CN109411460B - Multispectral solid-state light-emitting device and multispectral illumination light source - Google Patents
Multispectral solid-state light-emitting device and multispectral illumination light source Download PDFInfo
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- CN109411460B CN109411460B CN201811568425.7A CN201811568425A CN109411460B CN 109411460 B CN109411460 B CN 109411460B CN 201811568425 A CN201811568425 A CN 201811568425A CN 109411460 B CN109411460 B CN 109411460B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention provides a multispectral solid-state light-emitting device and a multispectral illumination light source, wherein the multispectral solid-state light-emitting device comprises a packaging substrate, a bearing surface of the packaging substrate is provided with a reflecting cup, and at least two solid-state light-emitting elements capable of emitting light rays with different wavelengths are arranged in an accommodating space of the reflecting cup; at least two pairs of electrodes are arranged on two sides of the packaging substrate, and the electrodes are connected with the anode and the cathode of the solid-state light-emitting element; the light outlet of the reflecting cup is also provided with a micro lens array in a closed mode, the micro lens array is parallel to the packaging substrate, and one side of the micro lens array, which is provided with a plurality of refractive hemispherical micro lenses arranged in an orthogonal array, faces away from the solid-state light-emitting element. The invention has the advantages of high light extraction efficiency, small packaging volume, approximately same space angle of light rays with different wavelengths, parallel light ray collimation, uniform light spots and the like, and the light rays with different wavelengths are approximately same in the uniform light spot position of the target surface of the target, thereby effectively improving the clinical effect of photodynamic therapy.
Description
Technical Field
The invention relates to the technical field of optical devices, in particular to a multispectral solid-state light-emitting device and a multispectral illumination light source.
Background
The light source for photodynamic therapy is the core and key of photodynamic therapy, and the technical indexes of the wavelength, illumination power density, illumination uniformity, illumination power density distribution curved surface of different wavelength light in the effective illumination area and the like of the light source directly influence the photodynamic therapy effect. In the prior art, multispectral solid state light emitting devices are commonly used as photodynamic therapy light sources.
However, in the prior art, a planar package structure is generally adopted in packaging the multi-spectrum solid-state light-emitting device, or a hemispherical lens is added on the light-emitting surface of the planar package structure, and the packaging material is generally made of transparent materials such as epoxy resin or silica gel. The light beam with different wavelengths has different refractive indexes and spatial angular distribution after passing through the lens, so that when the light beam irradiates the target surface, the uniform irradiation light spots formed on the target surface by the light beams with different wavelengths are different in position.
Therefore, the multispectral solid-state light-emitting device array in the prior art is arranged and then used as a light source in photodynamic therapy, which can cause a series of problems of low light energy utilization rate, uneven illumination, inconsistent positions of illumination spots with different wavelengths on the surface of a therapy area, large shape difference of illumination power density distribution curved surfaces with different wavelengths on the surface of the therapy area and the like, so that the clinical effect of photodynamic therapy is poor, and the application and development of the multispectral solid-state light-emitting device as a light source for photodynamic therapy are restricted.
Disclosure of Invention
The embodiment of the invention provides a multispectral solid-state light emitting device and a multispectral illumination light source, which are used for solving the problem that a series of problems affecting photodynamic treatment effect occur when the multispectral solid-state light emitting device is applied to photodynamic treatment as a light source after array arrangement in the prior art.
In a first aspect, an embodiment of the present invention provides a multispectral solid-state light emitting device, including a package substrate, a reflective cup is disposed on a bearing surface of the package substrate, and at least two solid-state light emitting elements with different wavelengths are disposed in an accommodating space of the reflective cup; at least two pairs of electrodes are arranged on two sides of the packaging substrate, and the electrodes are connected with the anode and the cathode of the solid-state light-emitting element;
the light outlet of the reflecting cup is also provided with a micro-lens array in a closed mode, the micro-lens array is parallel to the packaging substrate, and one side, provided with a plurality of refraction type hemispherical micro-lenses which are arranged in an orthogonal array, of the micro-lens array faces away from the solid-state light-emitting element.
As a preferred mode of the first aspect of the present invention, the solid-state light emitting element includes a red LED chip having a peak wavelength in a wavelength range of 620 to 630nm, a green LED chip having a peak wavelength in a wavelength range of 520 to 530nm, and a blue LED chip having a peak wavelength in a wavelength range of 460 to 470 nm.
As a preferred mode of the first aspect of the present invention, the red LED chip, the green LED chip and the blue LED chip are arranged in an equilateral triangle, and the distance between the red LED chip, the green LED chip and the blue LED chip is 0.1-0.2 mm.
As a preferable mode of the first aspect of the present invention, three pairs of the electrodes are disposed on two sides of the package substrate, and the three pairs of the electrodes are respectively connected with the positive and negative electrodes of the red LED chip, the green LED chip and the blue LED chip.
As a preferable mode of the first aspect of the present invention, the radius of the microlens is 0.05 to 0.25mm, the focal length of the microlens is 0.8mm, and the distance between the circular bottom surfaces of the adjacent microlenses is 0mm. .
As a preferred mode of the first aspect of the present invention, the radius of the microlens is 0.15mm.
