CN109370494A - A kind of adhesive and preparation method thereof of hardware plastic processing - Google Patents
A kind of adhesive and preparation method thereof of hardware plastic processing Download PDFInfo
- Publication number
- CN109370494A CN109370494A CN201811156136.6A CN201811156136A CN109370494A CN 109370494 A CN109370494 A CN 109370494A CN 201811156136 A CN201811156136 A CN 201811156136A CN 109370494 A CN109370494 A CN 109370494A
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- Prior art keywords
- parts
- adhesive
- plastic processing
- hardware plastic
- resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to adhesive fields, and in particular to a kind of adhesive and preparation method thereof of hardware plastic processing.The adhesive of the hardware plastic processing includes following quality grouping point: 40-50 parts of novolac epoxy resin, 12-15 parts of polyisoprene rubber, 12-18 parts of triisopropanolamine, 17-22 parts of epoxy modified silicone resin, 12-18 parts of modified tacky resin, 7-8 parts of triethylamine, 4-8 parts of improved silica, first 20-40 parts of alcohol；10-12 parts of bonding reinforcing agent, 10-13 parts of defrother, 4-5 parts of curing agent.The adhesive of hardware plastic processing prepared by the present invention with good wetability, high temperature resistant, rub resistance, resistance to acid and alkali, simultaneously in terms of bonding have high resiliency and excellent adhesion strength.
Description
Technical field
The invention belongs to adhesive fields, and in particular to a kind of adhesive and preparation method thereof of hardware plastic processing.
Background technique
Hardware plastic refer to plastic production at machine parts or component, it is identical tradition the part strength made of hardware
The still density that is not much different is small, and other mechanical performances are close.Hardware plastic may be used as independent purposes, be also used as assisting
Apparatus.
Plastic cement is a kind of plastic synthesis high molecular material of tool.It and synthetic rubber, synthetic fibers form now
The big synthetic material of daily life indispensable three.Relative to metal, stone material, timber, plastic products have at low cost, plasticity
The advantages that strong, is widely used in national economy, and plastics industry occupies particularly important status in today's world, moulds for many years
The production of material products develops at high speed all over the world.Because life in utilization rate it is very high, although therefore plastics be broken the problems such as send out
Raw probability is lower but still remains a large amount of maintenance and maintenance demand, and available glue currently on the market is seldom directed to plastic products
Special exploitation and production, causing the adhesives of plastic products, there are certain Improvement requirements.
Application No. is 201510554598.3 patents of invention to disclose a kind of preparation side of adhesive for plastics composition
Method, the constituent of the adhesive include following raw material count by weight percentage: 40-60 parts of organic solvent, 20-35 parts
Epoxy resin, 5-10 parts of polybutadiene, 5-10 parts of acrylic resin, 3-5 parts of celluosic resin, 3-5 parts of dioxy
SiClx, 1-3 parts of a variety of auxiliary agents.Gained adhesive of the invention has preferably resistance to primarily directed to the use of Plastic product
Water weatherability, while also having outstanding advantage in terms of the high resiliency of plastics bonding.But the patent there are resistance to acid and alkali poor, high temperature
Situations such as easily deforming.
Summary of the invention
For the deficiencies in the prior art, the present invention provides adhesive and its preparation of a kind of hardware plastic processing
The adhesive of method, hardware plastic processing prepared by the present invention has good wetability, high temperature resistant, rub resistance, acid and alkali-resistance
Property, simultaneously in terms of bonding have high resiliency and excellent adhesion strength.
In order to achieve the above-mentioned object of the invention, the invention adopts the following technical scheme:
A kind of adhesive of hardware plastic processing, including the grouping point of following quality: 40-50 parts of novolac epoxy resin, gather
12-15 parts of isoprene rubber, 12-18 parts of triisopropanolamine, 17-22 parts of epoxy modified silicone resin, modified tacky resin
12-18 parts, 7-8 parts of triethylamine, 4-8 parts of improved silica, first 20-40 parts of alcohol；10-12 parts of bonding reinforcing agent, defrother 10-
13 parts, 4-5 parts of curing agent.
