CN109385218A - Composite board produces glue special - Google Patents
Composite board produces glue special Download PDFInfo
- Publication number
- CN109385218A CN109385218A CN201811262857.5A CN201811262857A CN109385218A CN 109385218 A CN109385218 A CN 109385218A CN 201811262857 A CN201811262857 A CN 201811262857A CN 109385218 A CN109385218 A CN 109385218A
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- CN
- China
- Prior art keywords
- parts
- extract
- composite board
- glue
- glue special
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
The invention discloses a kind of composite boards to produce glue special, it is related to field of adhesive technology, the raw material used is 15~30 parts of butyl methacrylate, 2~4 parts of epoxy alkyl linear polymeric polymer, 1.5~2.5 parts of husk extract, 1.5~2.5 parts of rice bran extract, 1.5~2.5 parts of Testa Tritici extract, 0.6~1.5 part of hemicellulose degrading enzymes, 3~6 parts of buffer, 100~200 parts of deionized water；Compared with prior art, husk extract, rice bran extract and Testa Tritici extract are added in the present invention as zymoexciter, can be promoted the soluble lignin in degradation glue, be chemically reacted the lignin of glue and board surface, enhance the bond degree of glue, and without any pollution.
Description
Technical field
The present invention relates to field of adhesive technology, especially a kind of composite board produces glue special.
Background technique
Glue, is a kind of substance with fine bond properties, and glue and adhesive technology have shown that incomparable life
And vigor, importance is growing day by day, and practicability makes us belonging to mesh, and application is increasingly extensive；And the used glue in construction industry
Again different from common glue, the time of adhesive force with higher and holding viscosity is enough long.Currently, the glue master in China
Will be using formaldehyde as main production raw material, i.e., urea-formaldehyde resin adhesive, phenolic resin glue and melamine-formaldehyde resin adhesive, yield account for whole
90% or more of a industrial adhesive of wood-based plate,.For formaldehyde, it is known that formaldehyde be it is colourless, there is overpowering odor
Irritative gas, it be it is a kind of destroy biological cell protein plasm poisonous substance, can be in conjunction with protein, can be to the skin of people
Skin, respiratory tract and internal organ damage, and anaesthetize the nervous centralis of people, can cause pulmonary edema, hepatic coma, kidney failure etc..It defends in the world
Raw tissue confirmation formaldehyde is teratogenesis, carcinogen, is allergen, Long Term Contact will lead to gene mutation.And interior decoration
In the woodworks such as furniture, the plate being all derived from household with 90% or more formaldehyde pollution in daily household, these woodworks
Most of to use composite board processing and fabricating, most of used glue is the glue containing formaldehyde, this is because formaldehyde has
There is stronger adhesiveness, also have the function of to reinforce the hardness and insect prevention, corrosion-resistant of plate, therefore in woodwork process,
Most of producers can all use the glue containing formaldehyde.But the glue containing formaldehyde can issue harmful substance, it is therefore necessary to grind
Produce a kind of glue that performance is good and environmentally friendly.
Summary of the invention
The present invention provides a kind of composite board production glue special, and it is fugitive that it can solve existing composite board glue special
The problem of sending out formaldehyde, being detrimental to health.
In order to solve the above-mentioned technical problem, the technical scheme adopted by the invention is that: using following parts by weight raw material:
15~30 parts of butyl methacrylate, 2~4 parts of epoxy alkyl linear polymeric polymer, husk extract 1.5~
2.5 parts, 1.5~2.5 parts of rice bran extract, 1.5~2.5 parts of Testa Tritici extract, 0.6~1.5 part of hemicellulose degrading enzymes, buffering
3~6 parts of agent, 100~200 parts of deionized water.
In above-mentioned technical proposal, more specific scheme may also is that the buffer is Pehanorm or borate.
Further: the husk extract, rice bran extract, Testa Tritici extract are soluble half containing ferulic acid
Cellulosic plant extracting solution.
It is further: to contain the L- sandlwood saccharic acid for activating hemicellulose degrading enzymes in the ferulic acid.
Further: the parts by weight of the raw material of use are as follows: 15 parts of butyl methacrylate, the linear high score of epoxy alkyl
4 parts of sub- polymer, 1.5 parts of husk extract, 2.5 parts of rice bran extract, 1.5 parts of Testa Tritici extract, hemicellulose degrading enzymes
0.6 part, 6 parts of buffer, 100 parts of deionized water.
Further: the parts by weight of the raw material of use are as follows: 30 parts of butyl methacrylate, the linear high score of epoxy alkyl
2 parts of sub- polymer, 2.5 parts of husk extract, 1.5 parts of rice bran extract, 2.5 parts of Testa Tritici extract, hemicellulose degrading enzymes
1.5 parts, 3 parts of buffer, 200 parts of deionized water.
By adopting the above-described technical solution, compared with prior art, the present invention has the following advantages:
Husk extract, rice bran extract and Testa Tritici extract are added in the present invention as zymoexciter, can promote glue of degrading
In soluble lignin, chemically react the lignin of glue and board surface, enhance the bond degree of glue, and without appointing
What is polluted.
