CN109266008A - A kind of thermally conductive new material - Google Patents

A kind of thermally conductive new material Download PDF

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Publication number
CN109266008A
CN109266008A CN201811138154.1A CN201811138154A CN109266008A CN 109266008 A CN109266008 A CN 109266008A CN 201811138154 A CN201811138154 A CN 201811138154A CN 109266008 A CN109266008 A CN 109266008A
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CN
China
Prior art keywords
parts
thermally conductive
new material
conductive new
methylimidazole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811138154.1A
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Chinese (zh)
Inventor
潘杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tongcheng Shuanggang Senke Plastic Factory
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Tongcheng Shuanggang Senke Plastic Factory
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Tongcheng Shuanggang Senke Plastic Factory filed Critical Tongcheng Shuanggang Senke Plastic Factory
Priority to CN201811138154.1A priority Critical patent/CN109266008A/en
Publication of CN109266008A publication Critical patent/CN109266008A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0887Tungsten
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

The invention discloses a kind of thermally conductive new materials, include the following raw material according to mass fraction meter: 10-15 parts of organosilicon polymer, 2-5 parts of dipentaerythritol, 0.1-3 parts of sodium hydroxide, 1-10 parts of aqueous acrylic emulsion, 0.5-2.0 parts of ethyl acetate, 5-10 parts of toluene, 2-5 parts of tributoxyethyl phosphate, 2-4 parts of styrene-butadiene latex, 2-5 parts of ethoxy ethanol, 2-5 parts of dimethyl ether, 2-5 parts of graphene oxide, 2-5 parts of graphite powder, 0.1-0.3 parts of tungsten powder, 1-5 parts of polyamide, 2-7 parts of phenol, 0.5-1.0 parts of methylimidazole.Thermally conductive new material provided by the invention, the new material with good function effect can reach corresponding good result, and in the production process in the case where save the cost and reduction labour, can save a large amount of artificial.