Preferably, the adhesive of a kind of hardware plastic processing, including the grouping point of following quality: epoxy novolac tree
46 parts of rouge, 14 parts of polyisoprene rubber, 17 parts of triisopropanolamine, 19 parts of epoxy modified silicone resin, modified tacky resin
16 parts, 7 parts of triethylamine, 7 parts of improved silica, first 36 parts of alcohol；11 parts of bonding reinforcing agent, 12 parts of defrother, 4 parts of curing agent.
Preferably, the curing agent is p-hydroxybenzenyl sulfonate.
A kind of preparation method of the adhesive of hardware plastic processing, comprising the following steps: the first step weighs raw material；The
Two steps, each component is put into batch mixer, is stirred 15-25 minutes at 70-80 DEG C, is obtained the mixture of each raw material；Third step,
Mixture is moved into reaction kettle, temperature is 100-120 DEG C in the reaction kettle, and stirring rate 800-1000rpm continues to stir
Mix 2-4 hours, stop heat simultaneously continue to stir, naturally cool to 20-30 DEG C to get.
Preferably, temperature is 118 DEG C in the reaction kettle, stirring rate 900rpm.
Compared with prior art, the invention has the following advantages:
The adhesive of hardware plastic processing prepared by the present invention has good wetability, high temperature resistant, rub resistance, acidproof
Alkalinity has high resiliency and excellent adhesion strength in terms of bonding simultaneously.
Specific embodiment
Below by specific embodiment, invention is further described in detail.But those skilled in the art will manage
Solution, the following example is merely to illustrate the present invention, and should not be taken as limiting the scope of the invention.Specific skill is not specified in embodiment
Art or condition person, described technology or conditions carry out to specifications according to the literature in the art.Agents useful for same or instrument
Production firm person is not specified, being can be with conventional products that are commercially available.
Embodiment 1
A kind of adhesive of hardware plastic processing, including the grouping point of following quality: 50 parts of novolac epoxy resin, poly- isoamyl
15 parts of diene rubber, 18 parts of triisopropanolamine, 22 parts of epoxy modified silicone resin, 18 parts of modified tacky resin, triethylamine 8
Part, 8 parts of improved silica, first 40 parts of alcohol, 12 parts of bonding reinforcing agent, 13 parts of defrother, 5 parts of curing agent.
The curing agent is p-hydroxybenzenyl sulfonate.
A kind of preparation method of the adhesive of hardware plastic processing, comprising the following steps: the first step weighs raw material；The
Two steps, each component is put into batch mixer, is stirred 25 minutes at 80 DEG C, is obtained the mixture of each raw material；Third step will mix
Object moves into reaction kettle, and temperature is 120 DEG C, stirring rate 1000rpm in the reaction kettle, continues stirring 4 hours, stops adding
Heat simultaneously continue to stir, naturally cool to 30 DEG C to get.
Embodiment 2
A kind of adhesive of hardware plastic processing, including the grouping point of following quality: 40 parts of novolac epoxy resin, poly- isoamyl
12 parts of diene rubber, 12 parts of triisopropanolamine, 17 parts of epoxy modified silicone resin, 12 parts of modified tacky resin, triethylamine 7
Part, 4 parts of improved silica, first 20 parts of alcohol；10 parts of bonding reinforcing agent, 10 parts of defrother, 4 parts of curing agent.
The curing agent is p-hydroxybenzenyl sulfonate.
A kind of preparation method of the adhesive of hardware plastic processing, comprising the following steps: the first step weighs raw material；The
Two steps, each component is put into batch mixer, is stirred 15 minutes at 70 DEG C, is obtained the mixture of each raw material；Third step will mix
Object moves into reaction kettle, and temperature is 100 DEG C, stirring rate 800rpm in the reaction kettle, continues stirring 2 hours, stops adding
Heat simultaneously continue to stir, naturally cool to 20 DEG C to get.
