CN109311220B

CN109311220B - System for creating a relief pattern on a substrate

Info

Publication number: CN109311220B
Application number: CN201780035856.4A
Authority: CN
Inventors: R·奥尔; 迈克尔·卡普; 克劳迪奥·罗特曼
Original assignee: Highcon Systems Ltd
Current assignee: Highcon Systems Ltd
Priority date: 2016-05-29
Filing date: 2017-05-25
Publication date: 2022-12-20
Anticipated expiration: 2037-05-25
Also published as: EP3463807A1; US20190084265A1; EP3463807A4; US11667099B2; GB201609458D0; WO2017208118A1; JP2019517400A; CN109311220A

Abstract

A die and counter die system for laminating a relief pattern to a substrate includes a male die membrane and at least one female die. The master mold includes a master contact surface including at least one cavity defining a relief pattern. The male mold film includes a flexible male mold contacting surface that is free of features in areas opposite the relief pattern on the at least one female mold. The system also includes a compression mechanism adapted to move the male mold film and the at least one female mold toward one another when the substrate is disposed between the male mold contacting surface and the female mold contacting surface so as to laminate the relief pattern onto the substrate.

Description

System for creating a relief pattern on a substrate

Technical Field

The present invention relates to die and counter die systems, and more particularly to die and counter die systems including a male die membrane and a counter female die.

Disclosure of Invention

According to an aspect of the invention, there is provided a system for laminating a relief pattern onto a substrate, the system comprising:

at least one master tool comprising a master contacting surface comprising at least one cavity defining a relief pattern; and

a male mold film comprising a flexible male mold contacting surface spaced apart from a female mold contacting surface, the male mold contacting surface being free of features in areas opposite the relief pattern on the at least one female mold; and

a compression mechanism adapted to move the male mold half and the at least one female mold half toward each other in an operating mode,

wherein, in an operational mode, when the substrate is disposed between the male mold contacting surface and the female mold contacting surface, the compression mechanism moves the male mold film and the at least one female mold toward each other, thereby causing the female mold contacting surface to engage the first broad surface of the substrate and the male mold contacting surface to engage the relatively broad surface of the substrate, so as to laminate the relief pattern onto the substrate.

In some embodiments, in the operating mode, the substrate is pushed into the at least one cavity, thereby forming a relief pattern on the substrate.

In some embodiments, at least a portion of the relief pattern is defined on a bottom surface of the cavity, and the substrate is pushed into the cavity to engage the relief pattern on the bottom surface so as to laminate the relief pattern to the substrate.

In some embodiments, the male mold film comprises a resilient male mold film. In some embodiments, the elastic male mold film comprises at least one of polyurethane, polybutadiene rubber, and polyisoprene rubber. In some embodiments, the elastic male mold film has a thickness in a range from 0.5mm to 5mm, 0.5mm to 4mm, 0.5mm to 3mm, 0.5mm to 2mm, or 0.5mm to 1mm.

In some embodiments, the flexible male mold film comprises a compressible male mold film. In some embodiments, the compressible male mold film comprises a plurality of layers.

In some embodiments, a compressible male mold film comprises:

a base layer;

a contact layer comprising a male die contact surface adapted to contact a substrate; and

a compressible layer disposed between and attached to the base layer and the contact layer.

In some embodiments, the compressible male die film has a compressibility in a range of between 5-30%, 6-30%, 9-25%, 9-20%, or 9-15% at 1.35MPa in a direction perpendicular to a broad face of the compressible male die film.

In some embodiments, the base layer has a thickness in a range from 0.15mm to 1mm.

In some embodiments, the base layer comprises a metal layer. In some embodiments, the metal layer comprises at least one of steel and aluminum.

In some embodiments, the substrate layer comprises a polymer layer. In some embodiments, the polymer layer comprises PET.

In some embodiments, the substrate layer comprises a fabric layer. In some embodiments, the fabric layer comprises a material selected from the group consisting of: polyester, rayon, and cotton. In some embodiments, the fabric layer comprises a woven fabric. In some embodiments, the woven fabric has a density in the range of 10 to 30 thread/cm.

In some embodiments, the fabric layer comprises at least two layers of fabric attached to each other. In some embodiments, at least two layers of fabric are laminated to each other.

In some embodiments, the fabric layer is impregnated with a rubber-based material. In some embodiments, the rubber-based material comprises a material selected from the group consisting of: acrylonitrile butadiene copolymer rubber, EPDM rubber, and neoprene rubber. In some embodiments, the rubber-based material includes at least one of a vulcanizing agent, a vulcanization accelerator, an auxiliary vulcanization accelerator, a filler, a reinforcing agent, a softener, a plasticizer, and an antioxidant.

In some embodiments, the compressible layer is adapted to reduce lateral deformation due to pressure applied to the male mold film in a direction perpendicular to the broad face of the male mold film. In some embodiments, the compressible layer is adapted to make the relief pattern laminated to the substrate sharper.

In some embodiments, the compressible layer has a thickness in a range of 0.15mm to 5mm, 0.15mm to 4mm, 0.15mm to 3mm, 0.15mm to 2mm, or 0.15mm to 1mm.

In some embodiments, the compressible layer comprises a rubber foam layer. In some embodiments, the rubber foam layer comprises a synthetic rubber. In some embodiments, the synthetic rubber comprises at least one material selected from the group consisting of: acrylonitrile-butadiene copolymer rubber, butadiene rubber, poly-isoprene rubber, butyl rubber, chloroprene rubber, EPDM rubber, and urethane rubber.

In some embodiments, the compressible layer is directly attached to the base layer. In some embodiments, the compressible layer is attached to the base layer by at least one of an adhesive and lamination.

In some embodiments, the contact layer comprises a rubber-based material. In some embodiments, the rubber-based material includes at least one synthetic rubber. In some embodiments, the synthetic rubber comprises at least one of: acrylonitrile-butadiene rubber (NBR), hydrogenated NBR, butadiene rubber, poly-isoprene rubber, chloroprene Rubber (CR), polyurethane rubber, polysulfide rubber, and acrylic rubber. In some embodiments, the rubber-based material further includes at least one of a vulcanizing agent, a vulcanization accelerator, an auxiliary vulcanization accelerator, a filler, a reinforcing agent, a softener, a plasticizer, and an antioxidant. In some embodiments, the rubber-based material comprises a compressible rubber-based material. In some such embodiments, the reinforcing agent is a component of a rubber-based material or formulation that increases the mechanical properties or strength of the rubber-based material, such as carbon black or glass fibers.

In some embodiments, the contact layer has a thickness in a range of 0.1mm to 5mm, 0.1mm to 4mm, 0.1mm to 3mm, 0.1mm to 2mm, or 0.1mm to 1mm.

In some embodiments, the compressible male mold film further comprises:

a reinforcing fabric layer adapted to provide structural reinforcement to the compressible male mold film; and

a rubber layer attached to the reinforcing fabric layer along its broad face.

