CN109358733A - A kind of dustproof and waterproof cooling cabinet for main frame - Google Patents
A kind of dustproof and waterproof cooling cabinet for main frame Download PDFInfo
- Publication number
- CN109358733A CN109358733A CN201811391012.6A CN201811391012A CN109358733A CN 109358733 A CN109358733 A CN 109358733A CN 201811391012 A CN201811391012 A CN 201811391012A CN 109358733 A CN109358733 A CN 109358733A
- Authority
- CN
- China
- Prior art keywords
- cabinet
- air inlet
- fan
- venthole
- dustproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
Abstract
The invention discloses a kind of dustproof and waterproof cooling cabinet for main frame, including cabinet, cpu motherboard, the first fan, the first dust-proof cooling board, cpu motherboard is located in the box body and connect with the top of cabinet；First fan is located in the box body and the connection of the top of cabinet, the first fan are arranged close to cpu motherboard, the first fan and cpu motherboard communication connection；First dust-proof cooling board is connect with cabinet, and the first dust-proof cooling board is equipped with the first air inlet, the first air transmission channel, the first venthole, and the first air inlet is connected to cabinet, and the first air inlet is arranged close to the first fan；First venthole is in communication with the outside, and the first venthole is connected to by the first air transmission channel with the first air inlet, and the first air transmission channel is gradually in tilted layout upwards from the first venthole to the first air inlet.The present invention facilitates heat dissipation, being capable of dustproof and waterproof.
Description
Technical field
The present invention relates to field of computer technology more particularly to a kind of dustproof and waterproof heat dissipation machines for main frame
Case.
Background technique
Computer cabinet is a part in computer fittings, it mainly by the accessories such as the CPU of computer, video card, mainboard into
Row fixed placement plays the role of a support and protection, and computer cabinet also has the important of shielding electromagnetic radiation
Effect.
Current computer mainframe box is typically placed under desk, and some can also be directly placed at desk computer
It accidentally overturns when water is splashed casing when storing dampening in the cup of user or water is along desktop in one side of screen
When flowing under table, water may enter cabinet inside from dust-proof radiating hole, and current cabinet does not have the function of waterproof, may
Lead to computer internal short circuits, there is the risk for burning mainboard, influences the normal work of office worker.
And the dust-proof effect of existing cabinet is poor, is further improved.
Summary of the invention
To solve technical problem present in background technique, the present invention proposes a kind of dustproof and waterproof for main frame
Cooling cabinet, effect are good.
A kind of dustproof and waterproof cooling cabinet for main frame proposed by the present invention, including cabinet, cpu motherboard,
One fan, the first dust-proof cooling board, cpu motherboard are located in the box body and connect with the top of cabinet；First fan is located in the box body
And the top connection of cabinet, the first fan are arranged close to cpu motherboard, the first fan and cpu motherboard communication connection；First is dust-proof scattered
Hot plate is connect with cabinet, the first dust-proof cooling board be equipped with the first air inlet, the first air transmission channel, the first venthole, first into
Stomata is connected to cabinet, and the first air inlet is arranged close to the first fan；First venthole is in communication with the outside, and the first venthole passes through
First air transmission channel is connected to the first air inlet, and the first air transmission channel gradually tilts upwards from the first venthole to the first air inlet
Arrangement.
It preferably, further include the second fan, the second dust-proof cooling board；Second fan is located in the box body and the lower part of cabinet connects
It connects, the second fan and cpu motherboard communication connection；Second dust-proof cooling board is equipped with the second air inlet, the second air transmission channel, second
Venthole, the second air inlet are connected to cabinet, and the second air inlet is arranged close to the second fan；Second venthole is in communication with the outside,
Second venthole is connected to by the second air transmission channel with the second air inlet, and the second air transmission channel is from the second venthole to the second air inlet
Hole is gradually in tilted layout upwards.
Preferably, the first air inlet, the second air inlet are in the horn-like of contract.
Preferably, the angle of the first air transmission channel, the second air transmission channel and horizontal plane is 70~80 degree.
Preferably, the first venthole, the second venthole are multiple, multiple first ventholes, multiple second ventholes at
Arrangement is set.
