CN109226975A - A kind of surface has the matrix and its processing method of compound groove - Google Patents
A kind of surface has the matrix and its processing method of compound groove Download PDFInfo
- Publication number
- CN109226975A CN109226975A CN201811156290.3A CN201811156290A CN109226975A CN 109226975 A CN109226975 A CN 109226975A CN 201811156290 A CN201811156290 A CN 201811156290A CN 109226975 A CN109226975 A CN 109226975A
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- China
- Prior art keywords
- groove
- compound
- matrix
- texture
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides the matrix that a kind of surface has compound groove, the compound groove texture of matrix surface array distribution single；The compound groove texture of single by a plurality of parallel unit groove width direction it is adjacent or intersection form.Spacing between a plurality of parallel unit groove is identical or becomes larger or becomes smaller.The section of the compound groove texture of single is U-type groove, and the U-type groove width B is 20~300 μm；The U-type groove depth is that H is 1~15 μm.The compound groove texture of single, which is equidistantly intersected by 3 parallel unit grooves in width direction, to be formed, the pattern of the compound groove texture of single is broadening type groove pattern, the broadening type groove pattern is flat U-typed slot, and the depth and width ratio of the flat U-typed slot are 1/10~3/20.The present invention can method by the way that a plurality of parallel groove texture to be superimposed in the direction of the width, can be realized large range of adjusting groove width.
Description
Technical field
The present invention relates to laser surface treating technology field, in particular to a kind of surface with compound groove matrix and
Its processing method.
Background technique
With the development of science and technology the demand of complex precise part dramatically increases, Surface Texture is turned to a kind of improvement machine
It is tool part, micro-/to receive the effective means of part tribological property, it is known together extensively.Wherein, groove texture features are several normal
See one of texture features, there is good guide functions and hydrodynamic lubrication performance.The study found that groove width and depth for
Matrix surface lubrication has very big influence；Secondly there is the basal body coating layer technical field of micro- texture, micro- texture width on surface
Also there is strong influence with quality of the depth for coating.
Groove texture width and depth are determined by single pulse energy, width in a set of pulses.By adjusting laser
Parameter, such as average output power, pulse frequency, defocusing amount etc. can increase groove texture width, depth and shape in various degree
Looks quality, but its increased width is limited in scope, and the requirement to process equipment is also very high.
Summary of the invention
For the deficiencies in the prior art, a kind of matrix the present invention provides surface with compound groove and its
Processing method, the method by the way that a plurality of parallel groove texture to be superimposed in the direction of the width, can be realized large range of adjusting
Groove width.
The present invention achieves the above technical objects by the following technical means.
A kind of surface has the matrix of compound groove, the compound groove texture of matrix surface array distribution single；It is described
The compound groove texture of single by a plurality of parallel unit groove width direction it is adjacent or intersection form.
Further, the spacing between a plurality of parallel unit groove is identical or becomes larger or becomes smaller.
Further, the unit groove width b is 5~50 μm, and the unit groove depth h is 1~15 μm.
Further, the section of the compound groove texture of the single is U-type groove, and the U-type groove width B is 20~300 μm；
The U-type groove depth is that H is 1~15 μm.
Further, the two sidewalls of the U-type groove are linear or curved shape.
Further, the compound groove texture of the single is by 3 parallel unit grooves in the equidistant intersection group of width direction
At the pattern of the compound groove texture of single is broadening type groove pattern, and the broadening type groove pattern is flat U-typed
Slot, the depth and width ratio of the flat U-typed slot are 1/10~3/20.
Further, the width of the flat U-typed slot is 10 μm~100 μm, and depth is 1 μm~15 μm.
A kind of processing method of matrix of surface with compound groove, includes the following steps: to matrix surface laser
The compound groove texture that ablation obtains, the compound groove texture processing sequence of single are compound first to process the single
Then the unit groove on the outside of groove texture processes the unit on the inside of the compound groove texture of the single in order
Groove.
Further, further include following steps:
Pre-treatment: by the polishing of matrix work surface, polishing treatment to mirror surface, matrix surface is cleaned；
Laser processing parameter setting: optical maser wavelength is one of 532nm or 1064nm, defocusing amount 0, pulse width
100-600 μ s, pulse frequency 1000Hz-2000Hz, electric current 1A-8A, auxiliary gas are inert gas.
The beneficial effects of the present invention are:
1. surface of the present invention has the matrix of compound groove, the width of groove texture features is adjusted to a wide range
Degree and depth, so that matrix adapts to the processing request under different operating conditions.
2. surface of the present invention can be big if matrix is in tooling cost field with the matrix of compound groove
The hydrodynamic lubrication performance and guide functions of width raising tool surface；In coatings art, coating quality can be improved, increase coating and base
The binding force of body.