In some embodiments, the reinforcing fabric layer comprises a woven fabric. In some embodiments, the reinforcing fabric layer comprises a material selected from the group consisting of: polyester, rayon, and cotton. In some embodiments, the reinforcing fabric layer is impregnated with a rubber-based material. In some embodiments, the reinforcing layer has a thickness in the range of 0.15mm to 1mm.

In some embodiments, the rubber layer has a thickness in a range of 0.15mm to 5mm, 0.15mm to 4mm, 0.15m to 3mm, 0.15mm to 2mm, or 0.15mm to 1mm.

In some embodiments, the first broad side of the rubber layer is attached to the first broad side of the reinforcing layer, the second broad side of the rubber layer is disposed adjacent the base layer, and the second broad side of the reinforcing layer is disposed adjacent the compressible layer.

In some embodiments, the compressible male mold film has a thickness in a range of 0.75mm to 10mm, 1mm to 9mm, 2mm to 8mm, or 3mm to 7 mm.

In some embodiments, the contact layer of the compressible male mold film has a shore a hardness ranging from 10 to 80 or 20 to 70.

In some embodiments, the compressible male mold film further comprises a surface modulation layer disposed between the base layer and the contact layer and adapted such that in an operating mode, the surface modulation layer responds by modulating at least one of a height and a surface area of a deformation formed on the contact layer when a pressure applied to the contact layer exceeds an amount of pressure required to fully compress the compressible layer.

In some embodiments, the surface modulation layer is attached to the compressible layer along a first broad side thereof and to the contact layer along a second broad side thereof.

In some embodiments, the surface preparation layer is adapted to inhibit the contact layer from separating from or rotationally displacing relative to the compressible layer during lamination of the relief pattern to the substrate. In some embodiments, the surface preparation layer is adapted to increase the amount of pressure applied to the contact surface upon lamination without damaging the substrate or the relief pattern laminated thereto.

In some embodiments, the surface preparation layer has a thickness in a range from 0.15mm to 1mm.

In some embodiments, the surface preparation layer comprises a fabric layer impregnated with a rubber-based material. In some embodiments, the fabric layer comprises a material selected from the group consisting of: polyester, rayon, and cotton. In some embodiments, the fabric layer comprises a woven fabric. In some embodiments, the woven fabric has a density in the range of 10 to 30 thread/cm.

In some embodiments, the rubber-based material is selected from the group consisting of: acrylonitrile butadiene copolymer rubber, EPDM rubber, and neoprene rubber. In some embodiments, the rubber-based material includes at least one of a vulcanizing agent, a vulcanization accelerator, and a softener.

In some embodiments, the contact layer of the compressible male mold film has a Shore A hardness in the range of 60-90 or 65-75.

In some embodiments, the compressible male mold film has a thickness in a range from 0.5mm to 10mm, 1mm to 8mm, 1mm to 6mm, 1mm to 5mm, 1mm to 3mm, or 1mm to 2 mm.

In some embodiments, the compression mechanism is adapted to apply sufficient pressure to the compressible male mold film in a direction perpendicular to the broad face of the compressible male mold film, thereby causing the compressible layer to absorb the pressure by compression until the compressible layer is substantially incompressible.

In some embodiments, after laminating the relief pattern onto the substrate, the relief pattern is sharper on a first surface of the substrate than on an opposite surface of the substrate.

In some embodiments, the master die includes a rule die adapted to laminate crease lines as relief patterns onto a substrate. In some embodiments, the rule die includes a channel formed in the master die.

In some embodiments, the master mold includes an imprint pattern adapted to imprint the substrate with an imprint pattern that is a relief pattern.

In some embodiments, the master mold includes at least one cavity disposed below a nominal surface line of the master mold, the at least one cavity defining at least a portion of the relief pattern.

In some embodiments, the relief pattern is defined by at least one wall surrounding a surface at or above the nominal surface line of the master mold, the wall having a wall height, and the side of the at least one wall distal to the relief pattern defines a gradient from the wall height to the nominal surface line of the master mold. In some embodiments, the gradient has an aspect ratio of at least 10, at least 15, or at least 20. In some embodiments, the profile of the gradient is linear. In some embodiments, the profile of the gradient is truncated. In some embodiments, the profile of the gradient has a complex geometry including at least one of a gaussian element, a sinusoidal element, and a parabolic element.

In some embodiments, the height of the die is less than 5mm, less than 4mm, less than 3mm, less than 2mm, or less than 1mm.

In some embodiments, at least one of the at least one female and male molds is mounted to the drum. In some embodiments, at least one master mold is mounted to a first drum and a male mold film is mounted to a second drum.

In some embodiments, the substrate comprises a fibrous substrate. In some embodiments, the fibrous substrate comprises a corrugated substrate. In some embodiments, the fibrous substrate comprises paper. In some embodiments, the paper comprises a paper coated with a metal foil. In some embodiments, the paper comprises a paper coated with a plastic coating. In some embodiments, the paper has a thickness in the range of from 0.1 to 5mm.

In some embodiments, the substrate comprises a metal foil. In some embodiments, the metal foil is selected from the group consisting of: copper foil and aluminum foil. In some embodiments, the metal foil comprises a shape memory metal alloy foil. In some embodiments, the metal foil has a thickness in the range of 0.02mm to 0.2 mm.

In some embodiments, the substrate comprises a plastic substrate. In some embodiments, the plastic substrate has a thickness in the range of 0.05 to-0.5 mm. In some embodiments, the system further comprises a heating mechanism for applying heat to the plastic substrate during lamination of the relief pattern onto the plastic substrate.

According to yet another aspect of the invention, there is provided a system for manufacturing a male mold contact surface comprising features, the system comprising:

a male mold film comprising a contact layer of a male mold film comprising a sheet of a non-elastic material, the contact layer being spaced apart from the female mold contacting surface, the male mold contacting layer being free of features in areas opposite the relief pattern on the at least one female mold; and

wherein in the operating mode the compression mechanism moves the male mold film and the at least one female mold tool towards each other, thereby laminating the relief pattern onto the contact layer of the male mold film. According to another aspect of the invention, there is provided a method of making a male mold contact surface comprising features, the method comprising:

providing a system as described above, wherein the contact layer of the male mold film comprises a featureless sheet of inelastic material;

a compression mechanism is employed to move the male and female mold dies toward each other, thereby applying pressure to the contact layer of the male mold film, and laminating the relief pattern onto the substrate,

wherein application of pressure to the contact layer of the male tooling membrane causes the contact layer to be pushed into the at least one cavity, thereby forming a male tooling comprising at least one feature on the contact layer, whereby at least a portion of the at least one feature is maintained after disengagement between the male tooling membrane and the at least one cavity.

In some embodiments, the feature of the male mold comprising the feature corresponds to at least one cavity of the female mold.

