CN109286884A - Back pole plate and microphone - Google Patents
Back pole plate and microphone Download PDFInfo
- Publication number
- CN109286884A CN109286884A CN201710591002.6A CN201710591002A CN109286884A CN 109286884 A CN109286884 A CN 109286884A CN 201710591002 A CN201710591002 A CN 201710591002A CN 109286884 A CN109286884 A CN 109286884A
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- Prior art keywords
- acoustic holes
- pole plate
- back pole
- microphone
- acoustic
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- 239000002184 metal Substances 0.000 claims description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000029142 excretion Effects 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 10
- 230000010355 oscillation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Abstract
The embodiment of the invention provides a kind of back pole plate and microphones, back pole plate is center symmetric figure, back pole plate further include: multiple acoustic holes, multiple acoustic holes include first acoustic holes positioned at back pole plate center, and multiple acoustic holes groups, first acoustic holes are center symmetric figure, and the geometric center of the second acoustic holes in each acoustic holes group surrounds multilevel center symmetrical structure on back pole plate, and the symmetrical centre of multilevel center symmetrical structure is overlapped with the symmetrical centre of back pole plate；The hole shape and perforated area of the second acoustic holes in each acoustic holes group are all the same, and the perforated area of the second acoustic holes is respectively less than the perforated area of the first acoustic holes.The embodiment of the invention provides a kind of back pole plate and microphone, the perforated area of first acoustic holes of center is maximum on back pole plate, and big acoustic holes make the more easy excretion of air-flow, so that the noise for reducing microphone improves signal-to-noise ratio.
Description
Technical field
The present embodiments relate to microphone techniques field more particularly to a kind of back pole plates and microphone.
Background technique
With the development of wireless telecommunications, Global Mobile Phone Users are more and more.Requirement of the people to speech quality is more next
It is higher.That application is more at present is microphone of microelectromechanicsystem system (micro electro mechanical system
Microphone, MEMS).
MEMS silicon microphone uses capacitive principle, by forming capacitive junctions between the backboard in a vibrating diaphragm and microphone
Structure.After vibrating diaphragm experiences external audio sound pressure signal, the distance between vibrating diaphragm and backboard change, change capacitance and
Voltage, then the variation of voltage signal is converted for capacitance variations by subsequent cmos amplifier and is exported.
The structure of the acoustic holes in back pole plate in prior art microphone designs, and can not improve its signal-to-noise ratio very well.
Summary of the invention
In view of this, the embodiment of the invention provides a kind of back pole plate and microphone, one of center on back pole plate
The perforated area of first acoustic holes is maximum, and big acoustic holes make the more easy excretion of air-flow, to reduce the noise of microphone
Improve signal-to-noise ratio.
In a first aspect, the back pole plate is center symmetric figure, the back the embodiment of the invention provides a kind of back pole plate
Pole plate further include:
Multiple acoustic holes, the multiple acoustic holes include first acoustic holes positioned at the back pole plate center,
And the multiple acoustic holes groups being divided into according to the distance of the symmetrical centre apart from the back pole plate, first acoustic holes are
Centrosymmetric image, and the symmetrical centre of first acoustic holes is overlapped with the symmetrical centre of the back pole plate, each acoustic holes
The geometric center of the second acoustic holes in group surrounds multilevel center symmetrical structure on the back pole plate, and the multilevel center is symmetrical
The symmetrical centre of structure is overlapped with the symmetrical centre of the back pole plate；
The hole shape and perforated area of the second acoustic holes in each acoustic holes group are all the same, second acoustics
The perforated area in hole is respectively less than the perforated area of first acoustic holes；
In each acoustics group the center of the geometric center of arbitrary neighborhood two second acoustic holes and the back pole plate it
Between line angle it is equal.
Optionally, the perforated area of the multiple acoustic holes account for the backplane plate suqare numberical range be more than or equal to
30%, it is less than or equal to 70%.
Optionally, the rising tone in two acoustic holes groups of arbitrary neighborhood, in the acoustic holes group remote apart from the symmetrical centre
The perforated area for learning hole is less than the perforated area of the second acoustic holes in the acoustic holes group close apart from the symmetrical centre.
