CN109270434A - Detection probe - Google Patents
Detection probe Download PDFInfo
- Publication number
- CN109270434A CN109270434A CN201811168710.XA CN201811168710A CN109270434A CN 109270434 A CN109270434 A CN 109270434A CN 201811168710 A CN201811168710 A CN 201811168710A CN 109270434 A CN109270434 A CN 109270434A
- Authority
- CN
- China
- Prior art keywords
- magnetic mount
- column portion
- intelligent card
- card chip
- conductive filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A kind of detection probe, applied to intelligent card chip, including magnetic mount, the conductive filament being wound in magnetic mount and a side in magnetic mount and the probe circuit plate that connect with conductive filament, and magnetic mount is incident upon the projection on intelligent card chip and is entirely located in the range of intelligent card chip.It is entirely located in the range of intelligent card chip since magnetic mount is incident upon the projection on intelligent card chip, and then entire detection probe can be enable to carry out one-to-one aimed detection to the intelligent card chip of several semi-finished product in a product card, thus, intelligent card chip need not be removed one by one and be detected again, it is simple and convenient, moreover, such as undesirable intelligent card chip in discovery product card, as long as being identified to it.So, when delivered product, as long as entire product card is delivered to customer, and since the intelligent card chip in product card is customized number, metering is more convenient, advantageously reduces the generation of metering mistakes and omissions.
Description
Technical field
The present invention relates to the technical field of detection device more particularly to a kind of detection probes applied to intelligent card chip.
Background technique
With the development of technology and manufacture easy to produce, intelligent card chip are made more and more small, in order to high-volume
Production and processing.And generally, in process of production, several semi-finished product intelligent card chips can be produced with rectangular array at one
In product card, in order to produce and measure the quantity of intelligent card chip.And these semi-finished product need to carry out it before factory
Detection, to guarantee the qualification rate of factory.But when such as being detected with current detection device to intelligent card chip, due to this
The probe of a little detection devices is larger, and the area being covered in product card is equally likely to the face of several semi-finished product intelligent card chips
Product, it is seen then that it cannot carry out one-to-one aimed detection to several semi-finished product intelligent card chips in a product card,
For this purpose, can only remove one by one the intelligent card chip in product card, then detected again.But complete to intelligent card chip
After detection, the intelligent card chip of dispersion can only be collected by pouch, and measure, then dispatch from the factory and send to required client.
To sum up, embodiment in the prior art, not only bothers bothersome, influences production efficiency, and a pouch
Equipped with several intelligent card chips, delivers both sides and be difficult to determine product quantity, be easy the case where there are mistakes and omissions.
Therefore, it is necessary to provide a kind of technological means to solve drawbacks described above.
Summary of the invention
It is an object of the invention to overcome the defect of the prior art, a kind of detection probe is provided, to solve in the prior art
Detection probe cannot carry out one-to-one aimed detection to several semi-finished product intelligent card chips in a product card
The problem of.
The invention is realized in this way detection probe, be applied to intelligent card chip, including magnetic mount, be wound on it is described
Conductive filament in magnetic mount and the side in the magnetic mount and the probe being connect with conductive filament electricity
Road plate, and the magnetic mount is incident upon the range that the projection on the intelligent card chip is entirely located in the intelligent card chip
It is interior；
Wherein, the magnetic mount is cylindrical-shaped structure；The diameter range of the magnetic mount is 8-12mm, and
The height of the magnetic mount is 10-15mm；The magnetic mount is made of alnico magnets or non-permanent magnet；
The conductive filament is copper wire, filamentary silver or spun gold.
Preferably, the magnetic mount includes for the column portion of the conductive filament winding, set on a side in the column portion
It goes up and extends the side for protruding from the column portion to stop the conductive filament being set around in the column portion to be detached from the column portion
First blocking portion and on another side in the column portion and extends and protrude from the side in the column portion to stop to be set around institute
The second blocking portion that the conductive filament in column portion is detached from the column portion is stated, the probe circuit plate is set to first blocking portion
On, and first blocking portion, the column portion, the accommodating accommodated for the conductive filament is formed between second blocking portion
Slot.
Further, first blocking portion is to be arranged in parallel with second blocking portion.
Further, first blocking portion extends protrusion along the axial direction perpendicular to the column portion.
Further, second blocking portion extends protrusion along the axial direction perpendicular to the column portion.
Further, it is equipped between the probe circuit plate and the magnetic mount to make the probe circuit plate
The articulamentum being connected and fixed in the magnetic mount.
The technical effect of detection probe of the invention are as follows: since to be incident upon the projection on intelligent card chip complete for magnetic mount
Portion is located in the range of intelligent card chip, and then entire detection probe can be enable to several semi-finished product in a product card
Intelligent card chip carry out one-to-one aimed detection, intelligent card chip need not be removed one by one detect again as a result,
It is simple and convenient, moreover, such as undesirable intelligent card chip in discovery product card, as long as being identified to it.So, due to smart card
Chip need not be removed and be detected, and in this, as long as entire product card is delivered to customer, and be avoided after detecting in the prior art
It needs to collect the trouble of intelligent card chip using pouch, and the trouble for measuring intelligent card chip one by one can be saved whereby, significantly
Packed and transported is simplified, is conducive to improve entire production efficiency；Simultaneously due to which the intelligent card chip in product card is customization number
Amount, metering is more convenient, advantageously reduces the generation of metering mistakes and omissions.
