CN109280456A - A kind of electronic component coating material and preparation method thereof - Google Patents
A kind of electronic component coating material and preparation method thereof Download PDFInfo
- Publication number
- CN109280456A CN109280456A CN201810849899.2A CN201810849899A CN109280456A CN 109280456 A CN109280456 A CN 109280456A CN 201810849899 A CN201810849899 A CN 201810849899A CN 109280456 A CN109280456 A CN 109280456A
- Authority
- CN
- China
- Prior art keywords
- coating material
- formula
- bisphenol
- type epoxy
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
- C08G79/02—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule a linkage containing phosphorus
- C08G79/04—Phosphorus linked to oxygen or to oxygen and carbon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
Abstract
A kind of electronic component coating material provided by the invention, the electronic component with coating material be formula (I) shown in polymer and bisphenol A type epoxy resin compound.The present invention also provides the preparation methods of above-mentioned electronic component coating material.Sub- component coating material good effect of heat insulation provided by the invention, preparation method is simple, compound using macromolecule and bisphenol A type epoxy resin, on the one hand heat dissipation performance is improved, it is more suitable for electronic component use, on the other hand improves adhesion property, ensure that insulation effect.
Description
Technical field
The present invention relates to coating material field, in particular to a kind of electronic component coating material further relates to its preparation
Method.
Background technique
Coatings have the coating of good electrical insulation.There are good electrical property, hot property, mechanical performance and chemically
Energy.Mostly varnish, also coloured enamel.Coatings are divided into 600 DEG C of heatproof or less solvent types and 600-1700 DEG C aqueous two kinds.The painting
Material, which can form one layer on coated object surface, has higher volume resistivity, can bear strong electric and apply without breakdown ceramics
Layer.Coating mechanical strength with higher and good chemical stability, can be ageing-resistant, water-fast, resistant to chemical etching；Simultaneously also
With mechanical resistant impact and thermal shock resistance properties, which can descend continuous work in corresponding operating temperature.
Coatings are commonly used in electronic component, however, existing coatings insulation effect is bad, and only pay attention to
Insulation effect, paint adhesion is bad, further affects insulation effect.
Summary of the invention
Goal of the invention: in order to overcome the above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of electronics member devices
Part coating material.
The second object of the present invention is to provide the preparation method of above-mentioned electronic component coating material.
Technical solution: a kind of electronic component coating material provided by the invention, the electronic component coating material
For the compound of polymer and bisphenol A type epoxy resin shown in formula (I)；
Wherein, the structural formula of polymer shown in formula (I) are as follows:
In formula, n is the integer between 500~2000；
The structural formula of bisphenol A type epoxy resin are as follows:
The present invention also provides the preparation methods of above-mentioned electronic component coating material, comprising the following steps:
(1) at the protection of inert gas, 350~400 DEG C, by dimethyl phosphonate and 4,4 '-diamino-phenyl hydroxyl oxygens
Change phosphine and react 8-12h under the action of catalyst, is cooled to 300 DEG C to get polymer shown in formula (I)；
(2) 250 DEG C are cooled to the speed of 20 DEG C/h, while bisphenol A type epoxy resin is added, isothermal reaction 2-4h is cold
But it is dried in vacuo afterwards to get the compound of polymer and bisphenol A type epoxy resin shown in formula (I).
In step (1), catalyst is selected from one or more of triphenyl phosphate, triethylamine, ethylenediamine.
In step (1), dimethyl phosphonate and 4, the molar ratio of 4 '-diamino-phenyl hydroxyl phosphine oxides is (1~1.2): 1.
In step (2), the molar ratio of bisphenol A type epoxy resin and polymer shown in formula (I) is (1~1.2): 1,
In, polymer shown in formula (I) uses meter with 4,4 '-diamino-phenyl hydroxyl phosphine oxides.
The utility model has the advantages that sub- component coating material good effect of heat insulation provided by the invention, preparation method is simple, adopts
It is compound with macromolecule and bisphenol A type epoxy resin, heat dissipation performance is on the one hand improved, electronic component use is more suitable for, it is another
Aspect improves adhesion property, ensure that insulation effect.
