CN109360817A - A kind of aerofoil profile lead SOP device and its process of lead forming - Google Patents
A kind of aerofoil profile lead SOP device and its process of lead forming Download PDFInfo
- Publication number
- CN109360817A CN109360817A CN201811152134.XA CN201811152134A CN109360817A CN 109360817 A CN109360817 A CN 109360817A CN 201811152134 A CN201811152134 A CN 201811152134A CN 109360817 A CN109360817 A CN 109360817A
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- lead
- section
- horizontal segment
- forming
- aerofoil profile
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000007704 transition Effects 0.000 claims abstract description 11
- 238000007493 shaping process Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 9
- 230000007774 longterm Effects 0.000 abstract description 6
- 238000003466 welding Methods 0.000 abstract description 4
- 230000035882 stress Effects 0.000 description 29
- 238000010586 diagram Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 230000001351 cycling effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Processing (AREA)
Abstract
The invention discloses a kind of aerofoil profile lead SOP devices and its process of lead forming, lead one end to be fixed at device pin, and lead is divided into ramp down section, horizontal segment, vertical section and tilting section by fixing end to free end；Ramp down section and horizontal segment bend transition, vertical section and horizontal segment and the equal arc transition of tilting section to extension on the outside of device, and tilting section is angled downward from horizontal, and lead is symmetricly set on device both ends.The stress release space of device wire increases, significantly increase the stress release space of device wire, effectively reduce crash rate of the device under long-term shear stress and high-temerature creep effect, crash rate of the device under long-term shear stress and high-temerature creep effect is effectively reduced, and then improves the reliability after device welding.
Description
Technical field
The invention belongs to electronic component security reliability field, be related to a kind of aerofoil profile lead SOP device and its lead at
The process of shape.
Background technique
With domestic SOP package bottom draw device using more and more extensive, thus bring soldering reliability problem
Also it increasingly highlights.It is bottom extraction type that the lead that domestic SOP package bottom draws device, which stretches out mode, and device wire is without shoulder
Portion, and stress bends through small, stress release insufficient space, the lead drawn outside bottom is shorter, thus causes such device that can not expire
The related forming requirements of sufficient QJ 3171 " requirement of aerospace electron electric product component forming technique ".
After such device directly welds, since wire stress Free up Memory is insufficient, lead to the continuous action in environmental stress
Under, are there is the risk of stress Cracking Failure by shear stress and high-temerature creep effect for a long time in device body and welding material.
Summary of the invention
It is an object of the invention to overcome the above-mentioned prior art, a kind of aerofoil profile lead SOP device is provided and its is drawn
The process of line forming effectively reduces crash rate of the device under long-term shear stress and high-temerature creep effect, reduces
Crash rate of the device under long-term shear stress and high-temerature creep effect.
In order to achieve the above objectives, the present invention is achieved by the following scheme:
A kind of aerofoil profile lead SOP device, lead one end are fixed at device pin, lead by fixing end to free end successively
It is divided into ramp down section, horizontal segment, vertical section and tilting section；Ramp down section and horizontal segment are folded over to extension on the outside of device
It crosses, vertical section and horizontal segment and the equal arc transition of tilting section, tilting section is angled downward from horizontal, and lead is symmetricly set on device two
End.
Preferably, horizontal segment and ramp down section difference in height α are 0.5mm-1mm；Device end to horizontal segment terminal horizontal away from
From distance beta >=0.5mm.
Preferably, horizontal segment and ramp down section difference in height α are 0.8mm, and device end to horizontal segment terminal horizontal distance beta is
1mm。
Preferably, arc radius r >=lead thicknesses between vertical section and horizontal segment and tilting section.
Preferably, the arc radius r between vertical section and horizontal segment and tilting section is 0.8mm.
Preferably, inclination segment length γ is 1.1mm.
Preferably, the included angle X between the tilting section and horizontal line is 0 ° -5 °.
A kind of process of the lead forming of aerofoil profile lead SOP device, based on device described in above-mentioned any one, packet
Include following steps:
Step 1, the device shaped is put into shaping dies, device is corresponding with lower mold center to be placed, in upper mold
The positioning right angle of side unit positions device；
Step 2, it is once-forming to device progress to move downward through pressure for upper mold；
Lead after forming is divided into ramp down section, horizontal segment, vertical section and tilting section by fixing end to free end；Tiltedly
To lower section and horizontal segment to extension on the outside of device, and transition, vertical section and horizontal segment and the equal arc transition of tilting section are bent, inclined
Oblique section is angled downward from horizontal, and lead is symmetricly set on device both ends.