According to still another aspect of the present invention, there is provided a method of imprinting a substrate using a system including at least one master mold, the method including:

using the method described above to create at least one male mold having a shape corresponding to at least one female mold;

placing a substrate between the at least one master mold and the created at least one male mold; and

moving the at least one male mold toward the at least one female mold such that the at least one male mold engages a first broad surface of the substrate and the at least one female mold engages a relatively broad surface of the substrate to laminate a relief pattern corresponding to a shape of the at least one female mold onto the substrate.

According to another aspect of the present invention, there is provided a method for laminating a relief pattern onto a substrate, the method comprising:

a substrate is placed between at least one of the female and male mold films,

wherein at least one master mold comprises a master contact surface comprising at least one cavity defining a relief pattern,

and wherein the male mold film comprises a flexible male mold contacting surface spaced apart from the female mold contacting surface, the male mold contacting surface being free of features in areas opposite the relief pattern on the at least one female mold; and

moving the at least one female mold and the male mold film toward each other such that the female mold contacting surface engages the first broad surface of the substrate and the male mold contacting surface of the male mold film engages the relatively broad surface of the male mold film, thereby laminating the relief pattern layer onto the substrate.

In some embodiments, the male mold film comprises a compressible male mold film comprising:

a base layer;

a compressible layer disposed between and attached to the base layer and the contact layer;

and wherein moving comprises moving the at least one female mold half and the compressible male mold half toward each other to apply sufficient pressure to the compressible male mold half in a direction perpendicular to the broad face of the compressible male mold half, thereby causing the compressible layer to absorb pressure by compression until the compressible layer is substantially incompressible.

In some embodiments, the substrate comprises a plastic substrate. In some embodiments, the plastic substrate has a thickness in the range of 0.05 to-0.5 mm. In some embodiments, the method further comprises applying heat to the plastic substrate during lamination of the relief pattern onto the plastic substrate.

Drawings

The invention is herein described, by way of example only, with reference to the accompanying drawings. With specific reference now to the drawings in detail, it is stressed that the particulars shown are by way of example and for purposes of illustrative discussion of the preferred embodiments of the present invention only, and are presented in the cause of providing what is believed to be the most useful and readily understood description of the principles and conceptual aspects of the invention. In this regard, no attempt is made to show structural details of the invention in more detail than is necessary for a fundamental understanding of the invention, the description taken with the drawings making apparent to those skilled in the art how the several forms of the invention may be embodied in practice. Like reference numerals are used to designate like elements throughout the drawings.

In the drawings:

FIGS. 1A and 1B are schematic cross-sectional views of two embodiments of a male mold film and a female mold system of the present invention for laminating a relief pattern onto a substrate according to aspects of the present invention;

FIGS. 2A and 2B are schematic cross-sectional views of two embodiments of the compressible male and female mold systems of the present invention for laminating a relief pattern onto a substrate, according to aspects of the present invention;

FIGS. 3A, 3B and 3C are schematic cross-sectional views of embodiments of compressible male mold membranes of the present invention that can be used in the systems of FIGS. 2A and 2B, according to aspects of the present invention;

FIGS. 4A, 4B, 4C, 4D, and 4E are schematic cross-sectional views of embodiments of a master mold suitable for use in the system of the invention of FIGS. 1A-2B;

FIGS. 5A, 5B, and 5C are photographs of master molds having different gradient aspect ratios that can be used in the system of FIGS. 1A-2B;

FIGS. 6A, 6B, and 6C are photographs of a substrate imprinted using the system of FIGS. 2A through 2B and the corresponding dies of FIGS. 5A, 5B, and 5C; and

fig. 7 is a cross-sectional schematic view of a characteristic of a substrate imprinted using the system of fig. 1A-2B.

Description of the preferred embodiments

Referring now to fig. 1A and 1B, schematic cross-sectional views of two embodiments of the inventive male and female mold systems for laminating a relief pattern onto a substrate according to aspects of the invention, and to fig. 2A and 2B, schematic cross-sectional views of two embodiments of the inventive compressible male and female mold systems for laminating a relief pattern onto a substrate according to aspects of the invention.

As shown in fig. 1A-2B, a system 100 for laminating a relief pattern onto a substrate includes a master 102 mounted on a base 104 and having a master contact surface 106 including at least one cavity 108 for defining a relief pattern to be laminated onto a substrate as described below. The substrate 104 may be a flat or planar substrate, as shown in fig. 1A and 2A, or may be a rotating drum, as shown in fig. 1B and 2B.

In the illustrated embodiment, the master mold 102 includes a single cavity 108 for defining a rule die adapted to laminate crease lines as relief patterns onto a substrate. In other embodiments, the master mold 102 includes an imprint die that is adapted to imprint a substrate to form a relief pattern thereon. However, it should be understood that the master mold 102 can have any suitable structure, including textual and/or textural patterns.

The master mold 102 and/or the portions defining the relief pattern can be formed from a metal, a polymeric material, or any other suitable material, and can be created using any suitable mechanism, including inkjet printing, three-dimensional printing, etching, or mechanical cutting, for example, by a Computer Numerical Control (CNC) machine. In some embodiments, the master mold 102 and/or portions defining the relief pattern can be formed using surface-adhesive-rule techniques, such as those described by applicants in PCT application PCT/IL 2011/000389. Disposed opposite and spaced from the female mold half 102 is a male mold film comprising a flexible male mold contact surface 111 mounted on a substrate 112. In some embodiments, such as those shown in fig. 1A and 1B, the male mold film is an elastic, incompressible film 110, for example, formed of polyurethane, polybutadiene rubber, or polyisoprene rubber. In some such embodiments, male mold film 110 has a thickness in the range of 0.5-5 mm.

In other embodiments, such as those shown in fig. 2A and 2B, the male mold film is a compressible male mold film 113. As explained in further detail below with reference to fig. 3A-3C, compressible male mold 113 includes at least: a base layer 114 adjacent to the base 112; a contact layer 116 disposed relative to the master contact surface 106 of the master 102 and defining a male contact surface 111; and a compressible layer 118 disposed between the base layer 114 and the contact layer 116. In some such embodiments, male mold film 113 has a thickness in a range of 0.5mm to 10mm, 1mm to 9mm, 1mm to 8mm, 1mm to 5mm, 1mm to 3mm, 1mm to 2mm, 2mm to 8mm, or 3mm to 7 mm.

The

male mold films

110 and 113 are free of features or generally flat films at least in the areas opposite the relief pattern of the female mold 102. In some embodiments, the

male mold films

110 and 113, or at least the contact surface 111, are completely free of features, while in other embodiments, the

male mold films

110 and 113 can include one or more features in the areas not opposite the relief pattern of the female mold 102, whether features of the male mold, features of the female mold, texture, or any other features.

The substrate 112 may be a flat or planar substrate, as shown in fig. 1A and 2A, or may be a rotating drum, as shown in fig. 1B and 2B.

In some embodiments where both

substrates

104 and 112 are rotating drums, as shown in fig. 1B and 2B, the

rotating drums

104 and 112 may have the same diameter.

