photoelectric cutting knife cutting depth monitoring mechanism device
Technical Field
The invention relates to the field of opto-electro-mechanical application devices, in particular to a photoelectric cutting knife cutting depth monitoring mechanism device.
Background
The metal plate processing is called metal plate processing, and the main processes of the metal plate processing comprise shearing, bending and buckling, bending and forming, welding, riveting and the like. Sheet metal parts are parts which can be processed by means of stamping, bending, stretching and the like, and one general definition is parts with unchanged thickness in the processing process. Corresponding to the casting, the forging and pressing, the machining parts and the like.
In the sheet metal processing process, during shearing, the cutting of panel beating, the precision of cutting has decided the height of panel beating processing quality, and depth of cut is not enough or depth of cut is too big, all can make the follow-up processingquality of sheet metal component reduce, how effectual the depth of cut of accuse cutter carousel to the work piece board, makes the cutting accuracy of panel beating work piece board improve greatly, becomes the problem that needs the solution.
disclosure of Invention
the invention aims to solve the technical problem of providing a photoelectric cutting knife cutting depth monitoring mechanism device, so that the cutting depth of a workpiece plate by a cutting knife control turntable is effectively controlled, the cutting precision of the workpiece plate is greatly improved, and the processing quality of a sheet metal workpiece is improved.
In order to solve the technical problems, the invention is realized by the following technical scheme:
The invention provides a photoelectric cutting knife cutting depth monitoring mechanism device, which comprises a first base plate, wherein two sides of the first base plate are fixedly connected with a first side fixed connecting plate; the lifting mechanism comprises a pair of first lifting power devices distributed on two sides of a first base plate, wherein an output shaft of each first lifting power device is connected with a first lifting connecting rod mechanism; the first lifting connecting rod mechanism movably penetrates through the first side fixed connecting plate; the end side of the first lifting connecting rod mechanism is vertically and fixedly connected with a first side fixing transverse plate; the end side of the first side fixing transverse plate is fixedly connected with a first lifting transverse plate; one side of the first lifting transverse plate is provided with an infrared emission mechanism; the first lifting transverse plate is fixedly connected with the second lifting transverse plate through a side fixing connecting rod; one side of the second lifting transverse plate is provided with an infrared receiving mechanism.
The lifting mechanism comprises a second lifting power device, wherein an output shaft of the second lifting power device is connected with a second lifting connecting rod mechanism; the end side of the second lifting connecting rod mechanism is movably provided with a cutter turntable; the end side of the second lifting connecting rod mechanism is provided with a power device which is in driving connection with the cutter turntable; the cutting device comprises a workpiece plate to be cut, which is placed on a pressure sensing plate.
As a preferred technical scheme of the invention, the first side fixed connecting plate is provided with a through groove structure matched with the first lifting connecting rod mechanism.
as a preferred technical scheme of the invention, the infrared receiving mechanism on the second lifting transverse plate is matched with the infrared transmitting mechanism on the first lifting transverse plate in position.
As a preferred technical solution of the present invention, a first positioning link is fixedly connected to an end side of the first lifting link mechanism; one side of the first side fixing transverse plate is fixedly connected with a second positioning connecting rod; the guide device comprises a first guide fixing plate, wherein a first positioning connecting rod and a second positioning connecting rod movably penetrate through the first guide fixing plate, and a through groove structure matched with the first positioning connecting rod and the second positioning connecting rod is formed in the first guide fixing plate.
as a preferred technical scheme of the invention, the radius of the cutter turntable is set as R; the real-time blocked distance monitored by the current infrared receiving mechanism is L; the cutting depth of the workpiece plate to be cut is determined by the front cutter turntable
Compared with the prior art, the invention has the beneficial effects that:
According to the invention, the photoelectric position of the current cutter turntable is monitored by the infrared transmitting mechanism and the infrared receiving mechanism, the width of the blocking area of the current cutter turntable is monitored by the infrared transmitting mechanism and the infrared receiving mechanism, and the cutting depth of the cutter turntable on the workpiece plate is effectively controlled by analyzing and calculating the current cutting depth, so that the cutting precision of the workpiece plate is greatly improved, and the processing quality of the sheet metal workpiece is improved.