Optionally, the rising tone in two acoustic holes groups of arbitrary neighborhood, in the acoustic holes group remote apart from the symmetrical centre
The quantity for learning hole is greater than the quantity of the second acoustic holes in the acoustic holes group close apart from the symmetrical centre.
Optionally, the second acoustic holes of the multiple acoustic holes group include regular polygon acoustic holes and round acoustic holes, institute
It is more closer apart from the symmetrical centre than the round acoustic holes to state regular polygon acoustic holes.
Optionally, the shape of the regular polygon acoustic holes is identical with the shape of first acoustic holes.
Optionally, the shape of the regular polygon acoustic holes is octagon.
Second aspect, the embodiment of the invention provides a kind of microphones, comprising:
Including microphone chip, ASIC circuit chip, pedestal and metal coating shell；
The microphone chip and the ASIC circuit chip are fixed on the pedestal, the microphone chip and described
It is electrically connected between ASIC circuit chip；
The microphone chip includes back pole plate described in any one of above-mentioned technical proposal.
Optionally, the microphone chip includes semiconductor chip；
It is formed in the first insulating layer of the semiconductor-based on piece；
Form vibrating diaphragm on the first insulating layer；
The second insulating layer with via hole being formed on the vibrating diaphragm, the first metal electricity being formed in the via hole
The first surface of pole, first metal electrode is directly contacted with the vibrating diaphragm, and the second surface of first metal electrode is low
In the surface of the second insulating layer；
Form back pole plate on the second insulating layer；
The second metal electrode being formed on the back pole plate.
It include the first acoustic holes of center the embodiment of the invention provides a kind of back pole plate and microphone, in back pole plate
Institute is respectively less than with the perforated area of the second acoustic holes in acoustic holes group, second acoustic holes around the first acoustic holes
The perforated area for stating the first acoustic holes, the intermediate position for back pole plate are the center portions of microphone diaphragm, in induction sound
When, vibrating diaphragm center portion Oscillation Amplitude is larger, and biggish air-flow, big acoustics can be correspondingly generated between vibrating diaphragm and back pole plate
Hole makes the more easy excretion of air-flow, to reduce the noise of microphone, improves signal-to-noise ratio.
Detailed description of the invention
Fig. 1 a is a kind of structural schematic diagram for back pole plate that the embodiment of the present invention one provides；
Fig. 1 b is the enlarged drawing of acoustic holes group 3 and the first acoustic holes 21 in Fig. 1 a；
Fig. 2 is the structural schematic diagram for another back pole plate that the embodiment of the present invention one provides；
Fig. 3 is a kind of structural schematic diagram of microphone provided by Embodiment 2 of the present invention；
Fig. 4 is the structural schematic diagram of another microphone provided by Embodiment 2 of the present invention；
Fig. 5 is a kind of structural schematic diagram of microphone chip provided by Embodiment 2 of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Embodiment one
Fig. 1 a is a kind of structural schematic diagram of back pole plate provided in an embodiment of the present invention；Fig. 1 b is acoustic holes group 3 in Fig. 1 a
And first acoustic holes 21 enlarged drawing；Fig. 2 is the structural schematic diagram of another back pole plate provided in an embodiment of the present invention.
