CN109273837A - A kind of structure for realizing antenna Yu circuit nested encryptions - Google Patents

A kind of structure for realizing antenna Yu circuit nested encryptions Download PDF

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Publication number
CN109273837A
CN109273837A CN201811022560.1A CN201811022560A CN109273837A CN 109273837 A CN109273837 A CN 109273837A CN 201811022560 A CN201811022560 A CN 201811022560A CN 109273837 A CN109273837 A CN 109273837A
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CN
China
Prior art keywords
circuit
radiation patch
short
concentric ring
metal floor
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Pending
Application number
CN201811022560.1A
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Chinese (zh)
Inventor
朱华
李秀萍
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Beijing University of Posts and Telecommunications
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Beijing University of Posts and Telecommunications
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Application filed by Beijing University of Posts and Telecommunications filed Critical Beijing University of Posts and Telecommunications
Priority to CN201811022560.1A priority Critical patent/CN109273837A/en
Publication of CN109273837A publication Critical patent/CN109273837A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Abstract

The invention discloses a kind of structures for realizing antenna Yu circuit nested encryptions, including inhibiting surface-wave antenna, chip circuit and co-planar waveguide pad: surface-wave antenna being inhibited to include feed probes and be layered the silicon-based substrate of setting, metal floor, dielectric layer, radiation patch from bottom to top;It is provided with short-circuit concentric ring in radiation patch and short-circuit concentric ring is arranged concentrically with radiation patch, radiation patch passes through short-circuit concentric ring and connect with metal floor;Radiation patch part inside short-circuit concentric ring is provided with fluting, is used for chip placement circuit;One end of feed probes is connect with radiation patch;Co-planar waveguide pad includes the earth plate being arranged on metal floor, and the signal wire connecting with the other end of feed probes.