As a preferred mode of the first aspect of the present invention, the light outlet of the reflecting cup is rectangular or circular, and the shape of the microlens array is matched with the shape of the light outlet of the reflecting cup.
As a preferred mode of the first aspect of the present invention, the height of the reflecting cup is the same as the focal length of the microlens.
As a preferred mode of the first aspect of the present invention, an insulating surface layer is provided on the carrying surface of the package substrate, the insulating surface layer being made of a thermally conductive ceramic material.
In a second aspect, an embodiment of the present invention provides a multispectral illumination light source, including a circuit board and at least one multispectral solid-state light emitting device as set forth in any one of the first aspects, where each of the multispectral solid-state light emitting devices is arranged in an orthogonal array on the circuit board.
According to the multispectral solid-state light-emitting device provided by the embodiment of the invention, the solid-state light-emitting elements which emit light rays with different wavelengths are directly exposed in the air, so that the optical expansion is reduced, and then the light rays of the solid-state light-emitting elements in a large-angle light-emitting range are collected through the micro lens array which is arranged at the light outlet of the reflecting cup in a closed manner, so that the collimated parallel beamlets with smaller divergence angles are obtained, the light energy loss is reduced to a greater extent, and the light extraction efficiency is improved. Meanwhile, the collimated parallel beamlets formed after passing through the micro lens array restrict the spatial angular distribution difference of the light rays with different wavelengths to be very small, so that the positions of uniform irradiation spots formed by the light rays with different wavelengths on the target surface of a target are the same, the irradiation power density is uniformly distributed, and the clinical treatment effect of the multispectral irradiation light source consisting of the multispectral solid-state light emitting devices is better when the multispectral irradiation light source is applied to photodynamic treatment.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 (a) is a schematic diagram of a prior art multi-spectral solid state light device;
FIG. 1 (b) is a graph showing the effect of illumination applied to photodynamic therapy after a multispectral solid-state light-emitting device in the prior art is assembled into a multispectral illumination light source;
FIG. 2 (a) is a schematic diagram of another prior art multi-spectral solid state light device;
FIG. 2 (b) is a graph showing the effect of illumination applied in photodynamic therapy after a multispectral solid-state light-emitting device is assembled into a multispectral illumination light source in the prior art;
FIG. 3 is a schematic diagram of a multi-spectrum solid state light emitting device according to an embodiment of the present invention;
FIG. 4 is a schematic three-dimensional structure of a solid state light device with multiple spectra according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating an arrangement of a plurality of microlenses on a microlens array in a multi-spectral solid state light device according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating an arrangement of solid state light emitting devices with different wavelengths in a multi-spectral solid state light emitting device according to an embodiment of the present invention;
FIG. 7 is a graph showing a relationship between a radius of a microlens on a microlens array and normalized light extraction efficiency in a solid state light emitting device according to an embodiment of the present invention;
FIG. 8 is a graph showing a relationship between a distance between adjacent microlenses on a microlens array and normalized light extraction efficiency in a multi-spectral solid state light emitting device according to an embodiment of the present invention;
FIG. 9 illustrates a uniform spot area formed on a target surface by three different wavelengths of light in a multi-spectral solid state light emitting device according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of a multi-spectral illumination source according to an embodiment of the present invention;
FIG. 11 is a graph showing the effect of a multispectral illumination source applied in photodynamic therapy according to an embodiment of the present invention;
fig. 12 is an illumination power density distribution curve of a light spot formed on a target surface by three different wavelengths of light after the multispectral illumination light source provided by the embodiment of the invention is applied to photodynamic therapy.
Wherein, 1, a packaging substrate, 2, a reflecting cup, 3, a solid-state light-emitting element, 4, an electrode, 5, a plane packaging structure, 6, a circuit board, 7, a light-transmitting protection plate, 8, target surface, 9, hemispherical lens structure, 10, microlens array, 101, microlens, 11, first optical lens array, 12, second optical microlens array.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the prior art, a planar packaging structure is generally adopted in packaging a multispectral solid-state light-emitting device serving as a light source for photodynamic therapy, or a hemispherical lens structure is additionally arranged on the light-emitting surface of the planar packaging structure, and a transparent material such as epoxy resin or silica gel is generally used as a packaging material. The structure and existing drawbacks of the two prior art multi-spectral solid state light emitting devices will be described in detail with reference to the accompanying drawings.
Referring to fig. 1 (a), a schematic structure of a related art multi-spectrum solid state light emitting device employing a planar package structure is shown in fig. 1 (a). In the multi-spectrum solid state light emitting device, solid state light emitting elements 3 including red LED chips, green LED chips, and blue LED chips are integrated on the same package substrate 1 while the respective LED chips are connected with corresponding electrodes 4, and then the reflective cup 2 is filled with a transparent material such as epoxy resin or silica gel to form a planar package structure 5.
