CN109382982B - INS film die - Google Patents
INS film die Download PDFInfo
- Publication number
- CN109382982B CN109382982B CN201811511169.8A CN201811511169A CN109382982B CN 109382982 B CN109382982 B CN 109382982B CN 201811511169 A CN201811511169 A CN 201811511169A CN 109382982 B CN109382982 B CN 109382982B
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- Prior art keywords
- layer
- die
- plate
- upper die
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004033 plastic Substances 0.000 claims abstract description 7
- 229920003023 plastic Polymers 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 34
- 239000002131 composite material Substances 0.000 claims description 23
- 238000005260 corrosion Methods 0.000 claims description 11
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 6
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 5
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical group [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 239000005543 nano-size silicon particle Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical group O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000007666 vacuum forming Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 26
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polysiloxane Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14286—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure means for heating the insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3005—Body finishings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention provides an INS film die which comprises an upper die assembly and a lower die assembly, wherein the upper die assembly comprises an upper bottom plate, a hot runner plate, an upper die fixing plate and an upper die core, the lower die assembly comprises a lower bottom plate, an ejector plate, die legs, a lower die fixing plate and a lower die core, a die cavity is formed between the upper die core and the lower die core, a gate is arranged on the upper bottom plate, injection molding can be performed in the die cavity, the upper die fixing plate and the bottom plate are oppositely arranged on two sides of the hot runner plate, the upper die core extends from the upper die fixing plate to the lower die core, the lower bottom plate and the die legs are oppositely arranged on two sides of the ejector plate, and a vacuum forming INS film is arranged in the die cavity of the upper die core. Therefore, the INS film formed by plastic suction is placed in a die, and then injection molding is performed, so that the INS film is attached to the surface of an injection molding piece, the product yield is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the field of molds, in particular to an INS film injection mold.
Background
With the development of the automobile industry, the INS film paper adhesive film is also widely used, and particularly, the automobile shell decoration is provided. The current INS film paper film mainly relies on manual film pasting, so that the production speed is reduced, the film pasting quality is uneven, and the qualification rate and uniformity of products cannot be guaranteed. If the electrostatic adsorption mode is used for film sticking, a clean workshop must be ensured, otherwise, the materials are easy to adsorb dust to generate adverse effects, so that the film falls off, and the higher requirements are put on the workshop environment, and the manufacturing cost is increased.
Disclosure of Invention
The invention mainly aims to provide an INS film injection mold, which overcomes the defects of the prior art, and the INS film is attached to the surface of an injection molding piece in a mode of performing plastic suction molding on the INS film by the mold and then injection molding, so that the product yield is improved, the mold production cost is reduced, and the production efficiency is improved.
In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides an INS film mould includes mould subassembly and lower mould subassembly, it includes upper plate, hot runner board, goes up mould fixed plate and last mould benevolence to go up the mould subassembly, lower mould subassembly includes lower plate, ejector pin board, mould foot, lower mould fixed plate and lower mould benevolence, go up the mould benevolence with form the die cavity between the lower mould benevolence, the upper plate is equipped with into the runner, can to mould plastics in the die cavity, go up the mould fixed plate with the bottom plate set up relatively in the both sides of hot runner board, go up the mould benevolence follow go up the mould fixed plate to the lower mould benevolence extends, the lower plate with the mould foot set up relatively in the both sides of ejector pin board, lower mould benevolence with the mould foot set up relatively in the both sides of lower mould fixed plate.
According to an embodiment of the present invention, the upper mold fixing plate is provided with a first heating portion and a second heating portion, the first heating portion is annularly disposed on an outer periphery of the second heating portion, the second heating portion faces the middle portion of the upper mold core, and the power of the second heating portion is greater than that of the first heating portion, so that the temperature of the middle portion of the upper mold core cavity is higher than or equal to the outer periphery temperature.
According to an embodiment of the present invention, the second heating portion heats the middle portion of the upper cavity to 75-85 ℃, and the first heating portion heats the outer periphery of the upper cavity to 65-75 ℃.
According to an embodiment of the present invention, the upper die fixing plate is further provided with a heat conductive filler layer, and the heat conductive filler layer is disposed between the first heating portion and the second heating portion.
According to an embodiment of the invention, the surface of the die cavity of the upper die core is externally provided with a composite plate layer, a heat conducting layer and an anti-corrosion layer from inside to outside, the composite layer faces the upper die fixing plate, the heat conducting layer is arranged between the composite layer and the anti-corrosion layer, the middle part of the composite plate layer is an aluminum silicon carbide layer, and the periphery of the composite plate layer is a low carbon steel layer.
According to an embodiment of the present invention, the heat conducting layer is a graphene thin film heat conducting layer.
According to an embodiment of the present invention, the anticorrosive layer is coated on the outer surface of the heat conducting layer, and the anticorrosive layer is a silicone resin layer containing nano silicon carbide particles.
