CN109402706A - Selectively applied method - Google Patents
Selectively applied method Download PDFInfo
- Publication number
- CN109402706A CN109402706A CN201710696680.9A CN201710696680A CN109402706A CN 109402706 A CN109402706 A CN 109402706A CN 201710696680 A CN201710696680 A CN 201710696680A CN 109402706 A CN109402706 A CN 109402706A
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- CN
- China
- Prior art keywords
- metal portion
- workpiece
- surface tension
- film
- low surface
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The present invention provides a kind of selectively applied method comprising: provide a workpiece, the workpiece include metal portion and with the combined non-metal portion of the metal portion；Electro coat is carried out to the workpiece using the electrophoretic coating with low surface tension, to form low surface tension film on the surface of the metal portion of workpiece；The workpiece for being formed with low surface tension film is coated using the coating with high surface tension, to form high surface tension film on the surface of the non-metal portion of workpiece.Low surface tension film made from selectively applied method of the invention is made only in the surface of metal portion, and metal portion can be completely covered, and low surface tension film is not in flash in the intersection of metal portion and non-metal portion；High surface tension film is made only in the surface of non-metal portion, and can completely cover non-metal portion, and high surface tension film is not in flash in the intersection of metal portion and non-metal portion.
Description
Technical field
The present invention relates to a kind of coating method more particularly to a kind of selectively applied methods.
Background technique
In order to make the surface of 3C Product that there are the performances such as wear-resisting, anti-scratch, corrosion-resistant, anti-dazzle, it usually needs in workpiece
Surface localised application film layer.For heterotypic material engaging member, such as there is metal portion and non-metal portion workpiece simultaneously, sometimes only need
Metal portion or non-metal portion are coated.
When only needing the surface to the non-metal portion of workpiece to be coated, if the coating method used can be to metal
Portion carries out surface coating, and can carry out surface coating to non-metallic film, it is necessary to metal portion is covered, it is then individually right
Non-metal portion carries out surface coating, but the obtained film of this coating method metal portion and non-metal portion intersection often
There is flash, so that non-metal portion edge is exposed, prevents non-metal portion from being covered completely by film, or make metal portion edge quilt
Film covering, influences the beauty of workpiece.
When only needing to be coated the surface of metal portion, if the coating method used can be to metal portion carry out table
Face coating, and surface coating can be carried out to non-metallic film, it is necessary to non-metal portion is covered, then individually to metal portion
Surface coating is carried out, but the film that this coating method obtains often will appear hair in metal portion and non-metal portion intersection
Side, the i.e. boundary of film cannot (coincidence) consistent with the boundary line of non-metal portion with metal portion make so that metal portion edge is exposed
Metal portion cannot be covered by film completely, or cover non-metal portion edge by film, influence the beauty of workpiece, and nonmetallic
The masking in portion is relatively difficult.
In addition, general masking mode can not overcome the size difference of workpiece, need to make for various sizes of workpiece
Various sizes of covering increases processing procedure, wastes time and material.And because of the presence of error, the size of covering can not be complete
It is entirely completely the same with the size in shielded region.
Summary of the invention
In view of this, it is necessary to provide a kind of new selectively applied methods.
A kind of selectively applied method comprising following steps:
Step S1 provides a workpiece, the workpiece include metal portion and with the combined non-metal portion of the metal portion；
Step S2 carries out electro coat to the workpiece using the electrophoretic coating with low surface tension, in workpiece
The surface of metal portion forms low surface tension film；
Step S3 applies the workpiece for being formed with low surface tension film using the coating with high surface tension
Cloth, to form high surface tension film on the surface of the non-metal portion of workpiece.
Selectively applied method of the invention is by using the electrophoretic coating with low surface tension to the surface of metal portion
It carries out electro coat and forms low surface tension film, reuse the coating with high surface tension and the surface of non-metal portion is carried out
Coating forms high surface tension film.Because metal portion is combined with low surface tension film, therefore, it is coated to workpiece
When, have the coating of high surface tension without being adhered to the surface of low surface tension film, and only in the table of non-metal portion
Face forms high surface tension film.Low surface tension film of the invention is made only in the surface of metal portion and can be by metal portion
It is completely covered, low surface tension film is not in flash in the intersection of metal portion and non-metal portion.High surface of the invention
Tension film is made only in the surface of non-metal portion, and can completely cover non-metal portion, and high surface tension film is in metal
The intersection of portion and non-metal portion is not in flash.
Detailed description of the invention
Fig. 1 is the schematic cross-section of workpiece.
Fig. 2 is that the surface of the metal portion of workpiece shown in Fig. 1 forms the schematic cross-section of low surface tension film.
Fig. 3 is that the surface of the non-metal portion of workpiece shown in Fig. 2 forms the schematic cross-section of high surface tension film.
Fig. 4 is the schematic cross-section after stripping the low surface tension film of workpiece surface shown in Fig. 3.
Fig. 5 is that the surface of the metal portion of workpiece shown in Fig. 4 forms the schematic cross-section of plated film.
