CN109246368B - Thermal infrared imager and thermal infrared imager damping device - Google Patents
Thermal infrared imager and thermal infrared imager damping device Download PDFInfo
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- CN109246368B CN109246368B CN201811425711.8A CN201811425711A CN109246368B CN 109246368 B CN109246368 B CN 109246368B CN 201811425711 A CN201811425711 A CN 201811425711A CN 109246368 B CN109246368 B CN 109246368B
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- 238000013016 damping Methods 0.000 title claims abstract description 124
- 230000000712 assembly Effects 0.000 claims description 19
- 238000000429 assembly Methods 0.000 claims description 19
- 230000035939 shock Effects 0.000 claims description 14
- 238000009434 installation Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000006978 adaptation Effects 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 description 8
- 239000000306 component Substances 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000008358 core component Substances 0.000 description 2
- 238000003331 infrared imaging Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F2238/00—Type of springs or dampers
- F16F2238/02—Springs
- F16F2238/026—Springs wound- or coil-like
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Mechanical Engineering (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a thermal infrared imager damping device which comprises a thermal imager shell, wherein a damping assembly used for damping a core assembly in a preset direction is arranged on the thermal imager shell, the damping assembly comprises a fastening piece fixed on the thermal imager shell and a damping spring used for correspondingly compressing the fastening piece and the core assembly, and the fixing position of the fastening piece on the thermal imager shell is adjustable. When the thermal infrared imager damping device is used in practice, the core assembly is located in the thermal imager shell, the damping spring can be adjusted to damp the core assembly according to the vibration and impact magnitude possibly received by the thermal infrared imager in the practical use environment by adjusting the fixed position of the fastener on the thermal imager shell, the damping capacity of the damping assembly is adjustable, and the environment adaptation capacity is high. The invention also discloses the thermal infrared imager comprising the thermal infrared imager damping device, which can be well adapted to different impact environments.
Description
Technical Field
The invention relates to the technical field of infrared imaging equipment, in particular to a thermal infrared imager damping device and a thermal infrared imager.
Background
The infrared imaging is based on the infrared radiation imaging of a target, is a passive imaging mode, is less influenced by weather such as haze, cloudy days and the like, can work all weather, and has wide application in many fields such as automobile auxiliary driving and the like.
Due to the complex use environment, the vibration and the impact can damage electronic components inside the thermal infrared imager, and the final image can be influenced to cause a series of problems such as screen split and the like. Therefore, it is necessary to perform a shock absorption process on the thermal infrared imager to improve the reliability of the product and the imaging quality.
In the prior art, as shown in fig. 1 in detail, an infrared imager includes a housing, an inner cylinder and a rear cover, a movement assembly of the infrared imager is fixedly installed in the inner cylinder, and the inner cylinder is nested in the housing. Wherein, be equipped with between the front end of infrared imager's the core subassembly and the shell and be used for the absorbing high damping cushion, be equipped with damping spring between the back lid of rear end and shell rear end to carry out the shock attenuation to the core subassembly in the direction of perpendicular to camera lens.
After the infrared imager is assembled, the relative positions of all parts in the shell are determined, and the damping capacity of the damping spring and the high-damping cushion block is determined, so that the infrared imager cannot adapt to different impact environments.
Therefore, how to adapt the thermal infrared imager to different impact environments is a technical problem that needs to be solved by those skilled in the art at present.
Disclosure of Invention
In view of this, the present invention provides a thermal infrared imager damping device, which can make the thermal infrared imager better adapt to different impact environments. The thermal infrared imager comprises the thermal infrared imager damping device, and the thermal infrared imager can be well adapted to environments with different impacts.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a thermal infrared imager damping device, includes the thermal imager shell, be equipped with on the thermal imager shell and be used for carrying out absorbing damper to core assembly in the direction of predetermineeing, damper is including being fixed in the fastener of thermal imager shell with be used for corresponding compress tightly in the fastener with damping spring between the core assembly, the fastener is in fixed position on the thermal imager shell is adjustable.
Preferably, the preset directions are at least two; and in each preset direction, the two sides of the installation position of the machine core assembly are provided with the damping assemblies.
Preferably, the shock absorption assembly further comprises a ball for abutting between the shock absorption spring and the movement assembly.
Preferably, a guide hole is formed in the thermal imager shell, the damping spring is correspondingly arranged in the guide hole, and the guide hole extends along the preset direction corresponding to the damping spring in the guide hole.
Preferably, the guide holes are threaded holes penetrating through the thermal imager shell, and the fasteners are in threaded connection with the corresponding guide holes.
