
Preferably, the plating tungsten liquid is sodium tungstate solution.
Preferably, the main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine.
Compared with prior art, the invention proposes the preparation methods and its plating of track copper bar plating nickel on surface tungsten phosphorus alloy
Liquid, this method are realized by following steps: step 1, according to the component of nickel tungsten phosphorus electroplate liquid configuration nickel tungsten phosphorus base soln, then to
Complexing agent and brightener are successively added in the nickel tungsten phosphorus base soln, obtain nickel tungsten phosphorus electroplate liquid；Step 2, plating copper bar is treated
Successively carry out oil removing, pickling goes out light, polishing and the pre-treatment of activation；Step 3, the copper bar to be plated after pre-treatment is placed in institute
Progress nickel tungsten phosphorus ultrasonic chemistry in nickel tungsten phosphorus electroplate liquid is stated, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing
And drying and processing, obtain the copper bar of plating ni-w-p alloy.The present invention is using ultrasonic electroless deposition technique in track copper bar coating surface
Ni-w-p alloy prepares the composite deposite of ni-w-p alloy on track copper bar surface, in the corrosion resistant for further increasing track copper bar
While corrosion energy, the wearability of track copper bar is also improved, binding force of cladding material obtained is stronger；In addition, using ultrasonic wave
The mode of chemical plating, make plate layer porosity reduce, and thickness of coating uniformly and coating quality it is more stable；Using environment-friendly type
Brightener reduces the pollution in electroplating process to environment.
Detailed description of the invention
Fig. 1 is the flow chart of the preparation method of track copper bar plating nickel on surface tungsten phosphorus alloy provided in an embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
The embodiment of the present invention provides the preparation method of track copper bar plating nickel on surface tungsten phosphorus alloy, and this method passes through following steps
It realizes:
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.5-5.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 40~60 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4
Middle immersion 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and is impregnated
30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and impregnates 3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, by the copper bar to be plated after pre-treatment be placed in the nickel tungsten phosphorus electroplate liquid carry out nickel tungsten phosphorus it is sonicating
Plating is learned, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains plating ni-w-p alloy
Copper bar.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 18-60kHz, power 50-500w, operating temperature
It is 85-90 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 18-22 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 60-120 DEG C, drying time 10min.
The embodiment of the invention also provides the electroplate liquid for preparing ni-w-p alloy on track copper bar surface, the nickel tungsten phosphorus
Electroplate liquid composition is as follows:
Wherein, the component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine.
Compared with prior art, the invention proposes the preparation methods and its plating of track copper bar plating nickel on surface tungsten phosphorus alloy
Liquid, the present invention, in track copper bar coating surface ni-w-p alloy, prepare nickel tungsten on track copper bar surface using ultrasonic electroless deposition technique
The composite deposite of phosphorus alloy also improves the resistance to of track copper bar while further increasing the corrosion resistance of track copper bar
Mill property, binding force of cladding material obtained is stronger；In addition, make to plate layer porosity reduction by the way of ultrasonic electroless deposition technique, and
Thickness of coating is uniformly and the quality of coating is more stable；Dirt in electroplating process to environment is reduced using environment protection brilliant agent
Dye.
Embodiment 1
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and impregnates 30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and impregnates 3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, the copper bar to be plated after pre-treatment is placed in progress nickel tungsten phosphorus sonochemistry in the nickel tungsten phosphorus electroplate liquid
It plates, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains the copper bar of plating ni-w-p alloy.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 40kHz, power 50-500w, operating temperature are
88 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 20 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 90 DEG C, drying time 10min.
Embodiment 2
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and impregnates 30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and impregnates 3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, the copper bar to be plated after pre-treatment is placed in progress nickel tungsten phosphorus sonochemistry in the nickel tungsten phosphorus electroplate liquid
It plates, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains the copper bar of plating ni-w-p alloy.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 40kHz, power 50-500w, operating temperature are
88 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 20 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 90 DEG C, drying time 10min.
Embodiment 3
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and impregnates 30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and impregnates 3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, the copper bar to be plated after pre-treatment is placed in progress nickel tungsten phosphorus sonochemistry in the nickel tungsten phosphorus electroplate liquid
It plates, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains the copper bar of plating ni-w-p alloy.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 40kHz, power 50-500w, operating temperature are
88 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 20 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 90 DEG C, drying time 10min.