Description

A kind of thermally conductive new material
Technical field
The invention belongs to Material Fields, and in particular to a kind of thermally conductive new material.
Background technique
New material refers to some materials newly-developed or researching and developing, having preeminent performance, has more than traditional material For excellent performance.New material technology is then the will according to people, is commented by physical study, design of material, material processing, test A series of research process such as valence, create the technology for being able to satisfy the new material of various needs.With the development of science and technology, people On the basis of traditional material, according to the research achievement of modern science and technology, develop new material.
The research of new material is always the theme of China's scientific research project, if it is possible to research and develop that a ingredient is simple, raw material It is cheap, and the green wood material formula of good result can be reached, will contribute greatly the one of the mankind.
Summary of the invention
The purpose of the present invention is to provide a kind of thermally conductive new materials.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of thermally conductive new material, includes the following raw material according to mass fraction meter: 10-15 parts of organosilicon polymer, two seasons penta 2-5 parts of tetrol, 0.1-3 parts of sodium hydroxide, 1-10 parts of aqueous acrylic emulsion, 0.5-2.0 parts of ethyl acetate, 5-10 parts of toluene, 2-5 parts of tributoxyethyl phosphate, 2-4 parts of styrene-butadiene latex, 2-5 parts of ethoxy ethanol, 2-5 parts of dimethyl ether, graphene oxide 2-5 Part, 2-5 parts of graphite powder, 0.1-0.3 parts of tungsten powder, 1-5 parts of polyamide, 2-7 parts of phenol, 0.5-1.0 parts of methylimidazole.
A kind of thermally conductive new material, includes the following raw material according to mass fraction meter: 10 parts of organosilicon polymer, two seasons Penta 2 parts of tetrol, 3 parts of sodium hydroxide, 2 parts of aqueous acrylic emulsion, 1 part of ethyl acetate, 5 parts of toluene, tributoxyethyl phosphate 2 Part, 4 parts of styrene-butadiene latex, 2 parts of ethoxy ethanol, 5 parts of dimethyl ether, 2 parts of graphene oxide, 5 parts of graphite powder, 0.3 part of tungsten powder, polyamides 1 part of amine, 7 parts of phenol, 0.5 part of methylimidazole.
A kind of thermally conductive new material, includes the following raw material according to mass fraction meter: 13 parts of organosilicon polymer, two seasons Penta 3 parts of tetrol, 2 parts of sodium hydroxide, 5 parts of aqueous acrylic emulsion, 1 part of ethyl acetate, 6 parts of toluene, tributoxyethyl phosphate 3 Part, 3 parts of styrene-butadiene latex, 3 parts of ethoxy ethanol, 3 parts of dimethyl ether, 3 parts of graphene oxide, 3 parts of graphite powder, 0.2 part of tungsten powder, polyamides 2 parts of amine, 5 parts of phenol, 1 part of methylimidazole.
The diameter of the graphene oxide is 8-12 microns.
The diameter of the graphite powder is 80-100 nanometers.
The preparation method of the thermally conductive new material includes the following steps:
S1: it mediates: by graphene oxide, graphite powder and organosilicon polymer, dipentaerythritol, sodium hydroxide, acetic acid second Ester, tributoxyethyl phosphate, ethoxy ethanol, dimethyl ether, polyamide are added in kneader and mediate, as base-material;
S2: dispersion: base-material is poured into dispersion machine, and toluene, phenol, methylimidazole, styrene-butadiene latex, water soluble acrylic acid is added Lotion and tungsten powder, dispersion stirring 20-30 minutes;
S3: packaging: the raw material after dispersion is tested, is packed.
In the step S2, when being stirred, carry out under high pressure.
Beneficial effects of the present invention: thermally conductive new material provided by the invention, the new material with good function effect, energy It is enough to reach corresponding good result, and in the production process in the case where save the cost and reduction labour, it can It saves a large amount of artificial.
Specific embodiment
Present invention is further described in detail combined with specific embodiments below.
Embodiment 1:
A kind of thermally conductive new material, includes the following raw material according to mass fraction meter: 10 parts of organosilicon polymer, dipentaerythritol 2 parts, 0.1 part of sodium hydroxide, 1 part of aqueous acrylic emulsion, 0.5 part of ethyl acetate, 5 parts of toluene, tributoxyethyl phosphate 2 Part, 2 parts of styrene-butadiene latex, 2 parts of ethoxy ethanol, 2 parts of dimethyl ether, 2 parts of graphene oxide, 2 parts of graphite powder, 0.1 part of tungsten powder, polyamides 1 part of amine, 2 parts of phenol, 0.5 part of methylimidazole.
Preparation method includes the following steps:
S1: it mediates: by graphene oxide, graphite powder and organosilicon polymer, dipentaerythritol, sodium hydroxide, acetic acid second Ester, tributoxyethyl phosphate, ethoxy ethanol, dimethyl ether, polyamide are added in kneader and mediate, as base-material;
S2: dispersion: base-material is poured into dispersion machine, and toluene, phenol, methylimidazole, styrene-butadiene latex, water soluble acrylic acid is added Lotion and tungsten powder, dispersion stirring 20-30 minutes;
S3: packaging: the raw material after dispersion is tested, is packed.
Embodiment 2:
A kind of thermally conductive new material, includes the following raw material according to mass fraction meter: 15 parts of organosilicon polymer, dipentaerythritol 5 parts, 3 parts of sodium hydroxide, 10 parts of aqueous acrylic emulsion, 2.0 parts of ethyl acetate, 10 parts of toluene, tributoxyethyl phosphate 5 Part, 4 parts of styrene-butadiene latex, 5 parts of ethoxy ethanol, 5 parts of dimethyl ether, 5 parts of graphene oxide, 5 parts of graphite powder, 0.3 part of tungsten powder, polyamides 5 parts of amine, 7 parts of phenol, 1.0 parts of methylimidazole.
Preparation method includes the following steps:
S1: it mediates: by graphene oxide, graphite powder and organosilicon polymer, dipentaerythritol, sodium hydroxide, acetic acid second Ester, tributoxyethyl phosphate, ethoxy ethanol, dimethyl ether, polyamide are added in kneader and mediate, as base-material;
S2: dispersion: base-material is poured into dispersion machine, and toluene, phenol, methylimidazole, styrene-butadiene latex, water soluble acrylic acid is added Lotion and tungsten powder, dispersion stirring 20-30 minutes;
S3: packaging: the raw material after dispersion is tested, is packed.
Embodiment 3:
A kind of thermally conductive new material, includes the following raw material according to mass fraction meter: 13 parts of organosilicon polymer, dipentaerythritol 3 parts, 2 parts of sodium hydroxide, 5 parts of aqueous acrylic emulsion, 1 part of ethyl acetate, 6 parts of toluene, 3 parts of tributoxyethyl phosphate, fourth 3 parts of benzene latex, 3 parts of ethoxy ethanol, 3 parts of dimethyl ether, 3 parts of graphene oxide, 3 parts of graphite powder, 0.2 part of tungsten powder, polyamide 2 Part, 5 parts of phenol, 1 part of methylimidazole.
Preparation method includes the following steps:
S1: it mediates: by graphene oxide, graphite powder and organosilicon polymer, dipentaerythritol, sodium hydroxide, acetic acid second Ester, tributoxyethyl phosphate, ethoxy ethanol, dimethyl ether, polyamide are added in kneader and mediate, as base-material;
S2: dispersion: base-material is poured into dispersion machine, and toluene, phenol, methylimidazole, styrene-butadiene latex, water soluble acrylic acid is added Lotion and tungsten powder, dispersion stirring 20-30 minutes;
S3: packaging: the raw material after dispersion is tested, is packed.
Above content is only citing made for the present invention and explanation, affiliated those skilled in the art are to being retouched The specific embodiment stated does various modifications or additions or is substituted in a similar manner, as long as it does not deviate from the concept of invention Or beyond the scope defined by this claim, it is within the scope of protection of the invention.

