CN109301409A - A kind of bandpass filter based on resonator based on via structure - Google Patents
A kind of bandpass filter based on resonator based on via structure Download PDFInfo
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- CN109301409A CN109301409A CN201811045248.4A CN201811045248A CN109301409A CN 109301409 A CN109301409 A CN 109301409A CN 201811045248 A CN201811045248 A CN 201811045248A CN 109301409 A CN109301409 A CN 109301409A
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- via structure
- multilayer board
- bandpass filter
- copper metal
- pcb multilayer
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- 239000002184 metal Substances 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910052802 copper Inorganic materials 0.000 claims abstract description 58
- 239000010949 copper Substances 0.000 claims abstract description 58
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 12
- 238000005516 engineering process Methods 0.000 abstract description 8
- 238000004891 communication Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000009826 distribution Methods 0.000 abstract description 3
- 238000001914 filtration Methods 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/20327—Electromagnetic interstage coupling
- H01P1/20354—Non-comb or non-interdigital filters
- H01P1/20381—Special shape resonators
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The invention belongs to electronic component technology field, discloses in a kind of microwave regime the more pass-band performances of filtering of via structure and bandpass filter is produced based on resonator design based on via structure using a kind of, be provided with deposited copper metal, PCB multilayer board and through-hole；Deposited copper metal is inlaid in front and the aspect of PCB multilayer board 1, is in via structure with PCB multilayer board 1, and through-hole, which runs through, applies copper metal and PCB multilayer board.The present invention is all made of the electrical connection feature for concentrating the microstrip design of circuit distribution parameter to can make full use of via structure in upper and lower multilayer circuit board, improve filter transfer performance, optimize multi-layer board interconnection to reduce circuit size, the miniaturization for realizing radio circuit, produces the advantages that at low cost in enormous quantities.Especially suitable for the communication of corresponding microwave frequency band, digital radar, military and civilian multimode and multiplex communication terminal, wireless communication handheld terminal etc., and have in the corresponding system of rigors to weight, performance, reliability.
Description
Technical field
The invention belongs to a kind of filtering multi-pass bands of via structure in electronic component technology field more particularly to microwave regime
Characteristic and bandpass filter is produced based on resonator design based on via structure using a kind of.
Background technique
Currently, the prior art commonly used in the trade is such that
Microstripline filter is designed and produced using the connection of microstrip line straight line, it then follows basic step has index analysis and structure rule
It draws, and by reducing circuit size while junction input and output close coupling mode improves performance of filter.
Bandpass filter, which refers to, to decline by the frequency component in a certain frequency range but by the frequency component of other ranges
The filter for reducing to extremely low level is opposite with the concept of bandstop filter.
As market is to miniaturization of electronic products, high density, high-performance and multi-functional demand, the integrated level of circuit is more next
Higher, traditional encapsulation technology is difficult to meet needs, the electronic system that various passive electronics form can be integrated into biography
System-in-Package technology in the package substrate of system has become following important trend.
Much there are resonance circuit, and the bandpass filter constituted using resonance circuit in traditional circuit, wherein
Low-temperature co-fired ceramics (LTCC) and microstrip line are two kinds of most important filter fabrication technologies, and dual mode filter is made using perturbation
Two degenerate modes of one resonator intercouple and generate frequency separation, generate two resonance peaks, are similar to one pair
Tuning circuit or two cascade singlemode resonance device responses.But it since thickness of dielectric layers used is relatively large, causes
The degree of miniaturization of filter is limited.In addition, present some plane dual mode filters mostly use capacitively coupled mode to constitute
Input and output feed, but the filter for the embedded capacitor construction composition inside organic substrate can be embedded to, if using
Such structure can cause the insertion loss of filter excessive, influence performance of filter due to radiation and edge effect.
In conclusion problem of the existing technology is:
(1) traditional bandpass filter volume is big, and degree of miniaturization is limited；
(2) loss is excessive, and performance is unstable；
(3) optional passband frequency range is narrow；
(4) parasitic parameter is big.
