CN109397807A - The manufacturing method of composite phenolic resin plate and composite phenolic resin plate - Google Patents
The manufacturing method of composite phenolic resin plate and composite phenolic resin plate Download PDFInfo
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- CN109397807A CN109397807A CN201811542616.6A CN201811542616A CN109397807A CN 109397807 A CN109397807 A CN 109397807A CN 201811542616 A CN201811542616 A CN 201811542616A CN 109397807 A CN109397807 A CN 109397807A
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- Prior art keywords
- phenolic resin
- resin plate
- composite
- plate
- paper
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- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 228
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 224
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 222
- 239000002131 composite material Substances 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 241000499489 Castor canadensis Species 0.000 claims abstract description 65
- 235000011779 Menyanthes trifoliata Nutrition 0.000 claims abstract description 65
- 239000002994 raw material Substances 0.000 claims abstract description 27
- 229920003986 novolac Polymers 0.000 claims abstract description 17
- 239000000123 paper Substances 0.000 claims description 93
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 229920000877 Melamine resin Polymers 0.000 claims description 29
- 239000003822 epoxy resin Substances 0.000 claims description 29
- 229920000647 polyepoxide Polymers 0.000 claims description 29
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 25
- 239000004640 Melamine resin Substances 0.000 claims description 19
- 229920001131 Pulp (paper) Polymers 0.000 claims description 16
- 238000007731 hot pressing Methods 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 13
- 239000011094 fiberboard Substances 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 13
- 239000002023 wood Substances 0.000 claims description 13
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 9
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 9
- 241001330002 Bambuseae Species 0.000 claims description 9
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 9
- 239000011425 bamboo Substances 0.000 claims description 9
- 239000008187 granular material Substances 0.000 claims description 9
- 239000007858 starting material Substances 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims 1
- LCDFWRDNEPDQBV-UHFFFAOYSA-N formaldehyde;phenol;urea Chemical compound O=C.NC(N)=O.OC1=CC=CC=C1 LCDFWRDNEPDQBV-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 11
- 238000005452 bending Methods 0.000 description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 238000012797 qualification Methods 0.000 description 21
- 238000005213 imbibition Methods 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 9
- -1 phenolic aldehyde Chemical class 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 229920001807 Urea-formaldehyde Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229920002522 Wood fibre Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- RCHKEJKUUXXBSM-UHFFFAOYSA-N n-benzyl-2-(3-formylindol-1-yl)acetamide Chemical compound C12=CC=CC=C2C(C=O)=CN1CC(=O)NCC1=CC=CC=C1 RCHKEJKUUXXBSM-UHFFFAOYSA-N 0.000 description 3
- 239000002025 wood fiber Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000004061 bleaching Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000002803 maceration Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/02—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B21/06—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses the manufacturing methods of a kind of composite phenolic resin plate and composite phenolic resin plate.The composite phenolic resin plate includes: phenolic resin plate, is formed by a phenolic resin impregnated paper or is laminated by multiple phenolic resin impregnated papers and is formed, and the phenolic resin impregnated paper includes paper and the novolac resin layer positioned at the paper two sides；Beaver board, with the phenolic resin board stacking.Composite phenolic resin plate of the invention is carried out using beaver board with phenolic resin impregnated paper compound, using beaver board instead of part phenolic resin impregnated paper, therefore raw materials for production cost is not only greatly reduced, and reducing production exhaust gas discharge, the production efficiency of entire composite phenolic resin plate also greatly improves.
Description
Technical field
The present invention relates to resin plate fields, in particular to a kind of composite phenolic resin plate and composite phenolic resin plate
Manufacturing method.
Background technique
Phenolic resin is after hot briquetting, and just solidification can not fashion into other products again.Phenolic resin, which has, to insulate, no
Generate the characteristics such as electrostatic, wear-resisting and high temperature resistant.
Phenolic resin plate usually uses bleaching wooden oar paper as reinforcement, and using phenolic resin as resin binder system
Resin plate made of making.It is soaked by bleaching wooden oar paper and phenolic resin impregnated paper is formed with the hot pressing of phenolic resin rouge, then by multiple phenol
Phenolic resin plate is made in urea formaldehyde impregnated paper poststack hot pressing.Phenolic resin plate has insulating properties, intensity high, can be used for switching
Cabinet, equipment processing table top, machining support plate, test fixture plate.
