CN109241114B - Fault device identification system and method, and computer storage medium - Google Patents
Fault device identification system and method, and computer storage medium Download PDFInfo
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Abstract
The invention provides a fault equipment identification system, a fault equipment identification method and a computer storage medium, wherein the fault equipment identification method comprises the following steps: obtaining angle values of the directional characteristic defects on the wafers, and defining the angle values as first angle values; grouping the plurality of wafers for the first time according to the first angle values to obtain first group codes; obtaining an angle value of each wafer in the plurality of wafers when the wafer goes out of each processing device, and defining the angle value as a second angle value; grouping the plurality of wafers for the second time according to the second angle values to obtain a second group code; and comparing the first group code with the second group code to identify a faulty processing device from all processing devices experienced by the plurality of wafers, thereby achieving rapid and effective identification of the faulty device.
Description
Technical Field
The present invention relates to the field of semiconductor technology manufacturing, and in particular, to a fault device identification system and method, and a computer storage medium.
Background
In the manufacturing process of semiconductor integrated circuits, the ability to quickly identify faulty devices has become an important means to improve yield. In a mass production process, defects with directional group characteristics often appear in a defect distribution map (defect map) scanned by a detection device, the defects with the directional group characteristics can cause a fault device of the defect distribution map (defect map) to obtain a strong signal, and the defects with the directional group characteristics are usually characterized by using an angle value. In the prior art, a method of manually calling an angle database of equipment is adopted to identify faulty equipment, defects of directional group (group) characteristics are judged according to the obtained angle value of each wafer, and the equipment is checked and judged one by one to identify the faulty equipment. However, this method is inefficient and prone to error, and therefore, how to accurately and quickly identify a faulty device through defect information of a directional group (group) feature becomes an urgent problem to be solved.
Disclosure of Invention
An object of the present invention is to provide a faulty device identification system, a faulty device identification method, and a computer storage medium for quickly and efficiently identifying a faulty device that causes a defect in directivity characteristics.
In order to achieve the above object, the present invention provides a method for identifying a faulty device, comprising:
obtaining angle values of the directional characteristic defects on the wafers, and defining the angle values as first angle values;
grouping the plurality of wafers for the first time according to the first angle values to obtain first group codes;
obtaining an angle value of each wafer in the plurality of wafers when the wafer goes out of each processing device, and defining the angle value as a second angle value;
grouping the plurality of wafers for the second time according to the second angle values to obtain a second group code; and the number of the first and second groups,
comparing the first group code and the second group code to identify a malfunctioning processing tool from all processing tools experienced by the plurality of wafers.
Optionally, the step of obtaining the first angle value includes:
detecting defects of each wafer to detect the plurality of wafers with directional characteristic defects; and the number of the first and second groups,
setting the angle of the V groove of each wafer in the plurality of wafers to be zero, taking the anticlockwise rotation direction as the positive direction, and calculating the angle value of the directional characteristic defect on each wafer relative to the V groove of the wafer to serve as the first angle value corresponding to the wafer.
Optionally, the step of obtaining the second angle value includes:
arranging an angle detection device at a wafer outlet of each processing device, and defining the angle of the V groove to be zero when each wafer enters the processing device; and the number of the first and second groups,
and detecting an angle value of the V-shaped groove of the wafer from the wafer outlet of the processing equipment relative to the wafer when the wafer enters through the angle detection device on each processing equipment to serve as a second angle value corresponding to the wafer.
Optionally, the angle detection device is mainly composed of a 360 ° aperture.
Optionally, the first grouping is based on a principle that wafers having the same first angle value among the plurality of wafers are grouped into the same group; the second grouping is based on the principle that the wafers with the same second angle value in the plurality of wafers are grouped into the same group.
Optionally, the first grouping is a manual grouping, and the second grouping is an automatic grouping.
Optionally, the first group code and the second group code both adopt a way of combining a group number of each group with a number of each wafer in the group, and when a certain first group code and a certain second group code are completely the same, the processing equipment corresponding to the second group code is the faulty processing equipment.