A compression mechanism is functionally associated with the female mold half 102 and with the

male mold film

110 or 113, or with the

substrates

104 and 112, and is adapted to move at least one of the female mold half 102 and the

male mold film

110 or 113 toward each other, as indicated by arrows 120. The compression mechanism may be any suitable compression mechanism, such as a gear-based mechanism or a hydraulic mechanism.

In the operating mode, the substrate 130 is placed between the master contact surface 106 and the male contact surface 111, and the compression mechanism moves the master 102 and the

male film

110 or 113 toward each other, thereby causing the master contact surface 106 to engage a first surface 132 of the substrate and the male contact surface 111 of the

male film

110 or 113 to engage an opposing surface 134 of the substrate in order to laminate the relief pattern defined by the one or more cavities 108 of the master contact surface 106 onto the substrate 130. Specifically, in the operating mode, the substrate 130 is pushed into the cavity or cavities 108 of the master mold 102 by the

male mold film

110 or 113, thereby forming a relief pattern on the substrate 130.

In the context of the present application and the claims herein, the term "substrate" relates to a workpiece having a laminatable substrate which, after lamination of a broad surface of the substrate by a die and counter die system, the lamination pattern is retained or at least substantially retained after disengagement from the die and counter die system at ambient conditions and/or above ambient conditions. Such substrates typically include fibrous paper substrates (including but not limited to paper, boxboard, cardboard, metallized coated cardboard, laminated paper, and laminated cardboard), and metal foils (e.g., aluminum foil, copper foil, and shape memory metal alloy foils such as nitinol foil), as well as various plastic films, including shape memory plastic films such as polyurethane shape memory plastic films.

In some embodiments, the substrate 130 may be a fibrous substrate such as paper, boxboard, or cardboard, which may be corrugated, and may have a thickness in the range of 0.1-5 mm.

In some embodiments, the substrate may be a paper laminated with a plastic film such as polypropylene or polyester film, and may have a thickness in the range of 0.1mm to 5mm. In some embodiments, the substrate may be paper covered with a metal coating and may have a thickness in the range of 0.1mm to 5mm.

In some embodiments, the substrate may be a metal foil, such as an aluminum foil or a copper foil, and may have a thickness in a range of 0.02mm to 0.2 mm.

In some embodiments, the substrate may be a shape memory metal alloy foil, such as a nitinol foil, which may have a thickness in a range of 0.02mm to 0.2 mm.

In some embodiments, the substrate may be a plastic substrate such as polyvinyl chloride, polypropylene, polycarbonate, or polyester, or a polyurethane shape memory plastic film, which may have a thickness in the range of 0.05mm to 0.5mm. In some such embodiments, laminating the relief pattern to the substrate may be accomplished at elevated temperatures, as in the case of thermal embossing or thermal embossing as is known in the art. In some such embodiments, heat may be applied to the interior of the substrate by heating the base 104, such as via electrical heating by flowing a hot fluid through the base or via the drum surface, or may be applied to the exterior of the substrate, such as by placing a heat source, such as a halogen lamp, near the male mold, thereby causing the substrate and/or the relief pattern to be heated during the lamination process.

Referring now to fig. 3A, 3B, and 3C, fig. 3A, 3B, and 3C are schematic cross-sectional views of a compressible male mold film 113 of the present invention mounted to a substrate 112 and usable with the system of fig. 2A and 2B, according to aspects of the present invention.

Fig. 3A shows a substantially compressible male mold 113A mounted to a substrate 112 and including a substrate layer 114, a compressible layer 118, and a contact layer 116, as described above with reference to fig. 2A and 2B.

In some embodiments, the base layer 114, which may also be considered a support layer adapted to mechanically support the male mold film 113a, may have a thickness in the range of 0.15mm to 1mm.

In some embodiments, the base layer 114 comprises a metal layer, such as an aluminum or steel layer.

In some embodiments, the base layer 114 comprises a polymer layer, such as a PET layer.

In some embodiments, substrate layer 114 comprises a fabric or textile layer, specifically a fabric layer such as a polyester, rayon, or cotton layer. In some embodiments, the fabric layer may comprise a woven fabric, which in some embodiments has a density in the range of 10-30 threads/cm.

In some embodiments, the base layer 114 comprises two or more layers of fabric attached directly to each other, for example, by lamination, adhesives, or any other suitable attachment method known in the art.

In some embodiments, the fabric forming the base layer 114 includes or is impregnated with a rubber-based material, such as acrylonitrile-butadiene copolymer rubber, butadiene rubber, neoprene, or EPDM rubber. The rubber-based material may be incorporated into the fabric by using any suitable method known in the art, such as by coating the rubber material onto the fabric using a knife coater or by calendering. In some embodiments, the rubber-based material includes vulcanizing agents, such as organic peroxides, as well as sulfur, organic sulfur-containing compounds, and the like. In some embodiments, the rubber-based material includes vulcanization accelerators, such as inorganic accelerators (e.g., calcium hydroxide, magnesium oxide (MgO), and the like) and organic accelerators (e.g., thiurams, dithiocarbamates, and thiazoles). In some embodiments, the rubber-based material includes a softening agent, such as fatty acids, cottonseed oil, tall oil, asphaltic materials, paraffin, and the like.

Compressible layer 118 is adapted to reduce lateral deformation caused by pressure applied to male mold film 113 a. In addition, the compressible layer is adapted to make the relief pattern laminated to the substrate sharper, such as by making the embossments or creases to the embossed features or crease lines deeper, sharper in angle, and so forth.

In some embodiments, compressible layer 118 has a thickness in a range of 0.15mm to 5mm, 0.15mm to 4mm, 0.15mm to 3mm, 0.15mm to 2mm, or 0.15mm to 1mm. In some embodiments, the compressibility of compressible layer 118 is due to the foam content therein.

In some embodiments, compressible layer 118 comprises a rubber foam layer, which may include synthetic rubber as its rubber matrix. In some such embodiments, the synthetic rubber may include one or more of the following: acrylonitrile-butadiene copolymer rubber, butadiene rubber, polyisoprene rubber, butyl rubber, chloroprene rubber, EPDM rubber and polyurethane rubber. The compressible layer may be produced using any suitable method known in The art, for example, a leaching method, as described in Encyclopedia of Polymer Science and Technology, concise (brief Encyclopedia of Polymer Science and Technology), 3 rd edition by Herman F.Mark, or a blowing agent method, as described in The Complete Book of Rubber Processing and Compounding Technology, 2 nd revision of The Complete Book of Rubber Processing and Compounding Technology (appended mechanical Details), NIIR Board of Consultants and Engineers,2016 (American society of Engineers and Engineers, 2016), all of which are incorporated by reference as if fully set forth herein. In some such embodiments, the support substrate used in the leaching process may be a fabric layer, such as a woven fabric layer. It should be appreciated that the amount of foam in the compressible layer 118 may depend on the amount of water-soluble powder used in the leaching process.

The compressible layer 118 may be attached directly to the base layer 114, such as by lamination or by means of an adhesive, or may be attached to an intermediate layer.