Summary of the invention
An embodiment of the invention provides a kind of NEW TYPE OF COMPOSITE phenolic resin plate, comprising: phenolic resin plate, by one
Phenolic resin impregnated paper forms or is laminated and is formed by multiple phenolic resin impregnated papers, the phenolic resin impregnated paper include paper with
And the novolac resin layer positioned at the paper two sides；Beaver board, with the phenolic resin board stacking.
In one embodiment, the beaver board be high density fiberboard, medium density fibre board (MDF), solid wood granule plate,
At least one of reclaiming paper-pulp board and bamboo fiberboard.
In one embodiment, the composite phenolic resin plate is including two phenolic resin plates and in two phenolic aldehyde trees
A beaver board between rouge plate.
In one embodiment, the composite phenolic resin plate includes multiple phenolic resin plates and multiple beaver boards,
The phenolic resin plate and the beaver board are alternately laminated.
In one embodiment, two outermosts of composite phenolic resin plate are phenolic resin plate in the stacking direction.
In one embodiment, the composite phenolic resin plate includes three phenolic resin plates and two beaver boards.
In one embodiment, resin raw material used by the novolac resin layer include phenolic resin, melamine and
Epoxy resin, the mass ratio between phenolic resin, melamine and epoxy resin three are 100:(5~15): (0.1~5).
Another embodiment of the invention provides a kind of manufacturing method of composite phenolic resin plate, comprising:
Phenolic resin starting material is impregnated on paper, through dry obtained phenolic resin impregnated paper；
The phenolic resin impregnated paper and beaver board are formed into the composite phenolic resin plate by hot pressing.
In one embodiment, the phenolic resin starting material includes phenolic resin, melamine and epoxy resin, phenolic aldehyde tree
Mass ratio between rouge, melamine and epoxy resin three is 100:(5~15): (0.1~5).
In one embodiment, the mass ratio between phenolic resin, melamine and epoxy resin three be 100:(8~
12): (1~3).
Composite phenolic resin plate of the invention is compound using beaver board and the progress of phenolic resin impregnated paper, due to using
Beaver board is instead of part phenolic resin impregnated paper, so the usage amount of phenolic resin impregnated paper is greatly reduced, thus
Reduce production exhaust gas discharge.The production efficiency of entire composite phenolic resin plate also greatly improves.
In addition, in some embodiments, utilizing beaver board and the compound obtained composite phenol formaldehyde of phenolic resin impregnated paper
Resin plate is essentially identical to existing phenolic resin plate in angularity, water imbibition, heat resistance, machinability, and the thickness uniformity is excellent
In existing phenolic resin plate.In some embodiments, it is better than existing phenolic resin plate in hardness, bending strength.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, letter will be made to attached drawing needed in the embodiment below
It singly introduces, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as to the present invention
The restriction of protection scope.
Fig. 1 shows the schematic diagram of one embodiment of composite phenolic resin plate of the present invention.
Fig. 2 shows the schematic diagrames of another embodiment of composite phenolic resin plate of the present invention.
Fig. 3 shows the schematic diagram of another embodiment of composite phenolic resin plate of the present invention.
Main element symbol description:
100- composite phenolic resin plate；110- phenolic resin plate；111- phenolic resin impregnated paper；120- beaver board；
200- composite phenolic resin plate；210- phenolic resin plate；220- beaver board；300- composite phenolic resin plate；310- phenolic aldehyde
Resin plate；320- beaver board.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
The component of embodiments of the present invention, which are generally described and illustrated herein in the accompanying drawings can be come with a variety of different configurations
Arrangement and design.Therefore, requirement is not intended to limit to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
The scope of the present invention of protection, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, this field skill
Art personnel every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
Fig. 1 shows the composite phenolic resin plate 100 of an embodiment of the invention, comprising: phenolic resin plate 110,
It is made of a phenolic resin impregnated paper 111 or is made of the stacking of multiple phenolic resin impregnated papers 111, the phenolic resin dipping
Paper 111 includes paper and the novolac resin layer positioned at the paper two sides；Beaver board 120, with the phenolic resin plate
110 stackings.
Paper can be by being impregnated in the maceration extract of phenolic resin, by obtaining after drying by the phenolic resin impregnated paper 111
?.By impregnation technology thin resin layer can be rapidly formed on the two sides of paper.For example, paper to be passed through to traction from winding up roller
Roller stretching soaks upper resin on the two sides of paper, is then drawn through drying device, form tree by drying to resin immersion liquid slot
Rouge prepreg, the phenolic resin impregnated paper of predetermined size required for being formed finally by cutting.The temperature of baking can be
110-170 DEG C, such as 120 DEG C, 130 DEG C, 140 DEG C, 150 DEG C, 160 DEG C.