Embodiment 4
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.5-5.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 40~60 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4
Middle immersion 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and impregnates 30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and impregnates 3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, the copper bar to be plated after pre-treatment is placed in progress nickel tungsten phosphorus sonochemistry in the nickel tungsten phosphorus electroplate liquid
It plates, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains the copper bar of plating ni-w-p alloy.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 18-60kHz, power 50-500w, operating temperature
It is 85-90 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 18-22 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 60-120 DEG C, drying time 10min.
Embodiment 5
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.5-5.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 40~60 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4
Middle immersion 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and impregnates 30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and impregnates 3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, the copper bar to be plated after pre-treatment is placed in progress nickel tungsten phosphorus sonochemistry in the nickel tungsten phosphorus electroplate liquid
It plates, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains the copper bar of plating ni-w-p alloy.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 18-60kHz, power 50-500w, operating temperature
It is 85-90 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 18-22 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 60-120 DEG C, drying time 10min.
Embodiment 6
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and is impregnated
30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and is impregnated
3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, by the copper bar to be plated after pre-treatment be placed in the nickel tungsten phosphorus electroplate liquid carry out nickel tungsten phosphorus it is sonicating
Plating is learned, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains plating ni-w-p alloy
Copper bar.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 18kHz, power 50-500w, operating temperature are
88 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 20 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 90 DEG C, drying time 10min.
Embodiment 7
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and impregnates 30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and impregnates 3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, by the copper bar to be plated after pre-treatment be placed in the nickel tungsten phosphorus electroplate liquid carry out nickel tungsten phosphorus it is sonicating
Plating is learned, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains plating ni-w-p alloy
Copper bar.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 60kHz, power 50-500w, operating temperature are
88 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 20 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 90 DEG C, drying time 10min.
Embodiment 8
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and impregnates 30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and impregnates 3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, the copper bar to be plated after pre-treatment is placed in progress nickel tungsten phosphorus sonochemistry in the nickel tungsten phosphorus electroplate liquid
It plates, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains the copper bar of plating ni-w-p alloy.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 40kHz, power 50-500w, operating temperature are
85 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 20 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 90 DEG C, drying time 10min.
Embodiment 9
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and is impregnated
30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and is impregnated
3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, by the copper bar to be plated after pre-treatment be placed in the nickel tungsten phosphorus electroplate liquid carry out nickel tungsten phosphorus it is sonicating
Plating is learned, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains plating ni-w-p alloy
Copper bar.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 40kHz, power 50-500w, operating temperature are
90 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 20 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 90 DEG C, drying time 10min.
Embodiment 10
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and is impregnated
30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and is impregnated
3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, by the copper bar to be plated after pre-treatment be placed in the nickel tungsten phosphorus electroplate liquid carry out nickel tungsten phosphorus it is sonicating
Plating is learned, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains plating ni-w-p alloy
Copper bar.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 40kHz, power 50-500w, operating temperature are
88 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 18 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 90 DEG C, drying time 10min.
Embodiment 11
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and is impregnated
30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and is impregnated
3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, by the copper bar to be plated after pre-treatment be placed in the nickel tungsten phosphorus electroplate liquid carry out nickel tungsten phosphorus it is sonicating
Plating is learned, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains plating ni-w-p alloy
Copper bar.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 40kHz, power 50-500w, operating temperature are
88 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 22 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 90 DEG C, drying time 10min.
Embodiment 12
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and is impregnated
30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and is impregnated
3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, by the copper bar to be plated after pre-treatment be placed in the nickel tungsten phosphorus electroplate liquid carry out nickel tungsten phosphorus it is sonicating
Plating is learned, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains plating ni-w-p alloy
Copper bar.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 40kHz, power 50-500w, operating temperature are
88 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 20 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 60 DEG C, drying time 10min.
Embodiment 13
Step 1, nickel tungsten phosphorus base soln is configured according to the component of nickel tungsten phosphorus electroplate liquid, then to the nickel tungsten phosphorus base soln
Complexing agent and brightener are inside successively added, nickel tungsten phosphorus electroplate liquid is obtained；
Wherein, the nickel tungsten phosphorus electroplate liquid composition is as follows:
The component of the brightener are as follows:
Plating tungsten liquid is sodium tungstate solution；
Main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine；
Also, the pH value of the nickel tungsten phosphorus electroplate liquid is 4.8.
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Wherein, the oil removal treatment specifically: it is the H that 50 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle leaching
Steep 2min；
The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and is impregnated
30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the polishing treatment
Technological parameter be room temperature 30s；
The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and is impregnated
3min；
Also, the oil removing, the pickling carry out washing process after going out light and the polishing treatment.