Preferably, the fastener comprises an end cap and a guide rod fixed on the end cap, the outer peripheral surface of the end cap is provided with threads so as to be in threaded connection with the guide hole, and the damping spring is sleeved on the corresponding guide rod.
An infrared thermal imager comprises the infrared thermal imager damping device, wherein a core assembly is arranged inside a thermal imager shell of the infrared thermal imager damping device, and a damping spring in the damping assembly is tightly pressed between a fastener in the damping assembly and the core assembly.
Preferably, the preset directions include a first preset direction, a second preset direction and a third preset direction perpendicular to the lens of the movement assembly, and the first preset direction, the second preset direction and the third preset direction are pairwise perpendicular.
Preferably, in the first preset direction, two sides of the movement assembly are provided with three non-collinear shock absorption assemblies; in the second preset direction, three non-collinear damping assemblies are arranged on two sides of the movement assembly.
Preferably, on a mounting surface of the movement assembly on which the lens is disposed, four shock-absorbing assemblies corresponding to the third preset direction are respectively disposed at four vertices of a virtual rectangle on the mounting surface.
The thermal infrared imager damping device comprises a thermal imager shell, wherein a damping assembly used for damping a core assembly in a preset direction is arranged on the thermal imager shell, the damping assembly comprises a fastening piece fixed on the thermal imager shell and a damping spring used for being correspondingly compressed between the fastening piece and the core assembly, and the fixing position of the fastening piece on the thermal imager shell is adjustable.
When the thermal infrared imager damping device is used in practice, the core assembly is located in the thermal imager shell, the damping spring can be adjusted to damp the core assembly according to the vibration and impact magnitude possibly received by the thermal infrared imager in the practical use environment by adjusting the fixed position of the fastener on the thermal imager shell, the damping capacity of the damping assembly is adjustable, and the environment adaptation capacity is high.
The thermal infrared imager comprising the thermal infrared imager damping device provided by the invention can be well adapted to different impact environments.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is an explosion diagram of a conventional thermal infrared imager;
FIG. 2 is an exploded view of a shock absorbing assembly in a thermal infrared imager in accordance with the present invention;
FIG. 3 is an exploded view of a thermal infrared imager according to the present invention;
FIG. 4 is a cross-sectional view of a thermal infrared imager in accordance with the present invention;
FIG. 5 is a structural diagram of a rear cover in a thermal infrared imager according to the present invention;
FIG. 6 is a block diagram of a front housing of a thermal infrared imager in accordance with the present invention;
fig. 7 is a structural diagram of the interior of a thermal imager housing of a thermal infrared imager provided in accordance with the present invention.
In fig. 1: 01-shell, 02-high damping cushion block, 03-movement assembly, 04-inner cylinder, 05-damping spring, 06-back cover;
in fig. 2 to 7: 1-damping component, 11-fastener, 111-end cap, 112-guide rod, 113-groove, 12-damping spring, 13-ball, 2-core component, 3-lens, 4-thermal imager shell, 41-front shell, 42-rear cover and 43-guide hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core of the invention is to provide the thermal infrared imager damping device, which can enable the thermal infrared imager to be well adapted to different impact environments. The thermal infrared imager provided by the invention has the other core that the thermal infrared imager damping device is provided, so that the thermal infrared imager can be better suitable for different impact environments.
In a specific embodiment of the thermal infrared imager damping device provided by the present invention, please refer to fig. 2 to 7, which includes a thermal imager housing 4, wherein a damping assembly 1 for damping the movement assembly 2 in a predetermined direction is disposed on the thermal imager housing 4.
The damping assembly 1 comprises a fastener 11 fixedly arranged on the thermal imager shell 4 and a damping spring 12 correspondingly pressed between the fastener 11 and the core assembly 2, and the fixing position of the fastener 11 on the thermal imager shell 4 is adjustable. For the damping spring 12 damping in a predetermined direction, the deformation direction is along the predetermined direction to buffer the vibration in the predetermined direction, and the predetermined direction corresponds to the damping spring 12.
In the thermal infrared imager, a core assembly 2 is arranged in a thermal imager shell 4, a lens 3 is arranged on the core assembly 2, and the core assembly 2 can be matched with the lens 3 when imaging. The damping assembly 1 is disposed between the movement assembly 2 and the thermal imager housing 4 to damp the movement assembly 2 in a preset direction.
According to actual use conditions, threaded holes can be added in the thermal imager shell 4, and the thermal infrared imager damping device is fixedly connected with other devices through screws.