The present invention also provides a computer storage medium having stored thereon a computer program which, when executed by a processor, implements the faulty device identification method of the present invention.
The present invention also provides a faulty device identification system, including:
the first detection unit is used for establishing connection with a corresponding defect detection system so as to obtain a plurality of wafers with directional characteristic defects from the wafers detected by the defect detection system and further obtain an angle value of the directional characteristic defects on each wafer in the plurality of wafers, wherein the angle value is defined as a first angle value;
the first coding unit is used for grouping the plurality of wafers for the first time according to the first angle value obtained by the first detection unit and obtaining a first group code;
the second detection unit is used for establishing connection with each processing device in the experience of each wafer in the plurality of wafers so as to obtain an angle value when each wafer in the plurality of wafers comes out from each processing device in the experience of each wafer, and the angle value is defined as a second angle value;
the second coding unit is used for grouping the plurality of wafers for the second time according to the second angle value obtained by the second detection unit so as to obtain a second group code; and the number of the first and second groups,
a comparing unit, configured to compare the first group of codes obtained by the first encoding unit with the second group of codes obtained by the second encoding unit, so as to identify a faulty processing device from all processing devices experienced by the plurality of wafers.
Optionally, the first detecting unit is further configured to set an angle at the V-groove of each of the plurality of wafers to zero, and calculate an angle value of each directional feature defect on the wafer with respect to the V-groove of the wafer by taking the counterclockwise direction as a positive direction, so as to serve as a first angle value corresponding to the wafer.
Optionally, the second detecting unit is an angle detecting device installed at a wafer outlet of each processing apparatus, and is configured to define an angle at the V-groove when each wafer enters the processing apparatus to be zero, and detect an angle value when each wafer comes out from the wafer outlet of the processing apparatus and the V-groove of the wafer relatively enters, so as to serve as a second angle value corresponding to the wafer.
Optionally, the angle detection device is mainly composed of a 360 ° aperture.
Optionally, the first grouping in the first coding unit is based on a principle that wafers having the same first angle value in the plurality of wafers are grouped into the same group; the second grouping in the second coding unit is based on a principle that the wafers having the same second angle value are grouped into the same group.
Optionally, the first grouping is a manual grouping, and the second grouping is an automatic grouping.
Optionally, the first group code and the second group code both adopt a way of combining a group number of each group with a number of each wafer in the group, and when a certain first group code and a certain second group code are completely the same, the processing equipment corresponding to the second group code is the faulty processing equipment.
Compared with the prior art, the fault equipment identification system, the fault equipment identification method and the computer storage medium provided by the invention have the advantages that the group codes of the plurality of wafers with the defects of the directional characteristics are compared with the group codes of the angle values of the plurality of wafers coming out from the processing equipment, so that the fault equipment is quickly and effectively identified.
Drawings
FIG. 1 is a flow chart of a faulty device identification method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating the setting of an angle value according to an embodiment of the present invention;
FIG. 3 is a schematic view of a directional feature defect D1 angle of a wafer having a directional feature defect D1 in accordance with an embodiment of the present invention;
FIG. 4 is an example of a first group encoding according to an embodiment of the present invention;
FIG. 5 is a schematic view of an angle detection apparatus for a wafer according to an embodiment of the present invention;
FIG. 6 is an example of a second group encoding according to an embodiment of the present invention;
fig. 7 is a system block diagram of a faulty device identification system according to an embodiment of the present invention.
Wherein the reference numerals of figures 1 to 7 are as follows:
d1-defect; g1-aperture; w1-wafer; 1-a faulty device identification system; 2-a defect detection system; 3-a wafer; 4-processing equipment; 11-a first detection unit; 12-a first encoding unit; 13-a second detection unit; 14-a second encoding unit; 15-comparison unit.