In some embodiments, the contact layer 116 has a thickness in a range of 0.1mm to 5mm, 0.1mm to 4mm, 0.1mm to 3mm, 0.1mm to 2mm, or 0.1mm to 1mm, and a shore a hardness in a range of 20-90, 30-90, 40-90, 50-90, 60-90, 20-70, 30-70, or 65-75. The contact layer 116 comprises a rubber-based material, which in some embodiments comprises at least one synthetic rubber. In some such embodiments, the synthetic rubber comprises at least one of: acrylonitrile-butadiene rubber (NBR), hydrogenated NBR, butadiene rubber, poly-isoprene rubber, butyl rubber, neoprene rubber (CR), EPDM rubber, urethane rubber, and acrylic rubber. In some embodiments, the contact layer 116 includes polysulfide rubber in addition to one or more synthetic rubbers.

In some embodiments, the rubber-based material further includes a vulcanizing agent, such as an organic peroxide (e.g., benzoyl peroxide, etc.), sulfur, or an organic sulfur-containing compound (e.g., tetramethylthiuram disulfide, N-dithiodimorpholine, etc.). In some embodiments, the vulcanizing agent is added in an amount ranging from 0.3 to 4 parts by weight, preferably from 0.5 to 3 parts by weight, based on 100 parts by weight of the rubber material.

In some embodiments, the rubber-based material further comprises a vulcanization accelerator, such as an inorganic accelerator (e.g., calcium hydroxide, magnesium oxide (MgO), etc.), or an organic accelerator such as a thiuram (e.g., tetramethylthiuram disulfide, tetraethyl-thiuram disulfide, etc.), a dithiocarbamate (e.g., zinc dibutylthiocarbamate, zinc diethyldithiocarbamate, etc.), a thiazole (e.g., 2-mercaptobenzothiazole, N-dicyclohexyl-2-benzothiazolesulfenamide, etc.), and a thiourea (e.g., trimethylthiourea, 30n, N' -diethylthiourea, etc.).

In some embodiments, the rubber-based material may also include auxiliary vulcanization accelerators, fillers, reinforcing agents, softeners, plasticizers and/or antioxidants.

In some embodiments, the rubber-based material may comprise a rubber-based compressible material, such as a rubber foam.

Turning to the embodiment shown in fig. 3B, male mold 113B is adapted to be mounted to substrate 112. The compressible reverse membrane 113b includes a base layer 114, a compressible layer 118, and a contact layer 116, the layers being substantially as described above, and further including a surface preparation layer 140. The surface preparation layer may have a thickness in the range of 0.15mm to 1mm.

The surface modulation layer 140 may be attached to the compressible layer 118 along a first broad side thereof and may be attached to the contact layer 116 along a second broad side thereof.

Without wishing to be bound by theory, the inventors should appreciate that the surface preparation layer 140 as described herein is adapted to inhibit or prevent the contact layer 116 from separating from or rotationally displacing relative to the compressible layer 118 during lamination of the relief pattern to the substrate.

Additionally, and without wishing to be bound by theory, the inventors should appreciate that when the compressible layer 118 is fully compressed and additional pressure is applied to the contact surface 116, the resulting deformation of the compressible layer 118 is inhibited by the surface modulation layer 140, thereby causing the deformation occurring on the contact surface of the contact layer 116 to be modulated to be lower or more extensive than, for example, the deformation occurring in the compressible male mold film 113A of FIG. 3A under the same pressure conditions. Thus, when a compressible male mold film 113b is used, a greater amount of pressure may be applied to the contact layer 116 during lamination than when a compressible counter film 113a is used without damaging the substrate 130 or the relief pattern laminated thereto.

In some embodiments, the surface preparation layer 140 comprises a fabric layer impregnated with a rubber-based material. In some embodiments, the fabric layer may comprise a cotton, rayon, or polyester layer. In some embodiments, the fabric layer comprises a woven fabric, which may have a density in the range of 10-30 thread/cm.

In some embodiments, the surface preparation layer 140 comprises two or more layers of fabric directly attached to each other, for example, by lamination, adhesive, casting, co-extrusion, or any other suitable attachment method known in the art. In some embodiments, the surface preparation layer 140 comprises a sponge layer.

In some embodiments, the rubber-based material by which the fabric layer is impregnated includes at least one of acrylonitrile butadiene copolymer rubber, EPDM rubber, and neoprene rubber. The rubber-based material may be incorporated into the fabric by using any suitable method known in the art, such as by coating the rubber material onto the fabric using a knife coater or by calendering. In some embodiments, the rubber-based material includes vulcanizing agents, such as organic peroxides, as well as sulfur, organic sulfur-containing compounds, and the like. In some embodiments, the rubber-based material includes a vulcanization accelerator, such as an inorganic accelerator (e.g., calcium hydroxide, magnesium oxide (MgO), etc.) and/or an organic accelerator (e.g., thiuram, dithiocarbamate, thiazole, etc.). In some embodiments, the rubber-based material includes a softening agent, such as fatty acids, cottonseed oil, tall oil, asphaltic materials, paraffin, and the like. Referring now to the embodiment shown in FIG. 3C, a compressible male mold 113C is adapted to be mounted to the base 112. Compressible male mold 113c includes a base layer 114, a compressible layer 118, and a contact layer 116, the layers being substantially as described above, and further including a reinforcing layer 142 and a rubber layer 144. The reinforcing layer 142 may have a thickness ranging from 0.15mm to 1mm, and the rubber layer 144 may have a thickness ranging from 0.15mm to 5mm, 0.15mm to 4mm, 0.15m to 3mm, 0.15mm to 2mm, or 0.15mm to 1mm.

The reinforcing layer 142 may be a fabric layer, such as a cotton, rayon, or polyester layer, which may include a woven fabric. In some embodiments, the woven fabric may be impregnated with rubber, substantially as described above for the base layer 114 and the surface preparation layer 140.

The rubber layer 144 may comprise any suitable rubber, such as EPDM, polyurethane, natural rubber, silicone rubber, or asphalt rubber. The rubber layer may be formed by any suitable method known in the art, such as melting, simulated impregnation, two-component reactive materials, or controlled and thermo-compression.

In the illustrated embodiment, the reinforcing layer 142 is disposed above and directly adjacent to the rubber layer 144, and the

layers

142 and 144 are disposed between the compressible layer 118 and the base layer 114. However, it should be appreciated that the reinforcement layer 142 and the rubber layer 144 may be disposed at other locations between the base layer 114 and the contact layer 116.

In some embodiments, the compressible

male mold films

113a, 113b, and 113c have a compressibility in a range of 5-30%, 6-30%, 9-25%, 9-20%, or 9-15% at 1.35MPa in a direction perpendicular to their broad faces.