Paper can be one of bleached wood pulp paper, brown paper, recycled writing paper, balance paper, titanium white paper, release paper or more
Kind.It is preferred that using bleached wood pulp paper, it is the wooden fibre for not adding other fibers that bleached wood pulp paper, which is the wood pulp made of natural wood,
Dimension, can obtain enough strength supports using bleached wood pulp paper, sexual valence is relatively high.In addition, when being used as drilling support plate, it is fine
Dimension substance can clear up the residue after bit bore, protect drill bit.In some applications, recycled writing paper can be used, can drop
Low production cost.
Paper grammes per square metre is 50-350g/m2, such as can for 50,60,70,80,90,100,110,120,150,180,
200、220、240、260、280、300、320、350g/m2, according to finished product thickness, select corresponding gram weight specification, composite phenol formaldehyde tree
The integral thickness of rouge plate is thicker, and the grammes per square metre of paper can be bigger, thus can reduce the usage amount of phenolic resin impregnated paper, reduces whole
The time of body processing and cost of material.The paper grammes per square metre of bleached wood pulp paper is preferably 80-150g/m2。
The raw material of novolac resin layer can be phenolic resin in phenolic resin impregnated paper 111, be also possible to phenolic resin with
It is the mixture of other resins, wherein phenolic resin is primary raw material, preferably the 80% of the total resin content of phenolic resin weight Zhan
More than.Other resins can be melamine resin, epoxy resin, Lauxite, polyurethane resin etc..
The raw material of novolac resin layer preferably includes phenolic resin, melamine and epoxy resin, phenolic resin, melamine
Mass ratio between epoxy resin three can be 100:(0~15): (0~5), may be, for example, 100:(1,2,3,4,5,6,7,
8,9,10,11,12,13,14 or 15): (0.1,0.5,1,2,3,4 or 5), preferably 100:(5~15): (0.1~5), more preferably
For 100:(8~12): (1~3), more preferable 100:10:2.
Phenolic resin has the advantages that heat resistance, flexibility are good, and wearability is relatively weak.Phenolic resin is colourless or yellowish-brown
Color transparency.Phenolic resin can be by phenols and aldehydes as the synthetic resin for synthesizing main body, be also possible to modified phenolic aldehyde
Resin.Phenolic resin has heat-resisting quantity, even if at very high temperatures, being also able to maintain the globality and size of its structure
Stability.Moreover, phenolic resin can be used as binder, after cross-linking, it is possible to provide required mechanical strength, heat resistance and electricity
Performance.
Melamine resin adehsive has biggish chemical activity, and higher glue-joint strength, water-resistant capacity are high, can undergo three hours
Above boiling water, thermal stability high and low temperature ability to cure are compared with strong, wearability is good.Melamine resin is added in novolac resin layer
Afterwards, hardness and wearability can be increased, it is all good to resistivity, electrical insulation capability of chemicals etc..
Epoxy resin is the high-molecular compound in molecular structure containing epoxy group.Epoxy resin after solidification has good
Physics well, chemical property, dielectric properties are good, and shrinking percentage is small, and product size stability is good, and hardness is high, and flexibility is preferable.Phenol
After epoxy resin is added in urea formaldehyde layer, the performances such as the adhesive strength of beaver board can be increased.
By the way that melamine and epoxy resin is added, enhance the surface hardness of phenolic resin plate and beaver board and glues
Knotting strength, hot pressing time when shortening phenolic resin plate in conjunction with beaver board can effectively reduce chip, the layering of plate
Phenomenon.Flexibility, the heat resistance etc. for both having maintained composite board as a result, also improve wearability and adhesion strength of plate etc.,
And improve production efficiency.
The thickness of beaver board can be such as 1-15mm, such as can for 2mm, 2.5mm, 3mm, 5mm, 8mm,
10mm, 12mm or 14mm, preferably 2-5mm；It can be selected according to the thickness of composite phenolic resin plate, whole compound resin
Thickness is thicker, then the thickness of beaver board can be thicker.According to market supply situation and thickness deviation, flatness, preferably from about
The thickness of 2.5mm.When improving the thickness accounting of beaver board, production cost is greatly lowered, but in beaver board
Thickness when being more than 60%, the fall of bending strength is relatively large, can only be used to some low-end applications scenes at this time.Cause
This, the thickness of preferably beaver board account for entire composite phenolic resin plate thickness 10-60% (such as 20%, 30%, 40%,
50%, 55%), at this point, various performances are more balanced, the performances such as bending strength can also meet most application demand, and
Higher than no beaver board in terms of the thickness uniformity；More preferable thickness accounting is 18-55%；More preferable 20-40%, at this point,
The thickness uniformity is best.
