CN109370497A - A kind of preparation method of glue and products thereof producing high speed copper-clad plate - Google Patents
A kind of preparation method of glue and products thereof producing high speed copper-clad plate Download PDFInfo
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- CN109370497A CN109370497A CN201811259120.8A CN201811259120A CN109370497A CN 109370497 A CN109370497 A CN 109370497A CN 201811259120 A CN201811259120 A CN 201811259120A CN 109370497 A CN109370497 A CN 109370497A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M13/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment
- D06M13/50—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment with organometallic compounds; with organic compounds containing boron, silicon, selenium or tellurium atoms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
Abstract
The present invention relates to a kind of preparation methods of glue for producing high speed copper-clad plate to be prepared modified bismaleimide resin by the way that barbiturates and brominated bisphenol a type epoxy resin, bimaleimide resin are carried out blending and modifying；Using butyrolactone as its solvent, modified bismaleimide resin is made to form stable, uniform mixture；The glue special that other materials is configured to production high speed copper-clad plate is further added；There is low-k and dielectric loss factor using the high speed copper-clad plate that the glue reproduction that the present invention is prepared prepares, while being able to satisfy other performance requirements of copper-clad plate again, can be adapted for the production of high speed printed wiring board.
Description
Technical field
The present invention relates to copper-clad plates to produce preparation field, and in particular to a kind of preparation side for the glue for producing high speed copper-clad plate
Method and products thereof.
Background technique
With the revolution of smart electronics product advanced by leaps and bounds with information technology, global information technology is to digitlization, network
Change and rapidly develops, the transmission of vast capacity information, ultrafast speed and ultrahigh density processing, it has also become information and communication equipment
(ICT) technology develops pursued target.Gradually stepped into information processing high speed, signal transmit the high frequency stage to digital circuit,
To handle ever-increasing data, the frequency of electronic equipment becomes higher and higher, and at this moment the performance of substrate will seriously affect number
The characteristic of circuit.Printed circuit board (PCB) wiring densification, electric signal transmission speed high speed development it
Under, therefore more stringent requirements are proposed to the performance of printed wiring board (PCB) substrate.The fundamental characteristics of high speed baseplate material is necessary
Reach following two requirement, first is that dielectric constant (Dk) must be small and very stable, usually the smaller the better, the transmission speed of signal
The square root of rate and material dielectric constant is inversely proportional, and high dielectric constant be easy to cause signal transmission delay.Second is that dielectric loss
(Df) must be small, this mainly influences the quality of signal transmission, and dielectric loss is smaller to keep loss of signal also smaller.
High-frequency high-speed baseplate material mainly solves the common copper-clad plate fields such as microwave and millimeter wave transporting in the communications
The high frequency characteristics defect that energy is unstable and loss is big, has become the mainstream technology of industry development, then to low Jie of resin at present
The performances such as electricity propose higher, more urgent demand.For the demand for realizing these two types of high speed copper-clad plate market developments, to high speed
The exploitation of copper-clad plate used in PCB is required using novel, high performance resin material as support, novel resin material
The exploitation of application technology, emphasis, core technology as this kind of copper-clad plate exploitation project, and develop having for intellectual property strategy
Power weapon.
Summary of the invention
In view of this, one of the objects of the present invention is to provide a kind of preparation method of glue for producing high speed copper-clad plate and
Its obtained product.
In order to achieve the above objectives, the invention provides the following technical scheme:
1, a kind of preparation method for the glue for producing high speed copper-clad plate, the preparation method comprises the following steps:
1) bimaleimide resin is modified: by barbiturates, brominated bisphenol a type epoxy resin, bismaleimide tree
Rouge and butyrolactone are put into reactor, are reacted after mixing；Dimethylformamide, curing agent ethylene diamine are added, is mixed into
Resin A solution；
2) polyphenylene oxide resin is dissolved in toluene, dicyclopentadiene phenol epoxy resin and benzoyl peroxide first is then added
Acyl under conditions of 85-95 DEG C, reacts 2-3 hours, after reaction at resin B solution after mixing；
3) Resin A solution and resin B solution are mixed, catalyst preparation is added into the glue of production high speed copper-clad plate
Water.