In some embodiments, the compressible

male mold films

113a, 113b, and 113c can have a thickness in a range from 0.5mm to 10mm, 0.5mm to 8mm, or 1mm to 7 mm. In some embodiments, the compressible reverse membranes 113a and 113b may have a thickness in a range of 0.5mm to 4mm, 1mm to 3mm, or 1mm to 2 mm. In some embodiments, the compressible reverse membrane 113c may have a thickness in a range from 2mm to 8mm or 3mm to 7 mm.

Referring now to fig. 4A, 4B, 4C, and 4D, schematic cross-sectional views of embodiments of a master mold suitable for use in the inventive system of fig. 1A-2B.

As shown in fig. 4A, the master mold 102 mounted on the substrate 104 includes one or more cavities 108 disposed below a nominal surface line of the master mold, here represented by dashed lines 150. The one or more cavities 108 define at least part of the relief pattern. In some embodiments, the master die 102 can be a rule die, and the cavities can be channels formed in the master die 102 so as to define crease lines as a relief pattern. In other embodiments, one or more cavities may define an imprint pattern as a relief pattern. It will be appreciated that when the master mold 102 of FIG. 4A is used, the relief pattern is not surrounded by the artificial relief pattern resulting from the die structure, but rather the substrate surrounding the relief pattern remains unchanged.

In some embodiments, the depth of the cavity 108 is less than 5mm, less than 4mm, less than 3mm, less than 2mm, or less than 1mm relative to the nominal surface line 150. In the embodiment shown in fig. 4A, the height of the die is considered to be equal to the depth of the deepest cavity 108 in the die.

FIG. 4B shows the master 102 with the cavity 108 defined between two rule lines 152 that extend above the nominal surface line of the die to a height H, thereby placing the cavity at the nominal surface line 150 of the die. The distance between the rule 152, and the width of the cavity 108, is identified by D, which in some embodiments is less than 0.5mm. In some embodiments, the master die 102 can be a rule die, and the cavities can be channels formed in the master die 102 so as to define crease lines as a relief pattern. In other embodiments, one or more cavities may define an imprint pattern as a relief pattern.

It can be appreciated that the wall 154 of the slug 152 distal to the cavity 108 is substantially perpendicular to the nominal surface line 150 of the die. Thus, when laminating the relief pattern onto the substrate, artificial impressions may be formed around the relief pattern, but the ramp drops from height H to the nominal height of the die, as shown in the embodiment of fig. 6A.

In some embodiments, the height H of the master 102 or rule 152 is less than 5mm, less than 4mm, less than 3mm, less than 2mm, or less than 1mm.

Fig. 4C and 4E show the master mold 102 with the cavity 108 defined between two protrusions 162 that extend to a height H above the nominal surface line 150 of the die, thereby placing the cavity on the nominal surface line of the die. The protrusions have sides 164 adjacent the cavities 108 that are substantially perpendicular to the nominal surface line of the die, or at a desired angle for forming the relief surface. The opposing side 166 (fig. 4C) or 196 (fig. 4E) of the protrusion distal to the cavity 108 defines a gradient 150 from the height H of the protrusion to the nominal surface line of the die. The length of the gradient is defined from the edge of the cavity 108 to the point where the gradient reaches the nominal surface line of the die and is identified as L1 in fig. 4C and L2 in fig. 4E.

As explained in further detail below with reference to fig. 5A-6C, to avoid artificial embossing or creasing of the substrate, the gradient of side 166 and/or side 196 must be sufficiently gentle so as not to significantly affect the paper. Thus, in some embodiments, the aspect ratio of the gradient is at least 10, at least 15, or at least 20.

The profile of the gradient may be any suitable gradient, such as a linear gradient terminating at a highest point above the nominal surface line, a truncated linear gradient, as shown by side 166 of the cavity 108 in FIG. 4C, or a gradient having a complex geometry, such as a gradient defined by a function comprising a Gaussian, sinusoidal, or parabolic element, as shown by side 196 of the cavity 108 in FIG. 4E. Such gradients may still result in visible impact to the substrate outside or around the embossed or creased area due to the acute angle formed at the highest point of the linear gradient, and thus may be unsuitable in certain embodiments. In embodiments where multiple patterns are laminated onto a substrate in close proximity to each other, it may be advantageous to have a gradient of complex geometry, as shown in fig. 4E. This is because a gradient with a complex shape can provide the same effect as a truncated linear gradient while affecting a smaller radius around the lamination pattern, since the length of a gradient with a complex form (e.g., L2 in fig. 4E) is smaller than the length of a linear gradient or a truncated linear gradient (e.g., L1 in fig. 4C).

In some embodiments, the height H of the master mold 102 or protrusions 162 is less than 5mm, less than 4mm, less than 3mm, less than 2mm, or less than 1mm.

Turning to fig. 4D, it can be seen that, in some embodiments, at least a portion of the relief pattern is defined on a bottom surface 180 of the cavity 108 of the die 102. In the exemplary embodiment shown, portions of the relief pattern are defined by protrusions 182 along a portion of the floor 180 of the cavity, thereby providing grooves in the resulting imprint pattern. It will be appreciated that in some embodiments in which the relief pattern is defined along the bottom surface 180 of the cavity 108 of the master mold 102, in use, the substrate must be pushed into the cavity 108 to its full depth in order to engage the relief pattern onto the bottom surface of the cavity.

Referring now to fig. 5A, 5B and 5C, fig. 5A, 5B and 5C show photographs of master molds having different gradient aspect ratios that can be used in the system of fig. 1A to 2B, and referring to fig. 6A, 6B and 6C, fig. 6A, 6B and 6C show photographs of substrates imprinted using the system of fig. 2A to 2B and the corresponding dies of fig. 5A, 5B and 5C.

Fig. 5A-5C show respective

circular master molds

200a, 200b, and 200C that include cavities 202 that decoratively form the shape of the letter DART and are mounted on a substrate surface 204.

To prepare the dies 200a, 200b, and 200c, two-dimensional images of the die pattern to be the cavity 202 are prepared using Adobe Illustrator software.

Two-dimensional images were printed onto SH92 micron PET film, commercially available from SKC inc, georgia, usa, using a DMPS 4275 flat UV printer commercially available from DMPS co. Ltd is commercially available inkjet ink from DMPS co, korea for layered printing at a printing resolution of 2880x1440dpi using all cmykwww colors in "white mode". Three layer printing resulted in a die with a height H of 280 microns in the area without the gradient.

Fig. 6A-6C illustrate respective paper substrates 210a, 210B, and 210C imprinted using the system of fig. 2A or 2B, and using master molds 200a, 200B, and 200C, respectively. For embossing, 300gsm Invercote Creatoo paper commercially available from Iggesund of Sweden, with the respective dies 200a, 200B, and 200C mounted thereon, and an elastic male mold film as described above with reference to FIGS. 1A and 1B, was embossed using a CDP500 roll die cutter commercially available from Hengsilver mechanical manufacturing, inc., of Beijing, china.