Fig. 6 is the schematic cross-section after stripping the high surface tension film of workpiece surface shown in fig. 5.
Main element symbol description
Workpiece 100
Metal portion 10
Low surface tension film 11
Plated film 12
Non-metal portion 20
High surface tension film 21
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by, it is clear that described embodiment is only some embodiments of the invention, rather than whole realities
Apply mode.
Based on the embodiment in the present invention, those of ordinary skill in the art institute without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
All technical and scientific terms used herein with to belong to those skilled in the art of the invention usual
The meaning of understanding is identical.Term as used herein in the specification of the present invention is intended merely to description specific embodiment
Purpose, it is not intended that in limitation the present invention.
Fig. 1~6 are please referred to, the selectively applied method of better embodiment of the present invention includes the following steps:
Step S1, referring to Fig. 1, providing a workpiece 100.The workpiece 100 can be the knot such as shell, middle plate of electronic product
Structure component.The workpiece 100 include metal portion 10 and with the combined non-metal portion 20 of metal portion 10.
The material of the metal portion 10 can be conventionally applied to electronic product structural portion for stainless steel, aluminium, magnesium, copper, titanium etc.
The metal material of the conductive energy of part.
The material of the non-metal portion 20 can be conventionally applied to the non-metallic material of workpiece for plastics, ceramics, glass etc..
Step S2, further referring to Fig. 2, the electrophoretic coating with low surface tension carries out electrophoresis to the workpiece 100
Coating, to form low surface tension film 11 on the surface of the metal portion 10 of workpiece 100.
Specifically, the step S2 includes:
Step S21, will the workpiece 100 immerse electrophoretic coating in carry out electro coat, then take out workpiece 100, with
The surface of the metal portion 10 of workpiece 100 forms the low surface tension film (not shown) of semisolid.
Step S22 is rinsed the workpiece 100 of the low surface tension film for being formed with semisolid, residual to remove
Stay in the electrophoretic coating in the gap of 20 surface of non-metal portion and workpiece 100.Because of the low surface tension film and metal portion of semisolid
There is certain binding force, so will not be rinsed between 10.
Step S23 toasts the workpiece 100 after flushing, so as to be formed in the low of the semisolid on 10 surface of metal portion
Surface tension curing of coating obtains the low surface tension film 11 for being incorporated into 10 surface of metal portion.
Contain the substance with low surface tension in the electrophoretic coating with low surface tension.This has low surface
The substance of power is lyophobic dust and/or oleophobizing substances.
Because electro coat cannot form film on the surface of non-metal portion 20, the low surface tension film 11
It is made only in the surface of metal portion 10, and metal portion 10 can be completely covered, and the low surface tension film 11 is in metal portion
10 and the intersection of non-metal portion 20 are not in flash.
Step S3 is formed with low surface tension to described using the coating with high surface tension further referring to Fig. 3
The workpiece 100 of film 11 is coated, to form high surface tension film 21 on the surface of the non-metal portion 20 of workpiece 100.
Because having the coating of high surface tension that can not be incorporated in the surface of low surface tension film 11, and it is only capable of not tying
The surface for closing the non-metal portion 20 of low surface tension film 11 forms high surface tension film 21.The high surface tension film 21 is only
It is formed in the surface of non-metal portion 20, and can completely be covered non-metal portion 20, high surface tension film 21 is in metal portion 10
Intersection with non-metal portion 20 is not in flash.
The intersection boundary line of the low surface tension film 11 and high surface tension film 21 is neat, does not cover alternately
Phenomenon occurs.
Through above-mentioned steps S1~S3, low surface tension film 11 can be formed on the surface of the metal portion 10 of workpiece 100, and
High surface tension film 21 is formed on the surface of non-metal portion 20.
When only needing to form high surface tension film 21 on the surface of the non-metal portion 20 of workpiece 100, above-mentioned choosing
Selecting property coating method is after step S3 further include:
Step S4: further referring to Fig. 4, the low surface tension film 11 on 10 surface of metal portion of workpiece 100 is stripped.
When needing the metal portion 10 to workpiece 100 to carry out plated film, above-mentioned selectively applied method is after step S4
Further include:
Step S5, further referring to Fig. 5, to the metal portion 10 stripped after low surface tension film 11 of workpiece 100
Surface carries out plated film, and plated film is to form plated film 12 on the surface of metal portion 10.
The plated film can be the conventional use of film plating process such as evaporation coating, sputter coating, ion film plating.
It is only needing to carry out plated film on the surface of the metal portion 10 of workpiece 100, the surface of non-metal portion 20 does not need to combine
When high surface tension film 21, above-mentioned selectively applied method is after step S5 further include:
Step S6 strips the high surface tension film 21 on 20 surface of non-metal portion of workpiece 100 further referring to Fig. 6.
It should be understood that can also include surface and the metal portion to workpiece 100 between the step S1 and step S2
The step of gap between 10 and non-metal portion 20 is cleaned, to remove greasy dirt, the impurity etc. on 100 surface of workpiece and gap.