Detailed Description
To make the objects, advantages and features of the present invention clearer, the following describes the fault device identification system, the fault device identification method and the computer storage medium of the present invention in detail with reference to fig. 1 to 7. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
An embodiment of the present invention provides a method for identifying a faulty device, and referring to fig. 1, fig. 1 is a flowchart of a method for identifying a faulty device according to an embodiment of the present invention, where the method for identifying a faulty device includes:
step S1-A, obtaining angle values of the directional characteristic defects on a plurality of wafers, and defining the angle values as first angle values;
step S1-B, grouping the plurality of wafers for the first time according to the first angle values to obtain first group codes;
step S1-C, obtaining an angle value of each wafer in the plurality of wafers when the wafer comes out from each processing device, and defining the angle value as a second angle value;
step S1-D, grouping the plurality of wafers for the second time according to each second angle value to obtain a second group code;
step S1-E, comparing the first group code and the second group code to identify a malfunctioning process equipment from all process equipments experienced by the plurality of wafers.
The method for identifying a faulty device according to the present embodiment will be described in more detail with reference to fig. 2 to 6.
First, referring to fig. 2 and 3, according to step S1-a, angle values of the directional feature defects on a plurality of wafers are obtained, and defined as a first angle value. Specifically, performing defect detection on each wafer to detect the plurality of wafers with directional characteristic defects; and setting the angle of the V groove of each wafer in the plurality of wafers to be zero, and calculating the angle value of the directional characteristic defect on each wafer relative to the V groove of the wafer by taking the anticlockwise rotation direction as the positive direction so as to be used as the first angle value corresponding to the wafer. Fig. 2 is a schematic diagram illustrating the setting of the angle value according to an embodiment of the present invention, and as can be seen from fig. 2, the initial position (i.e., the 0 ° position) of the angle may be set at the V-groove of the wafer, and the counterclockwise rotation direction is set to be the positive angle direction, and the angle range is 0 ° to 360 °. Fig. 3 is a schematic view of the angle of the directional defect D1 of a wafer having the directional defect D1 according to an embodiment of the present invention, and as can be seen from fig. 3, the center of the detected directional defect D1 is taken as the position of the defect D1, so that the angle of the defect D1 is 135 °, i.e., the first angle of the wafer having the defect D1 is 135 °.
Then, referring to fig. 4, according to step S1-B, the plurality of wafers are first grouped according to the respective first angle values to obtain a first group code. The first grouping is based on the principle that the wafers with the same first angle value in the plurality of wafers are grouped into the same group, the first grouping is a manual grouping, and the first group code adopts a mode of combining the group number of each group with the serial number of each wafer in the group. Fig. 4 is an example of a first group code according to an embodiment of the present invention, and as can be seen from fig. 4, the numbers of the wafers with the corresponding directional feature defects are respectively 01, 02, 03, 04, and 05, the first angle values of the wafers are respectively 45 °, 30 °, 45 °, and 30 °, the wafers 02 and 05 with the first angle value of 30 ° are grouped into a group, and the group number is GA; and dividing the wafers 01, 03 and 04 with the same first angle value of 45 degrees into a group with the group number of GB. Thus, the resulting first group code may be GA0205GB 010304.