As shown, each

substrate

210a, 210b, and 210c has a relief pattern 212 imprinted thereon, including the letters DART in the pattern corresponding to cavities 202 of master mold 200. The letters in the embossed pattern 212 mirror the letters displayed on the die 200 when the die is placed over the paper during the embossing process.

Turning specifically to fig. 5A and 6A, it can be seen that in the die 200a of fig. 5A, the sidewall 206A on the far side of the cavity 202 is substantially perpendicular to the base surface 204. Thus, when die 200a is pressed against compressible male mold film 113 (fig. 2A and 2B), the artificial pattern corresponding to the die boundary is clearly formed on the substrate, as shown by circle 214a in fig. 6A. The size of circle 214a corresponds to the size of die 200 a.

In fig. 5B, the sidewall 206B on the distal side of the cavity 202 of the die 200B has a steep linear gradient, as described above with reference to fig. 4C. The aspect ratio of the gradient is 6. Thus, when die 200B is stamped against compressible male mold surface 113 (fig. 2A and 2B), the artificial pattern corresponding to the die boundary is not visible on the substrate, as shown by circle 214B in fig. 6B. The size of the circle 214b corresponds to the size of the die 200 b.

In fig. 5C, the sidewall 206C on the distal side of the cavity 202 of the die 200C has a smooth linear gradient, as described above with reference to fig. 4C. The aspect ratio of the gradient is 32. Thus, when the die 200C is pressed against the compressible male mold film 110 (fig. 2A and 2B), no artificial pattern is visible on the substrate, as shown in fig. 6C.

As can be seen from a comparison of fig. 5A, 5B and 5C, the greater the aspect ratio of the gradient of the die sidewall 206, the greater the overall size or footprint of the die. However, as can be seen from a comparison of fig. 6A, 6B and 6C, a change in the gradient of the die sidewall does not affect the size, transparency or imprinting depth of the relief pattern imprinted onto the substrate.

Referring now to fig. 7, fig. 7 is a cross-sectional schematic view of a characteristic of a substrate imprinted using the system of fig. 1A-2B.

As shown in fig. 7, the substrate 220 imprinted using the system of fig. 1A-2B includes a first broad surface 222 that engages the master mold 102, and a second, opposite broad surface 224 that engages the

male mold film

110 or 113. As shown in fig. 7, a particular feature of the present invention is that the relief pattern laminated to the substrate 220 is sharper on the surface 222 engaging the female mold half 102 than on the opposite surface 224 engaging the

male mold half

110 or 113.

In the context of the present application and its claims, the terms "sharpness of the relief pattern", "sharper relief pattern", and the like, refer to the definition of the relief pattern applied on the substrate and include parameters such as the depth of the relief pattern, the angular curvature of the relief pattern, the angular size of the relief pattern, and the like. For example, if the angles in the relief pattern have appropriate corners rather than curved corners, the relief pattern may be considered sharper or sharper. As another example, if the depth of the relief pattern (or the height of the embossed relief pattern) is greater, the relief pattern may be considered sharper or sharper. As yet another example, if the angle of the relief pattern is a sharper angle (geometrically), the relief pattern may be considered sharper or sharper. As another example, the identification of fold lines in the relief pattern is easier and the relief pattern can be considered more distinct or sharper.

In some embodiments, the system of fig. 1A-2B can be used to create a male mold contact surface with features. In such embodiments, the contact layer of the male mold half comprises a featureless sheet of flexible, non-elastic material, such as aluminum or steel. The compression mechanism is used to move the male and female mold halves towards each other, thereby applying pressure to the contact layer of the male mold half, and the contact layer of the male mold half and the substrate (if it is included in the process) are pushed into the cavity of the female mold half. Thus, the cavity of the female mold half becomes laminated on the male contact surface, thereby forming features on the male contact surface that correspond in shape to the cavity of the female mold half.

In the context of the present application and the claims herein, the term "attached" relates to a direct attachment between two objects via an adhesive layer, or an attachment between two objects via one or more intermediate objects or layers.

It is appreciated that certain features of the invention, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable subcombination.

While the invention has been described in conjunction with specific embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. Accordingly, it is intended to embrace all such alternatives, modifications and variations that fall within the spirit and broad scope of the appended claims. All publications, patents, and patent applications mentioned in this specification are herein incorporated in their entirety by reference into the specification, to the same extent as if each individual publication, patent, or patent application was specifically and individually indicated to be incorporated herein by reference. In addition, citation or identification of any reference in this application shall not be construed as an admission that such reference is available as prior art to the present invention.

Claims

1. A system for laminating a relief pattern onto a substrate, the system comprising:

at least one master tool including a master contacting surface including at least one cavity defining the relief pattern, wherein at least a portion of the relief pattern is defined on a bottom surface of the at least one cavity, and

a compressible male mold film comprising a flexible male mold contacting surface spaced apart from the female mold contacting surface, the flexible male mold contacting surface being free of features in areas opposite the relief pattern on the at least one female mold, and

a compression mechanism adapted to move the compressible male mold film and the at least one female mold toward each other in an operating mode,

wherein, in the operational mode, when the substrate is disposed between the flexible male mold contacting surface and the female mold contacting surface, the compression mechanism moves the compressible male mold film and the at least one female mold toward each other, thereby causing the female mold contacting surface to engage a first broad surface of the substrate, and the flexible male mold contacting surface to engage an opposite broad surface of the substrate such that the substrate is pushed into the at least one cavity to engage the relief pattern on the bottom surface, so as to laminate the relief pattern onto the substrate.

2. The system of claim 1, wherein the compressible male mold film comprises an elastic male mold film.

3. The system of claim 1, wherein the compressible male mold film comprises a plurality of layers.

4. The system of claim 1 or claim 3, wherein the compressible male mold comprises:

a base layer;

a contact layer comprising the flexible male mold contact surface adapted to contact the substrate, and

5. The system of claim 1 or 2, the compressible male mold film having a compressibility in a range of 5-30%, 6-30%, 9-25%, 9-20%, or 9-15% at 1.35MPa in a direction perpendicular to a broad face of the compressible male mold film.

6. The system of claim 4, wherein the base layer comprises a metal layer.

7. The system of claim 4, wherein the base layer comprises a polymer layer.

8. The system of claim 4, wherein the base layer comprises a fabric layer.

9. The system of claim 8, wherein the fabric layer comprises at least two layers of fabric attached to each other.

10. The system of claim 8, wherein the fabric layer is impregnated with a rubber-based material.

11. The system of claim 4, wherein the compressible layer is adapted to reduce lateral deformation due to pressure applied to the compressible male die membrane in a direction perpendicular to a broad face of the compressible male die membrane.

12. The system of claim 4, wherein the compressible layer is adapted to make the relief pattern laminated to the substrate sharper.

13. The system of claim 4, wherein the compressible layer comprises a rubber foam layer.

14. The system of claim 4, wherein the compressible layer is directly attached to the base layer.

15. The system of claim 4, the contact layer comprising a rubber-based material.

16. The system of claim 15, wherein the rubber-based material comprises a compressible rubber-based material.

17. The system of claim 4, the compressible male mold further comprising:

a reinforcing fabric layer adapted to provide structural reinforcement to the compressible male mold film, and

a rubber layer attached to the reinforcing fabric layer along a broad side thereof.

