CN109346443A - 一种集成电路板的扭力装夹机构 - Google Patents
一种集成电路板的扭力装夹机构 Download PDFInfo
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- CN109346443A CN109346443A CN201811346160.6A CN201811346160A CN109346443A CN 109346443 A CN109346443 A CN 109346443A CN 201811346160 A CN201811346160 A CN 201811346160A CN 109346443 A CN109346443 A CN 109346443A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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CN201811346160.6A CN109346443B (zh) | 2018-11-13 | 2018-11-13 | 一种集成电路板的扭力装夹机构 |
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CN201811346160.6A CN109346443B (zh) | 2018-11-13 | 2018-11-13 | 一种集成电路板的扭力装夹机构 |
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CN109346443B CN109346443B (zh) | 2020-02-18 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110519958A (zh) * | 2019-09-10 | 2019-11-29 | 常州信息职业技术学院 | 一种按压式集成电路板封装机构 |
CN111132493A (zh) * | 2019-12-15 | 2020-05-08 | 金栋 | 一种集成电路板的翻转夹持系统 |
CN111128802A (zh) * | 2019-12-16 | 2020-05-08 | 汤忠武 | 一种微电子管芯的封装系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130087376A1 (en) * | 2011-10-07 | 2013-04-11 | Fujitsu Limited | Interposer, circuit board module, and method for manufacturing interposer |
CN207665286U (zh) * | 2017-12-17 | 2018-07-27 | 洪英杰 | 一种可翻转的pcb板固定装置 |
CN108481048A (zh) * | 2018-07-11 | 2018-09-04 | 诸暨市基麦罗进出口有限公司 | 一种新型装夹工件的夹具组件 |
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2018
- 2018-11-13 CN CN201811346160.6A patent/CN109346443B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130087376A1 (en) * | 2011-10-07 | 2013-04-11 | Fujitsu Limited | Interposer, circuit board module, and method for manufacturing interposer |
CN207665286U (zh) * | 2017-12-17 | 2018-07-27 | 洪英杰 | 一种可翻转的pcb板固定装置 |
CN108481048A (zh) * | 2018-07-11 | 2018-09-04 | 诸暨市基麦罗进出口有限公司 | 一种新型装夹工件的夹具组件 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110519958A (zh) * | 2019-09-10 | 2019-11-29 | 常州信息职业技术学院 | 一种按压式集成电路板封装机构 |
CN111132493A (zh) * | 2019-12-15 | 2020-05-08 | 金栋 | 一种集成电路板的翻转夹持系统 |
CN111132493B (zh) * | 2019-12-15 | 2021-01-19 | 杨艳娥 | 一种集成电路板的翻转夹持系统 |
CN111128802A (zh) * | 2019-12-16 | 2020-05-08 | 汤忠武 | 一种微电子管芯的封装系统 |
CN111128802B (zh) * | 2019-12-16 | 2022-09-27 | 深圳友讯达科技股份有限公司 | 一种微电子管芯的封装系统 |
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Effective date of registration: 20240118 Address after: 230031 b-1018, business office building, Woye garden, No. 81, Ganquan Road, Shushan District, Hefei City, Anhui Province Patentee after: HEFEI WISDOM DRAGON MACHINERY DESIGN Co.,Ltd. Address before: 213164 No. 22, Ming Xin Road, Wujin District, Changzhou, Jiangsu. Patentee before: CHANGZHOU College OF INFORMATION TECHNOLOGY |
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Effective date of registration: 20240326 Address after: 415000 No.59 Chengdong Gaozhuan Road, Wuling District, Changde City, Hunan Province Patentee after: Sun Mei Country or region after: China Address before: 230031 b-1018, business office building, Woye garden, No. 81, Ganquan Road, Shushan District, Hefei City, Anhui Province Patentee before: HEFEI WISDOM DRAGON MACHINERY DESIGN Co.,Ltd. Country or region before: China |