As can be seen from fig. 1 (a), light rays exiting from the respective LED chips are reflected and refracted while passing through the interface of the surface of the planar package structure and air. When the incident angle is larger than the critical angle, total reflection can occur, and light rays cannot be emitted into the air, namely an escape cone of the critical angle exists, so that the overall light extraction efficiency of the multispectral solid-state light-emitting device is reduced. In addition, as the radiation angle of the light rays emitted by each LED chip is in lambertian distribution of 110-120 degrees, the light source energy is dispersed due to the overlarge divergence angle of the emitted light rays.
Referring to fig. 1 (b), fig. 1 (b) shows an irradiation effect diagram applied in photodynamic therapy after the multispectral solid-state light-emitting device having the structure shown in fig. 1 (a) is composed into a multispectral irradiation light source. The multispectral solid-state light-emitting devices composed of three LED chips with different wavelengths are arranged on the circuit board 6 in an array to form a multispectral irradiation light source, and when the multispectral solid-state light-emitting device is applied to photodynamic therapy, light beams with different wavelengths emitted by the multispectral solid-state light-emitting devices pass through the light-transmitting protection plate 7 arranged behind the multispectral solid-state light-emitting devices and irradiate the multispectral irradiation light source to the target surface 8. On the surface of the target surface 8, light spots generated by light beams with different wavelengths are mutually staggered and overlapped and are connected into a piece to form a large-area light spot.
Clearly, a multispectral illumination source composed of a multispectral solid-state light-emitting device employing the structure shown in fig. 1 (a) has the following drawbacks: although the light spots formed by the light beams emitted by the multispectral solid-state light emitting devices reaching the surface of the target surface can be mutually connected into pieces, the light extraction efficiency of each multispectral solid-state light emitting device is low, and the light source energy is dispersed due to the overlarge divergence angle, so that the light spot area irradiated on the surface of the target surface is large, but the illumination power density of each position is very low, the requirement of photodynamic therapy on the illumination power density of an effective irradiation area is difficult to meet, and the clinical treatment effect is poor.
Referring to fig. 2 (a), a schematic diagram of a prior art multi-spectrum solid state light emitting device employing a hemispherical lens structure added to the light exit surface of the planar package structure is shown in fig. 2 (a). In the multispectral solid-state light-emitting device, solid-state light-emitting elements 3 including red light LED chips, green light LED chips and blue light LED chips are integrated on the same package substrate 1, and each LED chip is connected with a corresponding electrode 4, then a reflective cup 2 is filled with a transparent material such as epoxy resin or silica gel to form a planar package structure 5, and then a hemispherical lens structure 9 is added on the planar package structure 5. Obviously, the light rays with lambertian distribution, the radiation angles of which are 110-120 degrees, emitted by each LED chip are converged through the hemispherical lens structure, so that the light rays become Gaussian distribution light with a specific divergence angle, and the energy of the emitted light beam is concentrated near the optical axis. In addition, the hemispherical lens structure changes the propagation direction of the light rays emitted from each LED chip and located in the "escape cone" so that the light rays can escape from the planar package structure, thereby improving the light extraction efficiency of the multi-spectral solid state light emitting device having the structure shown in fig. 2 (a).
As can be seen from fig. 2 (a), the solid state light emitting elements including the red LED chip, the green LED chip and the blue LED chip are integrated on the same package substrate, and although the different LED chips are closely spaced from each other, their spatial positions are still different, and the difference in spatial positions will cause a difference in spatial angular distribution of the light rays of different wavelengths emitted from them after being collimated by the hemispherical lens structure. In addition, since the refractive index of the hemispherical lens structure increases with the decrease of the wavelength of the incident light, the refractive index of the blue light with the smallest wavelength is the largest, and the refractive index of the red light with the largest wavelength is the smallest among the light emitted from the three LED chips. Light rays with a small refractive index may deflect towards the edges of the hemispherical lens structure as they propagate from the hemispherical lens structure into the air.
Referring to fig. 2 (b), fig. 2 (b) shows an irradiation effect diagram applied in photodynamic therapy after the multispectral solid-state light-emitting device having the structure shown in fig. 2 (a) is composed into a multispectral irradiation light source. The multispectral solid-state light-emitting devices composed of three LED chips with different wavelengths are arranged on the circuit board 6 in an array to form a multispectral irradiation light source, and when the multispectral solid-state light-emitting device is applied to photodynamic therapy, light beams with different wavelengths emitted by the multispectral solid-state light-emitting devices pass through the light-transmitting protection plate 7 arranged behind the multispectral solid-state light-emitting devices and are irradiated to the target surface 8. On the surface of the target surface 8, the positions of light spots generated by light beams with different wavelengths are different, are mutually independent and cannot be connected into a sheet, so that a light spot area with uniformly distributed illumination power density cannot be formed.
Of course, to solve this problem, the individual spots reaching the target surface of interest may be connected to each other by increasing the distance between the multispectral illumination source and the target surface of interest. However, as the distance increases, the illumination power density of each position on the target surface of the target decreases, so that the requirement of photodynamic therapy on the illumination power density of the effective irradiation area is difficult to meet, and the clinical treatment effect is poor. Meanwhile, due to the existence of the spatial angular distribution difference of the light rays with different wavelengths and the difference of refractive indexes of the light rays in the hemispherical lens structure, the position difference of the light spots formed by the light rays with different wavelengths on the surface of the target surface is always existed, the light spots cannot be reduced due to the increase of the distance between the multispectral irradiation light source and the target surface, and the difference of the distribution curved surfaces of the illumination power density in the effective irradiation area is unfavorable for realizing the effectiveness of the multispectral photodynamic combined treatment.