18. The system of claim 17 wherein the reinforcing fabric layer is impregnated with a rubber-based material.

19. The system of claim 17, wherein a first broad side of the rubber layer is attached to a first broad side of the reinforcing fabric layer, a second broad side of the rubber layer is disposed adjacent the base layer, and a second broad side of the reinforcing fabric layer is disposed adjacent the compressible layer.

20. The system of claim 4, the compressible male mold further comprising a surface modulation layer disposed between the base layer and the contact layer and adapted such that in the operational mode, the surface modulation layer responds by modulating at least one of a height and a surface area of a deformation formed on the contact layer when a pressure applied to the contact layer exceeds an amount of pressure required to fully compress the compressible layer.

21. A system as in claim 20, wherein the surface modulation layer is attached to the compressible layer along a first broad side thereof and to the contact layer along a second broad side thereof.

22. The system of claim 20, wherein the surface preparation layer is adapted to inhibit the contact layer from separating from or rotationally displacing relative to the compressible layer during lamination of the relief pattern to the substrate.

23. The system of claim 20, the surface preparation layer adapted to increase an amount of pressure applied to the contact layer upon lamination without damaging the substrate or the relief pattern laminated thereto.

24. A system as recited in claim 20, wherein the surface preparation layer comprises a fabric layer impregnated with a rubber-based material.

25. A system as recited in claim 24, wherein the fabric layer comprises at least two layers of fabric attached to one another.

26. The system of claim 4, wherein the compression mechanism is adapted to apply sufficient pressure to the compressible male mold film in a direction perpendicular to a broad face of the compressible male mold film, thereby causing the compressible layer to absorb the pressure by compression until the compressible layer is substantially incompressible.

27. The system of claim 1 or 2, wherein the relief pattern is sharper on a first surface of the substrate than on an opposite surface of the substrate after laminating the relief pattern onto the substrate.

28. The system of claim 1 or 2, wherein the at least one master die comprises a rule die adapted to laminate crease lines as the relief pattern onto the substrate.

29. The system of claim 28, wherein the rule die comprises a channel formed in the at least one master die.

30. The system of claim 1 or 2, wherein the at least one master mold comprises an imprint pattern adapted to laminate the substrate with the imprint pattern as a relief pattern.

31. The system of claim 1 or 2, wherein the at least one master tool comprises at least one cavity disposed below a nominal surface line of the at least one master tool, the at least one cavity defining at least a portion of the relief pattern.

32. The system of claim 1 or 2, wherein the relief pattern is defined by at least one wall surrounding a surface at or above a nominal surface line of the at least one master mold, the at least one wall having a wall height, and

wherein a side of the at least one wall distal to the relief pattern defines a gradient from the wall height to the nominal surface line of the at least one master mold.

33. The system of claim 32, wherein the gradient has an aspect ratio of at least 10, at least 15, or at least 20.

34. The system of claim 32, wherein the profile of the gradient is linear.

35. The system of claim 32, wherein the profile of the gradient is truncated.

36. The system of claim 32, wherein the profile of the gradient has a complex geometry comprising at least one of a gaussian element, a sinusoidal element, and a parabolic element.

37. The system of claim 1 or 2, wherein at least one of the at least one female mold half and the compressible male mold half is mounted to a rotating drum.

38. A system as claimed in claim 1 or 2, wherein the at least one master model is mounted on a first drum and the compressible male model is mounted on a second drum.

39. The system of claim 1 or 2, wherein the substrate comprises a fibrous substrate.

40. The system of claim 1 or 2, wherein the substrate comprises a metal foil.

41. The system of claim 1 or 2, wherein the substrate comprises a plastic substrate.

42. The system of claim 41, further comprising a heating mechanism for applying heat to the plastic substrate during lamination of the relief pattern to the plastic substrate.

43. A method of making a male mold contact surface comprising a feature, the method comprising:

providing the system of claim 1, wherein the compressible male mold film comprises a contact layer comprising the flexible male mold contact surface adapted to contact the substrate, the contact layer comprising a featureless sheet of inelastic material;

moving the compressible male mold film and the at least one female mold toward each other with the compression mechanism, thereby applying pressure to the contact layer of the compressible male mold film and urging the contact layer of the compressible male mold film toward the at least one female mold,

wherein the pressure applied to the contact layer of the compressible male mold film causes the contact layer to be pushed into the at least one cavity, thereby forming a male mold comprising at least one feature on the contact layer, whereby at least a portion of the at least one feature is maintained after disengagement between the compressible male mold film and the at least one cavity.

44. The method of claim 43, wherein the features of the male mold comprising the features correspond to the at least one cavity of the at least one female mold.

45. A method of imprinting a substrate using a system comprising at least one master mold, the method comprising:

creating at least one male mold corresponding to the at least one female mold using the method of claim 43 or claim 44;

placing a substrate between the at least one female mold and the created at least one male mold, and

moving the at least one male mold toward the at least one female mold such that the at least one male mold engages a first broad surface of the substrate and the at least one female mold engages an opposite broad surface of the substrate such that the substrate is pushed into the at least one cavity to engage the relief pattern on the bottom surface so as to laminate the relief pattern corresponding to the shape of the at least one female mold onto the substrate.

46. A method for laminating a relief pattern onto a substrate, the method comprising:

placing the substrate between at least one of the female mold and the male mold,

wherein the at least one master tool comprises a master contacting surface comprising at least one cavity defining the relief pattern, wherein at least a portion of the relief pattern is defined on a bottom surface of the at least one cavity,

and wherein the male mold film comprises a flexible male mold contacting surface spaced from the female mold contacting surface, the flexible male mold contacting surface being free of features in areas opposite the relief pattern on the at least one female mold, and

moving the at least one female mold and the male mold towards each other such that the female mold contacting surface engages a first broad surface of the substrate and the flexible male mold contacting surface of the male mold engages a relatively broad surface of the substrate such that the substrate is pushed into the at least one cavity to engage the relief pattern on the bottom surface, thereby laminating the relief pattern onto the substrate.

47. The method of claim 46, wherein:

the male die membrane comprises a compressible male die membrane comprising:

a base layer;

and wherein the moving comprises moving the at least one female mold half and the compressible male mold film toward each other to apply sufficient pressure to the compressible male mold film in a direction perpendicular to the broad face of the compressible male mold film, thereby causing the compressible layer to absorb pressure through compression until the compressible layer is substantially incompressible.

48. The method of claim 47, wherein the substrate comprises a fibrous substrate.

49. The method of claim 47, wherein the substrate comprises a metal foil.

50. The method of claim 47, wherein the substrate comprises a plastic substrate.

51. The method of claim 50, further comprising applying heat to the plastic substrate during lamination of the relief pattern to the plastic substrate.