Referring to Fig. 1 a and Fig. 1 b, the embodiment of the invention provides a kind of back pole plate 1, back pole plate 1 is center symmetric figure, figure
Back pole plate shown in 1a is circle, but is not limited to the shape of back pole plate 1 in embodiments of the present invention as circle, can also be
Regular polygon.Back pole plate 1 further include: multiple acoustic holes 2, multiple acoustic holes 2 include one for being located at 1 center O of back pole plate
First acoustic holes 21, and the multiple acoustic holes groups being divided into according to the distance of the symmetrical centre O apart from back pole plate 1, Fig. 1 a
4 acoustic holes groups (acoustic holes group 3, acoustic holes group 4, acoustic holes group 5 and acoustic holes group 6) is shown, the first acoustic holes 21 are
Centrosymmetric image, the first acoustic holes group shown in Fig. 1 a are octagon, and the symmetrical centre and backplane of the first acoustic holes 21
The symmetrical centre O of plate 1 is overlapped, and the geometric center of the second acoustic holes 22 in each acoustic holes group surrounds in multistage on back pole plate
Heart symmetrical structure, the symmetrical centre of multilevel center symmetrical structure are overlapped with the symmetrical centre O of back pole plate；In each acoustic holes group
The second acoustic holes 22 hole shape and perforated area it is all the same, the perforated area of the second acoustic holes 22 is respectively less than first
The perforated area of acoustic holes 21；In each acoustics group in the geometric center and back pole plate of two the second acoustic holes 22 of arbitrary neighborhood
The angle of line between heart O is equal, i.e., referring to Fig. 1 b, point A, point B, point C, point D, point E, point F and point G are respectively acoustics group 3
In the second acoustic holes 22 geometric center, ∠ AOB=∠ BOC=∠ COD=∠ DOE=∠ EOF=∠ FOG=∠ GOH=
∠HOA。
In the present embodiment, the geometric center of the second acoustic holes 22 in each acoustic holes group surrounds multistage on back pole plate
Centrosymmetric structure.In back pole plate shown in Fig. 1 a, the geometric center of the second acoustic holes 22 in each acoustic holes group is in backplane
What is surrounded on plate is multiple circles, Fig. 2 shows back pole plate in, in the geometry of the second acoustic holes 22 in each acoustic holes group
What the heart surrounded on back pole plate is multiple regular polygons.The embodiment of the present invention is for the second acoustic holes 22 in each acoustic holes group
Geometric center multilevel center symmetrical structure is surrounded on back pole plate concrete shape without limitation, can be circle, can also be with
Regular polygon, and also without limitation for the item number on the side of regular polygon, related practitioner can according to the actual situation from
Row design.
It include 21 harmony of the first acoustic holes of center the embodiment of the invention provides a kind of back pole plate, in back pole plate 1
The second acoustic holes 22 of Kong Zuzhong are learned, the perforated area of the second acoustic holes 22 around the first acoustic holes 21 is respectively less than first
The perforated area of acoustic holes 21, the intermediate position for back pole plate is the center portion of microphone diaphragm, when incuding sound, vibration
Film center portion Oscillation Amplitude is larger, and biggish air-flow can be correspondingly generated between vibrating diaphragm and back pole plate, and big acoustic holes make
The more easy excretion of air-flow is obtained, to reduce the noise of microphone, improves signal-to-noise ratio.
Optionally, the perforated area of multiple acoustic holes 2 account for 1 area of back pole plate numberical range be more than or equal to 30%,
Less than or equal to 70%.When sound wave makes diaphragm oscillations, vibrating diaphragm and back pole plate 1 is discharged in the acoustic holes 2 being distributed on back pole plate 1
Between air-flow, this process is the source of noise.Acoustic holes are set in back pole plate, and guarantee certain perforated area, so that
Air between vibrating diaphragm and back pole plate 1 smooth can be discharged by acoustic holes 2, to weaken noise.
Optionally, referring to Fig. 1 a, illustratively, Fig. 1 a merely illustrates 4 acoustic holes groups, respectively acoustic holes group 3,4,5
With acoustic holes group 6, in two acoustic holes groups of arbitrary neighborhood, the second acoustic holes in the acoustic holes group remote apart from symmetrical centre are opened
Hole area is less than the perforated area of the second acoustic holes in the acoustic holes group close apart from symmetrical centre, i.e. the second of acoustic holes group 6
The perforated area of acoustic holes 22 is less than the perforated area of the second acoustic holes 22 in the acoustic holes group 5 close apart from symmetrical centre, sound
The perforated area of the second acoustic holes 22 of hole group 5 is learned less than the second acoustic holes 22 in the acoustic holes group 4 close apart from symmetrical centre
Perforated area, the perforated areas of the second acoustic holes 22 of acoustic holes group 4 is less than in the acoustic holes group 3 close apart from symmetrical centre
The perforated area of second acoustic holes 22.The embodiment of the present invention is not construed as limiting the quantity of acoustic holes group, and related practitioner can
With the quantity of sets itself acoustic holes group according to the actual situation.Intermediate position for back pole plate 1 is the center of microphone diaphragm
Part, when incuding sound, vibrating diaphragm center portion Oscillation Amplitude is larger, can correspondingly generate between vibrating diaphragm and back pole plate larger
Air-flow, big acoustic holes make the more easy excretion of air-flow, to reduce the noise of microphone, signal-to-noise ratio are improved, apart from right
The amplitude of the corresponding vibrating diaphragm of the second acoustic holes in the remote acoustic holes group in title center is less than the acoustic holes group close apart from symmetrical centre
In the second acoustic holes corresponding vibrating diaphragm amplitude, so generating the of biggish air-flow between vibrating diaphragm and back pole plate for arranging
The perforated area of two acoustic holes can be smaller.Lesser acoustic holes will not cause very big noise, will not influence microphone
Signal-to-noise ratio.