The preferred high density fiberboard of beaver board, medium density fibre board (MDF), solid wood granule plate, reclaiming paper-pulp board and bamboo fibre
At least one of plate.
High density wood-fiber board is using wood fiber or other plant fiber as raw material, to apply ureaformaldehyde rouge or other synthesis tree
A kind of plate that rouge is pressed under conditions of heating and pressurizeing.Medium density fibre board (MDF) is with timber or plant fiber through mechanically decoupled
With chemical treatment means, adhesive and waterproofing agent etc. are mixed, then through made of high temperature, high-pressure molding.Solid wood granule plate is to utilize
Woody debris make material, and lignocellulosic particle is larger in plate, more remain the essence of natural timber.Solid wood granule plate is one
Novel, the environmentally friendly substrate of kind, just because of it is woody debris' splicing, so its surfacing is fine and smooth, and stability is good, material
Matter is uniform.In above-mentioned beaver board, most preferably high density fiberboard, with phenolic resin plate it is compound after, the thickness uniformity is high
In existing phenolic resin plate, and other performances are essentially identical.Bamboo fiberboard is also a kind of preferred fiberboard, after compound
Bending strength can also be higher than existing phenolic resin plate, but slightly worse in terms of water imbibition and angularity.In the present invention, why not
Carried out using solid wood board and phenolic resin plate it is compound, be because solid wood board is unsuitable compound with the progress hot pressing of phenolic resin plate,
And more forest reserves will be consumed so that cost is substantially increased relative to beaver board using solid wood board.
Another embodiment of the present invention provides a kind of manufacturing method of composite phenolic resin plate, comprising: by phenolic resin
Raw material is impregnated on paper, through dry obtained phenolic resin impregnated paper；The phenolic resin impregnated paper is led to beaver board
Hot pressing is crossed into the composite phenolic resin plate.Drying mode is, by baking oven, can will can to dry impregnated of the paper of resin
The different temperature of each section of setting of case.The temperature of baking can be 110-170 DEG C.
In the hot-pressing processing of the above-mentioned manufacturing method of composite phenolic resin plate, press temperature can be 120-180 DEG C, such as
130,140,150,160,170 DEG C, pressing pressure can be 30-100Mpa, such as 40,50,60,70,80,90Mpa, pressing time
It can be 0.5-3.5 hours, such as 1,1.5,2,2.5,3 hour.
Beaver board, can be in surface coated with resins before carrying out laminating hot pressing with phenolic resin impregnated paper prepreg
Or roughening treatment, for example, the resin or other adhesive type resins of the resin same type on paper can be coated and be impregnated in
To enhance the adhesion strength of phenolic resin impregnated paper prepreg and beaver board, roughening treatment can also enhance and phenolic resin
The adhesion strength of impregnated paper prepreg.
In addition, beaver board can be done before carrying out laminating hot pressing with phenolic resin impregnated paper prepreg
Dry dehumidification treatments reduce the moisture content in beaver board, so that beaver board and phenolic resin impregnated paper half are solid
Change piece to be more effectively bonded.
Phenolic resin starting material is impregnated on paper, and toasted processing, phenolic resin impregnated paper is made.Then, according to
It needs, surface, which is placed, above and/or under wood-fiber board is no less than a phenolic resin impregnated paper, through hot-pressing processing, is made new
Type composite phenolic resin plate.
Commercially available liquid phenolic resin can be used, can also be prepared in situ.In an embodiment of the invention, phenolic aldehyde
Resin can be prepared as follows: anacardol, phenol, formaldehyde being stirred with catalyst investment consersion unit by a certain percentage and added
Heat reaches isothermal reaction after set temperature.It is reacting after a certain period of time, sampling and measuring gelation time reaches in gel time
Vacuum dehydration after predetermined value.Ammonia spirit and triethylamine are as catalyst.It is preferred that by three kinds of phenol, formaldehyde and anacardol materials
Catalyst is added to be reacted again after having added.After anacardol is added in the feed, the toughness of phenolic resin is enhanced, thus also can
The toughness of whole enhancing composite phenolic resin plate.
The above-mentioned phenol-formaldehyde resin modified being prepared in situ is not only low in cost relative to commercial phenolic resin, but also improves phenol
The toughness of urea formaldehyde.