drawings
FIG. 1 is a schematic view of the overall apparatus of the present invention;
FIG. 2 is a schematic diagram of the distribution structure of the infrared transmitting/receiving mechanism of the present invention;
wherein: 1-a first base plate; 2-a first side fixed connecting plate; 3-a first lifting power device; 4-a first lifting linkage; 5-fixing a transverse plate at the first side; 6-a first lifting transverse plate; 7-an infrared emission mechanism; 8-a second lifting transverse plate; 9-an infrared receiving mechanism; 10-side fixed connecting rod; 11-a workpiece plate to be cut; 12-a pressure sensing plate; 13-a second lifting power device; 14-a second lifting linkage; 15-cutter turntable; 16-a first positioning link; 17-a second positioning link; 18-a first guide fixing plate; 19-fixing the bolt.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention relates to a photoelectric cutting knife cutting depth monitoring mechanism device, which comprises a first base plate 1, wherein two sides of the first base plate 1 are fixedly connected with a first side fixed connecting plate 2; comprises a pair of first lifting power devices 3 distributed at two sides of a first base plate 1; the output shaft of the first lifting power device 3 is connected with a first lifting connecting rod mechanism 4; the first lifting connecting rod mechanism 4 movably penetrates through the first side fixed connecting plate 2; a first side fixing transverse plate 5 is vertically and fixedly connected to the end side of the first lifting connecting rod mechanism 4; the end side of the first side fixing transverse plate 5 is fixedly connected with a first lifting transverse plate 6; one side of the first lifting transverse plate 6 is provided with an infrared emission mechanism 7; the lifting device comprises a second lifting transverse plate 8, wherein the second lifting transverse plate 8 is fixedly connected with the first lifting transverse plate 6 through a side fixing connecting rod 10; one side of the second lifting transverse plate 8 is provided with an infrared receiving mechanism 9.
the lifting device comprises a second lifting power device 13, wherein an output shaft of the second lifting power device 13 is connected with a second lifting connecting rod mechanism 14; the end side of the second lifting connecting rod mechanism 14 is movably provided with a cutter turntable 15; the end side of the second lifting connecting rod mechanism 14 is provided with a power device which is connected with the cutter turntable 15 in a driving way; including a workpiece plate 11 to be cut placed on a pressure sensing plate 12.
Furthermore, a through groove structure matched with the first lifting connecting rod mechanism 4 is formed in the first edge side fixing connecting plate 2.
Further, the infrared receiving mechanism 9 on the second lifting cross plate 8 is matched with the infrared emitting mechanism 7 on the first lifting cross plate 6.
further, a first positioning link 16 is fixedly connected to an end side of the first lifting link mechanism 4; one side of the first side fixing transverse plate 5 is fixedly connected with a second positioning connecting rod 17; the device comprises a first guide fixing plate 18, a first positioning connecting rod 16 and a second positioning connecting rod 17 movably penetrate through the first guide fixing plate 18, and a through groove structure matched with the first positioning connecting rod 16 and the second positioning connecting rod 17 is formed in the first guide fixing plate 18.
Further, the radius of the cutter turntable 15 is set as R; the real-time blocked distance monitored by the current infrared receiving mechanism 9 is L; the cutting depth of the workpiece plate 11 to be cut is determined by the front cutter wheel 15
In the invention, a workpiece plate 11 to be cut is placed on a pressure sensing plate 12 of a first base plate 1, the pressure grade monitored by the pressure sensing plate 12 is primary pressure, when a cutter turntable 15 presses the workpiece plate 11 to be cut, the pressure grade monitored by the pressure sensing plate 12 is secondary pressure, meanwhile, an infrared emission mechanism 7 and an infrared receiving mechanism 9 carry out photoelectric position monitoring on the current cutter turntable 15, and the blocked area monitored by the infrared emission mechanism 7 and the infrared receiving mechanism 9 is wider and wider along with the cutting depth of the cutter turntable 15; the current cutting depth is analyzed and calculated in the monitoring system, so that the cutting depth of the workpiece plate by the cutter control turntable 15 is effectively controlled.
The positions of the infrared emission mechanism 7 and the infrared receiving mechanism 9 are adjusted through the first lifting power device 13, so that the cutter rotating disc 15 and the workpiece plate 11 to be cut are accurately monitored.
the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.