Optionally, with 4 acoustic holes groups shown in Fig. 1 a, respectively acoustic holes group 3,4,5 and acoustic holes group 6, with Fig. 1 a
For be illustrated, in two acoustic holes groups of arbitrary neighborhood, the second acoustic holes in the acoustic holes group remote apart from symmetrical centre
Quantity is greater than the quantity of the second acoustic holes in the acoustic holes group close apart from symmetrical centre, i.e. the second acoustic holes of acoustic holes group 6
22 quantity is greater than the quantity of the second acoustic holes 22 in the acoustic holes group 5 close apart from symmetrical centre, the rising tone of acoustic holes group 5
The quantity for learning hole 22 is greater than the quantity of the second acoustic holes 22 in the acoustic holes group 4 close apart from symmetrical centre, and the of acoustic holes group 4
The quantity of two acoustic holes 22 is greater than the quantity of the second acoustic holes 22 in the acoustic holes group 3 close apart from symmetrical centre.The present invention is real
It applies example to be not construed as limiting the quantity of acoustic holes group, related practitioner can sets itself acoustic holes group according to the actual situation
Quantity.
Optionally, referring to Fig. 1 a, the second acoustic holes 22 of multiple acoustic holes groups include regular polygon acoustic holes and round sound
Hole is learned, regular polygon acoustic holes are more closer apart from symmetrical centre than round acoustic holes, by taking Fig. 1 a as an example, the second of acoustic holes group 3 and 4
Acoustic holes 22 include regular polygon acoustic holes, and the second acoustic holes 22 of acoustic holes group 5 and 6 include round acoustic holes, and just more
Side ideophone boring ratio circle acoustic holes are closer apart from symmetrical centre.Intermediate position for back pole plate is the center of microphone diaphragm
Part, when incuding sound, vibrating diaphragm center portion Oscillation Amplitude is larger, can correspondingly generate between vibrating diaphragm and back pole plate larger
Air-flow, big acoustic holes make the more easy excretion of air-flow, so that the noise for reducing microphone improves signal-to-noise ratio, distance is symmetrical
The closer acoustic holes in center are regular polygon acoustic holes, and just polygon design reduces the distance of the opinion of acoustic holes, can be more preferable
Decrease vibrating diaphragm and back pole plate between the outlet of air and the reciprocating motion of air inlet, further reduced noise.Round acoustic holes,
And the design that regular polygon acoustic holes are more closer apart from symmetrical centre than round acoustic holes, it can exist to avoid back pole plate marginal portion
Stress when because being impacted and dropped by hyperbar is very big, and circular acoustic holes are because without turning there is optimal stress uniformly to divide
Cloth, and the rigidity of back pole plate is enhanced, to greatly improve the impact of anti-hyperbar and drop resistant ability of back pole plate, improve
Reliability.
Optionally, the shape of regular polygon acoustic holes is identical with the shape of the first acoustic holes.Optionally, regular polygon acoustics
The shape in hole is octagon.The design of octagon reduces the distance of the opinion of acoustic holes, further reduced noise.Positive four
Side shape due to edge be right angle, stress concentrate it is bigger, regualr decagon with number of edges greater than ten regular polygon due to close to circle,
The distance of two acoustic holes just becomes larger, unfavorable for air between discharge vibrating diaphragm and back pole plate, for reducing the effect of noise simultaneously
It is bad.