In this embodiment, during actual use, by adjusting the fixed position of the fastening member 11 on the thermal imager housing 4, the damping of the damping spring 12 on the core assembly 2 can be adjusted according to the vibration and impact magnitude that the thermal infrared imager may be subjected to in an actual use environment, so that the damping capability of the damping assembly 1 is adjustable, and the environment adaptation capability is high.
On the basis of the above embodiments, referring to fig. 7 specifically, the number of the preset directions may be at least two, wherein the preset directions are linear directions, and an included angle greater than 0 exists between different preset directions. In every direction of predetermineeing, the both sides of core subassembly installation position all are equipped with damper 1, and the space of core subassembly installation for installing the core subassembly promptly to guarantee in thermal infrared imager, in every direction of predetermineeing, the both sides of core subassembly 2 all are equipped with damper 1.
Because when using, thermal infrared imager can receive the vibrations on the equidirectional, adopts thermal infrared imager damping device in this embodiment, core subassembly 2 can be carried out the shock attenuation by corresponding damper 1 in the equidirectional, alleviates the vibrations and the impact that core subassembly 2 received in the equidirectional, can effectively reduce because of core subassembly 2 receives the influence to the formation of image effect that vibrations caused. In addition, the damping assembly 1 can position the position of the core assembly 2 in the thermal imager shell 4 to a certain extent while buffering.
On the basis of the above embodiment, the damper assembly 1 may further include a ball 13, and the ball 13 is configured to abut between the corresponding damper spring 12 and the movement assembly 2, and specifically, refer to fig. 2 and 4. Wherein, the fastener 11, the damping spring 12 and the ball 13 in one damping assembly 1 have corresponding relations.
When the thermal infrared imager is applied to the thermal infrared imager, the ball 13 has small friction damage to the surface of the core assembly 2 due to point contact between the ball 13 and the core assembly 2. Meanwhile, through setting up ball 13 between core assembly 2 and damping spring 12, because damping spring 12 can not with core assembly 2's surperficial direct contact, when core assembly 2 takes place to remove, damping spring 12 that the direction of predetermineeing is different from this moving direction can not take place the slope because of the contact friction with core assembly 2, is favorable to guaranteeing damping spring 12 at its the ascending shock-absorbing capacity of the direction of predetermineeing that corresponds.
On the basis of the above embodiment, the thermal imager housing 4 may be provided with a guide hole 43, the damping spring 12 is correspondingly disposed in the guide hole 43, and the guide hole 43 extends along a preset direction in which the damping spring 12 corresponds. That is, the guide hole 43 can restrain the deformation direction of the damping spring 12, and ensure that the damping spring 12 deforms along the corresponding preset direction.
On the basis of the above embodiment, the guiding holes 43 may be specifically threaded holes penetrating through the thermal imager housing 4, and the fasteners 11 are screwed in the corresponding guiding holes 43.
The fixing position of the fastener 11 on the thermal imager shell 4 can be adjusted by rotating the fastener 11 in the guide hole 43 to adjust the threaded engagement position of the fastener 11 and the thermal imager shell 4, and the adjustment is convenient. Of course, the fastening element 11 may also be connected to the thermal imager housing by a snap connection or in some other manner.
On the basis of the above embodiment, referring to fig. 2, the fastening member 11 includes an end cap 111 and a guide rod 112 fixed to the end cap 111, the outer circumferential surface of the end cap 111 is provided with threads to be in threaded connection with the guide hole 43, the damping spring 12 is correspondingly sleeved on the guide rod 112, the damping spring 12 can be further guided by the guide rod 112, the deformation direction of the damping spring 12 is ensured to be maintained in the corresponding preset direction, and the damping spring 12 is prevented from deflecting.
Additionally, to facilitate the turning operation of fastener 11, end cap 111 may be provided with a recess 113 for application of force by an operating tool such as a screwdriver.
Besides the thermal infrared imager damping device, the invention also provides a thermal infrared imager which comprises the thermal infrared imager damping device and a core assembly. The thermal infrared imager damping device can be the thermal infrared imager damping device provided in any one of the above embodiments, and the beneficial effects can be obtained by referring to the above embodiments. The thermal imager shell 4 is internally provided with the core assembly 2, and a damping spring 12 in the damping assembly 1 is tightly pressed between a fastener 11 in the damping assembly 1 and the core assembly 2.