Preferably, the former is divided into upper mold and lower mold, and upper mold both sides are symmetrical arranged, and it is single to be divided into inside
Member and outer cells, outer cells length are greater than inside cell, and lower mold is convex shape, and the inside of upper mold inside cell is arranged
There are the positioning right angle for positioning to device both ends, the bottom surface of upper mold inside cell lead water corresponding with lower grinding tool top bar face
The forming of flat section；Upper mold outer cells grow the side of inside cell part, lead corresponding with lower grinding tool top bar surface side wall
The forming of vertical section；The bottom surface of upper mold outer cells and lower grinding tool are got out of a predicament or an embarrassing situation the forming of the corresponding lead tilting section in face.
Compared with prior art, the invention has the following advantages:
Domestic SOP package bottom is drawn the lead of device by the present invention, and being increased by level-one aerofoil profile is stage airfoil, forms the
Two stress releases are curved, and lead is in " double airfoil type " pattern, and device station height is raised, and the stress release space of device wire increases, and show
The stress release space for increasing device wire is write, effectively reduces device under long-term shear stress and high-temerature creep effect
Crash rate effectively reduces crash rate of the device under long-term shear stress and high-temerature creep effect, and then improves device weldering
Reliability after connecing.
Further, it is 0.8mm that device, which raises height α, meets the forming compared with short leg, improves the environment resistant of device after welding
Adaptive capacity.
Further, the bending radius r of down lead elimination internal stress is 0.8mm, is greater than lead thicknesses, after shaped, without report
Useless short leg device, save the cost.
Domestic SOP package bottom can be drawn device after the molding of original level-one by the method for the invention, then carry out two
Secondary die forming, the manufacturing process are determined on the basis of the original stress release of retaining means is curved using device body
Position, it is curved to form second stress release to the straight lead secondary mould pressing of device.Meet military device wire forming standard, nothing
Capable leveling need to be bent into original stress of device aerofoil profile lead, reduce operational sequence, improve forming efficiency, meanwhile, it reduces
To the secondary damage of device wire.
Detailed description of the invention
Fig. 1 is that domestic SOP package bottom draws device schematic diagram；
Fig. 2 is shaping dies schematic diagram of the invention；
Fig. 3 is key position schematic diagram of the invention；
Fig. 4 is device schematic diagram after present invention forming.
Wherein: 1- upper mold；2- device；Mold under 3-.
Specific embodiment
The invention will be described in further detail with reference to the accompanying drawing:
As shown in Figure 1, it is bottom extraction type, device that domestic SOP package bottom, which draws device there is device wire to stretch out mode,
The features such as release of part wire stress is curved smaller, and device wire length is shorter.These features determine that such device 2 is unable to satisfy QJ
The related forming requirements of 3171 " requirements of aerospace electron electric product component forming technique ", and there are solder joints after directly welding
By the risk of stress Cracking Failure.
Currently, the common processing method to domestic SOP device wire are as follows: first carry out alignment behaviour to device aerofoil profile lead
Make, then re-starts forming by standard requirements.The shortcomings that process be need operated twice, forming efficiency compared with
It is low.Meanwhile needing to carry out alignment operation to lead, there are the risks of damage device lead.
As shown in Fig. 2, the secondary mould pressing for 2 aerofoil profile lead of device shapes, packet for shaping dies needed for forming element
Upper mold 1 and lower 3 two parts of mold are included, 1 both sides of upper mold are symmetrical arranged, and are divided into inside cell and outer cells, and outside is single
First length is greater than inside cell, and lower mold 3 is convex shape, is provided on the inside of 1 inside cell of upper mold for 2 both ends of device
The positioning right angle of positioning, the forming of the bottom surface of 1 inside cell of upper mold lead horizontal segment corresponding with lower 3 top bar face of grinding tool；On
1 outer cells of mold grow the side of inside cell part, lead vertical section corresponding with lower 3 top bar surface side wall of grinding tool at
Shape；The bottom surface of 1 outer cells of upper mold and lower grinding tool 3 are got out of a predicament or an embarrassing situation the forming of the corresponding lead tilting section in face, the specific steps are as follows:
Step 1, the device 2 shaped is put into shaping dies, device 2 is corresponding with lower 3 center of mold to be placed, upper mold
The positioning right angle of 1 inside cell positions device 1；
Step 2, upper mold 1 move downward through pressure device 2 is carried out it is once-forming.