3. coating quality can be improved in coatings art with the matrix of compound groove in surface of the present invention, increase
The binding force of coating and matrix.
4. the processing method of matrix of the surface of the present invention with compound groove, can adjust ditch to a wide range
The width of slot texture features, so that matrix adapts to the processing request under different operating conditions.
Detailed description of the invention
Fig. 1 is the matrix three-dimensional figure that surface of the present invention has compound groove.
Fig. 2 is unit groove cross-sectional view of the present invention.
Fig. 3 is broadening type groove pattern sectional view of the present invention.
Fig. 4 is broadening type groove pattern machining sketch chart of the present invention.
In figure:
1- first unit groove；2- second unit groove；3- third unit groove.
Specific embodiment
Present invention will be further explained with reference to the attached drawings and specific examples, but protection scope of the present invention is simultaneously
It is without being limited thereto.
As shown in Figure 1, surface of the present invention has the matrix of compound groove, matrix surface array distribution single is multiple
Mould assembly groove texture；The compound groove texture of single is by a plurality of parallel unit groove width direction is adjacent or intersection group
At.Spacing between a plurality of parallel unit groove is identical or becomes larger or becomes smaller.The a plurality of parallel unit ditch
Spacing between slot can be identical, and such matrix installation is can to guarantee the uniform oil storage in surface；The a plurality of parallel unit
Spacing between groove can not also be identical, and biggish spacing is arranged according to the position that the motion profile of matrix and needs lubricate,
Keep the width of the compound groove texture of the single larger.
As shown in Fig. 2, the unit groove width b is 5~50 μm, the unit groove depth h is 1~15 μm, described
Unit groove length a is 1000~10000 μm.The section of the compound groove texture of single is U-type groove, and the U-type groove is wide
Spending B is 20~300 μm；The U-type groove depth is that H is 1~15 μm.The two sidewalls of the U-type groove be linear or curved shape,
General curve can be circular arc or parabola or trigonometric function curve.As shown in figure 3, the compound groove texture of single
Equidistantly intersected by 3 parallel unit grooves in width direction and formed, the pattern of the compound groove texture of single is broadening
Type groove pattern, the broadening type groove pattern are flat U-typed slot, and the depth and width ratio of the flat U-typed slot are 1/
10~3/10.The width of the flat U-typed slot is 10 μm~100 μm, and depth is 1 μm~15 μm.The flat U-typed slot
When depth and width ratio are 1/10, unit groove width is 5 μm, and depth is 1 μm, and compound groove width is 10 μm, depth 1
μm；When the depth and width ratio of the flat U-typed slot are 3/20, unit groove width is 50 μm, and depth is 15 μm, compound
Groove width is 100 μm, and depth is 15 μm
Embodiment as shown in Figure 4 is broadening type groove pattern, wherein the list that single broadening type groove pattern is intersected by 3
First groove composition, the processing method of matrix of the surface of the present invention with compound groove, step are as follows:
Step 1, matrix surface broadening type groove parameter is designed；The specific geometric parameter of unit groove are as follows: length a=
10000 μm, b=20 μm of width, h=15 μm of depth, pattern is sinusoidal pattern；The specific geometric parameters of single broadening type groove pattern
Number are as follows: single broadening type trench length A is equal to a=10000 μm of unit groove length, broadening type groove pattern width described in single
B=40 μm, broadening type groove pattern depth H=15 μm described in single.
Step 2, high speed steel substrate polishing, polishing treatment to mirror surface are cleaned high-speed steel-base body surface with dry cotton by pre-treatment
Face；
Step 3, broadening type groove is processed using more kinetic energy picosecond systems of processing, processing sequence is to add respectively first with laser
Then work first unit groove 1 and third unit groove 3 process intermediate second unit groove 2；As shown in figure 4, first unit
Spacing between groove 1 and third unit groove 3 is W1, the spacing between first unit groove 1 and second unit groove 2 is W2,
W2For W1Half.The machined parameters of specific single-pulse laser ablation are as follows: optical maser wavelength is 532nm or 1064nm, defocusing amount 0,
Pulse width 300 μ s, pulse frequency 1200Hz, electric current 3A, auxiliary gas is nitrogen.
Step 4, it post-processes, machined surface is polished, remove surface slag, and it is 75% alcohol that matrix, which is put into concentration,
It is cleaned by ultrasonic in solution, air-dries under room temperature.
The embodiment is a preferred embodiment of the present invention, but present invention is not limited to the embodiments described above, not
In the case where substantive content of the invention, any conspicuous improvement that those skilled in the art can make, replacement
Or modification all belongs to the scope of protection of the present invention.
Claims (9)
1. the matrix that a kind of surface has compound groove, which is characterized in that the compound groove of matrix surface array distribution single
Texture；The compound groove texture of single by a plurality of parallel unit groove width direction it is adjacent or intersection form.