Description

A kind of structure for realizing antenna Yu circuit nested encryptions
Technical field
The present invention relates to antenna technical fields, particularly relate to a kind of structure for realizing antenna Yu circuit nested encryptions.
Background technique
The people of continuous exploration with to(for) electromagnetic spectrum, millimeter wave/Terahertz (0.1THz-10THz) is due to its frequency spectrum It is resourceful, wavelength is short, interference is small, can be realized message transmission rate on Gbps, institute in wireless access can be efficiently solved The problems faced, broadband wireless communications, in terms of in have a wide range of applications.With solid-state electronic The progress of technology, millimeter wave/Terahertz chip circuit also has gradually developed, through integrated-optic device, from microwave signal Being converted to millimeter wave/Terahertz becomes realization low cost, high integration millimeter wave/Terahertz system optimal path.
In recent ten years, the technique of common millimeter wave/Terahertz frequency range has silicon-based technology (CMOS/BiCMOS), low temperature Ceramic process (LTCC), packaging technology.But the medium of these techniques leads to antenna there are high dielectric loss and high dielectric constant Larger surface wave is generated, aerial band width, radiation efficiency low (< 10%) and gain low (being less than -10dBi), radiation lobe are subtracted It is small.Secondly as millimeter wave/Terahertz wavelength is shorter, the size of antenna can compare with chip size, therefore, can be by day Line and chip circuit integrate jointly, but that there is antenna and chip circuit junction loss is big, couples to influence each other etc. and ask Topic.Inhibiting the main method on surface in millimeter wave/Terahertz antenna at present is to load in silicon base medium fluting, on chip antenna surface Medium and load Meta Materials, but these methods all introduce more complicated structure and processing technology.
Summary of the invention
In view of this, the purpose of the embodiment of the present invention is to propose a kind of structure for realizing antenna Yu circuit nested encryptions, Can overcome in millimeter wave/Terahertz antenna technological design the surface wave loss as caused by high dielectric constant and with chip circuit collection There are problems that junction loss in and influence each other, and there is simple structure, inhibition surface-wave antenna high gain and chip The advantages of circuit integration.
Based on a kind of above-mentioned purpose structure for realizing antenna Yu circuit nested encryptions provided in an embodiment of the present invention, including suppression Control surface wave antenna, chip circuit and co-planar waveguide pad:
The inhibition surface-wave antenna includes feed probes and with being layered the silicon-based substrate of setting, metal from bottom to top Plate, dielectric layer, radiation patch;It is provided with short-circuit concentric ring in the radiation patch and the short-circuit concentric ring and the radiation are pasted Piece is arranged concentrically, and the radiation patch is connect by the short-circuit concentric ring with the metal floor;With one heart positioned at the short circuit The radiation patch part inside ring is provided with fluting, for placing the chip circuit;One end of the feed probes with The radiation patch connection;
The co-planar waveguide pad includes the earth plate being arranged on the metal floor, and with the feed probes The signal wire of other end connection.
Optionally, the short-circuit concentric ring includes multiple evenly arranged metal columns, and the arrangement of multiple metal columns is in Rectangle.
Optionally, the diameter of the metal column is 1.2 μm, and the distance of the two neighboring metal column is 1.2 μm.
Optionally, the radiation patch is rectangular radiation patch, and the radiation patch is less than the face of the metal floor Product.
Optionally, the fluting is arranged along the edge of the short-circuit concentric ring, and the fluting is rectangle, square or just Hexagon.
Optionally, the feed probes include microstrip line and probe, the microstrip line be set to the radiation patch with Between the dielectric layer, one end of the microstrip line is connect by the probe with the radiation patch, the other end and the letter The connection of number line.
Optionally, the lower surface of the signal wire is arranged on the metal floor, at upper surface and the radiation patch In same level.
Optionally, the quantity of the earth plate is two and is separately positioned on the two sides of the signal wire, the earth plate Lower surface be arranged on the metal floor, upper surface and the radiation patch are in same level.
Optionally, the width of the metal floor is less than half waveguide wavelength.
Optionally, the connection structure is suitable for silicon-based technology, low-temp ceramics technique and packaging technology.