The working principle of the fixture for forming are as follows: the device 2 shaped is placed in lower mold 3 and is appeared on the stage on terrace, on
Mold 1 moves downwardly to the straight fragment position of lead, once-forming by the pressure of upper/lower die, completes second of mould of lead
Pressure.
Domestic SOP package bottom can be drawn device and carry out second of die forming by the manufacturing process.The forming side
Method is positioned on the basis of the original stress release of retaining means 2 is curved using 2 ontology of device, to the straight lead of prototype part 2
Secondary mould pressing is once-forming, curved to form second stress release.2 lead of device after forming is in " double airfoil type " pattern, device 2
Height of standing is raised, and the stress release space of 2 lead of device increases, and meets military device wire forming standard.
The inside part B of the upper mold 1 upper mold curved, described for realizing the protection original stress of device wire
1 outside part A and lower 3 collective effect of mold, it is curved to form second required stress release.The inside part B of upper mold 1
Size design is for meeting 2 body dimension of device and the original forming dimension of device wire, and the outside part A of upper mold 1 is under
It is curved that the size design of 3 leave from office terrace of mold is used to form second stress.
The final pattern of device wire is as shown in figure 3, lead one end is fixed at 2 pin of device after forming, lead
Ramp down section, horizontal segment, vertical section and tilting section are divided by fixing end to free end；Ramp down section and horizontal segment are to device
Extend on the outside of part 2, and bends transition, ramp down section and horizontal segment as the pin configuration of original device 2；By molding die at
Shape, the pushing of the flat segments of original 2 lead of device is configured to vertical section, tilting section and two stress curved, vertical section and horizontal segment
With the equal arc transition of tilting section, tilting section is angled downward from horizontal, and lead is symmetricly set on 2 both ends of device.
Key parameter after device 2 shapes includes: that device raises height, i.e., horizontal segment is with ramp down section difference in height α
0.5mm-1mm；Device shoulder length, i.e., 2 end of device to horizontal segment terminal horizontal is apart from distance beta >=0.5mm；In down lead elimination
Arc radius r >=lead thicknesses between the bending radius of stress, i.e. vertical section and horizontal segment and tilting section.In the present embodiment,
It is 0.8mm that device, which raises height α,；Device shoulder length β is 1mm；Gage lap length, i.e. inclination segment length γ are 1.1mm；Draw
Line up and down be bent between straight line portion and printed circuit board between angle, i.e., the included angle X between tilting section and horizontal line be 0 °-
5°；The bending radius r of down lead elimination internal stress is 0.8mm.Dimensions above is all satisfied " the aerospace electron electric product member of QJ 3171
Forming element technical requirements " the 4.4th article require.
Application Example of the invention is as shown in Figure 4.As can be seen that passing through second to such 2 aerofoil profile lead of device
Forming has raised 2 station of device height, has significantly increased the stress release space of device wire, effectively reduce device 2 and cut for a long time
Crash rate under shearing stress and high-temerature creep effect, and then improve the reliability after device 2 welds.To the embodiment of the present invention
Carry out random vibration test, impact test and temperature cycling test show using after the present invention, 2 solder joint of device is from being only resistant to 1
Secondary vibration test and 30 temperature cycling tests improve to be resistant to 2 vibration tests, 1 Secondary Shocks test and 500 temperature follow
Ring test.In addition, the present invention has been successfully applied in a variety of space flight type product tasks of country.For various sizes of domestic
SOP package bottom draws device, adjusts lead die size, above-mentioned process forming method according to 2 ontology of device and lead parameter
And device can satisfy the forming requirements of different scale devices 2, have stronger universality.
The above content is merely illustrative of the invention's technical idea, and this does not limit the scope of protection of the present invention, all to press
According to technical idea proposed by the present invention, any changes made on the basis of the technical scheme each falls within claims of the present invention
Protection scope within.
Claims (9)
1. a kind of aerofoil profile lead SOP device, which is characterized in that lead one end is fixed at device (2) pin, and lead is by fixing end
Ramp down section, horizontal segment, vertical section and tilting section are divided into free end；Ramp down section and horizontal segment to device (2) outside
Side extends, and bends transition, vertical section and horizontal segment and the equal arc transition of tilting section, and tilting section is angled downward from horizontal, lead
It is symmetricly set on device (2) both ends.
2. a kind of aerofoil profile lead SOP device according to claim 1, which is characterized in that horizontal segment and ramp down section height
Poor α is 0.5mm-1mm；Device (2) end is to horizontal segment terminal horizontal apart from distance beta >=0.5mm.