Further, reaction condition is to react 2-4 hour at 130-150 DEG C in step 1), and reaction is cooled to after stopping
60-70℃。
Further, according to the mass fraction, according to the mass fraction, barbiturates 0.05-0.07 parts, bmminated bisphenol-A type epoxy
4-12 parts of resin, 1 part of bimaleimide resin, 0.9-2.4 parts of curing agent ethylene diamine, 4-11 parts of polyphenylene oxide resin, bicyclic penta
0-0.6 parts of diene phenol epoxy resin, 0.2-0.6 parts of benzoyl peroxide, 0.06-0.08 parts of catalyst.
Further, butyrolactone, dimethylformamide and toluene are solvent, and additional amount is the 5-7 of corresponding resin quality
Times.
Further, the catalyst is methylimidazole.
Further, bromo element content is 18-25% in the brominated bisphenol a type epoxy resin.
A kind of glue obtained by any one preparation method is provided.
The second object of the present invention is to provide a kind of high speed copper-clad plate with low-k and dielectric loss factor,
It is prepared by the glue, the preparation method comprises the following steps:
A. it using glass fabric as reinforcing material, is pre-processed；
B. the glue is coated on pretreated glass fabric again, high speed is prepared into after drying, exhaust and is covered
Copper sheet adhesive sheet；
C. by adhesive sheet it is stacked after be covered with copper foil, suppress 5 hours, be prepared under conditions of 180-220 DEG C, 3-4Mpa
To high speed copper-clad plate.
Further, the pretreated method is: glass fabric burns 20-50min at 30-50 DEG C, naturally cools to
Room temperature；It is soaked in 10-15min in treatment fluid again, natural air drying 30-45min is taken out, then in 90-120 DEG C of drying 1.5-
2.5h；The treatment fluid is 1.5%w/v silane coupling agent aqueous solution, glacial acetic acid tune pH value to 3-4.
The beneficial effects of the present invention are: the present invention provides a kind of preparation method of glue for producing high speed copper-clad plate, leads to
It crosses and barbiturates and brominated bisphenol a type epoxy resin, bimaleimide resin is subjected to blending and modifying, be prepared modified double
Maleimide resin；Brominated bisphenol a type epoxy resin both exists in the form of fire retardant, is also total to bimaleimide resin
Same modified resin；Using butyrolactone as its solvent, modified bismaleimide resin is made to form stable, uniform mixture；Again
The glue special that other materials is configured to production high speed copper-clad plate is further added；Dicyclopentadiene phenol epoxy resin and polyphenyl
Ether is admixed together, can reduce its molecular weight, obtain relatively high crosslink density.Finally above-mentioned mixed liquor and span are come
The available semi-interpenetrating polymer network structure of imide reaction.It is prepared using the glue reproduction that the present invention is prepared
High speed copper-clad plate there is low-k and dielectric loss factor, while other performances for being able to satisfy high speed copper-clad plate again are wanted
It asks, can be adapted for the production of high speed printed wiring board.
Specific embodiment
A preferred embodiment of the present invention will be described in detail below.The experiment side of actual conditions is not specified in embodiment
Method, usually according to conventional conditions or according to the manufacturer's recommendations.
Embodiment 1
The glue special of high speed copper-clad plate:
1. bimaleimide resin is modified: by barbiturates 0.65g, brominated bisphenol a type epoxy resin 123.5g, span
Bismaleimide resin 11.2g, butyrolactone 77g are put into reactor, stable, uniform mixture are formed, later in 135 DEG C of item
It under part, reacts 2-3 hour, reaction is cooled to 65 DEG C after stopping；Wherein butyrolactone is only used as solvent and bismaleimide
Resin, barbiturates are added together, the only bimaleimide resin, barbiturates of reaction.It reacts at 130-150 DEG C,
2-4 hour of reaction is ok, and reaction is cooled to 60-70 DEG C after stopping.Bromo element accounts in brominated bisphenol a type epoxy resin
18-25%.