Embodiment 3
A kind of adhesive of hardware plastic processing, including the grouping point of following quality: 46 parts of novolac epoxy resin, poly- isoamyl
14 parts of diene rubber, 17 parts of triisopropanolamine, 19 parts of epoxy modified silicone resin, 16 parts of modified tacky resin, triethylamine 7
Part, 7 parts of improved silica, first 36 parts of alcohol；11 parts of bonding reinforcing agent, 12 parts of defrother, 4 parts of curing agent.
The curing agent is p-hydroxybenzenyl sulfonate.
A kind of preparation method of the adhesive of hardware plastic processing, comprising the following steps: the first step weighs raw material；The
Two steps, each component is put into batch mixer, is stirred 22 minutes at 70 DEG C, is obtained the mixture of each raw material；Third step will mix
Object moves into reaction kettle, and temperature is 118 DEG C, stirring rate 900rpm in the reaction kettle, continues stirring 3 hours, stops adding
Heat simultaneously continue to stir, naturally cool to 28 DEG C to get.
Comparative example 1
Step is with embodiment 1, the difference is that being not added with epoxy modified silicone resin in comparative example 1.
A kind of adhesive of hardware plastic processing, including the grouping point of following quality: 50 parts of novolac epoxy resin, poly- isoamyl
15 parts of diene rubber, 18 parts of triisopropanolamine, 18 parts of modified tacky resin, 8 parts of triethylamine, 8 parts of improved silica, first alcohol 40
Part, 12 parts of bonding reinforcing agent, 13 parts of defrother, 5 parts of curing agent.
The curing agent is p-hydroxybenzenyl sulfonate.
A kind of preparation method of the adhesive of hardware plastic processing, comprising the following steps: the first step weighs raw material；The
Two steps, each component is put into batch mixer, is stirred 25 minutes at 80 DEG C, is obtained the mixture of each raw material；Third step will mix
Object moves into reaction kettle, and temperature is 120 DEG C, stirring rate 1000rpm in the reaction kettle, continues stirring 4 hours, stops adding
Heat simultaneously continue to stir, naturally cool to 30 DEG C to get.
Comparative example 2
Step is with embodiment 2, the difference is that being not added with modified tacky resin in comparative example 2.
A kind of adhesive of hardware plastic processing, including the grouping point of following quality: 40 parts of novolac epoxy resin, poly- isoamyl
12 parts of diene rubber, 12 parts of triisopropanolamine, 17 parts of epoxy modified silicone resin, 7 parts of triethylamine, 4 parts of improved silica,
20 parts of first alcohol；10 parts of bonding reinforcing agent, 10 parts of defrother, 4 parts of curing agent.
The curing agent is p-hydroxybenzenyl sulfonate.
A kind of preparation method of the adhesive of hardware plastic processing, comprising the following steps: the first step weighs raw material；The
Two steps, each component is put into batch mixer, is stirred 15 minutes at 70 DEG C, is obtained the mixture of each raw material；Third step will mix
Object moves into reaction kettle, and temperature is 100 DEG C, stirring rate 800rpm in the reaction kettle, continues stirring 2 hours, stops adding
Heat simultaneously continue to stir, naturally cool to 20 DEG C to get.
Comparative example 3
Step is with embodiment 3, the difference is that preparation method is batch mixer processing in comparative example 3.
A kind of adhesive of hardware plastic processing, including the grouping point of following quality: 46 parts of novolac epoxy resin, poly- isoamyl
14 parts of diene rubber, 17 parts of triisopropanolamine, 19 parts of epoxy modified silicone resin, 16 parts of modified tacky resin, triethylamine 7
Part, 7 parts of improved silica, first 36 parts of alcohol；11 parts of bonding reinforcing agent, 12 parts of defrother, 4 parts of curing agent.
The curing agent is p-hydroxybenzenyl sulfonate.
