CN109332476A - A kind of mold and its method for laptop lower cover keyboard hole forming - Google Patents
A kind of mold and its method for laptop lower cover keyboard hole forming Download PDFInfo
- Publication number
- CN109332476A CN109332476A CN201811008013.8A CN201811008013A CN109332476A CN 109332476 A CN109332476 A CN 109332476A CN 201811008013 A CN201811008013 A CN 201811008013A CN 109332476 A CN109332476 A CN 109332476A
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- CN
- China
- Prior art keywords
- mold
- formed punch
- plate
- product
- die holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/24—Perforating, i.e. punching holes
- B21D28/34—Perforating tools; Die holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/24—Perforating, i.e. punching holes
- B21D28/26—Perforating, i.e. punching holes in sheets or flat parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D45/00—Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
- B21D45/02—Ejecting devices
- B21D45/04—Ejecting devices interrelated with motion of tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
A kind of mold and its method for laptop lower cover keyboard hole forming, mold includes upper die device and lower mold apparatus, shearing is punched out to product by mold and punching head, so that waste material is fallen by jigger pin and prevents formed punch from taking waste material out of, the technique for realizing one-step punching and being not necessarily to multiple clear away waste.The present invention uses downward one-step punching, goes out under product waste material, and the process for having subtracted multiple cleaning die surface waste material improves production efficiency, also avoids die surface damage, reduce maintenance cost；One-step punching is punched compared to by several times, is reduced the risk of product flange deformation, is improved product quality, reduce rejection rate, and the performance of enterprises is improved, and is suitble to volume production.
Description
Technical field
The invention belongs to cold-punching mold forming technique fields, and in particular to one kind for laptop lower cover keyboard hole at
The mold and its method of type.
Background technique
In recent years, laptop lower cover keyboard (as shown in Figure 1) has slowly been changed to aluminum component from original plastic parts processing
Anode machining, can be made a variety of different colors, and product is added usually by full aluminium block CNC machine-shaping using CNC omni mill
Work, it is of long duration, low output, at high cost, in today that competition is so fierce, production cost is reduced, production efficiency is improved, is promoted and produce
Quality is particularly important, and product just changes gradually by aluminum plate stock Cold Press Working.However, the key hole number due to keyboard is more, compared with
It is densely covered, and Kong Yukong scrap (bridge) is 2.2 ~ 2.4mm, punch process shearing strength is big, and initial stage, most of jump three times rushed processing, institute
With present industry largely using primary stamping, but consider mould strength, using upward punching, waste material not blanking and adopt
With the mode being ejected, it is ensured that mould strength.
In conclusion there is also many deficiencies for existing technology: gradation punching press then increases manufacturing procedure, and is punched by several times
Can be because product scrap (bridge) be small, product is easy flange deformation；Then waste material ejects upwards for primary punching upwards, every to produce and use once,
Die surface waste material will be cleared up once, troublesome in poeration, low efficiency, and waste material residual die surface is easy to make product by aluminium skimmings
It weighs wounded, fraction defective also can be higher.
Therefore, it devises and goes out under a kind of waste material that laptop lower cover keyboard hole may be implemented and can once complete to rush
The mold cut and its method solve the above problems.
Summary of the invention
To overcome the deficiencies in the prior art described above, it is an object of that present invention to provide one kind to be used for laptop lower cover key
The molding mold of disk hole and its method.
In order to achieve the above objects and other related objects, present invention provide the technical scheme that it is a kind of for notebook electricity
The mold of brain lower cover keyboard hole forming, the mold include upper die device and lower mold apparatus, the upper die device include by up to
Under set gradually upper pallet, on re-pack, upper die holder, upper padding plate, upper clamp plate, baffle plate and stripper plate, it is described on re-pack it is outer
Side is provided with top block, and the upper and lower end of the top block is connect with the upper pallet, upper die holder respectively, institute on re-pack with it is described
Be provided with buffer unit between upper pallet, it is described on the lower end that re-packs be provided with guide post, it is vertical that the guide post can move up and down formula
It is applied in the upper die holder, upper padding plate, in upper clamp plate, the lower end of the guide post is fixedly connected with the baffle plate, the upper pad
Several formed punches are provided with below plate, the upper end of the formed punch is fixed in the upper clamp plate, the lower end of the formed punch can on move down
Dynamic formula is applied in the baffle plate, in stripper plate vertically, and jigger pin, the upper end of the jigger pin are vertically arranged in the formed punch
It is provided with spring；The lower mold apparatus includes the lower template from top to bottom set gradually, lower bolster and lower die holder, the lower die dress
Be provided with blanking hole in setting, the blanking hole runs through the lower template, lower bolster and lower die holder setting vertically, the blanking hole with
The formed punch is correspondingly arranged up and down；The mold is symmetrical set.