In summary, the multispectral solid-state light emitting device in the prior art has the defects of low light extraction efficiency, light spot position difference of light rays with different wavelengths on the target surface of the target, and the like, if the multispectral solid-state light emitting device is directly arranged in an array to form a multispectral irradiation light source for photodynamic therapy, a series of problems of low light energy utilization rate, uneven illumination, inconsistent surface positions of irradiation light spots with different wavelengths on the treatment area, large shape difference of irradiation power density distribution curved surfaces with different wavelengths on the surface of the treatment area, and the like will occur, so that the clinical effect of photodynamic therapy is poor, and the application and development of the multispectral solid-state light emitting device as a light source for photodynamic therapy are restricted.
Aiming at various defects of the multispectral solid-state light-emitting device in the prior art, referring to fig. 3 to 5, the embodiment of the invention discloses a multispectral solid-state light-emitting device, which comprises a packaging substrate 1, wherein a bearing surface of the packaging substrate 1 is provided with a reflecting cup 2, and at least two solid-state light-emitting elements 3 with different wavelengths are arranged in an accommodating space of the reflecting cup 2; at least two pairs of electrodes 4 are arranged on two sides of the packaging substrate 1, and the electrodes 4 are connected with the anode and the cathode of the solid-state light-emitting element 3; the light outlet of the reflecting cup 2 is also provided with a micro lens array 10 in a closed mode, the micro lens array 10 is parallel to the packaging substrate 1, and one side of the micro lens array 10, which is provided with a plurality of refractive hemispherical micro lenses 101 arranged in an orthogonal array, faces away from the solid-state light-emitting element 3.
In this embodiment, the reflective cup is not filled with a transparent material such as epoxy resin or silica gel, but a micro lens array is sealed at the light outlet of the reflective cup, and the size of the micro lens array is slightly larger than that of the light outlet of the reflective cup, so that the micro lens array can completely cover the light outlet of the reflective cup, the distance between the micro lens array and each solid-state light-emitting element is fixed, each solid-state light-emitting element is isolated from the outside air, the structure of the whole device is more compact, and the production and the use are convenient.
By this arrangement, each solid state light emitting element can be directly exposed to the air, and thus the etendue can be reduced. The solid state light emitting element is encapsulated by a transparent material with refractive index n, and the optical expansion of the solid state light emitting element is increased by n 2 Multiple times.
Meanwhile, the microlens array can collect light rays emitted by each solid-state light-emitting element in a large-angle light-emitting range and form a plurality of collimated parallel beamlets, the number of which is the same as that of the microlenses on the microlens array. As a result of this processing, although the spatial positions of the solid-state light-emitting elements provided on the same package substrate are different, light rays of different wavelengths incident thereto can be approximately regarded as point light sources from the same position for each microlens on the microlens array. Therefore, after the light rays emitted by the solid-state light-emitting elements are collimated by the micro-lens array, the spatial angular distribution difference of the light rays with different wavelengths in the beamlets is restrained to be small, and the positions of light spots formed by the beamlets with different wavelengths on the target surface of the target are approximately the same. Because the micro lenses on the micro lens array are closely arranged, the light spots formed by a plurality of light beams on the target surface are mutually connected to form large light spots with uniform illumination power density distribution and consistent positions, and the clinical effect of photodynamic therapy can be effectively improved. The outgoing light ray composed of a plurality of beamlets is not an ideal parallel light but has a certain divergence angle, but can be regarded as a parallel light approximately because the divergence angle is already small.
In addition, compared with two packaging structures in the prior art, the micro-lens array remarkably reduces the thickness of the lens, thereby greatly reducing the energy loss of light rays in the lens. Therefore, by packaging the microlens array at the light outlet of the reflective cup, not only is the light extraction efficiency problem of the multispectral solid-state light-emitting device solved, but also the spatial angles of the light rays with different wavelengths can be constrained to be approximately the same.
The number of microlenses on the microlens array is not directly related to the number of solid-state light-emitting elements disposed on the package substrate. The number of microlenses provided on the microlens array is determined by parameters such as the radius of the microlens, the distance between circular bottom surfaces of adjacent microlenses, and the like under the condition that the shape and the size of the microlens array are determined.
Preferably, the light outlet of the reflecting cup 2 is rectangular or circular, and the shape of the micro lens array 10 is matched with the shape of the light outlet of the reflecting cup 2.
In this embodiment, the light outlet of the reflective cup may be rectangular or circular, preferably circular, and the microlens array is correspondingly circular. This is because the light outlet of the reflecting cup is circular, and is easy to realize in terms of technology.
The bottom surface of the reflecting cup preferably conforms to the shape of the light outlet, and when the light outlet of the reflecting cup is circular, the bottom surface is also circular. The dimensions of the bottom surface of the reflective cup and the light outlet are determined by the dimensions of the entire multi-spectral solid state light emitting device, and larger dimensions should be selected as much as process conditions allow.