Preferably, the first dust-proof cooling board, the second dust-proof cooling board are clamped with cabinet.
It preferably, further include radiator, radiator is located in the box body and is located between cpu motherboard and the first fan, heat dissipation
Device is fixedly connected by copper pipe with the copper sheet on cpu motherboard.
Preferably, cabinet includes side wall, ontology, and the junction of side wall and ontology is equipped with sealing strip.
Preferably, 1.5-2 times with a thickness of box top wall thickness of cabinet bottom wall.
Preferably, it is installed on the bottom wall of cabinet there are four the cushion block in matrix distribution, cushion block is equipped with anti-skid chequer.
In the present invention, heat is transported to the first air inlet, the second air inlet, the first air inlet by the first fan and the second fan
Hole, the second air inlet are in the horn-like of contract, convenient for the heat of surrounding is concentrated through the first wind conveying pipe road, the second defeated wind
Channel is transported to the external world, and the first wind conveying pipe road, the second air transmission channel are tilted down through the outer wall of the first, second dust-proof cooling board
It is connected with the first venthole, the second venthole, having prevents dust and water droplet from entering the benefit of box house.First venthole,
Second venthole horizontal homogeneous on the first, second dust-proof cooling board arranges, and is equipped in the first venthole, the second venthole
The wind with heat of anti-dust filter mesh, the first fan and the blowout of the second fan will blow the dust that dustproof filter adheres on the net
From, and keep the drying of anti-dust filter mesh.Therefore this cabinet also has good waterproof performance while dust-proof radiating, in electricity
When brain is splashed upper by the accident of water droplet, moisture will not be made to invade box house, computer is made to be able to maintain normal operating status.
Detailed description of the invention
Fig. 1 is external structure front view of the present invention；
Fig. 2 is ectosome structural side view of the present invention；
Fig. 3 is schematic diagram of internal structure of the present invention；
Fig. 4 is the portion A structure enlargement diagram in Fig. 3.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutual combination；Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " on ", "lower", "front", "rear", " left side " and " right side " etc. refer to
The orientation or positional relationship shown is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description present invention and simplifies
Description, rather than the position of indication or suggestion meaning or element must have particular orientation, be constituted and operated with specific orientation,
Therefore it should not be understood as limitation of the invention.In addition, term " first ", " second " are used for description purposes only, and should not be understood as
Indication or suggestion relative importance.
Referring to Fig.1, a kind of dustproof and waterproof cooling cabinet for main frame proposed by the present invention, including cabinet 1,
Cpu motherboard 2, the first fan 3, the first dust-proof cooling board 4, cpu motherboard 2 are located in cabinet 1 and connect with the top of cabinet 1；The
One fan 3 is located in cabinet 1 and the connection of the top of cabinet 1, the first fan 3 are arranged close to cpu motherboard 2, the first fan 3 and CPU
2 communication connection of mainboard；First dust-proof cooling board 4 is connect with cabinet 1, and the first dust-proof cooling board 4 is equipped with the first air inlet 5, the
One air transmission channel 7, the first venthole 6, the first air inlet 5 are connected to cabinet 1, and the first air inlet 5 is arranged close to the first fan 3；
First venthole 6 is in communication with the outside, and the first venthole 6 is connected to by the first air transmission channel 7 with the first air inlet 5, the first defeated wind
Channel 7 is gradually in tilted layout upwards from the first venthole 6 to the first air inlet 5.
It further, further include the second fan 8, the second dust-proof cooling board 9；Second fan 8 is located in cabinet 1 and cabinet 1
Lower part connection, the second fan 8 and 2 communication connection of cpu motherboard；Second dust-proof cooling board 9 is equipped with the second air inlet, second
Air transmission channel, the second venthole 12, the second air inlet are connected to cabinet 1, and the second air inlet is arranged close to the second fan 8；Second
Venthole 12 is in communication with the outside, and the second venthole 12 is connected to by the second air transmission channel with the second air inlet, the second air transmission channel
It is gradually in tilted layout upwards from the second venthole 12 to the second air inlet.Facilitate using the second further heat dissipation of fan 8, improves effect
Fruit.By CPU mainboard 2 monitor running temperature it is excessively high when, just automatically turn on the first fan 3 and the second fan 8, be used to based on
Machine heat dissipation, improves the stability of system, also extends the service life of cpu motherboard 2.