Claims (7)

1. a kind of thermally conductive new material, which is characterized in that according to mass fraction meter include the following raw material: organosilicon polymer 10-15 Part, 2-5 parts of dipentaerythritol, 0.1-3 parts of sodium hydroxide, 1-10 parts of aqueous acrylic emulsion, 0.5-2.0 parts of ethyl acetate, first 5-10 parts of benzene, 2-5 parts of tributoxyethyl phosphate, 2-4 parts of styrene-butadiene latex, 2-5 parts of ethoxy ethanol, 2-5 parts of dimethyl ether, oxidation 2-5 parts of graphene, 2-5 parts of graphite powder, 0.1-0.3 parts of tungsten powder, 1-5 parts of polyamide, 2-7 parts of phenol, methylimidazole 0.5-1.0 Part.
2. a kind of thermally conductive new material according to claim 1, which is characterized in that according to mass fraction meter including following former Material: 10 parts of organosilicon polymer, 2 parts of dipentaerythritol, 3 parts of sodium hydroxide, 2 parts of aqueous acrylic emulsion, 1 part of ethyl acetate, 5 parts of toluene, 2 parts of tributoxyethyl phosphate, 4 parts of styrene-butadiene latex, 2 parts of ethoxy ethanol, 5 parts of dimethyl ether, graphene oxide 2 Part, 5 parts of graphite powder, 0.3 part of tungsten powder, 1 part of polyamide, 7 parts of phenol, 0.5 part of methylimidazole.
3. a kind of thermally conductive new material according to claim 1, which is characterized in that according to mass fraction meter including following former Material: 13 parts of organosilicon polymer, 3 parts of dipentaerythritol, 2 parts of sodium hydroxide, 5 parts of aqueous acrylic emulsion, 1 part of ethyl acetate, 6 parts of toluene, 3 parts of tributoxyethyl phosphate, 3 parts of styrene-butadiene latex, 3 parts of ethoxy ethanol, 3 parts of dimethyl ether, graphene oxide 3 Part, 3 parts of graphite powder, 0.2 part of tungsten powder, 2 parts of polyamide, 5 parts of phenol, 1 part of methylimidazole.
4. a kind of thermally conductive new material according to claim 1, which is characterized in that the diameter of the graphene oxide is 8-12 Micron.
5. a kind of thermally conductive new material according to claim 1, which is characterized in that the diameter of the graphite powder is received for 80-100 Rice.
6. a kind of preparation method of thermally conductive new material, which is characterized in that the preparation method of the thermally conductive new material includes the following steps:
S1: it mediates: by graphene oxide, graphite powder and organosilicon polymer, dipentaerythritol, sodium hydroxide, ethyl acetate, phosphorus Sour three butoxyethyls, ethoxy ethanol, dimethyl ether, polyamide are added in kneader and mediate, as base-material;
S2: dispersion: base-material is poured into dispersion machine, and toluene, phenol, methylimidazole, styrene-butadiene latex, aqueous acrylic emulsion is added And tungsten powder, dispersion stirring 20-30 minutes;
S3: packaging: the raw material after dispersion is tested, is packed.
7. a kind of preparation method of thermally conductive new material according to claim 6, which is characterized in that in the step S2, When being stirred, carry out under high pressure.
CN201811138154.1A 2018-09-28 2018-09-28 A kind of thermally conductive new material Pending CN109266008A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
CN201811138154.1A CN109266008A (en) 2018-09-28 2018-09-28 A kind of thermally conductive new material