3. a kind of aerofoil profile lead SOP device according to claim 1, which is characterized in that horizontal segment and ramp down section height
Poor α is 0.8mm, and device (2) end to horizontal segment terminal horizontal distance beta is 1mm.
4. a kind of aerofoil profile lead SOP device according to claim 1, which is characterized in that vertical section and horizontal segment and inclination
Arc radius r >=lead thicknesses between section.
5. a kind of aerofoil profile lead SOP device according to claim 1, which is characterized in that vertical section and horizontal segment and inclination
Arc radius r between section is 0.8mm.
6. a kind of aerofoil profile lead SOP device according to claim 1, which is characterized in that inclination segment length γ is 1.1mm.
7. a kind of SOP device aerofoil profile lead according to claim 1, which is characterized in that the tilting section and horizontal line it
Between included angle X be 0 ° -5 °.
8. a kind of process of the lead forming of aerofoil profile lead SOP device, based on device described in claim 1-7 any one
Part, which comprises the following steps:
Step 1, the device shaped (2) is put into shaping dies, device (2) is corresponding with lower mold (3) center to be placed, upper mold
The positioning right angle of tool (1) inside cell positions device (1)；
Step 2, it is once-forming to device (2) progress to move downward through pressure for upper mold (1)；
Lead after forming is divided into ramp down section, horizontal segment, vertical section and tilting section by fixing end to free end；Obliquely
Section extends to device (2) outside with horizontal segment, and bends transition, vertical section and horizontal segment and the equal arc transition of tilting section, inclines
Oblique section is angled downward from horizontal, and lead is symmetricly set on device (2) both ends.
9. a kind of process of the lead forming of aerofoil profile lead SOP device according to claim 8, which is characterized in that
The former is divided into upper mold (1) and lower mold (3), and upper mold (1) both sides are symmetrical arranged, and is divided into inside cell and outer
Side unit, outer cells length are greater than inside cell, and lower mold (3) is convex shape, and the inside of upper mold (1) inside cell is arranged
There is a positioning right angle for positioning to device (2) both ends, the bottom surface of upper mold (1) inside cell and lower grinding tool (3) are appeared on the stage terrace
The forming of corresponding lead horizontal segment；Upper mold (1) outer cells grow the side of inside cell part, appear on the stage with lower grinding tool (3)
Terrace side wall corresponds to the forming of lead vertical section；The bottom surface of upper mold (1) outer cells is got out of a predicament or an embarrassing situation with lower grinding tool (3), and face is corresponding to draw
The forming of line tilting section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811152134.XA CN109360817A (en) | 2018-09-29 | 2018-09-29 | A kind of aerofoil profile lead SOP device and its process of lead forming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811152134.XA CN109360817A (en) | 2018-09-29 | 2018-09-29 | A kind of aerofoil profile lead SOP device and its process of lead forming |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109360817A true CN109360817A (en) | 2019-02-19 |
Family
ID=65348326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811152134.XA Pending CN109360817A (en) | 2018-09-29 | 2018-09-29 | A kind of aerofoil profile lead SOP device and its process of lead forming |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109360817A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112453262A (en) * | 2020-11-17 | 2021-03-09 | 中国科学院长春光学精密机械与物理研究所 | Lead forming device for integrated circuit |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62123751A (en) * | 1985-11-25 | 1987-06-05 | Hitachi Ltd | Lead forming mold |
| JPH04171850A (en) * | 1990-11-05 | 1992-06-19 | Nec Corp | Molding method for ic lead |
| JP2002305279A (en) * | 2001-04-06 | 2002-10-18 | Sharp Corp | Semiconductor device |
-
2018
- 2018-09-29 CN CN201811152134.XA patent/CN109360817A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62123751A (en) * | 1985-11-25 | 1987-06-05 | Hitachi Ltd | Lead forming mold |
| JPH04171850A (en) * | 1990-11-05 | 1992-06-19 | Nec Corp | Molding method for ic lead |
| JP2002305279A (en) * | 2001-04-06 | 2002-10-18 | Sharp Corp | Semiconductor device |
Non-Patent Citations (1)
| Title |
|---|
| 任超 等: "SOP器件引脚结构对互连可靠性的影响分析", 《机械强度》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112453262A (en) * | 2020-11-17 | 2021-03-09 | 中国科学院长春光学精密机械与物理研究所 | Lead forming device for integrated circuit |
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| PB01 | Publication | ||
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Application publication date: 20190219 |