From the above it can be seen that a kind of knot for realizing antenna Yu circuit nested encryptions provided in an embodiment of the present invention Structure, can overcome in millimeter wave/Terahertz antenna technological design the surface wave loss as caused by high dielectric constant and with chip electricity There are problems that junction loss during road is integrated and influence each other, using short-circuit concentric ring structure radiation patch and metal floor it Between introduce electric current and form equivalent inductance, equivalent inductance reduces the capacitor of dielectric layer to reduce effective dielectric constant, inhibits The surface wave of antenna, improves antenna gain;Partial radiation patch inside short-circuit concentric ring is cut out to form fluting, is opened Chip placement circuit in slot, to realize the miniaturization of antenna;Wire chamber is formd between short-circuit concentric ring and metal floor, It is isolated for realizing inhibition surface-wave antenna with chip circuit;And short-circuit concentric ring can provide effective grounding ground connection for chip circuit The intensivism for inhibiting surface-wave antenna and chip circuit is realized in connection.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with It obtains other drawings based on these drawings.
Fig. 1 is a kind of perspective view for the structure for realizing antenna and circuit nested encryptions of the embodiment of the present invention;
Fig. 2 is a kind of top view for the structure for realizing antenna and circuit nested encryptions of the embodiment of the present invention;
Fig. 3 is a kind of sectional view for the structure for realizing antenna and circuit nested encryptions of the embodiment of the present invention;
Fig. 4 is a kind of S parameter figure for the structure for realizing antenna and circuit nested encryptions of the embodiment of the present invention;
Fig. 5 is a kind of gain diagram for the structure for realizing antenna and circuit nested encryptions of the embodiment of the present invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference Attached drawing, the present invention is described in more detail.
It should be noted that all statements for using " first " and " second " are for differentiation two in the embodiment of the present invention The non-equal entity of a same names or non-equal parameter, it is seen that " first " " second " only for the convenience of statement, does not answer It is interpreted as the restriction to the embodiment of the present invention, subsequent embodiment no longer illustrates this one by one.
Fig. 1 is a kind of perspective view for the structure for realizing antenna and circuit nested encryptions of the embodiment of the present invention;Fig. 2 is the present invention A kind of top view for the structure for realizing antenna and circuit nested encryptions of embodiment;Fig. 3 is a kind of realization antenna of the embodiment of the present invention With the sectional view of the structure of circuit nested encryptions.
A kind of structure for realizing antenna Yu circuit nested encryptions provided in an embodiment of the present invention, including inhibit surface wave day Line, chip circuit 12 and co-planar waveguide pad: the inhibition surface-wave antenna includes feed probes and is layered from bottom to top Silicon-based substrate 7, metal floor 4, dielectric layer 11, the radiation patch 1 of setting;Short-circuit concentric ring is provided in the radiation patch 1 And the short-circuit concentric ring is arranged concentrically with the radiation patch 1, so that short-circuit concentric ring and radiation patch 1 have same center To form concentric ring, the radiation patch 1 is connect by the short-circuit concentric ring with the metal floor 4 origin;Positioned at described 1 part of the radiation patch inside short-circuit concentric ring is provided with fluting 5, for placing the chip circuit 12;The feed One end of probe is connect with the radiation patch 1;The co-planar waveguide pad includes the ground connection being arranged on the metal floor 4 Plate 9, and the signal wire 8 being connect with the other end of the feed probes.
Optionally, dielectric layer 11 is silica (SiO2) insulating medium layer.
The structure that antenna and circuit nested encryptions are realized described in the embodiment of the present invention, can overcome millimeter wave/Terahertz In antenna technological design the surface wave loss as caused by high dielectric constant and with chip circuit it is integrated in there are junction loss and phase The problem of mutually influencing, electric current is introduced between radiation patch 1 and metal floor 4 using short-circuit concentric ring structure and forms equivalent electricity Sense, equivalent inductance reduce the capacitor of dielectric layer 11 to reduce effective dielectric constant, it is suppressed that the surface wave of antenna improves Antenna gain;Partial radiation patch 1 inside short-circuit concentric ring is cut out to form fluting 5, chip placement circuit in fluting 5 12, to realize the miniaturization of antenna;Wire chamber is formd between short-circuit concentric ring and metal floor 4, for realizing inhibition Surface-wave antenna is isolated with chip circuit 12;And short-circuit concentric ring can provide effective grounding grounding connection for chip circuit 12, it is real Now inhibit the intensivism of surface-wave antenna and chip circuit 12.