A kind of preparation method of the adhesive of hardware plastic processing, comprising the following steps: the first step weighs raw material；The
Each component is mixed mixing and moved into reaction kettle by two steps, and temperature is 118 DEG C, stirring rate 900rpm in the reaction kettle, after
Continuous stirring 3 hours stops heating and simultaneously continues to stir, naturally cool to 28 DEG C to get.
The adhesive of the resulting hardware plastic processing of embodiment 1-3 and comparative example 1-3 is tested for the property, gained knot
Fruit is as shown in the table:
Wherein, friction testing uses RCA paper tape friction test, testing standard: ASTM F2357.
Table as above is visible: the adhesive of hardware plastic processing prepared by the present invention have good wetability, high temperature resistant,
Rub resistance, has high resiliency and excellent adhesion strength at resistance to acid and alkali in terms of bonding simultaneously.
The above is only preferred embodiments of the present invention, is not intended to limit the scope of the present invention,
Therefore any trickle amendment, equivalent variations and modification made to the above embodiment according to the technical essence of the invention, belong to
In the range of technical solution of the present invention.
Claims (5)
1. a kind of adhesive of hardware plastic processing, which is characterized in that including the grouping point of following quality: novolac epoxy resin
40-50 parts, 12-15 parts of polyisoprene rubber, 12-18 parts of triisopropanolamine, changes 17-22 parts of epoxy modified silicone resin
Property 12-18 parts of tackifying resin, 7-8 parts of triethylamine, 4-8 parts of improved silica, first 20-40 parts of alcohol；Bonding reinforcing agent 10-12
Part, 10-13 parts of defrother, 4-5 parts of curing agent.
2. a kind of adhesive of hardware plastic processing according to claim 1, which is characterized in that including following quality point
Component: 46 parts of novolac epoxy resin, 14 parts of polyisoprene rubber, 17 parts of triisopropanolamine, epoxy modified silicone resin 19
Part, 16 parts of modified tacky resin, 7 parts of triethylamine, 7 parts of improved silica, first 36 parts of alcohol；11 parts of bonding reinforcing agent, defrother
12 parts, 4 parts of curing agent.
3. a kind of adhesive of hardware plastic processing according to claim 1, which is characterized in that the curing agent is pair
Hydroxy benzene sulfonic acid.
4. a kind of preparation method of the adhesive of hardware plastic processing described in claim 1, which is characterized in that including following
Step: the first step weighs raw material；Each component is put into batch mixer by second step, is stirred 15-25 minutes, is obtained at 70-80 DEG C
To the mixture of each raw material；Third step moves into mixture in reaction kettle, and temperature is 100-120 DEG C in the reaction kettle, stirring
Rate is 800-1000rpm, continue stirring 2-4 hour, stop heating simultaneously continues to stir, naturally cool to 20-30 DEG C to get.
5. a kind of preparation method of the adhesive of hardware plastic processing according to claim 4, which is characterized in that described
Temperature is 118 DEG C in reaction kettle, stirring rate 900rpm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811156136.6A CN109370494A (en) | 2018-09-30 | 2018-09-30 | A kind of adhesive and preparation method thereof of hardware plastic processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811156136.6A CN109370494A (en) | 2018-09-30 | 2018-09-30 | A kind of adhesive and preparation method thereof of hardware plastic processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109370494A true CN109370494A (en) | 2019-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811156136.6A Pending CN109370494A (en) | 2018-09-30 | 2018-09-30 | A kind of adhesive and preparation method thereof of hardware plastic processing |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103173114A (en) * | 2013-03-23 | 2013-06-26 | 广东新展化工新材料有限公司 | Epoxy modified organic silicon resin adhesive and preparation method thereof |
-
2018
- 2018-09-30 CN CN201811156136.6A patent/CN109370494A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103173114A (en) * | 2013-03-23 | 2013-06-26 | 广东新展化工新材料有限公司 | Epoxy modified organic silicon resin adhesive and preparation method thereof |
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Application publication date: 20190222 |
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