On the basis of the above embodiment, the balls 13 are at least partially retracted into the corresponding guide holes 43, that is, after the thermal infrared imager is assembled, no matter how the position of the fastener 11 is adjusted relative to the thermal imager housing 4 within a set range, at least a portion of the balls 13 is always located inside the corresponding guide holes 43, so that the positions of the balls 13 can be limited by the cooperation of the guide holes 43 and the damping springs 12, and the balls 13 can be reliably prevented from being separated from the corresponding damping springs 12.
On the basis of any of the above embodiments, the preset directions may be three and two by two perpendicular directions, specifically including a first preset direction, a second preset direction and a third preset direction, where the third preset direction is perpendicular to the direction of the lens 3 of the movement assembly 2, specifically to the focal plane.
Specifically, as shown in fig. 7, the damping assemblies 1 can be arranged on six sides of the machine core assembly 2 in three directions to correspondingly damp, so that the machine core assembly 2 is comprehensively protected, external vibration is prevented from damaging electronic components inside the thermal infrared imager, and the adaptability and the imaging quality of the electronic components in a bumpy or frequently shocked or impacted environment are improved.
On the basis of the above embodiment, in the first preset direction, three non-collinear damping assemblies 1 are arranged on two sides of the movement assembly 2, and similarly, in the second preset direction, three non-collinear damping assemblies 1 are arranged on two sides of the movement assembly 2. Referring to fig. 3, the three damping assemblies 1 are arranged non-collinearly, so that the stable support of the side surface of the movement assembly 2 can be ensured. Meanwhile, in the first preset direction and the second preset direction, because the number of the damping assemblies 1 on the opposite surface of the core assembly 2 is consistent, the stress uniformity of the core assembly 2 can be improved, and the damping capacity of the core assembly 2 in the first preset direction and the second preset direction is ensured.
More preferably, in the first predetermined direction, the damper assembly 1 on one side of the movement assembly 2 may be plane-symmetric with respect to the damper assembly 1 on the other side, and the plane of symmetry is perpendicular to the first predetermined direction. In the second predetermined direction, the damping component 1 on one side of the core component 2 can be plane-symmetric to the damping component 1 on the other side, and the symmetry plane is perpendicular to the second predetermined direction
On the basis of the above-described embodiment, on the mount surface of the camera module 2 on which the lens 3 is disposed, four damper assemblies 1 corresponding to the third preset direction are respectively disposed at four vertices of a virtual rectangle on the mount surface. The mounting surface and the lens 3 thereon can be sufficiently protected by four-point support. In addition, on the core assembly 2, two damper assemblies 1 or three damper assemblies 1 may be provided on a surface opposite to the mounting surface in the third preset direction.
In one embodiment, and with particular reference to fig. 5 and 6, the imager housing includes a front housing 41 open on one side and a rear cover 42 removably and fixedly attached to the opening of the front housing 41, which may be bolted together. Wherein, a lens through hole is provided on the front case 41. The deck assembly 2 is disposed in a space enclosed by the front case 41 and the rear cover 42. The movement assembly 2 is of a hexahedral structure, one of the movement assemblies is a lens mounting surface, and four shock absorption assemblies 1 for absorbing shock in a direction perpendicular to the mounting surface are correspondingly arranged on the movement assembly; two damping components 1 are arranged on the opposite side of the mounting surface, and the two damping components 1 are used for damping in the direction perpendicular to the mounting surface; the other four side surfaces are correspondingly provided with three non-collinear shock absorption assemblies 1, and each shock absorption assembly 1 absorbs shock in the direction vertical to the side surface on which the shock absorption assembly is arranged. Accordingly, a guide hole 43 is penetratingly provided at each of the front case 41 and the rear cover 42 to mount the shock-absorbing assembly 1.
In a specific installation process, the movement assembly 2 and the lens 3 are placed in the front shell 41, the ball 13 is placed in the guide hole 43 of the front shell 41, then the damping spring 12 is placed, and finally the fastener 11 is screwed in to realize the installation of the damping assembly 1. Then, the rear cover 42 is attached to the front case 41, and the damper assembly 1 on the rear cover 42 is attached. After the whole installation is finished, the fasteners 11 are correspondingly adjusted according to the difference of vibration and impact magnitude in three preset directions in a specific use environment, so that the damping of the damping system is matched with the impact condition.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The thermal infrared imager and the damping device thereof provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (8)
1. The infrared thermal imager damping device comprises a thermal imager shell (4), wherein a damping assembly (1) used for damping a core assembly (2) in a preset direction is arranged on the thermal imager shell (4), and the infrared thermal imager damping device is characterized in that the damping assembly (1) comprises a fastener (11) fixed on the thermal imager shell (4) and a damping spring (12) used for being correspondingly compressed between the fastener (11) and the core assembly (2), and the fixing position of the fastener (11) on the thermal imager shell (4) is adjustable;
be equipped with guiding hole (43) on thermal imager shell (4), guiding hole (43) are for running through the screw hole of thermal imager shell (4), fastener (11) include end cap (111) and be fixed in guide bar (112) of end cap (111), the outer peripheral face of end cap (111) is equipped with the screw thread so that with guiding hole (43) threaded connection, damping spring (12) cover is established correspondingly on guide bar (112).