Specific embodiment
Below with reference to specific example, the invention will be further described:
Embodiment 1
The glue of this example uses the raw material of following parts by weight:
15 parts of butyl methacrylate, 4 parts of epoxy alkyl linear polymeric polymer, 1.5 parts of husk extract, rice bran extract
2.5 parts of object, 1.5 parts of Testa Tritici extract, 0.6 part of hemicellulose degrading enzymes, 6 parts of Pehanorm, 100 parts of deionized water；
Its production method is as follows:
First butyl methacrylate, Pehanorm and deionized water are put into reaction kettle and mixed, dissolves, then puts into ring
PH value is adjusted to 6.5 by oxyalkyl linear polymeric polymer, is then heated to 55 DEG C, is kept the temperature 15 minutes, is then cooled down, obtain
Solution；It is stirred into after husk extract, rice bran extract and Testa Tritici extract are diluted with water in above-mentioned acquired solution, stirring is equal
After even, hemicellulose degrading enzymes are being added, are continuing to stir evenly, up to this glue after encapsulation.
Embodiment two
The glue of this example uses the raw material of following parts by weight:
30 parts of butyl methacrylate, 2 parts of epoxy alkyl linear polymeric polymer, 2.5 parts of husk extract, rice bran extract
1.5 parts of object, 2.5 parts of Testa Tritici extract, 1.5 parts of hemicellulose degrading enzymes, 3 parts of borate, 200 parts of deionized water；
Its production method is as follows:
First butyl methacrylate, borate and deionized water are put into reaction kettle and mixed, dissolves, then puts into epoxy alkyl
PH value is adjusted to 6.5 by linear polymeric polymer, is then heated to 55 DEG C, is kept the temperature 15 minutes, is then cooled down, obtain solution；It will
Husk extract, rice bran extract and Testa Tritici extract are stirred into above-mentioned acquired solution after being diluted with water, after mixing evenly,
Hemicellulose degrading enzymes are added, continue to stir evenly, up to this glue after encapsulation.
The performance parameter of this urea formaldehyde glue of this example is as follows: 110~200mPas of viscosity, 35~60s of curing rate,
Free formaldehyde≤0.2%.
The performance parameter of glue made from embodiment 1 and example 2 is as follows: 1200~1800mPas of viscosity, odorlessness, face
Color is colorless and transparent, 35~60s of curing rate.
Claims (6)
1. a kind of composite board produces glue special, it is characterised in that using the raw material of following parts by weight:
15~30 parts of butyl methacrylate, 2~4 parts of epoxy alkyl linear polymeric polymer, husk extract 1.5~
2.5 parts, 1.5~2.5 parts of rice bran extract, 1.5~2.5 parts of Testa Tritici extract, 0.6~1.5 part of hemicellulose degrading enzymes, buffering
3~6 parts of agent, 100~200 parts of deionized water.
2. composite board according to claim 1 produces glue special, it is characterised in that: the buffer is trihydroxy methyl
Methane or borate.
3. composite board according to claim 1 or 2 produces glue special, it is characterised in that: the husk extract, rice
Chaff extract, Testa Tritici extract are the soluble hemicellulosic vegetable extracting solution containing ferulic acid.
4. composite board according to claim 3 produces glue special, it is characterised in that: contain in the ferulic acid and be used for
Activate the L- sandlwood saccharic acid of hemicellulose degrading enzymes.
5. composite board according to claim 1 produces glue special, it is characterised in that the parts by weight of the raw material of use are such as
Under:
15 parts of butyl methacrylate, 4 parts of epoxy alkyl linear polymeric polymer, 1.5 parts of husk extract, rice bran extract
2.5 parts of object, 1.5 parts of Testa Tritici extract, 0.6 part of hemicellulose degrading enzymes, 6 parts of buffer, 100 parts of deionized water.
6. composite board according to claim 1 produces glue special, it is characterised in that the parts by weight of the raw material of use are such as
Under:
30 parts of butyl methacrylate, 2 parts of epoxy alkyl linear polymeric polymer, 2.5 parts of husk extract, rice bran extract
1.5 parts of object, 2.5 parts of Testa Tritici extract, 1.5 parts of hemicellulose degrading enzymes, 3 parts of buffer, 200 parts of deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811262857.5A CN109385218A (en) | 2018-10-27 | 2018-10-27 | Composite board produces glue special |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811262857.5A CN109385218A (en) | 2018-10-27 | 2018-10-27 | Composite board produces glue special |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109385218A true CN109385218A (en) | 2019-02-26 |
Family
ID=65427766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811262857.5A Withdrawn CN109385218A (en) | 2018-10-27 | 2018-10-27 | Composite board produces glue special |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109385218A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006249173A (en) * | 2005-03-09 | 2006-09-21 | Kaneka Corp | Thermoplastic elastomer composition and molded article using the same |
| CN102719217A (en) * | 2012-06-20 | 2012-10-10 | 马晓平 | Protein-based wood adhesive and preparation method thereof |
| CN104629654A (en) * | 2015-02-11 | 2015-05-20 | 武汉优邦新材料化工有限公司 | Plant active high-strength wood glue |
-
2018
- 2018-10-27 CN CN201811262857.5A patent/CN109385218A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006249173A (en) * | 2005-03-09 | 2006-09-21 | Kaneka Corp | Thermoplastic elastomer composition and molded article using the same |
| CN102719217A (en) * | 2012-06-20 | 2012-10-10 | 马晓平 | Protein-based wood adhesive and preparation method thereof |
| CN104629654A (en) * | 2015-02-11 | 2015-05-20 | 武汉优邦新材料化工有限公司 | Plant active high-strength wood glue |
Non-Patent Citations (1)
| Title |
|---|
| 关志宇: "《药物制剂辅料与包装材料》", 31 January 2017, 中国医药科技出版社 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20190226 |