Embodiment two
Fig. 3 is a kind of structural schematic diagram of microphone provided in an embodiment of the present invention；Fig. 4 is provided in an embodiment of the present invention
The structural schematic diagram of another microphone；Fig. 5 is a kind of structural schematic diagram of microphone chip provided in an embodiment of the present invention.
It is invented based on same design, on the basis of the above embodiments, the embodiment of the invention provides a kind of microphone, ginsengs
See Fig. 3 and Fig. 4, comprising: including microphone chip 7, ASIC circuit chip 8, pedestal 9 and metal coating shell 10.Microphone chip 7
It is fixed on pedestal 9 with ASIC circuit chip 8, is electrically connected between microphone chip 7 and ASIC circuit chip 8.Microphone chip 7
Including the back pole plate 1 provided in the technical solution in above-described embodiment.It should be noted that microphone shown in Fig. 3 be carry on the back into
Sound microphone, into sound mouth A on microphone pedestal.Microphone shown in Fig. 4 is advance sound microphone, is protected into sound mouth B in metal
On protective case 9.The back pole plate 1 that the microphone of both structures can be mentioned using above-described embodiment.
Optionally, referring to Fig. 5, microphone chip 7 includes semiconductor chip 11.First be formed on semiconductor chip 10
Insulating layer 12.The vibrating diaphragm 13 being formed on the first insulating layer 12.The second insulating layer with via hole 14 being formed on vibrating diaphragm 13
15, the first metal electrode 16 being formed in via hole 14, the first surface 161 of the first metal electrode 16 is directly contacted with vibrating diaphragm 3,
The second surface 162 of first metal electrode 16 is lower than the surface 151 of second insulating layer 15.The back being formed in second insulating layer 15
Pole plate 1 is illustratively dispersed with multiple acoustic holes 2 on back pole plate 1.The second metal electrode 17 being formed on back pole plate 1.
In embodiments of the present invention, the microphone chip 7 in microphone is by forming electricity between a vibrating diaphragm 13 and back pole plate 1
Hold structure.After vibrating diaphragm 13 experiences external audio sound pressure signal (audio sound pressure signal carry on the back from the A in Fig. 3 into sound mouth or
B advance sound mouth enters microphone in Fig. 4), the distance between vibrating diaphragm 13 and back pole plate 1 change, change capacitance and voltage,
The variation of voltage signal is converted for capacitance variations by ASIC circuit chip 8 again and is exported.Illustratively, on vibrating diaphragm 13
There can be the design of some folds to increase the amplitude of vibrating diaphragm 13, improve the sensitivity of microphone.
The embodiment of the invention provides a kind of microphones, using back pole plate 1 provided by the above embodiment, wrap in back pole plate 1
Include the second acoustic holes 22 in the first acoustic holes 21 and acoustic holes group of center, second around the first acoustic holes 21
The perforated area of acoustic holes 22 is respectively less than the perforated area of the first acoustic holes 21, and the intermediate position for back pole plate is Mike's wind shake
The center portion of film, when incuding sound, vibrating diaphragm center portion Oscillation Amplitude is larger, correspondingly can be between vibrating diaphragm and back pole plate
Biggish air-flow is generated, big acoustic holes make the more easy excretion of air-flow, to reduce the noise of microphone, improve noise
Than.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts, be combined with each other and substitutes without departing from protection scope of the present invention.Therefore, although by above embodiments to this
Invention is described in further detail, but the present invention is not limited to the above embodiments only, is not departing from present inventive concept
In the case of, it can also include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (9)
1. a kind of back pole plate, which is characterized in that the back pole plate is center symmetric figure, the back pole plate further include:
Multiple acoustic holes, the multiple acoustic holes include first acoustic holes positioned at the back pole plate center, and
The multiple acoustic holes groups being divided into according to the distance of the symmetrical centre apart from the back pole plate, centered on first acoustic holes
Symmetric figure, and the symmetrical centre of first acoustic holes is overlapped with the symmetrical centre of the back pole plate, in each acoustic holes group
The geometric centers of the second acoustic holes multilevel center symmetrical structure, the multilevel center symmetrical structure are surrounded on the back pole plate
Symmetrical centre be overlapped with the symmetrical centre of the back pole plate；
The hole shape and perforated area of the second acoustic holes in each acoustic holes group are all the same, second acoustic holes
Perforated area is respectively less than the perforated area of first acoustic holes；
In each acoustics group between the geometric center of arbitrary neighborhood two second acoustic holes and the center of the back pole plate
The angle of line is equal.