Embodiment 1
The schematic diagram of the composite phenolic resin plate of one embodiment of the invention is shown in Fig. 2.The composite phenolic resin plate
200 include two phenolic resin plates 210 and a beaver board 220 between two phenolic resin plates 210.
Phenolic resin impregnated paper in the present embodiment is formed by the bleached wood pulp paper impregnated of phenolic resin.For impregnating
The resin raw material of paper includes phenolic resin, melamine and epoxy resin, and the ratio between three is 100:10:2.Phenolic resin
It is prepared in situ using the raw material for including phenol, formaldehyde and anacardol by method as discussed above.
Phenolic resin plate 210 is laminated by multiple phenolic resin impregnated papers.Although phenolic resin plate 210 is by multiple phenolic aldehyde
Tetefol is laminated, but after through hot pressing, multiple phenolic resin impregnated papers have combined together, from side
Through not seeing layered structure.Phenolic resin plate 210 and beaver board 220 are because of color difference, and the two exists more after hot-pressing
Apparent boundary.In this embodiment, the paper for forming Tetefol is bleached wood pulp paper.Beaver board 220 is high density
Fiberboard.Every layer of phenolic resin plate 210 with a thickness of 4mm, beaver board 220 with a thickness of 2.5mm.Relevant performance test
Data are referring to the following table 1.
Although beaver board accounts for 20% or more the thickness of entire composite phenolic resin plate, performance is as shown in the table,
Hardness, bending strength and the thickness uniformity are even better than existing phenolic resin plate, other performances and existing phenolic resin plate
Quite, whole production cost will save 30% or more, and exhaust gas discharge will reduce 20% or more, and production duration will also shorten close
20%.
Embodiment 2
Difference from example 1 is that: beaver board 220 is medium density fibre board (MDF).
Using medium density fibre board (MDF) compared with high-density plate, surface hardness is suitable, but the thickness uniformity, bending strength,
Angularity, water absorbing properties are declined slightly, heat resistance and machinability qualification rate 100%.
Embodiment 3
Difference from example 1 is that: beaver board 220 is bamboo fiberboard.
Using bamboo fiberboard compared with high-density plate, surface hardness is suitable, and bending strength increases, but the thickness uniformity,
Angularity, water imbibition are declined slightly, heat resistance and machinability qualification rate 100%.
Embodiment 4
Difference from example 1 is that: beaver board 220 is solid wood granule plate.
Using solid wood granule plate compared with high-density plate, surface hardness is suitable, but bending strength, angularity, thickness are equal
Even property, water imbibition are lower than embodiment 1, and heat resistance qualification rate 100%, machinability qualification rate 86%, sample segment is layered
Phenomenon.
Embodiment 5
Difference from example 1 is that: beaver board 220 is reclaiming paper-pulp board.
Using reclaiming paper-pulp board compared with high-density plate, surface hardness is suitable, but bending strength, angularity, thickness are equal
Even property, water imbibition are lower than embodiment 1, and heat resistance qualification rate is 80%, machinability qualification rate 82%.But it can be used for some requirements
In not high end product, and production cost can be further decreased using reclaiming paper-pulp board.
Embodiment 6
Difference from example 1 is that: the resin raw material for impregnated paper includes phenolic resin, melamine and ring
Oxygen resin, the ratio between three are 100:5:1.
Surface hardness, bending strength, water imbibition are lower than embodiment 1, and the thickness uniformity, angularity and embodiment 1 are quite, resistance to
Hot and machinability qualification rate 100%.The raw materials used cost of novolac resin layer is slightly below embodiment 1.
But surface hardness is better than embodiment 10 (novolac resin layer of impregnated paper only uses phenolic resin)；Other performance indicators
Quite；The raw materials used cost of novolac resin layer is slightly above embodiment 10.
Embodiment 7
Difference from example 1 is that: the resin raw material for impregnated paper includes phenolic resin, melamine and ring
Oxygen resin, the ratio between three are 100:15:3.
Surface hardness is higher than embodiment 1, and angularity, water imbibition and embodiment 1 are suitable, heat resistance qualification rate 100%, still
The thickness uniformity, bending strength are lower than embodiment 1, machinability qualification rate 84%.The raw materials used cost of novolac resin layer is slightly higher
In embodiment 1 and 10.
Embodiment 8
Difference from example 1 is that: the resin raw material for impregnated paper includes phenolic resin, melamine and ring
Oxygen resin, the ratio between three are 100:8:1.