Preferred technical solution are as follows: when the mold opening state, the lower end of the jigger pin is protruded under the formed punch
End setting, is provided with the movement clearance for punching between the upper clamp plate and the baffle plate.
Preferred technical solution are as follows: the movement clearance is greater than 5mm.
Preferred technical solution are as follows: the distance between the described upper pallet that re-packs on described is 35 ~ 40mm.
Preferred technical solution are as follows: the upper pallet, top block use bolt detachable connection between upper die holder.
Preferred technical solution are as follows: the lower end of the lower die holder is provided with bottom seat pad.
A method of molding keyboard hole enables the stripper plate including first product is placed in the lower template of the mold
Product compression is in the lower template；Then the formed punch is enabled to be punched out shearing to the product, while described
Jigger pin in formed punch ejects waste material；The formed punch is enabled to be detached from the product again, the jigger pin continues to withstand product at this time
Waste material；Finally, the upper die device is enabled to be detached from the lower mold apparatus.
Since above-mentioned technical proposal is used, the present invention has the advantage, that compared with prior art
The present invention uses downward one-step punching, goes out under product waste material, and the process for having subtracted multiple cleaning die surface waste material improves
Production efficiency also avoids die surface damage, reduces maintenance cost；One-step punching is punched compared to by several times, reduces production
The risk of product flange deformation, improves product quality, reduces rejection rate, and the performance of enterprises is improved, and is suitble to volume production.
Detailed description of the invention
Fig. 1 is laptop lower cover keyboard schematic diagram.
Fig. 2 is the mold overall schematic in the present invention.
Fig. 3 is mold setting in motion status diagram (product compression).
Fig. 4 is mold movement status diagram one (formed punch punching).
Fig. 5 is mold movement status diagram two (jigger pin liftout).
Fig. 6 is mold movement status diagram three (formed punch reset).
Fig. 7 is mold work completion status schematic diagram (punching is completed).
In the figures above, upper pallet 1, top block 2 above re-packs 3, upper die holder 4, upper padding plate 5, upper clamp plate 6, formed punch 7, backstop
Plate 8, stripper plate 9, lower template 10, lower bolster 11, lower die holder 12, bottom seat pad 13, jigger pin 14, guide post 15, spring 16, buffering dress
Set 17.
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book is understood other advantages and efficacy of the present invention easily.
Please refer to Fig. 1 ~ Fig. 7.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to
Cooperate the revealed content of specification, so that those skilled in the art understands and reads, being not intended to limit the invention can be real
The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size
It is whole, in the case where not influencing the effect of present invention can be generated and the purpose that can reach, it should all still fall in disclosed skill
Art content obtains in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", "left", "right", " centre " and
The term of " one " etc. is merely convenient to being illustrated for narration, rather than to limit the scope of the invention, relativeness
It is altered or modified, under the content of no substantial changes in technology, when being also considered as the enforceable scope of the present invention.
Embodiment: as shown in Fig. 2, a kind of mold for laptop lower cover keyboard hole forming, mold includes upper mold
Device and lower mold apparatus, upper die device include the upper pallet 1 from top to bottom set gradually, on re-pack 3, upper die holder 4, upper padding plate 5,
Upper clamp plate 6, baffle plate 8 and stripper plate 9,3 outside of above re-packing are provided with top block 2, the upper and lower end of top block 2 respectively with it is upper
Supporting plate 1, upper die holder 4 connect, and re-pack in institute and are provided with buffer unit 17 between 3 and upper pallet 1, and 3 lower end of above re-packing is provided with
Guide post 15, guide post 15 can move up and down formula and be applied in upper die holder 4, upper padding plate 5 vertically, in upper clamp plate 6, the lower end of guide post 15 with only
Baffle 8 is fixedly connected, and several formed punches 7 are provided with below upper padding plate 5, and the upper end of formed punch 7 is fixed in upper clamp plate 6, under formed punch 7
End can move up and down formula and be applied in baffle plate 8 vertically, in stripper plate 9, and jigger pin 14, jigger pin 14 are vertically arranged in formed punch 7
Upper end be provided with spring 16；Lower mold apparatus includes the lower template 10 from top to bottom set gradually, lower bolster 11 and lower die holder 12,
Be provided with blanking hole in lower mold apparatus, blanking hole runs through lower template 10, lower bolster 11 and lower die holder 12 vertically and is arranged, blanking hole with
About 7 formed punch is correspondingly arranged；Mold is symmetrical set.When mold opening state, under the lower end protrusion formed punch 7 of jigger pin 14
End setting, is provided with the movement clearance for punching between upper clamp plate 6 and baffle plate 8, movement clearance is greater than 5mm.