2. back pole plate according to claim 1, which is characterized in that
The perforated area of the multiple acoustic holes account for the backplane plate suqare numberical range be more than or equal to 30%, be less than or
Equal to 70%.
3. back pole plate according to claim 1, which is characterized in that
In two acoustic holes groups of arbitrary neighborhood, the aperture face of the second acoustic holes in the acoustic holes group remote apart from the symmetrical centre
Product is less than the perforated area of the second acoustic holes in the acoustic holes group close apart from the symmetrical centre.
4. back pole plate according to claim 1, which is characterized in that
In two acoustic holes groups of arbitrary neighborhood, the quantity of the second acoustic holes in the acoustic holes group remote apart from the symmetrical centre is big
The quantity of the second acoustic holes in the acoustic holes group close apart from the symmetrical centre.
5. back pole plate according to claim 1, which is characterized in that
Second acoustic holes of the multiple acoustic holes group include regular polygon acoustic holes and round acoustic holes, the regular polygon sound
It is closer apart from the symmetrical centre to learn circle acoustic holes described in boring ratio.
6. back pole plate according to claim 5, which is characterized in that
The shape of the regular polygon acoustic holes is identical with the shape of first acoustic holes.
7. the back pole plate according to claim 6, which is characterized in that
The shape of the regular polygon acoustic holes is octagon.
8. a kind of microphone characterized by comprising
Including microphone chip, ASIC circuit chip, pedestal and metal coating shell；
The microphone chip and the ASIC circuit chip are fixed on the pedestal, the microphone chip and the ASIC
It is electrically connected between circuit chip；
The microphone chip includes that back pole plate described in any one is required in aforesaid right 1-7.
9. microphone according to claim 8, which is characterized in that
The microphone chip includes semiconductor chip；
It is formed in the first insulating layer of the semiconductor-based on piece；
Form vibrating diaphragm on the first insulating layer；
The second insulating layer with via hole being formed on the vibrating diaphragm, the first metal electrode being formed in the via hole, institute
The first surface for stating the first metal electrode is directly contacted with the vibrating diaphragm, and the second surface of first metal electrode is lower than described
The surface of second insulating layer；
Form back pole plate on the second insulating layer；
The second metal electrode being formed on the back pole plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710591002.6A CN109286884A (en) | 2017-07-19 | 2017-07-19 | Back pole plate and microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710591002.6A CN109286884A (en) | 2017-07-19 | 2017-07-19 | Back pole plate and microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109286884A true CN109286884A (en) | 2019-01-29 |
Family
ID=65184060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710591002.6A Pending CN109286884A (en) | 2017-07-19 | 2017-07-19 | Back pole plate and microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109286884A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113613153A (en) * | 2021-08-27 | 2021-11-05 | 歌尔微电子股份有限公司 | Back electrode plate and microphone |
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| CN206923039U (en) * | 2017-07-19 | 2018-01-23 | 上海微联传感科技有限公司 | Back pole plate and microphone |
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- 2017-07-19 CN CN201710591002.6A patent/CN109286884A/en active Pending
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|---|---|---|---|---|
| CN201022230Y (en) * | 2007-02-15 | 2008-02-13 | 恩沛音响设备(上海)有限公司 | Audio header electrode board for capacitor transmitter |
| CN103491490A (en) * | 2013-08-16 | 2014-01-01 | 上海集成电路研发中心有限公司 | MEMS microphone structure and manufacturing method thereof |
| CN105282678A (en) * | 2014-06-06 | 2016-01-27 | 英飞凌科技股份有限公司 | System and method for a microphone |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113613153A (en) * | 2021-08-27 | 2021-11-05 | 歌尔微电子股份有限公司 | Back electrode plate and microphone |
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