2. the dimethylformamide 75g, the curing agent ethylene diamine 24.93g that are then added, mix to form uniform tree
Rouge solution A；
3. polyphenylene oxide resin 122g is dissolved in toluene (heating), benzoyl peroxide 6.05g is then added, is formed and is stablized
Mixture after, under conditions of 85-95 DEG C, react 2-3 hours, form stable resin B solution after reaction；
4. Resin A solution and resin B solution are homogenously mixed together, and catalyst methylimidazole (2-MI) is added
0.67g is configured to the glue special of production high speed copper-clad plate.
Toluene, butyrolactone and dimethylformamide (DMF) are all solvents in above step, do not participate in reaction, dissolving resin
It is used with filler, additional amount is 5-7 times of corresponding resin quality, the same below.
Embodiment 2
The preparation of high speed copper-clad plate:
1. reinforcing material pre-processes: choosing glass fiber with low dielectric constant cloth and burnt as reinforcing material, and at 40 DEG C
30min, then cooled to room temperature；Heat-treated glass fiber with low dielectric constant cloth is immersed in 10- in treatment fluid again
Then 15min, natural air drying 30-45min are placed it in 100 DEG C of electric heating bellows and are dried 2H；Glass cloth treatment fluid is
Silane coupling agent is made into 1.5% aqueous solution, pH value is then adjusted to 3-4 with glacial acetic acid, stirring at normal temperature reacts 45min.Implement
The dielectric constant of glass fabric used in example is between 4.2-4.5.
2. the preparation of adhesive sheet (semi-solid preparation state): the impregnated machine pipe of high speed copper-clad plate glue special prepared by embodiment 1
Road be coated to it is processed after glass fiber with low dielectric constant cloth, be prepared into high speed after the units operation such as drying, being vented and cover
Copper sheet special bonding piece (semi-solid preparation state)；
3. hot-forming: by adhesive sheet it is stacked after be covered with copper foil, suppressed 5 hours under conditions of 200 DEG C, 3.2Mpa.
Dielectric constant DK be the capacitor and identically constructed vacuum condenser when being filled with certain substance between electrode capacitor it
Than usually indicating the size of certain material storage electric energy ability.Current direction by printed board power on signal is usually positive and negative
Alternately change, is equivalent to the process for constantly being charged, being discharged to substrate.In exchange, capacitance will affect signal transmission
Speed.And this influence, seem in the device of High Speed Transfer and becomes apparent.When DK is big, indicate that storage electric energy ability is big, electricity
Electric signal transmission speed will be slack-off in road.When DK is small, indicate that storage electric energy ability is small, charge and discharge process is with regard to fast, to make
Transmission speed is accelerated.So in high-frequency transmission, it is desirable that dielectric constant DK is low, the dielectric constant DK=of low dielectric glass-fiber-fabric
4.4, it is lower than common E type glass-fiber-fabric DK=6.6, therefore normal using the dielectric that low dielectric glass-fiber-fabric can further decrease material
Number.
Dielectric loss factor Df is also dielectric loss angle tangent, and insulating materials or dielectric are in alternating electric field, due to being situated between
The hysteresis effect of matter conductance and dielectric polorization makes to generate certain phase between the current vector flowed through in dielectric and voltage vector
Potential difference, that is, form certain phase angle, tangent value, that is, dielectric loss factor Df of this phase angle, by the stagnant of dielectric conductance and dielectric polorization
Energy loss caused by aftereffect is called dielectric loss.Df is higher, and dielectric conductance and dielectric polorization hysteresis effect are more obvious, electric energy
Loss or the loss of signal are more, are the ability of dielectric loss electric energy and the characterization physics of insulating materials loss signal capabilities
Amount.