Preferably, the height of the reflective cup is the same as the focal length of the microlens.
In this embodiment, the height of the reflective cup is determined by the distance between the optical center of the micro lens in the micro lens array and the surface of the solid state light emitting element, and preferably is the same as the focal length of the micro lens, so that a better light emitting effect can be achieved.
Preferably, the carrier surface of the package substrate 1 is further provided with an insulating surface layer, which is made of a thermally conductive ceramic material.
In the embodiment, the package substrate is square, so that the package substrate is convenient to be arranged in an orthogonal array on the circuit board when the multispectral illumination light source is formed later. The ceramic material selected for the insulating surface layer is generally alumina or aluminum nitride and the like, so that the insulating effect is good.
On the basis of the above-described embodiment, the solid-state light-emitting element 3 includes a red LED chip having a peak wavelength in a wavelength range of 620 to 630nm, a green LED chip having a peak wavelength in a wavelength range of 520 to 530nm, and a blue LED chip having a peak wavelength in a wavelength range of 460 to 470 nm.
In this embodiment, the solid-state light emitting element is preferably a red LED chip, a green LED chip, and a blue LED chip each having a peak wavelength in the above wavelength range, and can satisfy the specific requirement of most photodynamic therapy for the wavelength of light since the peak of the absorbance spectrum of most photosensitizers is 625nm or 525nm or 465 nm.
Of course, for certain photosensitizers, depending on their light absorption spectral characteristics, those skilled in the art may prefer solid state light emitting elements to be red, yellow and blue LED chips, respectively, having peak wavelengths in the above wavelength ranges, or other combinations.
In addition, the solid-state light-emitting element preferably employs an LED chip, and since the LED chip emits less heat when lit, discomfort caused when the treatment area of the patient is irradiated during treatment can be reduced.
On the basis of the above embodiment, referring to fig. 6, the red LED chips, the green LED chips and the blue LED chips are arranged in an equilateral triangle, and the distances between the red LED chips, the green LED chips and the blue LED chips are 0.1 to 0.2mm.
In this embodiment, the red LED chip, the green LED chip, and the blue LED chip as the solid-state light emitting element are arranged in an equilateral triangle, and the center of the equilateral triangle is concentric with the plane of the light outlet of the reflective cup, so that the positions of the three LED chips are identical for the microlens array packaged on the light outlet of the reflective cup.
In addition, the gap between the three LED chips is set as small as possible, and the etendue can be reduced.
Of course, in practical application, the arrangement of three LED chips into an equilateral triangle is only one preferred arrangement, and other arrangements are also possible, and when the number of LED chips is not three, those skilled in the art will necessarily arrange the LED chips into other arrangements.
It should be noted that, in this embodiment, the positions of the red LED chip, the green LED chip, and the blue LED chip in the equilateral triangle are not limited.
On the basis of the above embodiment, three pairs of electrodes 4 are disposed on two sides of the package substrate 1, and the three pairs of electrodes 4 are respectively connected with the positive and negative electrodes of the red LED chip, the green LED chip and the blue LED chip.
In this embodiment, the positive and negative electrodes of the red LED chip, the green LED chip, and the blue LED chip are respectively connected with three pairs of electrodes, so that the on and off of each LED chip can be independently controlled, which is convenient for controlling each LED chip when performing photodynamic therapy.
On the basis of the above embodiment, the radius of the microlens 101 is 0.05 to 0.25mm, the focal length of the microlens is 0.8mm, and the distance between the circular bottom surfaces of the adjacent microlenses 101 is 0mm.
In this embodiment, the side of the microlens array facing away from each solid-state light emitting element is formed by a plurality of refractive hemispherical microlenses arranged in an orthogonal array. In fig. 5, r is the radius of the microlens, D is the distance between the circular bottom surfaces of the adjacent microlenses, and d=2r+d is the distance between the centers of the circular bottom surfaces of the adjacent microlenses.
Further, the multi-spectrum solid state light emitting device in the embodiment is modeled and trace simulated by using tracePro optical simulation software, and the influence of parameters r, D and D in the micro lens array on the light extraction efficiency of emergent rays with different wavelengths is analyzed to determine the preferred micro lens parameters in the embodiment of the invention.
The structure shown in the embodiment of the invention is imported into tracePro optical simulation software, the outline dimension of the package substrate is 5×5mm, the dimension of the solid-state light-emitting element is 1×1×0.5mm, the diameter of the bottom of the reflecting cup is 3.3mm, the diameter of the top light outlet is 3.8mm, the height is 0.8mm, the diameter of the micro lens array is 4.0mm, and then a light distribution model is built for simulation. Meanwhile, the number of solid-state light emitting elements is defined as three, namely a red LED chip having a peak wavelength in a wavelength range of 620 to 630nm, a green LED chip having a peak wavelength in a wavelength range of 520 to 530nm, and a blue LED chip having a peak wavelength in a wavelength range of 460 to 470nm, respectively.