Specific embodiment
According to following embodiments, the present invention may be better understood.However, as it will be easily appreciated by one skilled in the art that real
It applies content described in example and is merely to illustrate the present invention, without sheet described in detail in claims should will not be limited
Invention.
Embodiment 1
The preparation of sub- component coating material, steps are as follows:
(1) at the protection of inert gas, 375 DEG C, by dimethyl phosphonate and 4,4 '-diamino-phenyl hydroxyl phosphine oxides exist
Ethylenediamine effect is lower to react 10h, is cooled to 300 DEG C to get polymer shown in formula (I)；Wherein, dimethyl phosphonate and 4,4 '-
The molar ratio of diamino-phenyl hydroxyl phosphine oxide is 1.1: 1；
Sampling, cools down to room temperature, is dried in vacuo, washing, drying and crushing, and the detection degree of polymerization is 1850, and 1% heat is lost
Weight decomposition rate is 311.5 DEG C.
(2) 200 DEG C are cooled to the speed of 50 DEG C/h, while bisphenol A type epoxy resin is added, isothermal reaction 3h is cooling
It is dried in vacuo afterwards to get the compound of polymer and bisphenol A type epoxy resin shown in formula (I)；Wherein, bisphenol type epoxy tree
The molar ratio of rouge and polymer shown in formula (I) is 1.1: 1, wherein polymer shown in formula (I) is with 4,4 '-diamino-phenyls
Hydroxyl phosphine oxide uses meter.
Embodiment 2
The preparation of sub- component coating material, steps are as follows:
(1) at the protection of inert gas, 350 DEG C, by dimethyl phosphonate and 4,4 '-diamino-phenyl hydroxyl phosphine oxides exist
Triethylamine effect is lower to react 12h, is cooled to 300 DEG C to get polymer shown in formula (I)；Wherein, dimethyl phosphonate and 4,4 '-
The molar ratio of diamino-phenyl hydroxyl phosphine oxide is 1.2: 1；
Sampling, cools down to room temperature, is dried in vacuo, washing, drying and crushing, and the detection degree of polymerization is 1570, and 1% heat is lost
Weight decomposition rate is 289.9 DEG C.
(2) 200 DEG C are cooled to the speed of 50 DEG C/h, while bisphenol A type epoxy resin is added, isothermal reaction 2-4h is cold
But it is dried in vacuo afterwards to get the compound of polymer and bisphenol A type epoxy resin shown in formula (I)；Wherein, bisphenol type epoxy
The molar ratio of resin and polymer shown in formula (I) is 1: 1, wherein polymer shown in formula (I) is with 4,4 '-diamino-phenyls
Hydroxyl phosphine oxide uses meter.
Embodiment 3
The preparation of sub- component coating material, steps are as follows:
(1) at the protection of inert gas, 400 DEG C, by dimethyl phosphonate and 4,4 '-diamino-phenyl hydroxyl phosphine oxides exist
Triphenyl phosphate effect is lower to react 8h, is cooled to 300 DEG C to get polymer shown in formula (I)；Wherein, dimethyl phosphonate and 4,
The molar ratio of 4 '-diamino-phenyl hydroxyl phosphine oxides is 1: 1；
Sampling, cools down to room temperature, is dried in vacuo, washing, drying and crushing, and the detection degree of polymerization is 1180, and 1% heat is lost
Weight decomposition rate is 250.7 DEG C.
(2) 200 DEG C are cooled to the speed of 50 DEG C/h, while bisphenol A type epoxy resin is added, isothermal reaction 2-4h is cold
But it is dried in vacuo afterwards to get the compound of polymer and bisphenol A type epoxy resin shown in formula (I)；Wherein, bisphenol type epoxy
The molar ratio of resin and polymer shown in formula (I) is 1.2: 1, wherein polymer shown in formula (I) is with 4,4 '-diaminobenzenes
Base hydroxyl phosphine oxide uses meter.
The performance of the coating material of testing example 1 to 3
1, coating voltage-withstand test is to apply certain alternating current voltage, and coating can bear when then 1min coating does not puncture
Maximum voltage value.