Embodiment 3
1, bimaleimide resin is modified: by barbiturates 1.68g, brominated bisphenol a type epoxy resin 116.3g, span
Bismaleimide resin 25g, butyrolactone 160g are put into reactor, stable, uniform mixture are formed, later in 135 DEG C of item
It under part, reacts 2-3 hour, reaction is cooled to 65 DEG C after stopping；
2, dimethylformamide, the curing agent ethylene diamine 23.12g being then added by the 1:5-7 of resin quality, is blended in one
It rises and forms uniform Resin A solution；
3, polyphenylene oxide resin 115.5g is dissolved in toluene (heating), dicyclopentadiene phenol epoxy resin is then added
6.05g, benzoyl peroxide 5.75g after forming stable mixture, under conditions of 85-95 DEG C, react 2-3 hours, reaction
After form stable resin B solution；
4, Resin A solution and resin B solution are homogenously mixed together, and catalyst methylimidazole 0.67g is added and matches
The glue special of production high speed copper-clad plate is made.
5, the preparation of high speed copper-clad plate: preparation method is the same as embodiment 2.
Embodiment 4
The glue special of high speed copper-clad plate:
1. bimaleimide resin is modified: by barbiturates 0.65g, brominated bisphenol a type epoxy resin 123.5g, span
Bismaleimide resin 11.2g, butyrolactone are put into reactor, stable, uniform mixture are formed, later in 135 DEG C of condition
Under, it reacts 2-3 hour, reaction is cooled to 65 DEG C after stopping；
2. dimethylformamide appropriate, curing agent ethylene diamine 24.93g are then added according to a certain percentage, it is blended in one
It rises and forms uniform Resin A solution；
3. polyphenylene oxide resin 122g is dissolved in toluene (heating), dicyclopentadiene phenol epoxy resin is then added
6.05g, benzoyl peroxide 6.05g after forming stable mixture, under conditions of 85-95 DEG C, react 2-3 hours, reaction
After form stable resin B solution；
4. Resin A solution and resin B solution are homogenously mixed together, and catalyst methylimidazole 0.77g is added and matches
The glue special of production high speed copper-clad plate is made.
5. the preparation of high speed copper-clad plate: preparation method is the same as embodiment 2.
Embodiment 5
High speed copper-clad plate prepared by embodiment 2, embodiment 3 and embodiment 4 is subjected to physical property measurement, every physical property respectively
Test result is as shown in table 1；
The physical property measurement result of each high speed copper-clad plate of table 1
| Physical property | Embodiment 2 | Embodiment 3 | Embodiment 4 |
| Glass transition temperature | 182 | 190 | 186 |
| Soldering resistance | Well | Well | Well |
| Z axis thermal expansion coefficient, ppm/ DEG C | 3.4 | 3.5 | 3.3 |
| Dielectric constant (1MHZ) | 3.75 | 3.51 | 3.20 |
| Dielectric dissipation factor (1MHZ) | 0.0045 | 0.0046 | 0.0040 |
3%, 7% modified bismaleimide of amount of solid has been separately added into embodiment 2,3 (according to consolidating for resin
Ingredient calculates), glass transition temperature is respectively 182 DEG C, 190 DEG C, it is possible thereby to be clearly seen that modified using barbiturates
Modified bismaleimide can improve the Tg value of substrate: and the dimensional stability of sample, electrical property and heat resistance are also opposite
Raising.Dicyclopentadiene phenol epoxy resin is used in example 4, making to show that the electrical property of sample has significantly improves,
Its dielectric constant is 3.20, and it is the minimum that this item is tested that loss factor, which is 0.0040, meets properties of product requirement.
Comparative example
According to the preparation method and step of embodiment 3, wherein the additive amount of substance is as shown in table 2, prepares comparative example respectively
The copper-clad plate of 1-3, and physical property measurement is carried out under the equal conditions of same embodiment, the results are shown in Table 3 for every physical property measurement；
Each comparative example component additive amount of table 2
Each comparative example physical property measurement result of table 3
Finally, it is stated that preferred embodiment above is only used to illustrate the technical scheme of the present invention and not to limit it, although logical
It crosses above preferred embodiment the present invention is described in detail, however, those skilled in the art should understand that, can be
Various changes are made to it in form and in details, without departing from claims of the present invention limited range.