In addition, the detection probe structure is simple, be conducive to process.
Detailed description of the invention
Fig. 1 is that the detection that detection probe of the invention is installed on for being detected to the intelligent card chip in product card is set
Standby upper schematic diagram；
Fig. 2 is the schematic diagram of the magnetic mount of detection probe of the invention；
Fig. 3 is the schematic diagram of another embodiment of the magnetic mount of detection probe of the invention；
Fig. 4 is the schematic diagram of detection probe product card detected of the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The embodiment of detection probe of the invention is illustrated below referring to FIG. 1 to FIG. 4,.
The detection probe 20 of the present embodiment can be used as detecting to the intelligent card chip 300 in product card 200
Detection device 100 on probe, wherein detection device 100 further include shell 10, control circuit board 30, power module 40 and
Key (does not indicate) in figure, and control circuit board 30 is arranged in shell 10；Power module 40 be arranged in shell 10, and with control
Circuit board 30 connects；Key is set on shell 10, and is movably contacted with control circuit board 30；Detection probe 20 is set to shell
On 10 one end comprising magnetic mount 21, the conductive filament 22 being wound in magnetic mount 21 and be set to magnetic mount
A side on the 21 and probe circuit plate 23 connecting with conductive filament 22, probe circuit plate 23 are connect with control circuit board 30, and
The projection that magnetic mount 21 is incident upon on intelligent card chip 300 is entirely located in the range of intelligent card chip 300.
Since magnetic mount 21 is incident upon the model that the projection on intelligent card chip 300 is entirely located in intelligent card chip 300
In enclosing, and then entire detection probe 20 can be enable to the intelligent card chip 300 of several semi-finished product in a product card 200
One-to-one aimed detection is carried out, intelligent card chip 300 need not be removed one by one detect again as a result, it is simple and convenient,
Moreover, such as intelligent the core of the card 300 undesirable in discovery product card 200, as long as being identified to it.So, due to intelligent the core of the card
Piece 300 need not be removed and be detected, and in this, as long as entire product card 200 is delivered to customer, and avoid examining in the prior art
It needs to collect the trouble of intelligent card chip 300 after survey using pouch, and can save measure intelligent card chip 300 one by one whereby
Trouble, enormously simplifies packed and transported, is conducive to improve entire production efficiency；Simultaneously due to the smart card in product card 200
Chip 300 is customized number, and metering is more convenient, advantageously reduces the generation of metering mistakes and omissions.
In addition, not only structure is simple for the detection probe 20, it is convenient for production, and be conducive to control its overall dimensions size.
Wherein, magnetic mount 21 can be made of alnico magnets, and non-permanent magnet also can be used and be made；And it leads
Electrical filament 22 preferably uses copper wire, and while both having can guarantee preferable conductivity, the production cost of enterprise also can be effectively controlled, when
So, filamentary silver, spun gold etc. also can be selected in conductive filament 22.
Accordingly, 20 are popped one's head in made of magnetic mount 21, conductive filament 22 and probe circuit plate 23, when being powered, magnetic
Property 21 surface of fixing piece generate circumferential electric current, that is, be vortexed, and the direction of magnetization of eddy current magnetism direction and impressed current is on the contrary, therefore
A part of impressed current will be offset, makes the impedance of conductive filament 22, changed by the sized phases of electric current.Work as spy as a result,
First 20 close to intelligent card chip 300 when, the information of intelligent card chip 300 can be obtained by the variation of conductive filament 22.
Referring to Fig. 2, the magnetic mount 21 in the present embodiment is cylindrical-shaped structure, in order to produce and process.And preferably
Ground, the diameter range of the magnetic mount 21 is 8-12mm, preferably 10mm, and the height of the magnetic mount 21 is 10-
15mm, preferably 12mm, to guarantee that material cost can be saved while needed for meeting with optimization design.
Referring to Fig. 3, another preferred embodiment as this programme, magnetic mount 21 includes for 22 winding of conductive filament
Column portion 211 on a side in column portion 211 and extends and protrudes from the side in column portion 211 to stop to be set around in column portion 211
Conductive filament 22 be detached from column portion 211 the first blocking portion 212 and on another side in column portion 211 and extend protrude from column portion
211 side is to stop the conductive filament 22 being set around in column portion 211 to be detached from second blocking portion 213 in column portion 211, probe circuit
Plate 23 is set on the first blocking portion 212, and the first blocking portion 212, column portion 211 are formed for conductive filament between second blocking portion 213
The accommodation groove 214 of 22 accommodatings, wherein when setting conductive filament 22, can directly be set around in column portion 211, which will hold
It sets in accommodation groove 214, at this point, conductive filament 22 can be limited in accommodation groove by the first blocking portion 212 and the second blocking portion 213
In 214, conductive filament 22 is avoided to fall off.