According to an embodiment of the present invention, the surface of the cavity of the upper mold core is further provided with an antistatic layer, the antistatic layer is plated on the outer surface of the composite board layer, and the heat conducting layer is coated on the outer surface of the antistatic layer.
According to an embodiment of the present invention, the antistatic layer is a tin oxide layer.
Drawings
Fig. 1 is a schematic plan view of an INS film mold according to the present invention.
Fig. 2 is an exploded schematic view of an INS film mold according to the present invention.
Fig. 3 is a schematic structural view of an upper die assembly according to the present invention.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art.
As shown in fig. 1 to 3, the INS film mold includes an upper mold assembly 10 and a lower mold assembly 20, the upper mold assembly 10 includes an upper bottom plate 11, a hot runner plate 12, an upper mold fixing plate 13 and an upper mold core 14, the lower mold assembly 20 includes a lower bottom plate 21, an ejector plate 22, mold legs 23, a lower mold fixing plate 24 and a lower mold core 25, a mold cavity is formed between the upper mold core 14 and the lower mold core 25, the upper bottom plate 11 is provided with a gate 111 to be injection molded into the mold cavity, the upper mold fixing plate 13 and the upper bottom plate 11 are oppositely disposed at both sides of the hot runner plate 12, the upper mold core 14 extends from the upper mold fixing plate 13 to the lower mold core 25, the lower bottom plate 21 and the mold legs 23 are oppositely disposed at both sides of the ejector plate 22, the lower mold core 25 and the mold legs 23 are oppositely disposed at both sides of the lower mold fixing plate 24, and the INS film 3 is placed in the mold cavity 14. Therefore, the INS film 3 formed by plastic suction is placed in a die, and then injection molding is performed, so that the INS film 3 is attached to the surface of the injection molding piece 2, the product yield is improved, and the production cost is reduced.
Wherein, the hot runner plate 12 is provided with a hot runner 121, and the hot runner 121 is connected with an external heating system, so that melted plastic particles can be heated and injected into the mold cavity.
The upper die fixing plate 13 is provided with a first heating portion 131 and a second heating portion 132, the first heating portion 131 is annularly arranged on the periphery of the second heating portion 132, the second heating portion 132 faces the middle of the upper die core 14, the power of the second heating portion 132 is greater than that of the first heating portion 131, so that the temperature of the middle position of the upper die core 14 die cavity is higher than or equal to the peripheral temperature, INS films cannot be attached in place due to insufficient temperature of the middle position in the injection molding process, fixing of the middle part is guaranteed, and the periphery is driven to be attached uniformly.
The second heating part 132 heats the middle part of the cavity of the upper mold core 14 to 75-85 ℃, and the first heating part 131 heats the outer periphery of the cavity of the upper mold core 14 to 65-75 ℃. Before injection molding, the INS film needs to be preheated, the temperature is kept at 60 ℃, and the preheating time is 2-3 hours, so that the residual internal stress can be removed conveniently.
The upper die fixing plate 13 is further provided with a heat-conducting filler layer 133, the heat-conducting filler layer 133 is disposed between the first heating portion 131 and the second heating portion 132, and the heat-conducting filler layer 133 is an epoxy resin layer containing nano alumina particles and titanium dioxide particles, so that a heat-conducting network is formed, the heat conductivity is improved, and the thermal expansion coefficient is reduced.
The surface of the die cavity of the upper die core 14 is provided with a composite plate layer 142, a heat conducting layer 143 and an anti-corrosion layer 144 from inside to outside, the composite layer 142 faces the upper die fixing plate 13, the heat conducting layer 143 is arranged between the composite layer 142 and the anti-corrosion layer 144, the middle part of the composite plate layer 142 is an aluminum silicon carbide layer, the periphery of the composite plate layer 142 is a low carbon steel layer, and the heat conductivity coefficient of the aluminum silicon carbide layer is greater than that of the low carbon steel layer, so that the temperature of the middle part of the die cavity is conveniently greater than that of the periphery.
The heat conduction layer 143 is a graphene film heat conduction layer 143, polysiloxane is used as a film forming substance, graphene powder is used as a filler, the heat conduction layer 143 is prepared by a sol-gel method, the heat resistance of the heat conduction layer 143 is 40% lower than that of aluminum, the weight of the heat conduction layer is 25% lower than that of aluminum, and the heat conduction layer 143 can be smoothly attached to any plane and curved surface.
The anticorrosive layer 144 is coated on the outer surface of the heat conducting layer 143, the anticorrosive layer 144 is an organic silicon resin layer containing nano silicon carbide particles, the adhesive force is strong, the impact resistance is good, the high temperature resistance and the corrosion resistance are strong, meanwhile, the nano silicon carbide particles are beneficial to increasing the deformation resistance and the abrasion resistance of the die, the abrasion cycle of the die is effectively reduced, and the surface smoothness maintains the temperature.