Then, referring to fig. 5, according to step S1-C, the angle value at which each of the plurality of wafers exits from the respective processing equipment undergoing process is obtained, and defined as a second angle value. Specifically, an angle detection device is arranged at a wafer outlet of each processing device, and an angle at a V-shaped groove is defined to be zero when each wafer enters the processing device; and detecting an angle value of the V-shaped groove of the wafer from the wafer outlet of the processing equipment relative to the wafer when the wafer enters through the angle detection device on each processing equipment to serve as a second angle value corresponding to the wafer. The range of the angle value is 0-360 degrees, and the angle detection device mainly comprises a 360-degree aperture. Fig. 5 is a schematic diagram of an angle detecting apparatus for a wafer according to an embodiment of the present invention, and as can be seen from fig. 5, when the wafer W1 enters below an aperture G1 of the angle detecting apparatus after exiting from a wafer outlet of the processing equipment, the angle detecting apparatus detects an angle value at a V-groove of the wafer with respect to the wafer entering the processing equipment, so as to obtain the second angle value. Referring to fig. 6, wafers 01, 02, 03, 04, and 05 have undergone equipment 1, 2, 3, and 4, respectively, and wafers 01, 02, 03, 04, and 05 have second angle values of 90 °, 180 °, and 180 °, respectively, corresponding to equipment 1; the second angle values of the wafers 01, 02, 03, 04, and 05 corresponding to the apparatus 2 are 90 °, 180 °, and 180 °, respectively; the second angle values of the wafers 01, 02, 03, 04 and 05 corresponding to the device 3 are 90 °, 180 °, 90 ° and 180 °, respectively; the second angle values for wafers 01, 02, 03, 04, and 05 for apparatus 4 are 90 °, and 90 °, respectively.
Then, referring to fig. 6, according to step S1-D, the plurality of wafers are grouped for a second time according to each of the second angle values to obtain a second group code. The second grouping is based on the principle that the wafers with the same second angle value in the plurality of wafers are grouped into the same group, the second grouping is automatic grouping, and the second group coding adopts the mode of combining the group number of each group with the serial number of each wafer in the group. Fig. 6 is an example of a second group code according to an embodiment of the present invention, as can be seen from fig. 6, the processes for producing the wafers include processes 1 to 4, the processing apparatuses corresponding to the processes 1 to 4 respectively include apparatuses 1 to 4, each wafer 01, 02, 03, 04, and 05, when coming out of each processing apparatus, generates one second angle value, and automatically divides the wafer numbers having the same second angle value into the same group, so that the second group codes of the wafers coming out of the apparatuses 1 to 4 can be 010ga 203GB0405, GA0102GB030405, GA0205GB010304, and GA0102030405 respectively.
Finally, according to step S1-E, the first group code and the second group code are compared to identify a malfunctioning processing tool from all processing tools experienced by the plurality of wafers. And when a certain first group code is completely the same as a certain second group code, the processing equipment corresponding to the second group code is the processing equipment with the fault. Taking the first group code in fig. 4 and the second group code in fig. 6 as an example, the first group code GA0205GB010304 is the same as the second group code GA0205GB010304, and therefore, the machining device 3 corresponding to the second group code GA0205GB010304 is the faulty device.
In summary, the method for identifying a faulty device provided by the present invention includes: obtaining angle values of the directional characteristic defects on the wafers, and defining the angle values as first angle values; grouping the plurality of wafers for the first time according to the first angle values to obtain first group codes; obtaining an angle value of each wafer in the plurality of wafers when the wafer goes out of each processing device, and defining the angle value as a second angle value; grouping the plurality of wafers for the second time according to the second angle values to obtain a second group code; and comparing the first group of codes with the second group of codes to identify the processing equipment with faults from all the processing equipment experienced by the plurality of wafers, so that the fault equipment can be identified quickly and effectively.
An embodiment of the present invention provides a computer storage medium having stored thereon a computer program that, when executed by a processor, implements the faulty device identification method in steps S1-a through S1-F. The computer storage medium of the present invention may be embedded into the defect detecting system and the angle detecting device to obtain an angle value of a wafer having a defect of a directional characteristic and an angle value of a wafer coming out from a wafer outlet of the processing apparatus. When the computer program in the computer storage medium is executed by the processor, the automatic grouping coding can be carried out on the angle values of the wafers coming out from the processing devices, and the automatic grouping coding result can be compared with the grouping coding result of the angle values of the wafers with the defects with the directional characteristics, so that the fault devices can be identified quickly and effectively.
Referring to fig. 7, fig. 7 is a system block diagram of a faulty device identification system according to an embodiment of the present invention, where the faulty device identification system 1 includes a first detection unit 11, a first encoding unit 12, a second detection unit 13, a second encoding unit 14, and a comparison unit 15.