Further, the first air inlet 5, the second air inlet are in the horn-like of contract.Convenient for gas entrance, it is convenient for
The heat concentration of surrounding is transported to the external world.
Further, the angle of the first air transmission channel 7, the second air transmission channel and horizontal plane is 70~80 degree.Dust granule
Because of the gravity of itself, be liable to stick on the downward article in bottom in air, and water droplet can because self gravity downwards it is low or
It slides, dust or water droplet can be effectively prevent to enter inside cabinet 1, play the role of water proof and dust proof.
Further, the first venthole 6, the second venthole 12 are multiple, and multiple first ventholes 6, multiple second go out
Stomata 12 is arranged in rows.Improve heat dissipation effect.
Further, the first dust-proof cooling board 4, the second dust-proof cooling board 9 are clamped with cabinet 1.It is conveniently replaceable.
It further, further include radiator 10, radiator 10 is located in cabinet 1 and is located at cpu motherboard 2 and the first fan 3
Between, radiator 10 is fixedly connected by copper pipe with the copper sheet on cpu motherboard 2.The heat that cpu motherboard 2 is distributed at runtime,
Heat is guided to radiator 10 by copper pipe, the fin on radiator 10 radiates for it, and will be advantageous by the first fan 3
In the high efficiency and heat radiation of radiator 10.Second fan 8 is mounted on 1 lower part of cabinet by support, the member for facilitating 1 bottom of cabinet to install
Device heat dissipation.
Further, cabinet 1 includes side wall 101, ontology, and side wall 101 and the junction of ontology are equipped with sealing strip.Side wall
101 can open, and dust, moisture is avoided to enter.
Further, in order to improve the stability after 1 placement location of cabinet, prevent from being knocked over, 1 bottom wall of cabinet with a thickness of
1.5-2 times of 1 roof thickness of cabinet.The thickness of 1 bottom wall of cabinet is identical as the wall thickness of the first, second dust-proof cooling board 9.In order to subtract
The overall weight of light entire cabinet, herein making material of the preferred plastics as cabinet 1 in the present embodiment.In order to weaken in cabinet
The noise that internal component generates in operation preferably pastes acoustical cotton or sound-absorbing sea using each side inner wall in cabinet 1 herein
Silk floss, acoustical cotton or sound-absorbing sponge are advisable with a thickness of 4mm~6mm, to reduce in entire cabinet internal component in maneuverability
The noise of generation, acoustical cotton is soft and high temperature resistant, High Density Molecular structure can effective noise reduction, the vibration of active absorption mainframe box and
The noise that first fan 3 and the second fan 8 generate.
Further, it is installed on the bottom wall of cabinet 1 there are four the cushion block 11 in matrix distribution, cushion block 11 is equipped with anti-skidding
Line.Cushion block 11 is strip structure, convenient for cabinet 1 being placed in the host rack under desktop or table, the length of cushion block 11
The distance of two side ends apart from cabinet 1 is 2cm, and the height of cushion block 11 is 1.5~2.0cm, is goed deep into when being moved easily by finger
The bottom of cabinet 1 takes host in one's arms and carries out shift position.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of dustproof and waterproof cooling cabinet for main frame, which is characterized in that including cabinet, cpu motherboard, the first wind
Fan, the first dust-proof cooling board, cpu motherboard are located in the box body and connect with the top of cabinet；First fan is located in the box body and case
The top of body connects, and the first fan is arranged close to cpu motherboard, the first fan and cpu motherboard communication connection；First dust-proof cooling board
It is connect with cabinet, the first dust-proof cooling board is equipped with the first air inlet, the first air transmission channel, the first venthole, the first air inlet
It is connected to cabinet, the first air inlet is arranged close to the first fan；First venthole is in communication with the outside, and the first venthole passes through first
Air transmission channel is connected to the first air inlet, and the first air transmission channel gradually tilts cloth from the first venthole to the first air inlet upwards
It sets.