In some embodiments of the invention, the short-circuit concentric ring is by loading between radiation patch 1 and metal floor 4 And evenly arranged multiple metal columns 2 are constituted, the arrangement of multiple metal columns 2 is in rectangle, i.e., the described short-circuit concentric ring is square Shape.The fluting 5 is also rectangular channel.Optionally, the diameter of the metal column be 1.2 μm, the two neighboring metal column away from From being 1.2 μm.Short-circuit concentric ring is shown in introducing electric current in radiation patch and floor by metal column, forms equivalent inductance.Equivalent electricity Sense reduces the capacitor of dielectric layer to reduce equivalent electric constant, it is suppressed that the surface wave of antenna improves and inhibits surface wave day The gain and efficiency of line.Meanwhile chip circuit 12 is connect by connecting line with metal column 2, and short-circuit concentric ring is enabled to be chip Circuit 12 provides effective grounding grounding connection, realizes and inhibits surface-wave antenna and chip circuit intensivism.
In other embodiments of the invention, the radiation patch 1 is rectangular radiation patch, and the radiation patch 1 Less than the area of the metal floor 4.Optionally, the fluting 5 is arranged along the edge of the short-circuit concentric ring, and the fluting 5 may be square, regular hexagon or other optional shapes.
In some embodiments, the feed probes include microstrip line 6 and visit 3 needles, and the microstrip line 6 is set to described Between radiation patch 1 and the dielectric layer 11, one end of the microstrip line 6 is connected by the probe 3 with the radiation patch 1 It connects, the other end is connect with the signal wire 8.
Optionally, the signal wire 8 is rectangular block shape structure, and the lower surface of signal wire 8 is arranged in the metal floor 4 On, upper surface and the radiation patch 1 are in same level.
Optionally, the quantity of the earth plate 9 is two and is separately positioned on the two sides of the signal wire, and earth plate 9 is The lower surface of rectangular block shape structure, the earth plate 9 is arranged on the metal floor 4, at upper surface and the radiation patch 1 In same level.
Optionally, the width of the metal floor is less than half waveguide wavelength.
In further embodiments, the connection structure is suitable for silicon-based technology (CMOS/BiCMOS), low-temp ceramics technique (LTCC) and a variety of millimeter waves/Terahertz antenna processing technology such as packaging technology.
In a specific embodiment, antenna of the present invention uses the technique of BiCMOS, which includes eight layers of gold Belong to layer, eight layers of SiO2 insulating medium layer and silicon-based substrate, eight layers of SiO2 insulating medium layer constitute BiCMOS dielectric layers, metal layer and Insulating medium layer is alternately superimposed, and silicon-based substrate 6 is located at the bottom of eight layers of metal layer, eight layers of SiO2 insulating medium layer, radiation patch 1 For the top-level metallic of BiCMOS technique.Microstrip line 3 is located at the layer 5 metal under upper of BiCMOS technique, and probe 3 passes through 1~4 layer of connection rectangular radiation patch 1 of dielectric and microstrip line 6.Metal floor 4 is the underlying metal of BiCMOS technique.Two Earth plate 9 is located at 8 left and right sides of signal wire.Signal wire 8 is connect with microstrip line 6, and signal wire 8 is extended by the 5th layer of metal To top-level metallic, earth plate 9 extends to top-level metallic by underlying metal, and signal wire 8 and earth plate 9,10 are located at coplanar with side Just it uses.
Referring to shown in Fig. 4, Fig. 5, the arrangement works of the present invention for realizing antenna and circuit nested encryptions 254~ 271GHz frequency range.It is 1.8dBi, efficiency 30% in the gain of 267GHz.
It should be understood by those ordinary skilled in the art that: the discussion of any of the above embodiment is exemplary only, not It is intended to imply that the scope of the present disclosure (including claim) is limited to these examples;Under thinking of the invention, above embodiments Or can also be combined between the technical characteristic in different embodiments, step can be realized with random order, and be existed such as Many other variations of the upper different aspect of the invention, for simplicity, they are not provided in details.
The embodiment of the present invention be intended to cover fall into all such replacements within the broad range of appended claims, Modifications and variations.Therefore, all within the spirits and principles of the present invention, any omission, modification, equivalent replacement, the improvement made Deng should all be included in the protection scope of the present invention.