Surface hardness, bending strength, the thickness uniformity are lower than embodiment 1, but surface hardness is better than (the dipping of embodiment 10
The novolac resin layer of paper only uses phenolic resin).Angularity, water imbibition and embodiment 1 are suitable；Heat resistance and machinability qualification rate
100%.
Embodiment 9
Difference from example 1 is that: the resin raw material for impregnated paper includes phenolic resin, melamine and ring
Oxygen resin, the ratio between three are 100:12:3.
Surface hardness is higher than embodiment 1 and embodiment 10, and bending strength, the thickness uniformity, angularity performance are lower than implementation
Example 1, water imbibition and embodiment 1 are suitable.Heat resistance and machinability qualification rate 100%.The resin raw material cost of novolac resin layer
It is higher relative to embodiment 1.Comprehensively consider, the overall performance of embodiment 8 and 9 is better than embodiment 6 and 7.
Embodiment 10
Difference from example 1 is that: resin raw material for impregnated paper only phenolic resin, without adding melamine
Amine and epoxy resin.
Surface hardness, bending strength, the thickness uniformity are lower than embodiment 1, and angularity, water imbibition and embodiment 1 are suitable.It is resistance to
Hot qualification rate 100% and machinability qualification rate 96%.The resin raw material cost of novolac resin layer is more slightly higher than embodiment 1.
Embodiment 11
Difference from example 1 is that: the resin raw material for impregnated paper includes phenolic resin and melamine, and
Do not add epoxy resin, the mass ratio of phenolic resin and melamine is 100:10.
Surface hardness is better than embodiment 1, but bending strength is lower than embodiment 1.Angularity, the thickness uniformity, water imbibition
It is suitable with embodiment 1；Heat resistance qualification rate 100% and machinability qualification rate 80%.
Embodiment 12
Difference from example 1 is that: the resin raw material for impregnated paper includes phenolic resin and epoxy resin, and
Not comprising melamine, the mass ratio of phenolic resin and epoxy resin is 100:2.
Surface hardness is lower than embodiment 1, but bending strength, angularity are substantially the same manner as Example 1, the thickness uniformity,
Water imbibition is suitable lower than embodiment 1.Heat resistance qualification rate 100%, machinability qualification rate 98%；The resinogen of novolac resin layer
Material cost is significantly increased relative to embodiment 1.
Embodiment 13
Difference from example 1 is that: every layer of phenolic resin plate 210 with a thickness of 2.5mm, beaver board 220
With a thickness of 5mm.
Although beaver board accounts for the thickness 50% of entire composite phenolic resin plate, performance is as shown in the table, surface
Hardness is substantially same as Example 1, and the thickness uniformity, bending strength, angularity, water imbibition are lower than embodiment 1；Heat resistance is qualified
Rate 100%, machinability qualification rate 100%；Compared to existing phenolic resin plate, whole production cost will save 40% or more,
Exhaust gas discharge will reduce 50% or more, and production duration will also shorten nearly 30%.
Embodiment 14
The schematic diagram of the composite phenolic resin plate of one embodiment of the invention is shown in Fig. 3.The composite phenolic resin plate
300 include three phenolic resin plates 310 and two beaver boards 320, and phenolic resin plate 310 and beaver board 320 replace
Stacking, outermost two layers is phenolic resin plate 310.
Phenolic resin impregnated paper in the present embodiment is formed by the bleached wood pulp paper impregnated of phenolic resin.Phenolic resin
Plate 310 is laminated by multiple phenolic resin impregnated papers.The paper for forming Tetefol is bleached wood pulp paper.Beaver board
320 be high density fiberboard.Every layer of phenolic resin plate 310 with a thickness of 1.83mm, every layer of beaver board 320 with a thickness of
2.5mm。
The general thickness of the composite phenolic resin plate of embodiment 1 and 15 is identical.Compared with Example 1, the surface of product is hard
Quite, the thickness uniformity, bending strength, angularity, water imbibition are slightly below embodiment 1 to degree.Heat resistance and machinability qualification rate
100%.The usage amount of phenolic resin impregnated paper reduces 25% relative to embodiment 1.
Comparative example 1
Difference from example 1 is that: resin plate is that the phenol formed all is laminated by multilayer phenolic resin impregnated paper
Beaver board is not used in urea formaldehyde plate.
Compared with Example 1, surface hardness is essentially identical, and bending strength, angularity and water absorption rate are slightly above embodiment 1,
But the thickness uniformity is lower than embodiment 1, and whole production cost is significantly larger than embodiment 1.