Step 3, by the copper bar to be plated after pre-treatment be placed in the nickel tungsten phosphorus electroplate liquid carry out nickel tungsten phosphorus it is sonicating
Plating is learned, then the copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing, obtains plating ni-w-p alloy
Copper bar.
Wherein, the technological parameter of chemical plating is had children outside the state plan are as follows: frequency 40kHz, power 50-500w, operating temperature are
88 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 20 μm/h；
The dehydrating agent that the processing of dehydration Anti- tarnishing described in the step 3 uses is by weight by 10 parts of triethanolamine, 10
Product is first carried out 4 washings after the dehydration Anti- tarnishing processing by the oleic acid of part and 80 parts of water composition in tap water, then
2 washings are carried out using pure water；
The drying temperature of the drying and processing is 120 DEG C, drying time 10min.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.
Claims (10)
1. the preparation method of track copper bar plating nickel on surface tungsten phosphorus alloy, which is characterized in that this method is realized by following steps:
Step 1, according to the component of nickel tungsten phosphorus electroplate liquid configure nickel tungsten phosphorus base soln, then into the nickel tungsten phosphorus base soln according to
Secondary addition complexing agent and brightener obtain nickel tungsten phosphorus electroplate liquid；
Step 2, treating plating, copper bar successively carries out oil removing, pickling goes out light, the pre-treatment of polishing and activation；
Step 3, the copper bar to be plated after pre-treatment is placed in progress nickel tungsten phosphorus ultrasonic chemistry in the nickel tungsten phosphorus electroplate liquid,
The copper bar after ultrasonic chemistry successively carries out dehydration Anti- tarnishing and drying and processing again, obtains the copper bar of plating ni-w-p alloy.
2. according to claim 1 for preparing the electroplate liquid of ni-w-p alloy on track copper bar surface, which is characterized in that
The pH value of nickel tungsten phosphorus electroplate liquid described in the step 1 is adjusted to 4.5-5.
3. the preparation method of track copper bar plating nickel on surface tungsten phosphorus alloy according to claim 1, which is characterized in that the step
Oil removal treatment described in rapid 2 specifically: it is the H that 40~60 DEG C of concentration is 99% that copper bar to be plated, which is placed in temperature,2SO4Middle immersion
2min；The pickling goes out light processing specifically: the copper bar to be plated after oil removing is placed in the nitric acid that concentration is 30% and impregnates 30s；
The polishing treatment uses hydrochloric acid, sulfuric acid, nitric acid, and concentration is respectively 25%, 20%, 40%, the technique ginseng of the polishing treatment
Number is room temperature 30s；The activation processing specifically: the copper bar to be plated after polishing is placed in the HCl that concentration is 5% under room temperature and is soaked
Steep 3min.
4. the preparation method of track copper bar plating nickel on surface tungsten phosphorus alloy according to claim 3, which is characterized in that the step
The technological parameter of the chemical plating of excusing from death described in rapid 3 are as follows: frequency 18-60kHz, power 50-500w, operating temperature are
85-90 DEG C, useful load 0.5-2.5dm2/ L, film thickness are 15-25 μm, and wash speed is 18-22 μm/h.
5. the preparation method of track copper bar plating nickel on surface tungsten phosphorus alloy according to claim 4, which is characterized in that the step
The dehydrating agent that the processing of dehydration Anti- tarnishing described in rapid 3 uses is by weight by 10 parts of triethanolamine, 10 parts of oleic acid and 80 parts
Water composition, the drying temperature of the drying and processing is 60-120 DEG C, drying time 10min.
6. the preparation method of track copper bar plating nickel on surface tungsten phosphorus alloy according to claim 5, which is characterized in that the step
It is carried out after the dehydration Anti- tarnishing processing that oil removing described in rapid 2, the pickling go out in light and the polishing treatment and the step 3
Washing process, the washing process specifically: product is first carried out to 4 washings in tap water, then is carried out 2 times using pure water
Washing.
7. a kind of for preparing the electroplate liquid of ni-w-p alloy on track copper bar surface, which is characterized in that the nickel tungsten phosphorus electroplate liquid
It forms as follows:
8. according to claim 7 for preparing the electroplate liquid of ni-w-p alloy on track copper bar surface, which is characterized in that
The component of the brightener are as follows:
9. according to claim 8 for preparing the electroplate liquid of ni-w-p alloy on track copper bar surface, which is characterized in that
The plating tungsten liquid is sodium tungstate solution.
10. according to claim 9 for preparing the electroplate liquid of ni-w-p alloy on track copper bar surface, feature exists
In the main complexing agent is any one in sodium acetate, sodium citrate or triethanolamine.
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