First, a distance d=0 mm between the circular bottom surfaces of the adjacent microlenses is set, then tracking simulation is performed on the light extraction efficiency of each of the different wavelength light rays of the microlenses with different radii, normalization processing is performed with respect to the light extraction efficiency of each of the different wavelength light rays of the multispectral solid-state light emitting device shown in fig. 1 (a), and a simulation curve of the relationship between the radii of the microlenses and the normalized light extraction efficiency is obtained, as shown in fig. 7. As can be seen from fig. 7, the multi-spectral solid state light emitting device according to the embodiment of the present invention has improved extraction efficiency for each of the light rays of different wavelengths, and the extraction efficiency increases with the increase of the radius of the microlens, compared to the multi-spectral solid state light emitting device shown in fig. 1 (a). This is because the number of microlenses on the microlens array decreases due to the increased radius of the microlenses, which tends to reduce the loss of luminous flux, whereas too large a radius of the microlenses increases the difference in spatial angular distribution of light rays of different wavelengths, resulting in different spot positions formed by light rays of different wavelengths on the target surface. Therefore, the contradiction between the light extraction efficiency and the light spot position difference formed by the light rays with different wavelengths is comprehensively considered when the radius of the micro lens is determined.
Next, a radius r=0.15 mm of the microlens is set, tracking simulation is performed on the light extraction efficiency of each of the different wavelength light rays of the distance between the circular bottom surfaces of the adjacent microlenses, normalization processing is performed with respect to the light extraction efficiency of each of the different wavelength light rays of the multispectral solid-state light emitting device shown in fig. 1 (a), and a simulation curve of the relation between the distance between the circular bottom surfaces of the adjacent microlenses and the normalized light extraction efficiency is obtained, as shown with reference to fig. 8. As can be seen from fig. 8, in the case where the radius of the microlens is determined, the light extraction efficiency of each of the different wavelengths of light exhibits a maximum value at a distance d=0 mm between the circular bottom surfaces of the adjacent microlenses, and decreases as the distance increases, and after the distance approaches the radius of the microlens, the light extraction efficiency rapidly decreases. Therefore, in the case of radius determination of the microlenses, the distance between the circular bottom surfaces of the adjacent microlenses should be as small as possible according to the processing method of the microlens array.
Above-mentionedSimulation results show that: when the radius of each micro lens is 0.05-0.25 mm and the distance between the round bottom surfaces of the adjacent micro lenses is 0mm, the light extraction efficiency improving effect is obvious. At this time, the effective aperture ratio [ pi r ] of the microlens array 2 /(2r+d) 2 ]The value of x 100% is 78.5%.
Preferably, the microlens 101 has a radius of 0.15mm, and the light extraction efficiency is optimal when the distance between the circular bottom surfaces of the adjacent microlenses is 0mm.
According to the above preferred microlens parameters, the microlens array is made of optical glass having good light transmittance for all light rays in the wavelength range from visible light to infrared light. Since the diameter of the microlens is very small and each microlens on the microlens array is closely arranged, it cannot be processed by cold working techniques. In this embodiment, the fabrication of the microlens array is performed by using an optical micromachining technique using a plasma etching method. In addition, since the optical glass has a disadvantage of being fragile compared with a PMMA material, a PC material, or the like, the nonfriable property of the optical glass can be improved by a plating process.
Therefore, in the case where the distance between the radius of the above microlens and the circular bottom surface of the adjacent microlens is 0mm, the focal length of each microlens on the microlens array made of the material is 0.8mm.
The height of the microlens can be calculated by a person skilled in the art based on common general knowledge on the basis of the determination of the focal length and radius of the microlens, and this process is not described here.
On the basis of the structure of the multispectral solid-state light-emitting device shown in the above embodiments of the present invention, in order to further verify the effect of the multispectral solid-state light-emitting device provided in the embodiments of the present invention on light energy utilization rate, spatial angle constraint on light rays with different wavelengths, and spot uniformity, the following verification is performed, and the following parameters are defined:
uniformity: a is that i ＝E i /E p ；
Uniformity coefficient: e=s e /S。
Wherein E is i A certain point of a light spot formed by irradiating the target surface of the target with lightIs a light power density of (a); e (E) p A peak value of illumination power density in a light spot formed by irradiating the target surface of the target with light; s is the total area of light spots formed by irradiating the target surface with light; s is S e Satisfy A in the facula formed by irradiating the target surface of the target with light i Area of the region of 0.85 or more.
Wherein A is i The region of ∈0.85 was defined as the uniform spot region. The higher the uniformity coefficient E means that the illumination power density distribution within the spot is more uniform.
Specifically, a target surface is disposed at a position 150mm away from the microlens array in the multispectral light emitting device provided by the embodiment of the invention, and is used for simulating a treatment area of a patient. Then, red light having a peak wavelength in a wavelength range of 620 to 630nm, green light having a peak wavelength in a wavelength range of 520 to 530nm, and blue light having a peak wavelength in a wavelength range of 460 to 470nm are respectively projected to the target surface, and the illumination power densities of spots formed on the target surface by the light rays of the different wavelengths are measured using a light irradiator.