Comparative example 2
Difference from example 1 is that: resin plate is that the phenol formed all is laminated by multilayer phenolic resin impregnated paper
Beaver board is not used in urea formaldehyde plate, and the resin raw material for impregnated paper is commercially available conventional phenolic resin raw material, should
Modified formula is not used in raw material.
Compared with Example 1, surface hardness, the thickness uniformity, bending strength, angularity and water absorption rate performance are lower than implementation
Example 1, heat resistance and machinability qualification rate 85%, and whole production cost is also significantly larger than embodiment 1.
Comparative example 3
Difference from example 1 is that: it is not the phenolic resin formed by hot pressing in the two sides of beaver board
Plate, but phenolic resin coat is formed in the two sides of beaver board by coating method.The thickness of phenolic resin coat
For 0.1-0.15mm.
By coating method two sides formed phenolic resin coat, if to form the thickness of 5mm, need it is coated again
Solidify repeated multiple times, will lead to that process time is very long, and it is difficult to ensure that product the thickness uniformity.This method is in composite phenol formaldehyde tree
The production application field of rouge plate is limited.
Surface hardness, bending strength, the thickness uniformity and processability are far below embodiment 1, and production efficiency is also remote
Lower than embodiment 1-14.
Comparative example 4
Difference from example 1 is that: the resin raw material of the impregnated paper in this comparative example is only epoxy resin, is not added
Add other resins.
Compared with Example 1, surface hardness, angularity and water absorption rate are substantially suitable, and bending strength, the thickness uniformity are lower than
Embodiment 1, and the cost of epoxy resin is significantly larger than the phenolic resin of embodiment 1.
Performance test:
To the resin plate of each embodiment and comparative example carry out surface hardness, the thickness uniformity, bending strength, angularity,
Water imbibition, heat resistance, processing performance are tested.Each embodiment and comparative example takes 50 samples to be tested, surface hardness,
The thickness uniformity, bending strength, angularity, water imbibition are averaged as test result values；Heat resistance, processing performance are to test
The total pass rate of sample is as test result values.
Surface hardness test: using Shore durometer, presses 9 palace lattice distribution in plank front and back sides, takes measure hardness at 9 points,
It is minimized.It is required that: >=85 degree (Shore D)；
The thickness uniformity test: using thickness measurement equipment, presses 9 palace lattice distribution in plate face, takes measure thickness at 9 points, count
Calculate deviation average.Thickness deviation requirement :≤0.5mm；
Bending strength: it presses bending strength national standard (GB/T 6569-86), is tested, be minimized using three-point bending resistance.It is required that:
>=120MPa, preferably >=125Mpa；
Angularity: plank being laid flat and is placed in marble horizontal platform, with the warpage maximal clearance value of feeler gauge measurement plank quadrangle.
Angularity (maximal clearance angularity %=value/plate face catercorner length) is calculated as follows, is averaged；It is required that :≤
0.3%；
Heat resistance: placing flat in oven heat, by 120 DEG C 120min toast, it is desirable that plate surface is without chip, layering drum
Bubble；
Water absorption rate: it is executed by GB/T 1034-2008, it is desirable that less than 1.6%
Processing performance: borehole test is carried out using above-described embodiment and the plate of comparative example and plays nail test of pulling pin, observation
Whether each plate occurs being layered or chip in drilled edge, i.e., occurs material breakage on plate, falls off.
The 1 test performance table of comparisons of table
From the data of upper table 1 it can be seen that
Although beaver board accounts for 20% or more the thickness of entire composite phenolic resin plate, will be saved in whole production cost
30% or more, exhaust gas discharge will reduce 20% or more, and production duration will also shorten nearly 20%.In beaver board, preferably bamboo is fine
Tie up plate and high-density plate, most preferably high-density plate.It is preferred that beaver board with a thickness of accounting for composite phenolic resin plate overall thickness
For 18-55%；More preferable 20-40%.
When adding a certain proportion of melamine and epoxy resin in the phenolic resin of impregnated paper, overall performance is much better than
The adding proportion of no added phenolic resin, melamine and epoxy resin will affect surface hardness and bending strength.Phenolic aldehyde tree
Mass ratio between rouge, melamine and epoxy resin three is 100:(8~12): (1~3), preferred ratio are as follows: 100:
10:2.
It can be seen from embodiment 1 and 14 when with essentially identical overall thickness, three-decker and five-layer structure it is compound
Every test performance of phenolic resin plate is suitable.But the composite phenolic resin plate production cost of five-layer structure is lower.