Note: " outside " in text refers to the horizontal direction far from mold center's line, and " inside " refers to the water close to mold center's line
Square to.The quantity of ejector pin needle is identical as 7 quantity of formed punch, and the quantity of formed punch 7 and arrangement position need the number of punching depending on product
Depending on amount and position.
The method for forming laptop lower cover keyboard hole:
1. enabling press machine push as shown in figure 3, product is put into mold, product compression is in lower template 10 by stripper plate 9；
2. mold is kept in motion as shown in figure 4, press machine is enabled to continue to push, formed punch 7 come into contact with product and to its into
Row punching shearing；
3. the jigger pin 14 in formed punch 7 ejects product waste material, and product waste material is under as shown in figure 5, press machine is enabled to continue to push
Material hole drops out；
4. formed punch 7 starts to be detached from product, and jigger pin 14 continues to withstand product at this time as shown in fig. 6, press machine is enabled to be opened upwards
Waste material prevents waste material from being taken out of by formed punch 7；
5. upper die device is detached from product as shown in fig. 7, press machine is enabled to continue up, punching press is completed.
Note: formed punch 7 uses difference of height 0.6mm, reduces one-step punching strength, and lower template 10 uses high-strength die tool
Steel, heat treatment is cold using ultra-deep, and heat treatment hardness moderately reduces to improve its toughness.Meanwhile lower bolster 11 and lower die holder 12
Heat treatment is increased using tool steel to improve intensity.
Preferred embodiment are as follows: re-pack on as shown in Fig. 2, the distance between 3 and upper pallet 1 are 35 ~ 40mm.Guarantee foot
The suitable buffer unit 17 of enough space installations.
Preferred embodiment are as follows: as shown in Fig. 2, detachable using bolt between upper pallet 1, top block 2, upper die holder 4
Formula connection.It is easy to disassemble, convenient for the installation and adjustment of above re-pack 3 and buffer unit 17.
Preferred embodiment are as follows: as shown in Fig. 2, the lower end of lower die holder 12 is provided with bottom seat pad 13.Convenient for product waste material
Smoothly fall and collect.
The present invention uses downward one-step punching, goes out under product waste material, the process for having subtracted multiple cleaning die surface waste material,
Production efficiency is improved, die surface damage is also avoided, reduces maintenance cost；One-step punching is punched compared to by several times, is reduced
The risk of product flange deformation, improves product quality, reduces rejection rate, and the performance of enterprises is improved, and is suitble to volume production.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (7)
1. a kind of mold for laptop lower cover keyboard hole forming, the mold includes upper die device and lower mold apparatus,
It is characterized by: the upper die device include the upper pallet from top to bottom set gradually, on re-pack, upper die holder, upper padding plate, upper folder
Plate, baffle plate and stripper plate, it is described on the outside that re-packs be provided with top block, the upper and lower end of the top block respectively with it is described
Upper pallet, upper die holder connection are re-packed and are provided with buffer unit between the upper pallet in institute, it is described on the lower end setting that re-packs
There is a guide post, the guide post can move up and down formula and be applied in the upper die holder, upper padding plate vertically, in upper clamp plate, under the guide post
End is fixedly connected with the baffle plate, and several formed punches are provided with below the upper padding plate, and the upper end of the formed punch is fixed on described
In upper clamp plate, the lower end of the formed punch can move up and down formula and be applied in the baffle plate vertically, in stripper plate, erect in the formed punch
It directly is provided with jigger pin, the upper end of the jigger pin is provided with spring；The lower mold apparatus includes from top to bottom setting gradually
Lower template, lower bolster and lower die holder are provided with blanking hole in the lower mold apparatus, and the blanking hole runs through the lower die vertically
Plate, lower bolster and lower die holder setting, the blanking hole are correspondingly arranged up and down with the formed punch；The mold is symmetrical set.