The surface of the cavity of the upper mold core 14 is further provided with an antistatic layer 145, the antistatic layer 145 is plated on the outer surface of the composite board layer 142, the heat conducting layer 143 is coated on the outer surface of the antistatic layer 145, and the antistatic layer 145 is a tin oxide layer, so that the antistatic property of the cavity of the upper mold core 14 is improved, electrostatic adsorption can not be generated on the surface of the cavity, the reliability of a product is improved, and interference caused by dust when the INS film 3 is attached is effectively prevented.
During preparation, the INS film 3 with the appearance pattern is subjected to plastic suction molding, redundant die cutting is performed, and the punched film is placed into an injection molding cavity for injection molding.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The INS film die is characterized by comprising an upper die assembly and a lower die assembly, wherein the upper die assembly comprises an upper bottom plate, a hot runner plate, an upper die fixing plate and an upper die core, the lower die assembly comprises a lower bottom plate, an ejector plate, die legs, a lower die fixing plate and a lower die core, a die cavity is formed between the upper die core and the lower die core, the upper bottom plate is provided with a gate for injecting plastic into the die cavity, the upper die fixing plate and the bottom plate are oppositely arranged on two sides of the hot runner plate, the upper die core extends from the upper die fixing plate to the lower die core, the lower bottom plate and the die legs are oppositely arranged on two sides of the ejector plate, the lower die core and the die legs are oppositely arranged on two sides of the lower die fixing plate, the upper die fixing plate is provided with a first heating part, a second heating part and a heat conducting filler layer, the first heating part is annularly arranged on the periphery of the second heating part, the second heating part faces the middle part of the upper die core, the power of the second heating part is higher than that of the first heating part, so that the temperature of the middle part of the upper die core die cavity is higher than or equal to the periphery temperature, the second heating part heats the middle part of the upper die core die cavity to 75-85 ℃, the first heating part heats the periphery temperature of the upper die core die cavity to 65-75 ℃, the heat conducting filler layer is arranged between the first heating part and the second heating part, the die cavity surface of the upper die core is externally provided with a composite plate layer, a heat conducting layer and an anti-corrosion layer from inside to outside, the composite layer faces the upper die fixing plate, the heat conducting layer is arranged between the composite layer and the anti-corrosion layer, the middle part of the composite plate layer is an aluminum silicon carbide layer, the periphery of the composite board layer is a low carbon steel layer.
2. The INS film mold of claim 1, wherein the cavity surface of the upper mold core is provided with a composite plate layer, a heat conducting layer and an anti-corrosion layer from inside to outside, the composite layer faces the upper mold fixing plate, the heat conducting layer is arranged between the composite layer and the anti-corrosion layer, the middle part of the composite plate layer is an aluminum silicon carbide layer, and the periphery of the composite plate layer is a low carbon steel layer.
3. The INS film mold of claim 2, wherein the thermally conductive layer is a graphene film thermally conductive layer.
4. The INS film mold of claim 3, wherein the corrosion protection layer is coated on an outer surface of the heat conductive layer, and the corrosion protection layer is a silicone resin layer containing nano silicon carbide particles.
5. The INS film mold of claim 4, wherein the cavity surface of the upper mold core is further provided with an antistatic layer, the antistatic layer is plated on the outer surface of the composite board layer, and the heat conductive layer is coated on the outer surface of the antistatic layer.
6. The INS film mold of claim 5, wherein the antistatic layer is a tin oxide layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811511169.8A CN109382982B (en) | 2018-12-11 | 2018-12-11 | INS film die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811511169.8A CN109382982B (en) | 2018-12-11 | 2018-12-11 | INS film die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109382982A CN109382982A (en) | 2019-02-26 |
| CN109382982B true CN109382982B (en) | 2024-08-20 |
Family
ID=65429165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811511169.8A Active CN109382982B (en) | 2018-12-11 | 2018-12-11 | INS film die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109382982B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209454063U (en) * | 2018-12-11 | 2019-10-01 | 宁波众拓模具科技有限公司 | A kind of INS film die |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002283353A (en) * | 2001-03-26 | 2002-10-03 | Mitsubishi Materials Corp | Mold assembly |
| KR200371945Y1 (en) * | 2004-10-13 | 2005-01-06 | 주식회사 유씨티 | Structure for reducing pressure of injecting mold for forming parts of cell phone |
| CN202922890U (en) * | 2012-11-28 | 2013-05-08 | 青岛佳友模具科技有限公司 | Injection molding mold with simple structure |
| CN107186963B (en) * | 2017-06-14 | 2023-02-10 | 思柏精密科技股份有限公司 | Precision mould of copying machine deep cavity injection molding and forming method thereof |
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2018
- 2018-12-11 CN CN201811511169.8A patent/CN109382982B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209454063U (en) * | 2018-12-11 | 2019-10-01 | 宁波众拓模具科技有限公司 | A kind of INS film die |
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| Publication number | Publication date |
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| CN109382982A (en) | 2019-02-26 |
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