Coat phenolic resin comparative example 3 surface hardness, the thickness uniformity, bending strength it is unqualified, processability
Qualification rate be only 60%, and production efficiency be far below embodiment 1.Every test item performance indicator is much smaller than embodiment 1-
14。
In terms of the thickness uniformity, the thickness uniformity of most embodiments is good, meets requirement.But coating phenolic aldehyde
The thickness uniformity of the comparative example 2 of resin is unqualified.Compound by hot pressing using high-density plate, medium-density plate, bamboo fiberboard
When generating composite phenolic resin board, the thickness uniformity is higher than existing phenolic resin plate.
In terms of processability, there is chip, lamination in many samples of comparative example 2, solid wood granule plate and again
Also there is chip and lamination in a small amount of sample of raw pulp plate.In the sample of high-density plate, phenolic resin adds certain proportion
Melamine and epoxy resin when, processing performance is good, do not occur chip, layering the phenomenon that.And in phenolic resin, three
Mass ratio between poly cyanamid and epoxy resin three is 100:(8~12): when (1~3), all samples all do not have in processing
Appearance is layered or the case where chip.In the phenolic resin of identical adding proportion, embodiment 1,2 is (using high, medium density fiber
Plate), machinability is better than embodiment 3,4 (using bamboo fiberboard and solid wood granule plate).
In addition, although only giving the example that two outermosts are phenolic resin plates in the above-described embodiments,
Can be only one outermost is phenolic resin plate, and another outermost is beaver board, can be used for only needing side in this way
The higher application scenarios of surface hardness.In addition, when needed, secondary operation can be carried out to such product, for example, again with
Above-mentioned phenolic resin plate carries out hot pressing to form the product that two outsides are phenolic resin plate.
Therefore, composite phenolic resin plate of the invention not only greatly reduces resin raw material usage amount, to reduce production
Cost and the discharge of production exhaust gas improve production efficiency.In the above-described embodiments, surface hardness, in bending strength, substantially etc.
With even better than existing phenolic resin plate, the thickness uniformity is better than existing phenolic resin plate, angularity, water absorption rate, heat-resisting
Property, machinability and existing phenolic resin plate are substantially suitable, and meet the requirements index.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.
Claims (10)
1. a kind of composite phenolic resin plate characterized by comprising
Phenolic resin plate, is formed by a phenolic resin impregnated paper or is laminated by multiple phenolic resin impregnated papers and formed, the phenol
Urea formaldehyde impregnated paper includes paper and the novolac resin layer positioned at the paper two sides；
Beaver board, with the phenolic resin board stacking.
2. composite phenolic resin plate according to claim 1, which is characterized in that the beaver board is high-density fiber
At least one of plate, medium density fibre board (MDF), solid wood granule plate, reclaiming paper-pulp board and bamboo fiberboard.
3. composite phenolic resin plate according to claim 1, which is characterized in that the composite phenolic resin plate includes two
Phenolic resin plate and a beaver board between two phenolic resin plates.
4. composite phenolic resin plate according to claim 1, which is characterized in that the composite phenolic resin plate includes multiple
Phenolic resin plate and multiple beaver boards, the phenolic resin plate and the beaver board are alternately laminated.
5. composite phenolic resin plate according to claim 4, which is characterized in that composite phenolic resin plate in the stacking direction
Two outermosts be phenolic resin plate.
6. composite phenolic resin plate according to claim 5, which is characterized in that the composite phenolic resin plate includes three
Phenolic resin plate and two beaver boards.
7. composite phenolic resin plate according to claim 1, which is characterized in that resin used by the novolac resin layer
Raw material includes phenolic resin, melamine and epoxy resin, the quality between phenolic resin, melamine and epoxy resin three
Than for 100:(5~15): (0.1~5).
8. a kind of manufacturing method of composite phenolic resin plate characterized by comprising
Phenolic resin starting material is impregnated on paper, through dry obtained phenolic resin impregnated paper；
The phenolic resin impregnated paper and beaver board are formed into the composite phenolic resin plate by hot pressing.
9. the manufacturing method of composite phenolic resin plate according to claim 8, it is characterised in that: the phenolic resin starting material
Including phenolic resin, melamine and epoxy resin, the mass ratio between phenolic resin, melamine and epoxy resin three is
100:(5~15): (0.1~5).
10. the manufacturing method of composite phenolic resin plate according to claim 9, it is characterised in that: phenolic resin, melamine
Mass ratio between amine and epoxy resin three is 100:(8~12): (1~3).
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