Publications (1)

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CN109266008A true CN109266008A (en) 2019-01-25

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105086688A (en) * 2015-08-25 2015-11-25 济宁利特纳米技术有限责任公司 Oxidized graphene insulating heat-radiating coating and preparation method thereof
CN105199184A (en) * 2015-10-30 2015-12-30 太仓市天合新材料科技有限公司 Novel heat conduction material
CN105385411A (en) * 2015-10-30 2016-03-09 太仓市天合新材料科技有限公司 Novel radiation-proof material
WO2016082139A1 (en) * 2014-11-27 2016-06-02 Dow Global Technologies Llc Thermal conductive composition
US20160251558A1 (en) * 2013-10-15 2016-09-01 Enrad Ltd. Elastomer and/or composite based material for thermal energy storage
WO2016163830A1 (en) * 2015-04-08 2016-10-13 주식회사 아모그린텍 Heat dissipating coating composition and heat dissipating unit formed using same
CN106633257A (en) * 2016-10-19 2017-05-10 黄宇 Modified rubber material
CN107151447A (en) * 2017-07-13 2017-09-12 合肥利元杰信息科技有限公司 A kind of CPU high-efficiency heat conduction materials and preparation method thereof
CN107698966A (en) * 2017-11-07 2018-02-16 广西小草信息产业有限责任公司 A kind of heat conduction new material and preparation method thereof
CN108047723A (en) * 2017-12-18 2018-05-18 中山市雅乐思商住电器有限公司 A kind of heat conduction new material and preparation method thereof

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160251558A1 (en) * 2013-10-15 2016-09-01 Enrad Ltd. Elastomer and/or composite based material for thermal energy storage
WO2016082139A1 (en) * 2014-11-27 2016-06-02 Dow Global Technologies Llc Thermal conductive composition
WO2016163830A1 (en) * 2015-04-08 2016-10-13 주식회사 아모그린텍 Heat dissipating coating composition and heat dissipating unit formed using same
CN105086688A (en) * 2015-08-25 2015-11-25 济宁利特纳米技术有限责任公司 Oxidized graphene insulating heat-radiating coating and preparation method thereof
CN105199184A (en) * 2015-10-30 2015-12-30 太仓市天合新材料科技有限公司 Novel heat conduction material
CN105385411A (en) * 2015-10-30 2016-03-09 太仓市天合新材料科技有限公司 Novel radiation-proof material
CN106633257A (en) * 2016-10-19 2017-05-10 黄宇 Modified rubber material
CN107151447A (en) * 2017-07-13 2017-09-12 合肥利元杰信息科技有限公司 A kind of CPU high-efficiency heat conduction materials and preparation method thereof
CN107698966A (en) * 2017-11-07 2018-02-16 广西小草信息产业有限责任公司 A kind of heat conduction new material and preparation method thereof
CN108047723A (en) * 2017-12-18 2018-05-18 中山市雅乐思商住电器有限公司 A kind of heat conduction new material and preparation method thereof

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Application publication date: 20190125