2. the matrix that surface according to claim 1 has compound groove, which is characterized in that a plurality of parallel list
Spacing between first groove is identical or becomes larger or becomes smaller.
3. the matrix that surface according to claim 1 has compound groove, which is characterized in that the unit groove width
B is 5~50 μm, and the unit groove depth h is 1~15 μm.
4. the matrix that surface according to claim 1 has compound groove, which is characterized in that the compound ditch of single
The section of slot texture is U-type groove, and the U-type groove width B is 20~300 μm；The U-type groove depth is that H is 1~15 μm.
5. the matrix that surface according to claim 4 has compound groove, which is characterized in that the two sides of the U-type groove
Wall is linear or curved shape.
6. the matrix that surface according to claim 4 has compound groove, which is characterized in that the compound ditch of single
Slot texture, which is equidistantly intersected by 3 parallel unit grooves in width direction, to be formed, the pattern of the compound groove texture of single
For broadening type groove pattern, the broadening type groove pattern is flat U-typed slot, the depth and width of the flat U-typed slot
Than being 1/10~3/20.
7. the matrix that surface according to claim 6 has compound groove, which is characterized in that the flat U-typed slot
Width be 10 μm~100 μm, depth be 1 μm~15 μm.
8. a kind of processing method of matrix of surface according to claim 1-7 with compound groove, special
Sign is, includes the following steps: the compound groove texture obtained to matrix surface laser ablation, the compound groove of single
Texture processing sequence is the unit groove first processed on the outside of the compound groove texture of the single, then processes institute in order
State the unit groove on the inside of the compound groove texture of single.
9. the processing method of matrix of the surface according to claim 8 with compound groove, which is characterized in that further include
Following steps:
Pre-treatment: by the polishing of matrix work surface, polishing treatment to mirror surface, matrix surface is cleaned；
Laser processing parameter setting: optical maser wavelength is one of 532nm or 1064nm, defocusing amount 0, pulse width 100-
600 μ s, pulse frequency 1000Hz-2000Hz, electric current 1A-8A, auxiliary gas are inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811156290.3A CN109226975A (en) | 2018-09-28 | 2018-09-28 | A kind of surface has the matrix and its processing method of compound groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811156290.3A CN109226975A (en) | 2018-09-28 | 2018-09-28 | A kind of surface has the matrix and its processing method of compound groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109226975A true CN109226975A (en) | 2019-01-18 |
Family
ID=65054678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811156290.3A Pending CN109226975A (en) | 2018-09-28 | 2018-09-28 | A kind of surface has the matrix and its processing method of compound groove |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110613924A (en) * | 2019-10-30 | 2019-12-27 | 北京航空航天大学 | Composite groove structure for drag reduction of sports equipment and laser processing method |
| CN114734955A (en) * | 2022-04-07 | 2022-07-12 | 安徽工业大学芜湖技术创新研究院 | Wiper surface texture |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19836330A1 (en) * | 1998-01-26 | 1999-08-05 | Mitsubishi Electric Corp | Scraping workpiece surfaces for production of lubricating groovelets in large numbers |
| CN1857843A (en) * | 2006-04-21 | 2006-11-08 | 江苏大学 | Laser surface micro molding process |
| CN101318262A (en) * | 2008-06-25 | 2008-12-10 | 江苏大学 | Laser micro-modelling method for cam surface profile |
| JP2010012570A (en) * | 2008-07-04 | 2010-01-21 | Jtekt Corp | Oil groove forming method |
| CN102962656A (en) * | 2012-11-09 | 2013-03-13 | 江苏大学 | Compound model processing method and device for cutter |
-
2018
- 2018-09-28 CN CN201811156290.3A patent/CN109226975A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19836330A1 (en) * | 1998-01-26 | 1999-08-05 | Mitsubishi Electric Corp | Scraping workpiece surfaces for production of lubricating groovelets in large numbers |
| CN1857843A (en) * | 2006-04-21 | 2006-11-08 | 江苏大学 | Laser surface micro molding process |
| CN101318262A (en) * | 2008-06-25 | 2008-12-10 | 江苏大学 | Laser micro-modelling method for cam surface profile |
| JP2010012570A (en) * | 2008-07-04 | 2010-01-21 | Jtekt Corp | Oil groove forming method |
| CN102962656A (en) * | 2012-11-09 | 2013-03-13 | 江苏大学 | Compound model processing method and device for cutter |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110613924A (en) * | 2019-10-30 | 2019-12-27 | 北京航空航天大学 | Composite groove structure for drag reduction of sports equipment and laser processing method |
| CN114734955A (en) * | 2022-04-07 | 2022-07-12 | 安徽工业大学芜湖技术创新研究院 | Wiper surface texture |
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