During verification, dividing the target surface into square measurement subareas with the diameter of 10 multiplied by 10mm, taking the measurement target as the geometric center point of each measurement subarea, and marking the illumination power density value of the measurement target as E i Calculating the uniformity A of the measurement target according to the formula for calculating uniformity i . In the same coordinate system, A in the outermost periphery of a light spot formed by light rays with three different wavelengths i The points of 0.85 or more are connected by fold lines to form three closed areas shown in figure 9, namely, the areas with uniform light spots formed by the light rays with three different wavelengths respectively.
As can be seen from fig. 9, the areas of the uniform light spot areas formed by the light rays with three different wavelengths are substantially the same, and are distributed in the center of the light spot in a concentrated manner, and the positions of the three uniform light spot areas on the target surface are approximately coincident.
Then, the light extraction efficiency of the multispectral solid-state light emitting device shown in fig. 1 (a) and the multispectral light emitting device provided by the embodiment of the invention when emitting light rays with different wavelengths is measured by using an integrating sphere, and the measured value of the multispectral solid-state light emitting device provided by the embodiment of the invention is normalized relative to the measured value of the multispectral solid-state light emitting device shown in fig. 1 (a), so as to obtain the value of the normalized light extraction efficiency of each light ray with different wavelength of the multispectral solid-state light emitting device provided by the embodiment of the invention, which is shown in the following table.
| Peak wavelength of light source | 625nm | 525nm | 465nm |
| Normalized light extraction efficiency | 51.50％ | 46.40％ | 48.70％ |
As can be seen from the above table, the optical expansion can be effectively reduced by exposing the solid-state light-emitting element in the air, and the light extraction efficiency of the light rays with different wavelengths can be obviously improved by packaging the microlens array at the light outlet of the reflecting cup. The actual measurement values of the normalized light extraction efficiency of the light rays with different wavelengths are identical to the simulation results obtained by using the optical simulation software, as indicated by the dashed lines on the simulation curves shown in fig. 7.
In summary, the multispectral solid-state light-emitting device provided by the embodiment of the invention has the advantages of high light extraction efficiency, small packaging volume, approximately same space angle of light rays with different wavelengths, parallel light ray collimation, uniform light spots and the like, and the positions of the uniform light spots of the light rays with different wavelengths on the target surface are approximately same, so that the clinical effect of photodynamic therapy is effectively improved.
Referring to fig. 10, the embodiment of the present invention further discloses a multispectral illumination light source, which includes a circuit board 6 and at least one multispectral solid-state light emitting device according to any one of the above embodiments, where each multispectral solid-state light emitting device is arranged on the circuit board 6 in an orthogonal array.
In this embodiment, when the multispectral solid-state light emitting device provided in any one of the embodiments is used as a light source for photodynamic therapy, the multispectral solid-state light emitting device composed of LED chips with different wavelengths is arranged in an orthogonal array on a circuit board to form a multispectral illumination light source, and then a first optical lens array and a second optical lens array are sequentially arranged behind the multispectral illumination light source, wherein one side, close to the multispectral illumination light source, of the first optical lens array, with a plurality of refractive lenslets arranged in an orthogonal array faces the multispectral illumination light source, and one side, close to the multispectral illumination light source, of the second optical lens array, with a plurality of refractive lenslets arranged in an orthogonal array faces away from the multispectral illumination light source. Wherein each lenslet on the second optical lens array coincides with the center of each lenslet on the first optical lens array and each side is uniform and corresponds.
Referring to fig. 11, fig. 11 shows an irradiation effect diagram of the multispectral irradiation light source applied to photodynamic therapy according to the embodiment of the invention. The collimated light beam generated by the multispectral illumination light source sequentially passes through the first optical lens array 11 and the second optical micro lens array 12 to be subjected to homogenization treatment, and finally the output light beam is directly illuminated on the target surface 8. On the surface of the target surface, light spots generated by light beams with different wavelengths are mutually overlapped and the non-uniformity is mutually compensated, so that a light spot area with uniformly distributed illumination power density is formed.
Preferably, the multi-spectral solid state light emitting device in the present embodiment includes three solid state light emitting elements, which are respectively a red LED chip having a peak wavelength in a wavelength range of 620 to 630nm, a green LED chip having a peak wavelength in a wavelength range of 520 to 530nm, and a blue LED chip having a peak wavelength in a wavelength range of 460 to 470 nm.
Further, the multispectral illumination light source provided by the embodiment of the invention is applied to photodynamic therapy and then subjected to illumination power density tests of three different-wavelength light rays so as to obtain the illumination power density distribution condition of each different-wavelength light ray.
First, a target surface is provided at a position 300mm from the above-mentioned second optical lens array for simulating a patient treatment area. Then, red light having a peak wavelength in a wavelength range of 620 to 630nm, green light having a peak wavelength in a wavelength range of 520 to 530nm, and blue light having a peak wavelength in a wavelength range of 460 to 470nm are respectively projected toward the target surface, and the illumination power densities of spots formed on the target surface by the light of the respective wavelengths are measured using a light irradiator.