The first detecting unit 11 is configured to establish a connection with the corresponding defect detecting system 2, so as to obtain a plurality of wafers with directional feature defects from the wafers 3 detected by the defect detecting system 2, and further obtain an angle value of the directional feature defect on each of the plurality of wafers, where the angle value is defined as a first angle value, and the range of the first angle value is 0 ° to 360 °. The first detecting unit 11 is further configured to set an angle at the V-groove of each of the plurality of wafers to zero, and calculate an angle value of the directional feature defect on each of the wafers with respect to the V-groove of the wafer by taking the counterclockwise direction as a positive direction, so as to serve as a first angle value corresponding to the wafer.
The first encoding unit 12 is configured to perform first grouping on the plurality of wafers according to the first angle value obtained by the first detecting unit 11, and obtain a first group code. The principle of the first grouping in the first encoding unit 12 is to group the wafers having the same first angle value into the same group, wherein the first grouping in the first encoding unit 12 may be manual grouping to improve the grouping accuracy, but the first encoding unit 12 may use an automatic encoding method for encoding. The first group code is a combination of the group number of each group and the number of each wafer in the group. In other embodiments of the present invention, the first time packet in the first encoding unit 12 may also be an automatic packet to increase the packet speed.
The second detecting unit 13 is configured to establish a connection with each of the plurality of wafers from each of the processing devices 4 that have undergone the process, so as to obtain an angle value of each of the plurality of wafers from each of the processing devices 4 that have undergone the process, and define the angle value as a second angle value. The second detecting unit 13 is an angle detecting device installed at the wafer outlet of each processing apparatus 4, and is configured to define an angle at the V-groove when each wafer enters the processing apparatus 4 to be zero, and detect an angle value when each wafer relatively enters the V-groove when the wafer exits from the wafer outlet of the processing apparatus 4, as a second angle value corresponding to the wafer. The angle detection device is mainly composed of a 360-degree aperture, and the range of the angle value is 0-360 degrees.
The second encoding unit 14 is configured to perform second grouping on the plurality of wafers according to the second angle value obtained by the second detecting unit 13 to obtain a second group code. The principle of the second grouping in the second encoding unit 14 is to divide the wafers having the same second angle value into the same group, where the second grouping is automatic grouping, and the second group encoding adopts a combination of the group number of each group and the serial number of each wafer in the group.
The comparing unit 15 is configured to compare the first group code obtained by the first encoding unit 12 with the second group code obtained by the second encoding unit 14, so as to identify a faulty processing equipment from all the processing equipments 4 experienced by the plurality of wafers. And when a certain first group code is identical to a certain second group code, the processing equipment 4 corresponding to the second group code is the processing equipment with the fault.
In summary, the faulty equipment identification system provided by the present invention includes a first detecting unit for obtaining an angle value of a directional feature defect on each wafer, a first encoding unit for grouping the wafers having the angle value of the directional feature defect, a second detecting unit for obtaining the angle value of each wafer when the wafer comes out from each processing equipment, a second encoding unit for grouping the wafers having the detected angle value when the wafer comes out from each processing equipment, and a comparing unit for comparing the codes obtained by the first encoding unit and the second encoding unit. The fault equipment identification system provided by the invention can realize quick and effective identification of fault equipment.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (7)
1. A method for identifying a malfunctioning device, comprising:
obtaining angle values of the directional characteristic defects on the wafers, and defining the angle values as first angle values;
performing first grouping on the plurality of wafers according to the first angle values to obtain first group codes, wherein the first grouping is based on the principle that the wafers with the same first angle value in the plurality of wafers are divided into the same group;
obtaining an angle value of each wafer in the plurality of wafers when the wafer goes out of each processing device, and defining the angle value as a second angle value;
grouping the plurality of wafers for the second time according to the second angle values to obtain a second group code, wherein the second grouping is based on the principle that the wafers with the same second angle value in the plurality of wafers are grouped into the same group; and the number of the first and second groups,