2, at a temperature of temperature recycles the alternating hot and cold for referring to -40 DEG C/30min-125 DEG C/30min, what coating can bear is followed
Number of rings is until coating cracking.
Claims (5)
1. a kind of electronic component coating material, it is characterised in that: shown in the electronic component is formula (I) with coating material
The compound of polymer and bisphenol A type epoxy resin；
Wherein, the structural formula of polymer shown in formula (I) are as follows:
In formula, n is the integer between 500~2000；
The structural formula of bisphenol A type epoxy resin are as follows:
2. a kind of preparation method of electronic component coating material described in claim 1, it is characterised in that: including following step
It is rapid:
(1) at the protection of inert gas, 350~400 DEG C, by dimethyl phosphonate and 4,4 '-diamino-phenyl hydroxyl phosphine oxides
8-12h is reacted under the action of catalyst, is cooled to 300 DEG C to get polymer shown in formula (I)；
(2) 250 DEG C are cooled to the speed of 20 DEG C/h, while bisphenol A type epoxy resin is added, isothermal reaction 2-4h, after cooling
It is dried in vacuo the compound to get polymer and bisphenol A type epoxy resin shown in formula (I).
3. the preparation method of seed component coating material according to claim 2, it is characterised in that: step (1)
In, catalyst is selected from one or more of triphenyl phosphate, triethylamine, ethylenediamine.
4. the preparation method of seed component coating material according to claim 2, it is characterised in that: step (1)
In, dimethyl phosphonate and 4, the molar ratio of 4 '-diamino-phenyl hydroxyl phosphine oxides is (1~1.2): 1.
5. the preparation method of seed component coating material according to claim 2, it is characterised in that: step (2)
In, the molar ratio of bisphenol A type epoxy resin and polymer shown in formula (I) is (1~1.2): 1, wherein gather shown in formula (I)
It closes object and uses meter with 4,4 '-diamino-phenyl hydroxyl phosphine oxides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810849899.2A CN109280456A (en) | 2018-07-28 | 2018-07-28 | A kind of electronic component coating material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810849899.2A CN109280456A (en) | 2018-07-28 | 2018-07-28 | A kind of electronic component coating material and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN109280456A true CN109280456A (en) | 2019-01-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810849899.2A Withdrawn CN109280456A (en) | 2018-07-28 | 2018-07-28 | A kind of electronic component coating material and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1423678A (en) * | 1999-12-13 | 2003-06-11 | 陶氏环球技术公司 | Flame retardant phosphorus element-containing epoxy resin compositions |
| CN102433001A (en) * | 2011-09-13 | 2012-05-02 | 华烁科技股份有限公司 | Halogen-free flame-retarding material composition and application thereof in bonding sheets, copper clad laminates and laminates |
| JP2017039810A (en) * | 2015-08-18 | 2017-02-23 | 信越化学工業株式会社 | Method for bonding photocurable fluoropolyether elastomer composition |
-
2018
- 2018-07-28 CN CN201810849899.2A patent/CN109280456A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1423678A (en) * | 1999-12-13 | 2003-06-11 | 陶氏环球技术公司 | Flame retardant phosphorus element-containing epoxy resin compositions |
| CN1423678B (en) * | 1999-12-13 | 2010-11-10 | 陶氏环球技术公司 | Flame retardant phosphorus element-containing epoxy resin compositions |
| CN102433001A (en) * | 2011-09-13 | 2012-05-02 | 华烁科技股份有限公司 | Halogen-free flame-retarding material composition and application thereof in bonding sheets, copper clad laminates and laminates |
| JP2017039810A (en) * | 2015-08-18 | 2017-02-23 | 信越化学工業株式会社 | Method for bonding photocurable fluoropolyether elastomer composition |
Non-Patent Citations (1)
| Title |
|---|
| 赵伟: "聚合型磷基阻燃剂合成及对环氧树脂的阻燃机理研究", 《中国博士学位论文全文数据库 工程科技Ⅰ辑》 * |
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Application publication date: 20190129 |
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