Specifically, dividing the target surface into square measurement subareas with the diameter of 10 multiplied by 10mm, taking the measurement target as the geometric center point of each measurement subarea, and recording the illumination power density value of the measurement target as E i Simultaneously, the three-dimensional mapping software is utilized to measure the illumination power density value E of the target i And constructing an illumination power density curved surface in a three-dimensional coordinate system for the Z-axis coordinate value and the x-y coordinate values of the measurement targets. According to this method, the illumination power density curved surfaces of the spots formed on the target surface by the three different wavelength light rays are obtained respectively, and they are placed in the same coordinate system, as shown with reference to fig. 12.
As can be seen from fig. 12, after three kinds of light rays with different wavelengths are collimated and sequentially homogenized by the first optical lens array and the second optical lens array, a homogenized large-area light spot is formed on the target surface of the target, and the distribution curved surfaces of the illumination power density of the light spots are highly similar, so that the effect of improving the photodynamic multispectral combined treatment mode of the multispectral illumination light source applied to photodynamic treatment provided by the embodiment of the invention is achieved.
It should be noted that, the shapes, dimensions, etc. of the multispectral illumination light source, the first optical lens array, and the second optical lens array may be changed correspondingly according to the light source irradiation condition to achieve the desired technical effects, and these changes are all made within the spirit and principles of the present invention, and are all included in the protection scope of the present invention.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the foregoing embodiments of the present invention, the descriptions of the embodiments are emphasized, and for a portion of this disclosure that is not described in detail in this embodiment, reference is made to the related descriptions of other embodiments.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (8)
1. The multispectral solid-state light-emitting device is characterized by comprising a packaging substrate, wherein a bearing surface of the packaging substrate is provided with a reflecting cup, and at least two solid-state light-emitting elements with different wavelengths are arranged in an accommodating space of the reflecting cup; at least two pairs of electrodes are arranged on two sides of the packaging substrate, and the electrodes are connected with the anode and the cathode of the solid-state light-emitting element;
a micro-lens array is also arranged at the light outlet of the reflecting cup in a sealing way, the micro-lens array is parallel to the packaging substrate, and one side of the micro-lens array, which is provided with a plurality of refraction type hemispherical micro-lenses arranged in an orthogonal array, faces away from the solid-state light-emitting element;
the solid state light emitting element includes a red light LED chip having a peak wavelength in a wavelength range of 620 to 630nm, a green light LED chip having a peak wavelength in a wavelength range of 520 to 530nm, and a blue light LED chip having a peak wavelength in a wavelength range of 460 to 470 nm;
the red light LED chips, the green light LED chips and the blue light LED chips are arranged in an equilateral triangle, and the center of the equilateral triangle is concentric with the plane of the light outlet of the reflecting cup;
the radius of the micro lens is 0.05-0.25 mm, the focal length of the micro lens is 0.8mm, and the distance between the round bottom surfaces of the adjacent micro lenses is 0mm.
2. The multi-spectral solid state light emitting device of claim 1, wherein the red LED chips, the green LED chips, and the blue LED chips are arranged in an equilateral triangle, and the distances between the red LED chips, the green LED chips, and the blue LED chips are 0.1 to 0.2mm.
3. The multi-spectral solid state light emitting device of claim 1, wherein three pairs of electrodes are disposed on two sides of the package substrate, and the three pairs of electrodes are respectively connected to the positive and negative electrodes of the red LED chip, the green LED chip, and the blue LED chip.
4. The multi-spectral solid state light emitting device of claim 1, wherein the micro-lens has a radius of 0.15mm.
5. The multi-spectral solid state light emitting device of claim 1, wherein the light exit opening of the reflective cup is rectangular or circular, and the microlens array has a shape matching the shape of the light exit opening of the reflective cup.
6. The multi-spectral solid state light emitting device of claim 1, wherein the height of the reflective cup is the same as the focal length of the microlens.
7. The device of claim 1, wherein the package substrate has an insulating surface layer disposed on a bearing surface thereof, the insulating surface layer being made of a thermally conductive ceramic material.
8. A multi-spectral illumination light source comprising a wiring board and at least one multi-spectral solid state light emitting device according to any one of claims 1 to 7, each of the multi-spectral solid state light emitting devices being arranged in an orthogonal array on the wiring board.
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| TW201010118A (en) * | 2008-08-20 | 2010-03-01 | Luxtaltek Corp | Solid-state light-emitting device array module |
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| KR100649641B1 (en) * | 2005-05-31 | 2006-11-27 | 삼성전기주식회사 | Led package |
| US7485480B2 (en) * | 2006-09-21 | 2009-02-03 | Harvatek Corporation | Method of manufacturing high power light-emitting device package and structure thereof |
| US7737636B2 (en) * | 2006-11-09 | 2010-06-15 | Intematix Corporation | LED assembly with an LED and adjacent lens and method of making same |
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| TW201010118A (en) * | 2008-08-20 | 2010-03-01 | Luxtaltek Corp | Solid-state light-emitting device array module |
| CN202930428U (en) * | 2012-11-20 | 2013-05-08 | 彩虹奥特姆（湖北）光电有限公司 | LED lamp structure |
| CN103474423A (en) * | 2013-03-28 | 2013-12-25 | 深圳信息职业技术学院 | High luminous efficiency LED integrated light source and LED lamp |
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