2. a kind of mold for laptop lower cover keyboard hole forming according to claim 1, it is characterised in that: institute
When stating mold opening state, the lower end setting of the formed punch, the upper clamp plate and the backstop are protruded in the lower end of the jigger pin
The movement clearance for punching is provided between plate.
3. a kind of mold for laptop lower cover keyboard hole forming according to claim 2, it is characterised in that: institute
Movement clearance is stated greater than 5mm.
4. a kind of mold for laptop lower cover keyboard hole forming according to claim 1, it is characterised in that: institute
Stating the distance between the described upper pallet that re-packs is 35 ~ 40mm.
5. a kind of mold for laptop lower cover keyboard hole forming according to claim 1, it is characterised in that: institute
State upper pallet, top block, between upper die holder using bolt detachable connection.
6. a kind of mold for laptop lower cover keyboard hole forming according to claim 1, it is characterised in that: institute
The lower end for stating lower die holder is provided with bottom seat pad.
7. a kind of method using mold molding keyboard hole described in any one of claim 1 ~ 6 claim, feature
Be: including first product being placed in the lower template of the mold, enable the stripper plate by product compression be it is described under
In template；Then the formed punch is enabled to be punched out shearing to the product, while the jigger pin in the formed punch ejects waste material；
The formed punch is enabled to be detached from the product again, the jigger pin continues to withstand product waste material at this time；Finally, enabling the upper die device de-
From the lower mold apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811008013.8A CN109332476A (en) | 2018-08-31 | 2018-08-31 | A kind of mold and its method for laptop lower cover keyboard hole forming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811008013.8A CN109332476A (en) | 2018-08-31 | 2018-08-31 | A kind of mold and its method for laptop lower cover keyboard hole forming |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109332476A true CN109332476A (en) | 2019-02-15 |
Family
ID=65292014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811008013.8A Pending CN109332476A (en) | 2018-08-31 | 2018-08-31 | A kind of mold and its method for laptop lower cover keyboard hole forming |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109332476A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109985958A (en) * | 2019-04-11 | 2019-07-09 | 重庆百钰顺科技有限公司 | The disposable punching structure in the hole keyboard of notebook computer KB |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59166328A (en) * | 1984-03-02 | 1984-09-19 | Hitachi Ltd | Press die |
| CN201862688U (en) * | 2010-11-02 | 2011-06-15 | 昆山乙盛机械工业有限公司 | Device for piercing and molding spring leaf |
| CN202185510U (en) * | 2011-07-15 | 2012-04-11 | 冠鸿光电科技（福建）有限公司 | Parent-subsidiary punch of die |
| US8827130B2 (en) * | 2010-07-27 | 2014-09-09 | Nhk Spring Co., Ltd. | Method and apparatus for ripping plate material, and plate material |
| CN204564918U (en) * | 2014-12-19 | 2015-08-19 | 重庆飞龙江利汽车部件有限公司 | Automobile engine cylinder-body right support punching blanking mould |
| CN206241066U (en) * | 2016-10-24 | 2017-06-13 | 广东长盈精密技术有限公司 | Stamping mold |
-
2018
- 2018-08-31 CN CN201811008013.8A patent/CN109332476A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59166328A (en) * | 1984-03-02 | 1984-09-19 | Hitachi Ltd | Press die |
| US8827130B2 (en) * | 2010-07-27 | 2014-09-09 | Nhk Spring Co., Ltd. | Method and apparatus for ripping plate material, and plate material |
| CN201862688U (en) * | 2010-11-02 | 2011-06-15 | 昆山乙盛机械工业有限公司 | Device for piercing and molding spring leaf |
| CN202185510U (en) * | 2011-07-15 | 2012-04-11 | 冠鸿光电科技（福建）有限公司 | Parent-subsidiary punch of die |
| CN204564918U (en) * | 2014-12-19 | 2015-08-19 | 重庆飞龙江利汽车部件有限公司 | Automobile engine cylinder-body right support punching blanking mould |
| CN206241066U (en) * | 2016-10-24 | 2017-06-13 | 广东长盈精密技术有限公司 | Stamping mold |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109985958A (en) * | 2019-04-11 | 2019-07-09 | 重庆百钰顺科技有限公司 | The disposable punching structure in the hole keyboard of notebook computer KB |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190215 |