Solve the difficulty and meaning of above-mentioned technical problem:
The invention discloses more pass-band performances of via structure in microwave regime, in conjunction with technical circuitry software HFSS and ADS
Establish the full wave analysis theoretical model and circuit model of multiple layer high speed pcb board via hole.In 1~10GHz frequency range, via hole is studied
Multiple important feature parameters, difference ratio, via length, substrate dielectric constant including aperture and internal-and external diameter etc. transmit signal
The influence of performance；The via hole size and signal for realizing selection reasonable size change layer, cabling, reduce the parasitic parameter of structure devices
And equivalent series inductance.The design parameter of optimization signal integrity has been obtained finally by emulation and actual measurement verifying in kind:
Bandpass characteristics filter Each part parameter size scope of design of the present invention is big, by via hole via metal wave guide
Part and minor matters resonator structure parameter form, wherein Lo、WoFor minor matters length and width of opening a way, Ls、WsFor short-circuit minor matters length and
Width；Electric connecting member includes that W, d is respectively adopted to indicate connection ground plane width, ground connection column diameter, Lz、WzFor input and output
The length and width of matching stub, L, W are the length and width for being shorted ground floor and applying copper face, rviaFor via hole through-hole inside radius,
rpFor via hole through-hole outer radius, rgdFor the partition radius of via hole through-hole and intermediate grounded layer.It is imitative in pass filter structural parameters
The size of each part structural parameters range size of true optimization and material object manufacture, as shown in table 1.
1 material object manufacture bandpass characteristics filter Each part parameter size scope of design (unit/mm) of table
| W | L | Ws | Ls | Wo | Lo | d | rvia | rp | rgd |
| 5±2 | 13±8 | 0.4±0.3 | 3±1 | 1.7±1 | 8±1 | 1±0.9 | 1.1±1 | 1.6±1 | 2.0±1 |
By rigorously testing and interpretation of result, it was demonstrated that the technology of the present invention is meaningful, and the theoretical model including verifying is real
Border effectively and the design parameter that has a reference, and optimize can guarantee via hole impedance continuity and lesser reflection loss,
Insertion loss.This has fine directive function to the design of frequency PCB circuit board.
Summary of the invention
In view of the problems of the existing technology, the present invention provides a kind of band logicals based on resonator based on via structure
Filter.
The invention is realized in this way a kind of bandpass filter based on resonator based on via structure is provided with
Apply copper metal, PCB multilayer board and through-hole；
PCB multilayer board is the PCB multilayer board of " sandwich " formula structure, and applying copper metal is that copper ground connection is applied among " sandwich " formula
Structure sheaf；
The deposited copper metal is inlaid in front and the aspect of PCB multilayer board, is in via structure with PCB multilayer board；
The deposited copper metal includes the open circuit minor matters, short-circuit minor matters and parallel coupling feeder line micro-strip of upper and lower level vertical symmetry
Cable architecture can adjust out band passband, form special frequency band bandpass filter.
The through-hole, which runs through, applies copper metal and PCB multilayer board.
In conclusion advantages of the present invention and good effect are as follows:
The present invention is structure based on the pass-band performance using via hole, and supplementary structure uses load open circuit minor matters resonator,
Coupling short minor matters resonator, optimization design go out a kind of bandpass filter of passband.Using the micro-strip for concentrating circuit distribution parameter
Line design, can make full use of the electrical connection feature of via structure in upper and lower multilayer circuit board, being capable of the specific filter of Optimal improvements
Wave device transmission performance, optimization multi-layer board interconnection realize the miniaturization of radio circuit to reduce circuit size, produce in enormous quantities at
This low advantage.Light-weight, high reliablity, have excellent performance, temperature stability is good, especially suitable for the logical of corresponding microwave frequency band
Letter, digital radar, military and civilian multimode and multiplex communication terminal, wireless communication handheld terminal etc., and to weight, property
Energy, reliability have in the corresponding system of rigors.Specific Optimal Parameters are as shown in table 2.