Claims (10)

1. a kind of structure for realizing antenna Yu circuit nested encryptions, which is characterized in that including inhibiting surface-wave antenna, chip circuit And co-planar waveguide pad:
The inhibition surface-wave antenna includes feed probes and is layered the silicon-based substrate of setting, metal floor, Jie from bottom to top Matter layer, radiation patch;It is provided with short-circuit concentric ring in the radiation patch and the short-circuit concentric ring and the radiation patch are same Heart setting, the radiation patch are connect by the short-circuit concentric ring with the metal floor;In the short-circuit concentric ring The radiation patch part in portion is provided with fluting, for placing the chip circuit;One end of the feed probes with it is described Radiation patch connection;
The co-planar waveguide pad includes the earth plate being arranged on the metal floor, and another with the feed probes Hold the signal wire of connection.
2. structure according to claim 1, which is characterized in that the short circuit concentric ring includes multiple evenly arranged metals Column, the arrangement of multiple metal columns are in rectangle.
3. structure according to claim 2, which is characterized in that the diameter of the metal column is 1.2 μm, two neighboring described The distance of metal column is 1.2 μm.
4. structure according to claim 1, which is characterized in that the radiation patch is rectangular radiation patch, and the spoke Penetrate the area that patch is less than the metal floor.
5. structure according to claim 1, which is characterized in that the fluting is arranged along the edge of the short-circuit concentric ring, And the fluting is rectangle, square or regular hexagon.
6. structure according to claim 1, which is characterized in that the feed probes include microstrip line and probe, described Microstrip line is set between the radiation patch and the dielectric layer, and one end of the microstrip line passes through the probe and the spoke Patch connection is penetrated, the other end is connect with the signal wire.
7. structure according to claim 1, which is characterized in that the lower surface of the signal wire is arranged in the metal floor On, upper surface and the radiation patch are in same level.
8. structure according to claim 1, which is characterized in that the quantity of the earth plate is two and is separately positioned on institute The two sides of signal wire are stated, the lower surface of the earth plate is arranged on the metal floor, at upper surface and the radiation patch In same level.
9. structure according to claim 1, which is characterized in that the width of the metal floor is less than half waveguide wave It is long.
10. structure described in -9 any one according to claim 1, which is characterized in that the connection structure is suitable for silicon substrate work Skill, low-temp ceramics technique and packaging technology.
CN201811022560.1A 2018-09-03 2018-09-03 A kind of structure for realizing antenna Yu circuit nested encryptions Pending CN109273837A (en)

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
CN109655970A (en) * 2019-01-30 2019-04-19 电子科技大学 A kind of integrated transition structure of Terahertz on piece
CN109830796A (en) * 2019-03-29 2019-05-31 中国电子科技集团公司第三十八研究所 A kind of antenna based on CMOS technology
CN109828330A (en) * 2019-01-30 2019-05-31 电子科技大学 The antenna integrated transition structure of Terahertz on piece with multistage tapered waveguide structure
CN111211416A (en) * 2020-03-20 2020-05-29 厦门大学 Silicon-based chip antenna based on substrate integrated waveguide technology
CN112054301A (en) * 2020-09-16 2020-12-08 南京尤圣美电子科技有限公司 Miniaturized linear polarization, dual polarization, circular polarization and triple polarization 5G antenna
WO2022011805A1 (en) * 2020-07-16 2022-01-20 盛纬伦(深圳)通信技术有限公司 Ridge waveguide-based dielectric-plate-free broadband millimeter wave chip packaging structure

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109655970A (en) * 2019-01-30 2019-04-19 电子科技大学 A kind of integrated transition structure of Terahertz on piece
CN109828330A (en) * 2019-01-30 2019-05-31 电子科技大学 The antenna integrated transition structure of Terahertz on piece with multistage tapered waveguide structure
CN109828330B (en) * 2019-01-30 2020-01-07 电子科技大学 Terahertz on-chip integrated antenna transition structure with multi-stage gradient waveguide structure
CN109830796A (en) * 2019-03-29 2019-05-31 中国电子科技集团公司第三十八研究所 A kind of antenna based on CMOS technology
CN111211416A (en) * 2020-03-20 2020-05-29 厦门大学 Silicon-based chip antenna based on substrate integrated waveguide technology
WO2022011805A1 (en) * 2020-07-16 2022-01-20 盛纬伦(深圳)通信技术有限公司 Ridge waveguide-based dielectric-plate-free broadband millimeter wave chip packaging structure
CN112054301A (en) * 2020-09-16 2020-12-08 南京尤圣美电子科技有限公司 Miniaturized linear polarization, dual polarization, circular polarization and triple polarization 5G antenna
CN112054301B (en) * 2020-09-16 2024-01-30 南京尤圣美电子科技有限公司 Miniaturized linear polarization, dual polarization, circular polarization and three-polarization 5G antenna

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Application publication date: 20190125