2. The thermal infrared imager damping device of claim 1, wherein the predetermined number of directions is at least two; and in each preset direction, the two sides of the installation position of the machine core assembly are provided with the damping assemblies (1).
3. The thermal infrared imager damping device according to claim 2, characterized in that said damping assembly (1) further comprises a ball (13) for abutting between said damping spring (12) and the movement assembly (2).
4. The thermal infrared imager damping device according to claim 3, characterized in that said damping spring (12) is correspondingly disposed in said guiding hole (43), said guiding hole (43) extending along said predetermined direction in which said damping spring (12) corresponds.
5. An infrared thermal imager, characterized by comprising the infrared thermal imager damping device of any one of claims 1 to 4, wherein a core assembly (2) is arranged inside a thermal imager shell of the infrared thermal imager damping device, and a damping spring (12) in the damping assembly (1) is compressed between a fastener (11) in the damping assembly (1) and the core assembly (2).
6. The thermal infrared imager according to claim 5, characterized in that said preset directions comprise a first preset direction, a second preset direction and a third preset direction perpendicular to a lens (3) of said core assembly (2), and said first preset direction, said second preset direction and said third preset direction are perpendicular to each other.
7. The thermal infrared imager according to claim 6, characterized in that, in said first predetermined direction, two sides of said core assembly (2) are provided with three said shock absorbing assemblies (1) which are not collinear; in the second preset direction, three non-collinear damping assemblies (1) are arranged on two sides of the movement assembly (2).
8. The thermal infrared imager according to claim 7, characterized in that on the mounting surface of said core assembly (2) on which said lens (3) is arranged, four of said shock-absorbing assemblies (1) corresponding to said third preset direction are arranged respectively at four vertices of a virtual rectangle on said mounting surface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811425711.8A CN109246368B (en) | 2018-11-27 | 2018-11-27 | Thermal infrared imager and thermal infrared imager damping device |
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| CN201811425711.8A CN109246368B (en) | 2018-11-27 | 2018-11-27 | Thermal infrared imager and thermal infrared imager damping device |
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| CN109246368B true CN109246368B (en) | 2020-10-20 |
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| CN111107254A (en) * | 2019-12-21 | 2020-05-05 | 浙江红相科技股份有限公司 | High-definition imaging movement with separation blade |
| CN111594731B (en) * | 2020-05-15 | 2021-08-03 | 苏州济能网络科技有限公司 | Bracket component for fixing camera |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN205981456U (en) * | 2014-12-30 | 2017-02-22 | 浙江兆晟科技股份有限公司 | Hot image device of buffer type |
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| CN202833809U (en) * | 2012-10-31 | 2013-03-27 | 成都市翻鑫家科技有限公司 | Shearing type adjustable spring shock absorber |
| CN103558675B (en) * | 2013-11-06 | 2016-03-30 | 海信集团有限公司 | Reflective mirror regulating device and optical instrument |
| CN205655824U (en) * | 2016-03-13 | 2016-10-19 | 宁波舜宇测绘科技有限公司 | Take shell core structure |
| CN205987096U (en) * | 2016-08-18 | 2017-02-22 | 浙江华睿科技有限公司 | Image capture device |
| CN206802189U (en) * | 2017-05-31 | 2017-12-26 | 航天在轨技术（深圳）有限公司 | High stable remote sensor with shock-damping structure |
| CN207780057U (en) * | 2018-01-24 | 2018-08-28 | 江西荣力航空工业有限公司 | DC distribution intelligent detector |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN205981456U (en) * | 2014-12-30 | 2017-02-22 | 浙江兆晟科技股份有限公司 | Hot image device of buffer type |
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Application publication date: 20190118 Assignee: INFIRAY TECHNOLOGIES CO.,LTD. Assignor: Yantai Airui Photo-Electric Technology Co.,Ltd. Contract record no.: X2024980006380 Denomination of invention: Infrared thermal imagers and shock absorption devices for infrared thermal imagers Granted publication date: 20201020 License type: Common License Record date: 20240530 |