Preferably, the first blocking portion 212 is to be arranged in parallel with the second blocking portion 213 for the ease of production and processing.Simultaneously
Ground, the first blocking portion 212 extend protrusion along the axial direction perpendicular to column portion 211, and the second blocking portion 213 is along perpendicular to column portion
211 axial direction extends protrusion.
Referring to Fig. 2, for the ease of production and processing, in the present embodiment, in probe circuit plate 30 and magnetic mount 21
Between be equipped with to make probe circuit plate 23 be connected and fixed on the articulamentum in magnetic mount 21, wherein articulamentum is preferable
For soldering-tin layer.
The foregoing is merely preferred embodiments of the present invention, structure is not limited to the above-mentioned shape enumerated, it is all
Made any modifications, equivalent replacements, and improvements etc. within the spirit and principles in the present invention, should be included in protection of the invention
Within the scope of.
Claims (6)
1. detection probe is applied to intelligent card chip, it is characterised in that: including magnetic mount, be wound on the magnetic mount
On conductive filament and a side in the magnetic mount and the probe circuit plate being connect with the conductive filament, and institute
The projection that magnetic mount is incident upon on the intelligent card chip is stated to be entirely located in the range of the intelligent card chip；
Wherein, the magnetic mount is cylindrical-shaped structure；The diameter range of the magnetic mount is 8-12mm, and the magnetic
Property fixing piece height be 10-15mm；The magnetic mount is made of alnico magnets or non-permanent magnet；It is described to lead
Electrical filament is copper wire, filamentary silver or spun gold.
2. detection probe as described in claim 1, it is characterised in that: the magnetic mount includes supplying the conductive filament winding
Column portion, on a side in the column portion and extend and protrude from the side in the column portion to stop to be set around in the column portion
The conductive filament be detached from first blocking portion in the column portion and on another side in the column portion and extend protrude from institute
The side in column portion is stated to stop the conductive filament being set around in the column portion to be detached from second blocking portion in the column portion, the spy
Head circuit board is set on first blocking portion, and first blocking portion, the column portion, is formed between second blocking portion
For the accommodation groove of conductive filament accommodating.
3. detection probe as claimed in claim 2, it is characterised in that: first blocking portion and second blocking portion are flat
Row setting.
4. detection probe as claimed in claim 2, it is characterised in that: first blocking portion is along the axis perpendicular to the column portion
Extend to direction and protrudes.
5. detection probe as claimed in claim 2, it is characterised in that: second blocking portion is along the axis perpendicular to the column portion
Extend to direction and protrudes.
6. detection probe as claimed in claim 2, it is characterised in that: in the probe circuit plate and the magnetic mount it
Between be equipped with to make the probe circuit plate be connected and fixed on the articulamentum in the magnetic mount.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820345029 | 2018-03-13 | ||
| CN2018203450297 | 2018-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109270434A true CN109270434A (en) | 2019-01-25 |
Family
ID=65195983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811168710.XA Withdrawn CN109270434A (en) | 2018-03-13 | 2018-10-08 | Detection probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109270434A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865071A (en) * | 2012-10-16 | 2013-01-09 | 中国科学院电工研究所 | Over-metal sleeve magnetosonic resistivity imaging logging method and device |
| CN203930090U (en) * | 2014-05-20 | 2014-11-05 | 中国地质科学院地球物理地球化学勘查研究所 | Magnetic probe in three-component TEM well |
| CN204269770U (en) * | 2014-05-08 | 2015-04-15 | 国民技术股份有限公司 | A kind of chip security detection system |
| CN104527735A (en) * | 2014-12-30 | 2015-04-22 | 中国人民解放军国防科学技术大学 | Magnetic-levitation train positioning and speed measuring device and method based on F rail |
| CN204759426U (en) * | 2015-06-09 | 2015-11-11 | 北京电子科技学院 | Electromagnetism analytic system of crypto chip |
-
2018
- 2018-10-08 CN CN201811168710.XA patent/CN109270434A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865071A (en) * | 2012-10-16 | 2013-01-09 | 中国科学院电工研究所 | Over-metal sleeve magnetosonic resistivity imaging logging method and device |
| CN204269770U (en) * | 2014-05-08 | 2015-04-15 | 国民技术股份有限公司 | A kind of chip security detection system |
| CN203930090U (en) * | 2014-05-20 | 2014-11-05 | 中国地质科学院地球物理地球化学勘查研究所 | Magnetic probe in three-component TEM well |
| CN104527735A (en) * | 2014-12-30 | 2015-04-22 | 中国人民解放军国防科学技术大学 | Magnetic-levitation train positioning and speed measuring device and method based on F rail |
| CN204759426U (en) * | 2015-06-09 | 2015-11-11 | 北京电子科技学院 | Electromagnetism analytic system of crypto chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190125 |