The performance parameter of 2 material object manufacture bandpass characteristics filter of table compares
Detailed description of the invention
Fig. 1 is the bandpass filter structures signal provided in an embodiment of the present invention based on resonator based on via structure
Figure；
In figure: 1, PCB multilayer board.2, copper metal is applied；Copper metal piece is applied on 2-1, the first sheet metal, positive upper layer；2-3, just
Copper third sheet metal is applied on face upper layer, and outer end is connected with intermediate grounded layer；Copper fifth metal piece is applied on 2-5, positive upper layer；It is 2-2, anti-
The second sheet metal of copper applies in face lower layer；The 4th sheet metal of copper applies in 2-4, reverse side lower layer；Copper third sheet metal applies in 2-6, reverse side lower layer, outside
End is connected with intermediate grounded layer.3, through-hole.4, intermediate deposited copper ground plane；4-1, positive upper layer are connected to intermediate deposited copper ground connection
Layer；Copper metal layer applies in 4-2, reverse side lower layer, is already connected to intermediate deposited copper ground plane；
Specific embodiment
In order to further understand the content, features and effects of the present invention, the following examples are hereby given, and cooperate attached drawing
Detailed description are as follows.
As shown in Figure 1, the bandpass filter provided in an embodiment of the present invention based on resonator based on via structure includes
PCB multilayer board 1, PCB multilayer board.2, copper metal is applied；Copper metal piece is applied on 2-1, the first sheet metal, positive upper layer；On 2-3, front
The deposited copper third sheet metal of layer, outer end is connected with intermediate grounded layer；Copper fifth metal piece is applied on 2-5, positive upper layer；Under 2-2, reverse side
Deposited the second sheet metal of copper of layer；The 4th sheet metal of copper applies in 2-4, reverse side lower layer；2-6, reverse side lower layer apply copper third sheet metal, outer end with
Intermediate grounded layer is connected.3, through-hole.4, intermediate deposited copper ground plane；4-1, positive upper layer are connected to intermediate deposited copper ground plane；4-
2, copper metal layer applies in reverse side lower layer, is already connected to intermediate deposited copper ground plane.
The small deposited copper vias 3 that can reduce parasitic parameter of internal diameter is grafted the first sheet metal 2-1 of section with front end and reverse side terminates
The connection of minor matters the second sheet metal 2-2 progress Two-port netwerk signal.It includes 2-1, the first metal that wherein, which there is deposited copper metal on positive upper layer,
Copper metal piece is applied on piece, positive upper layer；Copper third sheet metal is applied on 2-3, positive upper layer, and outer end is connected with intermediate grounded layer；2-5,
Copper fifth metal piece is applied on positive upper layer；4-1, positive upper layer are connected to intermediate deposited copper ground connection by penetrating through the small through hole of four deposited copper
Layer.It includes 2-2, deposited the second sheet metal of copper of reverse side lower layer that wherein, which there is deposited copper metal in reverse side lower layer,；Copper the 4th applies in 2-4, reverse side lower layer
Sheet metal；Copper third sheet metal applies in 2-6, reverse side lower layer, and outer end is connected with intermediate grounded layer.4-2, reverse side lower layer pass through perforation
Four deposited copper small through hole are connected to intermediate deposited copper ground plane.And copper metal piece 2-1,2-3,2-5,4-1 is applied under in upper layer front
Layer reverse side, which applies copper metal piece 2-2,2-4,2-6,4-2, does not have the direct interface point of physical structure.
Front and aspect that copper metal 2 is inlaid in PCB multilayer board 1 are applied, is in via structure with PCB multilayer board 1；
It applies copper metal 2 and is provided with the first metal 2-1, the second metal 2-3 and third metal 2-5, wherein the first sheet metal 2-1
Open circuit minor matters are formed with the second sheet metal 2-5, are the microstrip line of 50Q as both ends termination minor matters, 4-1 is as Two-port netwerk interface
Survey signal ground.
First sheet metal 2-1 and third sheet metal 2-3 forms short-circuit minor matters.
It applies copper metal 2 and is provided with the first metal 2-2, the second metal 2-4 and third metal 2-6, wherein the first sheet metal 2-2
Open circuit minor matters are formed with the second sheet metal 2-4, are the microstrip line of 50Q as both ends termination minor matters, 4-2 is as Two-port netwerk interface
Survey signal ground.
First sheet metal 2-2 and third sheet metal 2-6 forms short-circuit minor matters.
Perforation PCB editions positive upper layers and the reverse side lower layer for applying copper metal through-hole 3, do not have physical structure straight with intermediate grounded layer
Interface point is connect, the adjustable whole design of outer diameter is spaced, influences filter passbands characteristic.