comparing the first group of codes to the second group of codes to identify a malfunctioning processing tool from all processing tools experienced by the plurality of wafers; the first group codes and the second group codes are combined by adopting the group numbers of each group and the serial numbers of all wafers in the group, and when a certain first group code is completely the same as a certain second group code, the processing equipment corresponding to the second group code is the failed processing equipment;
wherein the step of obtaining the first angle value comprises:
detecting defects of each wafer to detect the plurality of wafers with directional characteristic defects; and the number of the first and second groups,
setting the angle of the V-shaped groove of each wafer in the plurality of wafers to be zero, and calculating the angle value of the directional characteristic defect on each wafer relative to the V-shaped groove of the wafer by taking the anticlockwise rotation direction as the positive direction to be used as a first angle value corresponding to the wafer;
the step of obtaining the second angle value comprises:
arranging an angle detection device at a wafer outlet of each processing device, and defining the angle of the V groove to be zero when each wafer enters the processing device; and the number of the first and second groups,
and detecting an angle value of the V-shaped groove of the wafer from the wafer outlet of the processing equipment relative to the wafer when the wafer enters through the angle detection device on each processing equipment to serve as a second angle value corresponding to the wafer.
2. The faulty device identification method as claimed in claim 1, wherein said angle detection means is constituted by an aperture of 360 °.
3. The faulty device identification method as in claim 1, wherein said first grouping is a manual grouping and said second grouping is an automatic grouping.
4. A computer storage medium on which a computer program is stored, the computer program, when being executed by a processor, implementing the faulty device identification method according to any one of claims 1 to 3.
5. A faulty device identification system, comprising:
the first detection unit is used for establishing connection with a corresponding defect detection system so as to obtain a plurality of wafers with directional characteristic defects from the wafers detected by the defect detection system and further obtain an angle value of the directional characteristic defects on each wafer in the plurality of wafers, wherein the angle value is defined as a first angle value; the first detection unit is further configured to set an angle at the V-groove of each of the plurality of wafers to zero, and calculate an angle value of the directional feature defect on each of the wafers with respect to the V-groove of the wafer with the counterclockwise rotation direction as a positive direction, as a first angle value corresponding to the wafer;
the first coding unit is used for grouping the plurality of wafers for the first time according to the first angle value obtained by the first detection unit and obtaining a first group code; the principle of the first grouping in the first coding unit is to divide the wafers with the same first angle value into the same group;
the second detection unit is used for establishing connection with each processing device in the experience of each wafer in the plurality of wafers so as to obtain an angle value when each wafer in the plurality of wafers comes out from each processing device in the experience of each wafer, and the angle value is defined as a second angle value; the second detection unit is an angle detection device installed at a wafer outlet of each processing device, and is configured to define an angle at the V-groove to be zero when each wafer enters the processing device, and detect an angle value when each wafer relatively enters the V-groove when the wafer exits from the wafer outlet of the processing device, so as to serve as a second angle value corresponding to the wafer;
the second coding unit is used for grouping the plurality of wafers for the second time according to the second angle value obtained by the second detection unit so as to obtain a second group code; the second grouping in the second coding unit is based on the principle that the wafers with the same second angle value in the plurality of wafers are grouped into the same group; and the number of the first and second groups,
a comparing unit, configured to compare the first group of codes obtained by the first encoding unit with the second group of codes obtained by the second encoding unit, so as to identify a faulty processing device from all processing devices experienced by the plurality of wafers; the first group code and the second group code are combined by adopting a group number of each group and a serial number of each wafer in the group, and when a certain first group code is completely the same as a certain second group code, the processing equipment corresponding to the second group code is the failed processing equipment.
6. The faulty device identification system as claimed in claim 5, wherein said angle detection means is constituted by an aperture of 360 °.
7. The faulty device identification system as in claim 5, wherein said first grouping is a manual grouping and said second grouping is an automatic grouping.
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