The selectively applied method by using the electrophoretic coating with low surface tension to the surface of metal portion 10 into
Row electro coat forms low surface tension film 11, reuse the coating with high surface tension to the surface of non-metal portion 20 into
Row coating forms high surface tension film 21.Because 10 surface of metal portion is combined with low surface tension film 11, therefore, to workpiece
100 when be coated, and the coating with high surface tension and only exists without being adhered to the surface of low surface tension film 11
The surface of non-metal portion 20 forms high surface tension film 21.Low surface tension film 11 of the invention is made only in metal portion 10
Surface and metal portion 10 can be completely covered, intersection of the low surface tension film 11 in metal portion 10 and non-metal portion 20
It is not in flash.High surface tension film 21 of the invention is made only in the surface of non-metal portion 20, and can completely will be non-
Metal portion 20 covers, and high surface tension film 21 is not in flash in the intersection of metal portion 10 and non-metal portion 20.
In addition, it is described above, it is only better embodiment of the invention, not to limit in any form of the invention
System, although the present invention is disclosed above by better embodiment, is not intended to limit the invention, any skill for being familiar with this profession
Art personnel, without departing from the scope of the present invention, be modified when the technology contents using the disclosure above or
The equivalent implementations of equivalent variations are modified to, but without departing from the technical solutions of the present invention, technology according to the present invention
Any simple modification, equivalent change and modification that essence does embodiment of above, still fall within technical solution of the present invention
In range.
Claims (7)
1. a kind of selectively applied method comprising following steps:
Step S1 provides a workpiece, the workpiece include metal portion and with the combined non-metal portion of the metal portion；
Step S2 carries out electro coat to the workpiece using the electrophoretic coating with low surface tension, in the metal of workpiece
The surface in portion forms low surface tension film；
Step S3 is coated the workpiece for being formed with low surface tension film using the coating with high surface tension,
To form high surface tension film on the surface of the non-metal portion of workpiece.
2. selectively applied method as described in claim 1, it is characterised in that: the electrophoretic coating with low surface tension
In contain lyophobic dust and/or oleophobizing substances.
3. selectively applied method as described in claim 1, it is characterised in that: the selectively applied method step S3 it
Afterwards further include:
Step S4: the low surface tension film of the metal portion of workpiece is stripped.
4. selectively applied method as claimed in claim 3, it is characterised in that: the selectively applied method step S4 it
Afterwards further include:
Step S5 carries out plated film to the surface for stripping the metal portion after low surface tension film of workpiece.
5. selectively applied method as claimed in claim 4, it is characterised in that: the selectively applied method step S5 it
Afterwards further include:
Step S6 strips the high surface tension film on the non-metal portion surface of workpiece.
6. selectively applied method as described in claim 1, it is characterised in that: also wrapped between the step S1 and step S2
The gap between surface and metal portion and non-metal portion to workpiece is included to be cleaned to remove the greasy dirt of workpiece surface and gap
And the step of impurity.
7. selectively applied method as described in claim 1, it is characterised in that: the step S2 includes:
The workpiece is immersed in electrophoretic coating and carries out electro coat, workpiece then taken out, in the metal of workpiece by step S21
The surface in portion forms the low surface tension film of semisolid；
Step S22 is rinsed the workpiece of the low surface tension film for being formed with semisolid, remains in non-gold with removal
The electrophoretic coating of category portion surface and workpiece gap；
Step S23 toasts the workpiece after flushing, so that the low surface tension for being formed in the semisolid of metal portion applies
Film solidification, obtains the low surface tension film for being incorporated into metal portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710696680.9A CN109402706A (en) | 2017-08-15 | 2017-08-15 | Selectively applied method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710696680.9A CN109402706A (en) | 2017-08-15 | 2017-08-15 | Selectively applied method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109402706A true CN109402706A (en) | 2019-03-01 |
Family
ID=65454091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710696680.9A Pending CN109402706A (en) | 2017-08-15 | 2017-08-15 | Selectively applied method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109402706A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1348511A (en) * | 1999-02-27 | 2002-05-08 | 晏达科技有限公司 | Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
| CN103878338A (en) * | 2014-03-19 | 2014-06-25 | 宁波东浩铸业有限公司 | Technology for machining automobile engine end cover |
| CN104159983A (en) * | 2012-03-06 | 2014-11-19 | 奥西-技术有限公司 | Ink composition |
-
2017
- 2017-08-15 CN CN201710696680.9A patent/CN109402706A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1348511A (en) * | 1999-02-27 | 2002-05-08 | 晏达科技有限公司 | Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
| CN104159983A (en) * | 2012-03-06 | 2014-11-19 | 奥西-技术有限公司 | Ink composition |
| CN103878338A (en) * | 2014-03-19 | 2014-06-25 | 宁波东浩铸业有限公司 | Technology for machining automobile engine end cover |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190301 |