PCB multilayer board 1 of the present invention uses PCB making sheet, and band passband, regulates 3 diameter of via hole through-hole according to actual needs,
It determines that deposited copper metal 2 loads the length and width of minor matters, applies copper thickness, carry out the plate-making processing of medium substrate.The present invention adopts
With the microstrip design for concentrating circuit distribution parameter, the electrical connection of via structure in upper and lower multilayer circuit board can make full use of
Feature, improves filter transfer performance, and optimization multi-layer board interconnection realizes the small-sized of radio circuit to reduce circuit size
Change, produces the advantages that at low cost in enormous quantities.
The above is only the preferred embodiments of the present invention, and is not intended to limit the present invention in any form,
According to the technical essence of the invention above embodiments are made with any simple modification, equivalent variations and modification, is belonged to
In the range of technical solution of the present invention.
Claims (4)
1. a kind of bandpass filter based on resonator based on via structure, which is characterized in that described to be based on via structure
The bandpass filter of main body resonator is provided with
Apply copper metal, PCB multilayer board and through-hole；
The deposited copper metal is inlaid in front and the aspect of PCB multilayer board 1, is in via structure with PCB multilayer board 1.
2. the bandpass filter as described in claim 1 based on resonator based on via structure, which is characterized in that described to apply
Copper metal includes the open circuit minor matters, short-circuit minor matters and parallel coupling feeder line microstrip line construction of upper and lower level vertical symmetry, can be adjusted
Band passband is saved out, special frequency band bandpass filter is formed.
3. the bandpass filter as described in claim 1 based on resonator based on via structure, which is characterized in that described logical
Hole, which is run through, applies copper metal and PCB multilayer board.
4. the bandpass filter as described in claim 1 based on resonator based on via structure, which is characterized in that described
The deposited copper ground plane of PCB multilayer board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811045248.4A CN109301409A (en) | 2018-09-07 | 2018-09-07 | A kind of bandpass filter based on resonator based on via structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811045248.4A CN109301409A (en) | 2018-09-07 | 2018-09-07 | A kind of bandpass filter based on resonator based on via structure |
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| Publication Number | Publication Date |
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| CN109301409A true CN109301409A (en) | 2019-02-01 |
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| CN201811045248.4A Pending CN109301409A (en) | 2018-09-07 | 2018-09-07 | A kind of bandpass filter based on resonator based on via structure |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203760599U (en) * | 2014-03-28 | 2014-08-06 | 南京航空航天大学 | Compact type ultra wide band double-band-notch balance band-pass filter |
| CN104319440A (en) * | 2014-10-29 | 2015-01-28 | 上海大学 | Hairpin type dual passband electrically-tunable microwave filter |
| CN106169635A (en) * | 2016-08-13 | 2016-11-30 | 南京理工大学 | A kind of pocket super-broadband band filter with trap characteristic |
| CN206497970U (en) * | 2016-12-23 | 2017-09-15 | 南京信息工程大学 | One kind miniaturization single-pass band microstrip filter |
| CN209029511U (en) * | 2018-09-07 | 2019-06-25 | 北京信息科技大学 | A kind of bandpass filter based on resonator based on via structure |
-
2018
- 2018-09-07 CN CN201811045248.4A patent/CN109301409A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203760599U (en) * | 2014-03-28 | 2014-08-06 | 南京航空航天大学 | Compact type ultra wide band double-band-notch balance band-pass filter |
| CN104319440A (en) * | 2014-10-29 | 2015-01-28 | 上海大学 | Hairpin type dual passband electrically-tunable microwave filter |
| CN106169635A (en) * | 2016-08-13 | 2016-11-30 | 南京理工大学 | A kind of pocket super-broadband band filter with trap characteristic |
| CN206497970U (en) * | 2016-12-23 | 2017-09-15 | 南京信息工程大学 | One kind miniaturization single-pass band microstrip filter |
| CN209029511U (en) * | 2018-09-07 | 2019-06-25 | 北京信息科技大学 | A kind of bandpass filter based on resonator based on via structure |
Non-Patent Citations (1)
| Title |
|---|
| 许晓飞: "一种过孔和枝节加载的带通滤波器设计", 《微波学报》, vol. 33, no. 6, pages 1 - 10 * |
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Application publication date: 20190201 |