2. the dustproof and waterproof cooling cabinet according to claim 1 for main frame, which is characterized in that further include
Two fans, the second dust-proof cooling board；Second fan is located in the box body and the connection of the lower part of cabinet, and the second fan and cpu motherboard are logical
News connection；Second dust-proof cooling board is equipped with the second air inlet, the second air transmission channel, the second venthole, the second air inlet and case
Body connection, the second air inlet are arranged close to the second fan；Second venthole is in communication with the outside, and the second venthole passes through the second defeated wind
Channel is connected to the second air inlet, and the second air transmission channel is gradually in tilted layout upwards from the second venthole to the second air inlet.
3. the dustproof and waterproof cooling cabinet according to claim 2 for main frame, which is characterized in that the first air inlet
Hole, the second air inlet are in the horn-like of contract.
4. the dustproof and waterproof cooling cabinet according to claim 2 for main frame, which is characterized in that the first defeated wind
The angle in channel, the second air transmission channel and horizontal plane is 70~80 degree.
5. the dustproof and waterproof cooling cabinet according to claim 2 for main frame, which is characterized in that the first outlet
Hole, the second venthole be it is multiple, multiple first ventholes, multiple second ventholes are arranged in rows.
6. the dustproof and waterproof cooling cabinet according to claim 2 for main frame, which is characterized in that first is dust-proof
Heat sink, the second dust-proof cooling board are clamped with cabinet.
7. the dustproof and waterproof cooling cabinet according to claim 1 for main frame, which is characterized in that further include dissipating
Hot device, radiator are located in the box body and are located between cpu motherboard and the first fan, and radiator passes through on copper pipe and cpu motherboard
Copper sheet is fixedly connected.
8. the dustproof and waterproof cooling cabinet according to claim 1 for main frame, which is characterized in that cabinet includes
The junction of side wall, ontology, side wall and ontology is equipped with sealing strip.
9. the dustproof and waterproof cooling cabinet according to claim 1 for main frame, which is characterized in that cabinet bottom wall
1.5-2 times with a thickness of box top wall thickness.
10. the dustproof and waterproof cooling cabinet according to claim 1 for main frame, which is characterized in that cabinet
It is installed on bottom wall there are four the cushion block in matrix distribution, cushion block is equipped with anti-skid chequer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811391012.6A CN109358733A (en) | 2018-11-21 | 2018-11-21 | A kind of dustproof and waterproof cooling cabinet for main frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811391012.6A CN109358733A (en) | 2018-11-21 | 2018-11-21 | A kind of dustproof and waterproof cooling cabinet for main frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109358733A true CN109358733A (en) | 2019-02-19 |
Family
ID=65338312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811391012.6A Pending CN109358733A (en) | 2018-11-21 | 2018-11-21 | A kind of dustproof and waterproof cooling cabinet for main frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109358733A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107168497A (en) * | 2017-06-27 | 2017-09-15 | 葛娅敬 | A kind of air guiding heat dissipation device for computer |
| CN206805383U (en) * | 2017-03-22 | 2017-12-26 | 东莞市威旭机电设备有限公司 | A kind of casing structure of dustproof and waterproof |
| CN206977320U (en) * | 2017-06-29 | 2018-02-06 | 深圳市昆腾电源科技有限公司 | One kind radiating waterproof solar inverter |
| CN108541162A (en) * | 2018-05-29 | 2018-09-14 | 滁州职业技术学院 | A kind of large size computer room cabinet |
-
2018
- 2018-11-21 CN CN201811391012.6A patent/CN109358733A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206805383U (en) * | 2017-03-22 | 2017-12-26 | 东莞市威旭机电设备有限公司 | A kind of casing structure of dustproof and waterproof |
| CN107168497A (en) * | 2017-06-27 | 2017-09-15 | 葛娅敬 | A kind of air guiding heat dissipation device for computer |
| CN206977320U (en) * | 2017-06-29 | 2018-02-06 | 深圳市昆腾电源科技有限公司 | One kind radiating waterproof solar inverter |
| CN108541162A (en) * | 2018-05-29 | 2018-09-14 | 滁州职业技术学院 | A kind of large size computer room cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190219 |
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| RJ01 | Rejection of invention patent application after publication |