Claims (9)
1. a kind of preparation method for the glue for producing high speed copper-clad plate, which is characterized in that the preparation method comprises the following steps:
1) bimaleimide resin is modified: by barbiturates, brominated bisphenol a type epoxy resin, bimaleimide resin and
Butyrolactone is put into reactor, is reacted after mixing；Dimethylformamide, curing agent ethylene diamine are added, Resin A is mixed into
Solution；
2) polyphenylene oxide resin is dissolved in toluene, dicyclopentadiene phenol epoxy resin and benzoyl peroxide is then added, mixed
After closing uniformly, under conditions of 85-95 DEG C, react 2-3 hours, after reaction at resin B solution；
3) Resin A solution and resin B solution are mixed, catalyst preparation is added into the glue of production high speed copper-clad plate.
2. preparation method according to claim 1, which is characterized in that reaction condition is at 130-150 DEG C, instead in step 1)
It answers 2-4 hour, reaction is cooled to 60-70 DEG C after stopping.
3. preparation method according to claim 1, which is characterized in that according to the mass fraction, barbiturates 0.05-0.07
Part, 4-12 parts of brominated bisphenol a type epoxy resin, 1 part of bimaleimide resin, 0.9-2.4 parts of curing agent ethylene diamine, polyphenylene oxide
4-11 parts of resin, 0-0.6 parts of dicyclopentadiene phenol epoxy resin, 0.2-0.6 parts of benzoyl peroxide, catalyst 0.06-
0.08 part.
4. preparation method according to claim 1, which is characterized in that butyrolactone, dimethylformamide and toluene are molten
Agent, additional amount are 5-7 times of corresponding resin quality.
5. preparation method according to claim 1, which is characterized in that the catalyst is methylimidazole.
6. preparation method according to claim 1, which is characterized in that bromo element in the brominated bisphenol a type epoxy resin
Content is 18-25%.
7. the glue that any one of -6 preparation methods obtain according to claim 1.
8. glue according to claim 7 prepares high speed copper-clad plate, which is characterized in that the preparation method comprises the following steps:
A. it using glass fabric as reinforcing material, is pre-processed；
B. the glue is coated on pretreated glass fabric again, high speed copper-clad plate is prepared into after drying, exhaust
Adhesive sheet；
C. by adhesive sheet it is stacked after be covered with copper foil, suppressed 5 hours under conditions of 180-220 DEG C, 3-4Mpa, height be prepared
Fast copper-clad plate.
9. glue according to claim 8 prepares high speed copper-clad plate, which is characterized in that the pretreated method is: glass
Glass fiber cloth burns 20-50min, cooled to room temperature at 30-50 DEG C；It is soaked in 10-15min in treatment fluid again, takes out certainly
So air-dried 30-45min, then in 90-120 DEG C of drying 1.5-2.5h；The treatment fluid is that 1.5%w/v silane coupling agent is water-soluble
Liquid, glacial acetic acid tune pH value to 3-4.
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| CN201811259120.8A CN109370497B (en) | 2018-10-26 | 2018-10-26 | Preparation method of glue for producing high-speed copper-clad plate and product thereof |
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| CN201811259120.8A CN109370497B (en) | 2018-10-26 | 2018-10-26 | Preparation method of glue for producing high-speed copper-clad plate and product thereof |
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| CN109370497B CN109370497B (en) | 2021-03-02 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110317541A (en) * | 2019-06-19 | 2019-10-11 | 南亚新材料科技股份有限公司 | A kind of bonding sheet and the preparation method of high speed copper-clad plate |
| CN113502141A (en) * | 2021-07-19 | 2021-10-15 | 安徽鸿海新材料股份有限公司 | Copper-clad plate glue synthesis preparation method |
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| CN110317541A (en) * | 2019-06-19 | 2019-10-11 | 南亚新材料科技股份有限公司 | A kind of bonding sheet and the preparation method of high speed copper-clad plate |
| CN113502141A (en) * | 2021-07-19 | 2021-10-15 | 安徽鸿海新材料股份有限公司 | Copper-clad plate glue synthesis preparation method |
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| CN109370497B (en) | 2021-03-02 |
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